KR20130142844A - Semiconductor manufacturing apparatus having variable transferring paths and in-line system having the same - Google Patents

Abstract

A semiconductor manufacturing apparatus having various transfer paths and an inline system including the same, wherein the semiconductor manufacturing apparatus includes a vacuum processing space having one side port and the other port on opposite sidewalls, and a first member drawn from the one side port to the other port. A first transfer path for transmitting a second transfer path, which is drawn from the other port and transfers a second member and a fourth member to the one port through a branch node, and the first node from the branch node on the second transfer path; And a third conveying path for delivering the third member in a direction having a predetermined angle with the second conveying path.

Description

Semiconductor Manufacturing Apparatus Having Variable Transfer Paths and In-line System Having The Same}

The present invention relates to a semiconductor manufacturing apparatus and an inline system including the same, and more particularly to a display manufacturing apparatus and a display manufacturing system including the same.

The semiconductor device and the display device are configured by stacking various thin films. Various thin films can be formed in a processing device that provides a variety of sources, and these processing devices make up the system along with other processing devices having various functions.

Currently, a system for forming a display device such as an OLED is mainly adopted in an in-line form in which an alignment chamber, a process chamber, and a mask replacement chamber are linearly disposed.

On the other hand, as display manufacturing systems are configured to process large substrates, they require a size and footprint to accommodate and transport large substrates. Therefore, it is required to realize the maximum function with the smallest possible size.

The present invention provides a semiconductor manufacturing apparatus capable of moving various members in various paths within a limited space and an inline system including the same.

The semiconductor manufacturing apparatus according to the present embodiment includes a vacuum processing space having one side port and the other port on opposite sidewalls, a first transfer path that enters from the one port and transfers the first member to the other port, and the other port. A second transfer path for transferring a second member drawn in from the branch node and returned to the one port through a branch node; and a third transfer for transferring a third member from the branch node in a direction having a predetermined angle with the second transfer path. It is configured to include a path.

A semiconductor manufacturing apparatus according to another embodiment of the present invention includes a chamber having first and second ports positioned on one side wall and third and fourth ports positioned on the other side wall facing the one side wall. A first transfer unit for sequentially transferring a plurality of first members sequentially introduced from a port to the third port, a second transfer unit for transferring a second member different from the first member from the fourth port to a branch node, And a third transfer unit configured to transfer a third member corresponding to a part of the second member from the branch node in a direction different from that of the second member.

In addition, the in-line system according to another embodiment of the present invention, a first functional chamber, a transfer chamber to sequentially transfer a plurality of first members from the first functional chamber, and the first member entered into the transfer chamber And a second functional chamber provided, wherein the transfer chamber includes a first transfer path for transferring the first member to the second functional chamber, and a second member returned from the second functional chamber to the first functional chamber. And a third transfer path for transferring to the second transfer path and a third transfer path derived from the second transfer path.

The chambers presented in this embodiment can transport members, such as substrates, in at least three directions within one chamber space. Therefore, a large number of transfer chambers can be transferred in a limited space, so that a large number of transfer chambers are not required.

In addition, the chamber of the present embodiment can flexibly control the conveying speed of the member, thereby reducing the source supply waste of the process chamber.

1 is a schematic perspective view of a semiconductor manufacturing apparatus including a chamber according to an embodiment of the present invention.
2A is a cross-sectional view illustrating a member transfer path inside a chamber according to an embodiment of the present invention.
Figure 2b is a cross-sectional view showing the interior of the chamber according to another embodiment of the present invention.
3 and 4 schematically show a control block for controlling a first transfer unit according to an embodiment of the present invention.
5 is a perspective view of an inline system according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout.

1 is a perspective view of a schematic chamber according to an embodiment of the present invention, Figure 2 is a cross-sectional view for explaining a member transfer path inside the chamber according to an embodiment of the present invention.

1 and 2A, the chamber 100 may have a first transport path a, a second transport path b, and a third transport path c.

The chamber 100 may have one port G1 and the other port G2. Transfer of a processing member such as a substrate or a mask may be performed through one port G1 and the other port G2, which may be located on opposite side walls of the chamber 100, respectively. In communication with one port G1 and the other port G2, a chamber (not shown) having another function may be located outside the chamber 100. The chamber 100 of this embodiment may be a transfer chamber located between chambers of different functions.

