KR20140136664A - Explosion-proof ＬＥＤ Lamp - Google Patents

Abstract

The present invention relates to LED explosion-proofing and the like, and is intended to solve the problem that the heat radiation efficiency of the LED lamp is improved and the illuminance of the LED lamp is rapidly lowered and the service life is shortened. The LED explosion-proof lamp according to the present invention includes a power supply unit with a built-in switching mode power supply (SMPS), and an LED lamp coupled to the power supply unit and supplied with power from the switching mode power supply unit. The LED lamp includes a first coupling portion, a basic heat dissipation structure, an LED module structure, and a glass cover. The first coupling unit is connected to the power supply unit and receives power from the switching mode power supply unit. The basic heat dissipating structure is connected to the first coupling portion. The LED module structure is in contact with the basic heat dissipation structure and generates light by a power source transmitted through the first coupling portion and supports at least a part of the inner surface of the LED module to be exposed in order to dissipate heat generated by the light. The glass lid is fastened to the basic heat dissipation structure to protect the LED module structure.

Description

Explosion-proof LED Lamp}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to explosion-proof and the like, and more particularly to an explosion-proof light emitting diode using a light emitting diode (LED) as a light source.

In general, it is necessary to isolate or isolate an ignition source, since there is a risk of explosion by an electrical spark when using electrical equipment in a hazardous area with flammable gas. However, since it is impossible to isolate the ignition source in reality, explosion-proof electrical equipment is used as a general method for preventing explosion.

As one of such explosion-proof electrical apparatuses, there has been known an explosion-proof lamp which is equipped with a glass bulb such as a high-pressure mercury lamp, a high-pressure sodium lamp, a metal halide lamp, etc. as disclosed in Patent Publication No. 2000-0041923 And a pressure-resistant housing for preventing an explosion of the lamp from leading to a secondary explosion when a spark due to overheating occurs.

The pressure resistant housing has an internal pressure that the container can withstand when the explosive gas or steam explodes due to the electric spark of the lamp inside the container and the airtightness which is not likely to be ignited by the external explosive gas through the joint surface, Is required.

Therefore, the housing such as the explosion-proof housing has a rigid structure in which the glass globe is tightly bonded to the housing main body made of a metal material, and a protective net is formed outside the glass globe.

In addition, since the LED lamp has a glass bulb, the glass glove must have a sufficient inner space for accommodating the glass bulb and must have an internal pressure against the breaking force at the time of explosion of the bulb, It is composed of explosion-proof structure which is thick and large in size as a whole.

In such a conventional technique, lamps emit light due to their heat emission characteristics, so that sparks due to heat frequently occur, so lamp replacement is frequent. When the lamp is replaced, the housing having a heavy structure must be opened and closed. This was a very difficult problem.

On the other hand, in the case of an LED, a small number of injected carriers (electrons or holes) are formed by using a PN junction structure of a semiconductor rather than a heat emission, and since the light is emitted by recombination thereof, , If an explosion-proof lamp is constructed using an LED lamp, a strong pressure-resistant structure is not necessary, thereby enabling miniaturization and weight reduction.

Accordingly, although a conventional explosion-proof technology using LED lamps has been disclosed, since the LED lamp and the switching mode power supply (SMPS) are installed in a single-piece housing, the heat dissipation performance is not supported, There was a problem that this was shortened.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an LED explosion-proofing device capable of solving the problem that the illuminance of the LED lamp is rapidly lowered and the service life is shortened due to the deterioration of the heat radiation performance due to the LED lamp and the switching mode power supply device being integrally installed in the housing I have to.

Another object of the present invention is to provide an LED explosion-proofing which can solve the problem that the light-emitting efficiency of an LED lamp used for an LED explosion-proofing or the like is improved so that the illuminance of the LED lamp is rapidly lowered and the service life is shortened.

In order to accomplish the above object, the present invention provides a power supply apparatus including a power supply unit including a switching mode power supply unit (SMPS), and an LED lamp coupled to the power supply unit and receiving light from the switching mode power supply unit and outputting light And LED explosion-proof. The LED lamp includes a first coupling portion, a basic heat dissipation structure, an LED module structure, and a glass lid. The first coupling unit is connected to the power supply unit to supply power from the switching mode power supply unit. The basic heat dissipating structure is connected to the first coupling portion. The LED module structure generates light by a power source that is in contact with the basic heat dissipating structure and transmits through the first coupling portion and supports at least a part of the inner surface of the LED module in order to dissipate heat generated by the light. The glass cover part is fastened to the basic heat dissipating structure to cover and protect the LED module structure.

In the LED explosion-proof and the like according to the present invention, the power supply unit includes a housing and a switching mode power supply unit. The housing has a second coupling portion coupled to a first coupling portion of the LED lamp on a side facing the LED lamp, a mounting space in which the switching mode power supply is mounted, and a plurality of Radiating fins are formed. And the switching mode power supply device is installed in a mounting space of the housing.

In the LED explosion-proof according to the present invention, the glass lid includes a glass lid surrounding the LED module structure, a coupling ring coupled to an outer periphery of the glass lid to couple the glass lid to the LED module structure, And a protective net surrounding the glass cover.

In the LED explosion-proof and the like according to the present invention, the LED module structure may include a fastening disk, a column, and a plurality of LED module substrates. The fastening disk is fastened to the basic heat dissipating structure. The column portion is formed in a hollow shape with a predetermined inclination from the front surface of the fastening disk, and at least one constant size space portion is formed for the hollow inner surface exposure. The plurality of LED module substrates are coupled to the posts and generate light using the supplied power source.

In the LED explosion-proof and the like according to the present invention, the column portion includes a first column portion and a second column portion. The first pillar portion is formed to have a predetermined height in a hollow shape upward from the central portion of the clamping disk. The second pillar portion is further extended by a predetermined length in a direction in which the first pillar portions are extended from the upper end of the first pillar portions, and the at least one space portion is formed.

In the LED explosion-proof structure according to the present invention, the column portion may further include a module support portion formed in parallel with the first column portion and spaced apart from the space portion by a predetermined distance, and a part of the LED module substrate is fastened.

In the LED explosion-proofing and the like according to the present invention, the pillar portion is formed with a lead-out hole so that a lead wire can be discharged to at least one side of the first pillar portion.

In the LED explosion-proofing and the like according to the present invention, the basic heat-radiation structure is provided with heat-radiating concave-convex portions on its outer surface.

In the LED explosion-proofing and the like according to the present invention, the fastening disk may be fixed to the upper surface of the sacrificial basic heat-dissipating structure.

In the LED explosion-proof according to the present invention, the pillar portion may have at least one shape of polygonal, elliptic, and circular shapes such as triangular, rectangular, pentagonal, hexagonal,

Since the LED lamp and the switching mode power supply device are separately coupled to each other and the LED lamp and the switching mode power supply device each include a heat dissipation structure, the conventional LED lamp and the switching mode power supply device It is possible to solve the problem that the light emitting efficiency is improved and the illuminance of the LED lamp is rapidly lowered and the service life is shortened as compared with the LED explosion-proof formed integrally.

In addition, since the LED lamp has a structure in which the column heat dissipation structure is connected to the basic heat dissipation structure and the basic heat dissipation structure connected to the screw cap and has a plurality of open passages and the LED module is installed on the outer surface of the column heat dissipation structure, It is possible to effectively radiate the heat generated from the heat dissipation structure and the plurality of column heat dissipation structures to the outside. Accordingly, the present invention can secure stability such as LED explosion-proofing and thereby achieve a life extension.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an LED explosion proof according to an embodiment of the present invention; FIG.
Fig. 2 is an exploded view of the LED explosion-proof lamp of Fig.
FIGS. 3 and 4 are perspective views showing an LED module structure installed inside the glass cover of the LED lamp of FIG. 2. FIG.
Figure 5 is a bottom view of the bottom of the LED module structure of Figure 3;

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an LED explosion proof according to an embodiment of the present invention; FIG. Fig. 2 is an exploded view of the LED explosion-proof lamp of Fig.