One side port G1 may include a first port G11 and a second port G12, and any one of the first and second ports G11 and G12 may be an inlet port through which the processing member is introduced. The other can be a withdrawal port through which the treatment member is withdrawn. The other port G2 may also include a third port G21 and a fourth port G22, and any one of the third and fourth ports G21 and G22 may be an inlet port through which the processing member is introduced. The other can be a withdrawal port through which the treatment member is withdrawn. In the present embodiment, a case will be described in which the first and fourth ports G11 and G22 are the inlet ports, and the second and third ports G12 and G22 are the outgoing ports. In addition, the chamber 100 of the present embodiment may include a side port G3. The side port G3 may be installed on any one of the extension surfaces connecting the opposite sidewalls on which the one side and the other side ports G1 and G2 are located.

Opening and closing of the one side port G1, the other side port G2, and the side port G3 may be controlled by a control block (not shown) in conjunction with the first to fourth transfer units 112, 122, 250, and 280. In addition, the chamber 100 may be maintained in a vacuum by a vacuum pump (not shown).

Here, the first transport path (a) may be, for example, a path from the first port G11 to the third port G21, and substantially in the x direction of the drawing, that is, the bottom surface of the chamber 100. May be parallel. In addition, the first port G11 and the third port G21 may be located on different planes, such that the first transport path a may have a stepped shape.

 The second conveying path b may be a return path from the fourth port G22 to the first port G1 and may be parallel to the direction antiparallel with the x direction (-x direction in the drawing). Can be.

The second conveyance path b may have a difference by the first conveyance path a and the first height H1. In FIG. 2A, the second conveying path b is illustrated in the upper portion of the first conveying path a, but the second conveying path b may be located below the first conveying path a. Of course. Accordingly, the inside of the chamber 100 may be divided into a top and bottom area in which a first transfer path a is formed and a region in which second and third transfer paths b and c are formed.

In addition, as shown in FIG. 2B, the chamber 100 includes a first subchamber 100-1 in which a first transport path a is formed and a second subchamber in which a second transport path b is formed. Of course, the 100-2) may be stacked.

The second conveying path b may be substantially divided into a first sub conveying path b1 and a second sub conveying path b2. The first sub transport path b1 is a path from the fourth port G22 to the branch node N, and the second sub transport path b2 is a path from the branch node N to the second port G12. Path. Here, the branch node N is a node located on the second conveyance path b.

In this case, the second member 120 may be transferred to the first sub transfer path b1 by the second transfer unit 122.

The third conveying path c is a path derived and branched from the second conveying path b. That is, the third transfer path c is a path extending from the branch node N in a direction forming a predetermined angle with respect to the second transfer path b. The arrival point of the third transfer path c may be a point at which the side port G3 is located or a point at which any unit (not shown) in the chamber 100 is installed. Preferably, the third transport path (c) may extend in the z direction substantially perpendicular to the second transport path (b).

Through the third transfer path c, the third member 130 may be transferred, and the third member 130 may correspond to some elements constituting the second member 120. In addition, the fourth member 140 may have the same configuration as that of the second member 120, but the type of each component may be different.

Here, the third member 130 is delivered to the arbitrary point by the third transfer unit 132. In this process, as shown in FIG. 2, a support member such as a shuttle 135 may be mounted and moved. In this case, the reason for mounting the third member 130 on the shuttle 135 is to prevent foreign substances remaining in the third member 130 from falling into the chamber 100.

The first member 110 entering the first port G11 may include a substrate 111, a mask assembly 115, and a magnet plate 117. The substrate 111 may be a transparent glass substrate on which a display element is to be formed. However, the present invention is not limited thereto, and of course, the semiconductor manufacturing apparatus may correspond to a wafer. The mask assembly 115 may include a mask 115a and a mask frame 115b. The mask 115a is fixed by the tensile stress with the mask frame 115b. As is known, the mask 115a includes a plurality of unit patterns (not shown), and individual unit elements may be defined by one unit pattern. The unit pattern constituting the mask 115a is a magnetic thin film. For example, a metal alloy film may be used. The mask frame 115b may be configured to have an open center, and may be formed of a material having an elastic force. In addition, the mask frame 115b should have a rigidity that can withstand the tensile stress applied to the mask 115a, and it is preferable that the mask frame 115b does not cause interference when the deposition object and the mask 115 come into close contact with each other. The magnet plate 117 is disposed to face the mask assembly 115 with the substrate 111 interposed therebetween, and the mask 115a is in close contact with the substrate 111 by the magnetic field generated by the magnet plate 117. Avoid shadows on the surface.