1 and 2, an LED explosion-proof lamp 500 according to an embodiment of the present invention includes a power supply unit 20 and an LED lamp 10. The LED explosion-proof lamp 500 is connected to a power supply line 30 for supplying power to the power supply unit 20 side. The power supply unit 20 includes a switching mode power supply unit (SMPS) and is supplied with external power through a power supply line 30 to a switching mode power supply unit. The LED lamp 10 is coupled to the power supply unit 20 and receives power from the switching mode power supply unit to output light to the outside.

The LED lamp 20 includes a first coupling portion 100, a basic heat dissipation structure 200, an LED module structure 300, and a glass cover portion 400. The first coupling unit 100 is connected to the power supply unit 20 and is supplied with power from the switching mode power supply unit. The basic heat dissipating structure 200 is connected to the first coupling portion 100. The LED module structure 300 includes a light emitting diode (LED) 300, a light emitting diode (LED) module 300, a light emitting diode Supports exposure. The glass cover 400 is fastened to the basic heat dissipating structure 200 to cover and protect the LED module structure 300.

The glass cover part 400 includes a glass cover 430, a coupling ring 410 and a protection net 420. The glass cover 430 surrounds and protects the LED module structure 300. The coupling ring 410 is coupled to the outer periphery of the glass cover 430 to couple the glass cover 430 to the LED module structure 300. The protection net 420 is coupled to the coupling ring 410 to surround the glass cover 420 and protects the glass cover 420 from the protective environment. At this time, the glass cover 430 may be formed in a dome shape having an exit space in which the LED module structure 300 can be received.

The power supply unit 20 includes a housing 21 having a mounting space and a switching mode power supply unit installed in a mounting space of the housing 921. At this time, the housing 21 is formed with a second engaging portion 25 to which the first engaging portion 100 of the LED lamp 10 is engaged, on the side facing the LED lamp 10. The housing 21 has a mounting space in which a switching mode power supply is mounted. The housing 21 has a plurality of heat dissipation fins 23 on its surface that can radiate heat generated when the switching mode power supply is driven to the outside. The first coupling portion 100 and the second coupling portion 25 may be coupled to each other via the first coupling member 40. The housing 21 has a third engaging portion 27 formed on the opposite side of the second engaging portion 25 to be coupled to the power source line 30. And the third coupling portion 27 may be coupled to the power supply line 30 via the second connection member 50. [

The first to third coupling portions 100, 25, 27 and the coupling members 40, 50 may be realized in the form of a tube. The first to third coupling portions 100, 25, 27 and the inner surface of the end portion of the power source line 30 may be formed with a female screw. The first connecting member 40 is formed with male threads that can be screwed to the first and second engaging portions 100 and 25 on both outer side surfaces thereof. The second linking member 50 is formed with a male screw acid on both outer side surfaces thereof, which can be screwed to the ends of the third engaging portion 27 and the power source line 30. [

The LED lamp 10 according to this embodiment will now be described with reference to FIGS. 1 to 5. FIG. 3 and 4 are perspective views showing the LED module structure 300 installed inside the glass lid of the LED lamp 10 of FIG. 5 is a bottom view showing the bottom of the LED module structure 300 of FIG.

The LED lamp 10 radiates heat generated from the LED module structure 300 primarily through the column heat sink structure 310 included in the LED module structure 300 while the column heat sink structure 310 covers the LED module structure 300 to the basic heat-dissipating structure 200. The LED lamp 10 provides a structure in which the basic heat-dissipating structure 200 secondarily dissipates heat transferred thereto. In particular, at least one open passage 313 is formed in the column heat dissipation structure 310 to maximize heat dissipation capability of the column heat dissipation structure 310.

The first coupling unit 100 is coupled to a power supply unit 20 that supplies power to the LED lamp 10 and provides a passage through which a power line can be installed to transmit power to the LED module structure 300.

The base heat-dissipating structure 200 is connected to the first coupling part 100 at one side and the bottom surface of the LED module structure 300 at the other side. The basic heat dissipation structure 200 is formed of a material having excellent thermal conductivity, for example, copper, aluminum, magnesium, or an alloy thereof. The basic heat dissipation structure 200 may have a wrinkle shape As shown in FIG. The base heat-radiating structure 200 of the corrugated or concave-convex type can generate heat from the LED module structure 300 and conduct heat to dissipate heat to the outside.

The base heat-dissipating structure 200 has a belt-shaped cylindrical portion and a contact surface contacting the LED module structure 300 on the upper surface of the cylindrical portion. The protrusions 220 are formed on the side surface of the cylindrical portion at regular intervals And is disposed in the width direction of the cylindrical portion. Accordingly, the heat transferred from the LED module structure 300 can be conducted to the atmosphere circulating in the spaces provided between the concave-convex portions 220 of the basic heat dissipation structure 200.

The contact surface may include an inner surface on which the LED module structure 300 contacts and an outer peripheral region on which the glass lid 400 is seated. On the inner surface, a surface that can be in flat contact with the bottom surface of the LED module structure 300 is made flat. And a module fastening hole for fastening the LED module structure 300 to one side of the inner surface. The module fastening holes can be aligned with the screw holes 332 formed in the fastening disk 330 of the LED module structure 300 and screwed into the screw holes 332 of the fastening disk 330 have.

Also, at the center of the inner surface, a hole through which the power lines can be arranged can be provided to the LED driving circuit 353 provided in the LED module structure 300. The holes may have a predetermined size at the center of the inner surface, or may be formed in a number corresponding to the number of the LED module substrates 350 in the inner surface. Accordingly, the conductors passing through the first coupling portion 100 can be connected to the LED module structure 300, which is disposed at an upper portion through a central hole or holes.

The LED module structure 300 that is coupled to the basic heat dissipation structure 200 and emits light by the power supplied from the first coupling unit 100 includes a fastening disk 330, a column heat dissipation structure 310, (350).

The fastening disk 330 is faced to the front surface of the basic heat dissipation structure 200 and then fixed to the front surface of the basic heat dissipation structure 200 using a fastening structure such as a screw 355. [ The fastening disk 330 may have a smaller diameter than the inner surface of the basic heat dissipating structure 200 and may be provided in the form of a disk, and the central portion thereof may have a certain opening 331 formed therein. The openings 331 are formed on the side surfaces of the openings 331 with the sidewalls of the column portions of the column heat-dissipating structures 310 having a predetermined inclination while being connected to the column-like heat- The lead wire connected through the first coupling portion 100 through the opening 331 may be disposed inside the column heat-dissipating structure 310. [

At this time, the sidewalls of the column portions of the column heat-dissipating structure 310 are formed with a diagonal slope in order to secure a wide light distribution area. For example, it is preferable that the fastening disk 330 and the sidewall of the column portion of the column heat-dissipating structure are formed to have a thickness of 95 to 110 degrees. At this time, when the LED lamp is installed perpendicularly to the ground, the light distribution is performed in the range of 180 to 220 degrees.

The fastening disk 330 may be made of a material having a high thermal conductivity such as steel, copper, aluminum, stainless steel or the like in order to transmit heat generated from a plurality of LED modules 352, an LED driving circuit 353, And the like. On the other hand, at least one screw hole 332 into which the above-mentioned screw or the like can be inserted may be provided on one side of the fastening disk 330. The screw holes 332 may be provided at positions corresponding to the module fastening holes formed in the inner surface of the basic heat dissipating structure 200. The screw passes through the threaded hole 332 formed in the fastening disk 330 and is then coupled to the module fastening hole formed in the basic heat dissipating structure 200 while the fastening disk 330 is fastened to the inside of the basic heat dissipating structure 200 So that it can be more firmly adhered to the surface.