Attachment and alignment of the substrate 111, mask assembly 115 and magnet plate 117 may be performed outside the chamber 100, for example, in a separate alignment chamber (not shown), The substrate 100, the mask assembly 115, and the magnet plate 117 are introduced into the chamber 100 in an aligned state.

The second member 120 entering the fourth port G22 may include a mask assembly 115 and a magnet plate 117. In this case, the second member 120 is a member from which the substrate 111 is separated and removed from the first member 110, and the mask assembly 115 constituting the second member 120 is completely used. It may include.

The third member 130 may be a mask assembly 115 separated from the second member 120, and the fourth member 140 may be a structure in which another mask assembly 115 is placed below the magnet plate 117. It may be taken out through the second port G12.

That is, the substrate 111 on which the mask assembly 115 and the magnet plate 117 are aligned is subjected to a predetermined process while passing through the chamber 100 and other chambers (not shown). The substrate 111 is then separated and moved to another chamber for the next process. Thereafter, the mask assembly 115 and the magnet plate 117 used are returned to the chamber 100 of the present embodiment. In this process, the mask assembly 115 is moved to the third transfer path c for cleaning, and the other mask assembly 115 is placed under the magnet plate 117 through the third transfer path c. It is delivered to a chamber (not shown) in front of it. In the present embodiment, the fourth member 140 has been described as a laminate of the cleaned other mask assembly 115 and the magnet plate 117, but the present invention is not limited thereto, and the magnet plate 117 may be itself. to be.

Meanwhile, the first to fourth members 110, 120, 130, and 140 are transferred by the first to fourth transfer units 112, 122, 250, and 280. Each of the first to fourth transfer units 112, 122, 250, and 280 may include driving units 112a, 122a, 250a, and 280a and driving rollers 112b, 122b, 250b, and 280b. The driving units 112a, 122a, 250a, and 280a may be any one of a power transmission member such as various motors, hydraulic and pneumatic cylinders, and a linear rail or a movable conveyor belt instead of the driving rollers 112b, 122b, 250b and 280b. Can be used.

In addition, as shown in FIG. 3, the control block 200 linked to the first to fourth transfer units 112, 122, 250, and 280 may control the speed of the first transfer unit 112.

The control block 200 is a position sensor 210 for detecting the position of the first member 110, a control unit for determining the acceleration or deceleration of the first member 110 according to the position of the first member 110. The driving unit 230 may adjust the speed of the first transfer unit 112 according to the determination of the 220 and the control unit 220.

In more detail, as illustrated in FIG. 4, the plurality of first members 110 may sequentially enter through the first port G11 of the chamber 100. In this case, by detecting the position of the preceding first member 110F previously entered, it is possible to accelerate or decelerate the feed speed of the subsequently entered first member 110R.

For example, when the preceding first member 110F has passed through a specific position, the preceding first member 110F is decelerated or waited, and the receding first member 110R is connected to the preceding first member 110F. The control unit 220 and the drive unit 230 can be driven to accelerate to position.

That is, the control unit 220 and the drive unit 230 adjusts the speed of the first conveying unit 112F for conveying the preceding first member 110F as well as the first conveying unit for conveying the rear first member 110R. The speed of 112R can be adjusted simultaneously.

Here, aF in the figure shows the first conveyance path of the first member 110F first-in, and aR shows the 1st conveyance path of the 1st member 11R which was post-inserted. Accordingly, the chamber 100 of the present embodiment may perform the function of the speed buffer.

Since the chamber according to the present technology can transfer different members in various directions within the chamber, various functions can be performed in the chamber, and the speed of the processing member can be increased and decreased as necessary.

5 is a schematic perspective view showing an in-line system according to an embodiment of the present invention.

In the in-line system 300 of the present embodiment, a plurality of chambers having different functions are continuously arranged. The chambers having different functions in this embodiment may be the alignment chamber 310, the transfer chamber 100, and the process chamber 350.