On the other hand, the fastening disk 330 may be provided so that the reference passage 333 penetrates to the center of the disk as shown in FIG. The reference passage 333 can be used as an alignment point for aligning the clamping disk 330 on the inner surface of the basic heat dissipating structure 200 and can also be used as a process of combining the basic heat dissipating structure 200 and the clamping disk 330 The coupling disk 330 may serve as an opening to open a hole disposed at the center of the inner surface of the basic heat dissipation structure 200. As a result, the reference passage 333 serves to open the central portion of the basic heat dissipation structure 200 and the coupling disk 330 in the process of disposing the coupling disk 330 on the upper side of the basic heat dissipation structure 200, And can be used for alignment of the clamping disk 330. [ Also, the reference passage 333 can serve as a passage for exposing a lead disposed inside the basic heat dissipation structure 200 to the outside.

The column heat dissipation structure 310 includes a first column 311 disposed at the center of the fastening disk 330 and connected to the front surface of the fastening disk 330, a first column 311 having a smaller surface than the upper surface of the first column 311, The second pillar portion 312 and the second pillar portion 312 are formed at positions spaced apart from the region where the open passages 313 are provided, And at least one module supporting portion 315 provided with a predetermined width and a surface in an edge region of the first column portion 311.

The following description will be made with reference to a structure in which the horizontal section of the column heat-dissipating structure 310 has a pentagonal shape. However, the horizontal section of the column heat-dissipating structure 310 of the present invention is not limited to a pentagon. On the other hand, since the horizontal section of the column heat-dissipating structure 310 has a pentagonal shape, the first column 311 includes five lower sidewalls, and the second column 312 also has five lower sidewalls And five upper side walls formed in succession. The at least one module supports 315 may also be spaced apart from the upper sidewalls by a predetermined distance and may include five supports.

The first column 311 may have a hollow shape and be provided in various columns. In the drawing, the shape of a pentagonal column having five sides is shown. However, the present invention is not limited to this, and the first column 311 may be provided in various shapes such as a triangular column, a quadrangular column, a hexagonal column, an octagonal column and the like. In the meantime, the first column 311 is formed to have a vertical or a predetermined inclination at each side of the pentagonal opening formed at the center of the clamping disk 330, And may include five lower side walls. The five lower side walls may be formed in such a way that the length of the side adjacent to the clamping disk 330 is long and the length of the side is smaller as the clamping disk 330 is moved away from the clamping disk 330. As a result, the first column 311 may be formed such that the width of the lower side walls decreases from the bottom to the top in a state where the center is empty. And one side of the five lower side walls may be provided with the wire arranging holes 316. In particular, the wire arranging holes 316 may be formed in a portion where the lower side walls are connected to the fastening disk 330. Accordingly, the fastening disk 330 may be further provided with an opening area associated with the lead arranging holes 316 at a position where the fastening disk 330 is connected to the first post 311.

The leads passing through the first coupling portion 100 are connected to the LED driving circuit 353 of the LED module substrate 350 disposed on the module supporting portions 315 after passing through the wire arranging holes 316 . Each of the conductive lines is provided in a pentagonal shape so that six module supporting portions 315 are provided so that six conductive lines can be disposed across the inside of the column through the first connecting portion 100. [ The five wires are exposed to the outside through the wire arranging holes 316 and then connected to the LED driving circuits 353 of the LED module substrate 350 disposed on the module supporting portions 315 .

The second pillar 312 has a thickness smaller than the thickness of the lower sidewalls of the first pillar 311 and is formed in a shape extending from the end of the inner side of the lower sidewalls to the first pillar 311 May be formed including two upper side walls. Space portions 314 may be provided in each of the five upper side walls. The space portions 314 are open regions of the upper sidewalls, and are open regions of the empty spaces of the second columnar portions 312. The space portions 314 support the atmospheric circulation together with the open passage 313 at the column heat-dissipating structure 310, and can support maximization of the heat-dissipating function.

The second post 312 may further include an upper end covering upper ends of the upper sidewalls. And an LED module substrate 350 may be disposed on the upper end. Meanwhile, the center portion of the upper end portion may be provided with a space portion 314 like other upper side walls. The space portion 314 formed at the upper end may be used as a path through which a wire for supplying power to the LED module substrate 350 disposed at the upper end of the second column portion 312 is exposed.

The module supports 315 are formed to have a predetermined thickness at the outer edges of the upper surfaces of the lower sidewalls and are disposed at positions spaced apart from the upper sidewalls of the second posts 312 by a predetermined distance. As a result, the module support portions 315 are spaced apart from the space portion 314 by a predetermined distance, so that the open passage 313 in which the air can be circulated inside the first and second post portions 311 and 312, Can be formed. The width of the module supports 315 is formed to be smaller than the width of the lower side walls. The module supporting portions 315 may be provided with screw holes through which a part of the LED module substrate 350 can be mounted. The shape of the module supports 315 may be similar to that of the top sidewalls of the second post 312.

At least one LED module substrate 350 includes substrate portions 351 disposed on one side of the first column portion 311 formed continuously and one surface of the module supporting portions 315, a plurality of LED modules 352, Circuitry 353.

The substrate portions 351 may be formed in a "spiral" shape so as to be disposed on the side surfaces of the first column portion 311 and one surface of the module supporting portions 315. The substrate portions 351 are arranged in the vicinity of the first pillar portion 311 to maximally transfer the heat generated in the plurality of LED modules 352 and the LED driving circuits 353 arranged in the column portion to the pillar heat- May be provided in a shape corresponding to one side of the side and module supports 315. The substrate portions 351 may be formed of a material having excellent thermal conductivity, for example, a ceramic or an insulated metal. For example, the substrate portions 351 may be formed of an insulating layer formed on a plate made of copper, aluminum, magnesium, or the like or an alloy thereof, as an insulated metal. Accordingly, the substrate portions 351 smoothly divert the heat generated from the plurality of LED modules 352 through the column heat-dissipating structure 310 to prevent the plurality of LED modules 352 from being deteriorated. In addition, the substrate portions 351 may include carbon nanotubes (CNTs) or graphenes to improve heat transfer characteristics and reduce weight.

A plurality of LED modules 352 may be arranged at a predetermined interval on the front surface of each of the substrate portions 351. On the other hand, the substrate portion disposed at the upper end of the second column portion 312 of the substrate portions 351 may be provided in a shape different from that of the other substrate portions, for example, a pentagonal shape in which a through hole is formed at the center. In the meantime, a plurality of LED modules and an LED driving circuit may be arranged on the upper substrate part like other substrate parts. The substrate portions 351 are formed with threaded holes and can be fastened to the first column portion 311 and the module supporting portions 315 through screw holes.

The plurality of LED modules 352 are arranged in a predetermined array in each of the base portions 351. The plurality of LED modules 352 emit light according to the power supplied from the LED driving circuit 353. [ For example, the plurality of LED modules 352 may be arranged side by side on the base portions 351 as shown. The plurality of LED modules 352 may generate white light of high luminance or may constitute a plurality of LEDs of blue or yellow LEDs and may transmit the light emitted from the LEDs to the cover part 400.

The LED driving circuit 353 supplies power to the plurality of LED modules 352 to support the plurality of LED modules 352 to emit light. The LED driving circuit 353 includes a connection portion that can be connected to each lead, and can be connected to a lead exposed to the outside through the lead arrangement holes 316. [ And the LED driving circuit 353 can supply the power supplied from the lead wire to the respective LED modules.

The glass cover part 400 is formed in a transparent or semitransparent cone shape for packaging a plurality of LED modules 352 by being fastened to the basic heat dissipation structure 200 and enclosing a plurality of LED modules 352, And is coupled to the heat dissipating structure 200 to diffuse or transmit light generated from the plurality of LED modules 352. [ The glass lid unit 400 includes a plurality of LED modules 352 formed of blue or yellow LEDs for emitting white light from the LED lamps 10 and a yellow or blue phosphor formed on the glass lid unit 400 is passed So that it can be converted to the light of a short wavelength or several long wavelengths to obtain a doctor white.

On the other hand, the glass cover part 400 may be provided with the wing part on the outer periphery of the circumference part in the opened area. Bolt holes may be provided in the wing portions at regular intervals. The bolt hole penetrates the fastening bolt formed in the outer circumferential region of the basic heat dissipation structure 200, and the nut can be fastened to the fastening bolt that is penetrated. Accordingly, the glass cover part 400 can be firmly coupled to the basic heat dissipation structure 200.