The alignment chamber 310 may be disposed with the transfer chamber 100 and the first and second ports G11 and G12 interposed therebetween. The substrate 111, the mask assembly 115, and the magnet plate 117 are aligned with each other in the alignment chamber 310.

The transfer chamber 100 includes first and second ports G11 and G12 communicating with the alignment chamber 310 and third and fourth ports G21 and G22 communicating with the process chamber 350. In addition, the transfer chamber 100 has a side portion located at a connection surface connecting one side wall where the first and second ports G11 and G12 are positioned and the other side wall where the third and fourth ports G21 and G22 are positioned. Port G3. The transfer chamber 100 is configured to separate the second member 120 to be returned to the third and fourth members 130 and 140 to be transferred to another path. That is, the transfer chamber 100 may have a function of transferring different members to different first to third transfer paths a, b, and c. In addition, the transfer chamber 100 may include a control block 200 to control the moving speed of the member moved in the first transfer path a.

The process chamber 350 is linearly disposed with the transfer chamber 100 and the third and fourth ports G2 interposed therebetween, and the substrate constituting the first member 110, for example, the first member 110. The source for forming a predetermined layer is continuously supplied to the (111) surface. The source and the amount of source provided in the process chamber 350 are controllable in a control system (not shown) provided in the system.

A vacuum pump (not shown) may be connected to each chamber so that the alignment chamber 310, the transfer chamber 100, and the process chamber 350 constituting the in-line system 300 may maintain a vacuum state.

Although not shown in the figure, additional chambers may be arranged in a line on one side of the process chamber 350.

Referring to the members conveying path of the in-line system 300 of the present embodiment as follows.

In the alignment chamber 310, the resultant 110 (first member) having the substrate 111, the mask assembly 115, and the magnet plate 117 aligned is introduced into the transfer chamber 100 through the first port G11. do.

The first member 110 introduced into the transfer chamber 100 is carried out to the third port G21 of the transfer chamber 100 through the first transfer path a. In this process, a plurality of first members 110 may be sequentially introduced into the chamber 100, and the first transfer unit 112 for transferring the first members 110 may be preceded by the first first members 110. According to the position and the speed of the control, the feed speed of the substrate substrate 110 is retarded.

The first member 110 carried out to the third port G21 of the transfer chamber 100 is introduced into the process chamber 350 and subjected to a predetermined process 352. Accordingly, a predetermined film may be formed on the exposed surface of the substrate 111 in the form of a mask assembly 115.

Subsequently, although not shown in the drawing, one side of the process chamber may be provided with a substrate separation chamber (hereinafter, a detach chamber) (not shown), and the substrate 111 of the first member 110 may be provided in the detach chamber. This is separated. Thus, the second member 120 is configured, and the second member 120 enters the fourth port G22 of the transfer chamber 100 through the process chamber 350 again.

The second member 120 is transferred through the first sub transfer path b1 of the second transfer path b to the separation node N of the transfer chamber 100, and then the mask assembly ( 115) and the magnet plate 117. The mask assembly 115 is a third conveying member 130, which is transmitted through the third conveying path c to the side port G3 or to an arbitrary point, and again through the third conveying path c to another mask assembly. 115 may be returned. The other mask assembly 115 returned is disposed under the magnet plate 117 to constitute the fourth member 140. The fourth member 140 composed of the other mask assembly 115 and the magnet plate 117 is carried out to the second port G12 via the second sub conveying path b2 of the second conveying path b and freezes. It may be delivered to the in-chamber 310.

The chambers presented in this embodiment can transport members, such as substrates, in at least three directions within one chamber space. Therefore, a plurality of members can be transported in a limited space. In addition, the chamber of the present embodiment can flexibly control the conveying speed of the member, thereby reducing the source supply waste of the process chamber.

The present invention is not limited to the above embodiment. In the present exemplary embodiment, a display manufacturing apparatus such as an OLED has been described as an example, but the present invention is not limited thereto and may be applied to both a semiconductor and a display apparatus.