When the power source is applied, the LED lamp 10 of the present invention having the above-described structure generates and illuminates specific light such as white light. That is, the LED lamp 10 supports power supply to the LED driving circuit 353 and the plurality of LED modules 352 to generate light emission of high brightness. At this time, the generated blue or yellow light is emitted to the outside through the glass cover part 400 and irradiated with white light. The heat generated from the LED driving circuit 353 and the plurality of LED modules 352 can be radiated through the column heat dissipation structure 310.

More specifically, the heat generated by the plurality of LED modules 352 and the LED driving circuit 353 is transferred to the base portions 351 basically. Since the substrate portions 351 are in close contact with the first column portion 311 and the module supporting portions 315 of the column heat dissipation structure 310, the heat transferred by the substrate portions 351 is transferred to the first column portion 311, Lt; RTI ID = 0.0 > 311 < / RTI > At this time, the first column portion 311 and the module supporting portions 315 conduct the corresponding heat to the atmosphere provided inside the cover portion 400. Particularly, the atmosphere provided inside the lid part 400 moves along the open passage 313 formed by the module supporting parts 315 and the space part 314 of the second column part 312, Helps heat dissipation. The heat transferred to the first column 311 may be transferred to the second column 312 to be dissipated.

On the other hand, the heat that is not radiated first in the column heat-dissipating structure 310 may be transferred to the basic heat-dissipating structure 200 through the concave disc 330 connected to the column heat-dissipating structure 310 again. Then, the basic heat-dissipating structure 200 secondarily dissipates the heat transferred through the concave disc 330 through the concave-convex part 220 or the like.

The LED lamp 10 of the present invention has the space 314 and the open passage 313 formed in the column heat dissipation structure 310 so that the air flows into the space 314 and the inside of the column heat dissipation structure 310 And can be circulated using the open passage 313. As a result, as the surface area of the column heat-dissipating structure 310 is widened, the atmosphere is circulated, thereby maximizing the primary heat-dissipating effect and providing an improved heat-dissipating effect.

In the above description, the structure of the column heat-dissipating structure 310 having a pentagonal cross section has been described, but the present invention is not limited thereto. That is, the LED lamp 10 of the present invention can be equally applied to a structure in which the cross-section of the column heat-dissipation structure 310 has not only a polygonal shape such as a triangular shape or a tetragonal shape, but also a circular shape or an elliptical shape. In this process, the LED lamp 10 having the improved heat dissipation structure of the present invention is basically provided with a first column 311 at the lower end thereof, and at least one The LED module substrate 350 is provided with a second columnar section 312 on which a space is provided and is formed continuously from the first columnar section 311 and spaced apart from the second columnar section 312 by a predetermined distance. May be provided with a structure including module supports 315 at least partially disposed. Here, the present invention is not limited by the shape of the first column 311, the second column 312, and the module supports 315. As a result, the present invention is applicable to the formation of the open passageway 313 by the second pillar portion 312 formed with at least one space portion 314 and the module supporting portions 315 spaced apart from the second pillar portion 312 by a predetermined distance It should be understood that the present invention is based on the structure of improving the heat radiation effect through the atmospheric circulation.

The structure described above may include at least one space portion 314 in the second column portion 312 so that not only the air circulation inside the hollow of the second column portion 312 but also the space of the second column portion 312 By arranging the module supports 315 at positions facing the module supports 314, an open passage 313 for atmospheric circulation for the heat dissipation of the module supports 315 is formed including the space 314 . The column heat dissipation structure 310 induces a large atmospheric circulation through the space portion 314 having a relatively large open area and a narrow gap formed by the module supports 315 and the second column portions 312 It is possible to induce a small atmospheric circulation through which the air can be accelerated. Accordingly, the atmospheric circulation for the heat dissipation of the column heat-dissipating structure 310 of the present invention is maximized compared to the conventional one, thereby providing a more improved heat dissipation effect.