As described above, embodiments of the present invention have been described with reference to the accompanying drawings, but those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that it can be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100 chamber 110 first member
120: second member 130: third member
140: fourth member 210: position sensor
220: control unit 230: drive unit
300: in-line system 310: alignment chamber
350: process chamber

Claims (20)

A vacuum processing space having one port and the other port on opposite sidewalls;
A first transfer path that is drawn from the one port and delivers a first member to the other port;
A second transfer path which transfers a second member drawn from the other port and returned to the one port via a branch node; And
And a third transfer path for transferring a third member from the branch node in a direction having a predetermined angle with the second transfer path. The method of claim 1,
And the first member is configured such that a plurality of the members are sequentially drawn into the vacuum processing space. 3. The method of claim 2,
A first transfer unit for transferring the first member along the first transfer path,
And the first transfer unit is configured to control the speed of the first member to be subsequently introduced according to the position of the first member previously introduced. The method of claim 1,
And a predetermined height exists between the first transfer path and the second transfer path. The method of claim 1,
The second transfer path is,
A first sub transport path from the other port to the branch node, and
A second sub transport path from the branch node to the one port,
The second member is transferred through the first sub conveying path,
And the fourth member is configured to be transferred through the second sub transfer path. The method of claim 5, wherein
The first member includes a substrate, a mask assembly positioned on the lower surface of the substrate, and a magnet plate positioned on the upper surface of the substrate,
The second member includes the mask assembly and the magnet plate sequentially stacked;
The third member comprises the mask assembly,
And the fourth member includes a structure in which a new mask assembly and the magnet plate are combined. The method according to claim 6,
And a facility for separating the mask assembly of the second member and the magnet plate from the branch node. The method of claim 5, wherein
The one side port includes a first port through which the first member is drawn in, and a second port through which the fourth member is drawn out,
The other port includes a third port through which the first member is drawn out, and a fourth port through which the second member is drawn in. The method of claim 1,
The vacuum processing space is divided into a region where the first transfer path is formed and a region where the second and third transfer paths are formed. The method of claim 9,
The vacuum processing space is configured by stacking a first sub chamber formed in a region where the first transfer path is formed and a second sub chamber formed in a region where the second transfer path is formed. A chamber having first and second ports positioned on one side wall and third and fourth ports positioned on the other side wall facing the one side wall;
A first transfer unit sequentially transferring a plurality of first members drawn in sequentially from the first port to the third port;
A second transfer unit for transferring a second member different from the first member from the fourth port to a branch node; And
And a third transfer unit configured to transfer a third member corresponding to a part of the second member from the branch node in a direction different from a transfer direction of the second member. The method of claim 11,
The chamber may comprise:
And a control block for controlling the first transfer unit to accelerate and decelerate the speed of the first member to be retarded according to the position of the preceding first member. The method of claim 11,
The control block,
A position sensor for sensing a position of the preceding first member;
A control unit for determining acceleration and deceleration of the retarding first member according to a sensing result of the position sensor; And
And a drive unit for adjusting the speed of the first transfer unit in accordance with the control unit. The method of claim 11,
The first member includes a substrate, a mask assembly positioned on the lower surface of the substrate, and a magnet plate positioned on the upper surface of the substrate,
The second member includes the mask assembly and the magnet plate sequentially stacked;
And the third member comprises the mask assembly. The method of claim 11,
And a fourth transfer unit for transferring a fourth member from the branch node to the second port. The method of claim 15,
And the fourth member is a laminate structure of a magnet plate and a mask assembly. A first functional chamber;
A transfer chamber configured to sequentially transfer a plurality of first members from the first functional chamber; And
A second functional chamber provided with the first member entered into the transfer chamber,
The transfer chamber includes a first transfer path for delivering the first member to the second functional chamber, a second transfer path for transferring a second member returned from the second functional chamber to the first functional chamber, and the An inline system configured to have a third transport path derived from a second transport path. The method of claim 17,
The first functional chamber is an alignment chamber that aligns the substrate, the mask assembly and the magnet plate,
And said second functional chamber is a process chamber provided with a reactive gas. The method of claim 17,
The transfer chamber,
A first transfer unit for transferring the first member along a first transfer path;
A second transfer unit for transferring the second member along the second transfer path; And
And a third transfer unit for transferring the third member along the third transfer path. The method of claim 19,
The transfer chamber,
And a control block for controlling the first transfer unit to accelerate and decelerate the speed of the first member that recurs according to the position of the preceding first member.

Images