Meanwhile, the module supporting portions 315 may have a secondary structure in the characteristic of the column heat-dissipating structure 310 according to the embodiment of the present invention. In other words, the column heat-dissipating structure 310 of the present invention may be constituted by one column portion without distinguishing the first column portion 311 and the second column portion 312. In this case, And at least one space portion 314 may be provided so as to be exposed to the outside. In this case, the LED module substrate 350 may be coupled and supported only in a region defined by the first column 311 without being coupled with the module supports 315. In this structure, a portion of the LED module substrate 350, which is not in contact with the first column 311 and protrudes in a direction opposite to the clamping plate 330, is formed in a space defined by the second column portion 312 Section 314, as shown in FIG. Accordingly, the atmosphere circulating through the space portion 314 directly dissipates the backside of the LED module substrate 350, thereby further improving the atmospheric conduction effect of heat.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: LED lamp 20: Power supply
21: housing 23:
25: second engaging portion 27: third engaging portion
30: power supply line 40: first connection member
50: second connecting member 100: first coupling portion
200: basic heat dissipation structure 300: LED module structure
310: column portion 311: first column portion
312: second post 313: open passage
314: space part 315: module supporting part
330: fastening disk 331: opening face
332: screw hole 333: reference passage
350: LED module substrate 351: substrate part
352: LED module 353: LED driving circuit
400: glass cover part 410: engaging ring
420: protective net 430: glass cover
500: LED explosion-proof light

Claims (10)

A power supply with a switching mode power supply (SMPS);
And an LED lamp coupled to the power supply unit and receiving power from the switching mode power supply unit to output light,
The LED lamp includes:
A first coupling unit connected to the power supply unit and supplied with power from the switching mode power supply unit;
A basic heat dissipation structure connected to the first coupling portion;
An LED module structure for generating light by a power source which is in contact with the basic heat dissipating structure and transmitted through the first coupling portion and at least part of the inner surface of the LED module is exposed to dissipate heat generated by the light generation;
A glass lid coupled to the basic heat dissipation structure to surround and protect the LED module structure;
And an LED explosion-proofing lamp. The power supply unit according to claim 1,
A second coupling part coupled to the first coupling part of the LED lamp is formed on a side facing the LED lamp, a mounting space in which the switching mode power supply device is mounted is formed on the inside, and a plurality of radiating fins housing;
A switching mode power supply installed in a mounting space of the housing;
And an LED explosion-proofing lamp. 3. The projector according to claim 2,
A glass cover surrounding the LED module structure;
A coupling ring coupled to an outer periphery of the glass cover to couple the glass cover to the LED module structure;
A protection net coupled to the coupling ring and surrounding the glass cover;
And an LED explosion-proofing lamp. The LED module structure according to claim 3,
A fastening disk that is fastened to the basic heat dissipating structure;
A pillar having a hollow shape with a predetermined inclination from the front surface of the fastening disk and having at least one constant size space portion for exposing the hollow interior;
A plurality of LED module substrates coupled to the column portions and generating light using the supplied power source;
And an LED explosion-proofing lamp. [5] The apparatus of claim 4,
A first pillar formed at a predetermined height in a hollow shape upward from a central portion of the fastening disk;
A second pillar portion extending from the upper end of the first pillar portions by a predetermined length in a direction in which the first pillar portions are elongated, the at least one space portion being formed;
And an LED explosion-proofing lamp. 6. The apparatus according to claim 5,
A module supporting portion formed continuously with the first column portion and spaced apart from the space portion by a predetermined distance, and a part of the LED module substrate is fastened;
And an LED explosion-proofing lamp. 6. The apparatus according to claim 5,
And a lead wire discharge hole is formed in at least one side of the first pillar so that the lead wire can be discharged. 5. The heat sink according to claim 4,
And a heat dissipating concavo-convex portion is formed on the outer side of the LED. The apparatus according to claim 8,
And is fixed to the upper surface of the basic heat dissipation structure. [5] The apparatus of claim 4,
Wherein the hollow section has at least one of a polygon, an ellipse, and a circle such as a triangle, a rectangle, a pentagon, a hexagon, and an octagon.

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