KR20130104754A - Thermal conductive resin composites comprising carbon nano tubes and method of preparing the same - Google Patents
Thermal conductive resin composites comprising carbon nano tubes and method of preparing the same Download PDFInfo
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- KR20130104754A KR20130104754A KR1020120026562A KR20120026562A KR20130104754A KR 20130104754 A KR20130104754 A KR 20130104754A KR 1020120026562 A KR1020120026562 A KR 1020120026562A KR 20120026562 A KR20120026562 A KR 20120026562A KR 20130104754 A KR20130104754 A KR 20130104754A
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- Prior art keywords
- resins
- carbon nanotubes
- resin
- thermally conductive
- composite
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 98
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 97
- 239000000805 composite resin Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000002952 polymeric resin Substances 0.000 claims abstract description 27
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000006185 dispersion Substances 0.000 claims description 20
- -1 polypropylene Polymers 0.000 claims description 20
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- 239000003377 acid catalyst Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 239000002244 precipitate Substances 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 229920000877 Melamine resin Polymers 0.000 claims description 5
- 239000004640 Melamine resin Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920006122 polyamide resin Polymers 0.000 claims description 5
- 229920013716 polyethylene resin Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920005990 polystyrene resin Polymers 0.000 claims description 5
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 5
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000002612 dispersion medium Substances 0.000 claims description 4
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 4
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 4
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical group [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- WDCKRYQAVLUEDJ-UHFFFAOYSA-N methyl(oxo)silicon Chemical compound C[Si]=O WDCKRYQAVLUEDJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 5
- 238000001241 arc-discharge method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000001308 synthesis method Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N 2-pentanol Substances CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000002079 double walled nanotube Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylene tetramine Natural products C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- ZZLOQICNGDMUBA-UHFFFAOYSA-N tetraethyl silicate;hydrate Chemical compound O.CCO[Si](OCC)(OCC)OCC ZZLOQICNGDMUBA-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73113—Thermal conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 탄소 나노 튜브를 함유한 열전도성 수지 복합체 및 그 제조방법에 관한 것으로서, 보다 상세하게는 탄소 나노 튜브와 규소 산화물이 결합된 입자가 고분자 수지 내부에 분산됨으로써, 다량의 탄소 나노 튜브를 함유하여 열전도성이 우수하며, 특히 고열에서도 그 구조가 붕괴되지 않아 열내구성이 우수한 탄소 나노 튜브를 함유한 열전도성 수지 복합체 및 그 제조방법에 관한 것이다.The present invention relates to a thermally conductive resin composite containing carbon nanotubes and a method for manufacturing the same, and more particularly, a carbon nanotube and a silicon oxide-bonded particles are dispersed in a polymer resin, thereby containing a large amount of carbon nanotubes. Therefore, the present invention relates to a thermally conductive resin composite containing carbon nanotubes having excellent thermal conductivity, and in particular, its structure does not collapse even at high heat, and thus has excellent thermal durability.
Description
본 발명은 탄소 나노 튜브를 함유한 열전도성 수지 복합체 및 그 제조방법에 관한 것으로서, 보다 상세하게는 고열에서도 분해되지 않고 높은 전도성을 갖는 복합체 및 그 제조방법에 관한 것이다.
The present invention relates to a thermally conductive resin composite containing carbon nanotubes and a method for producing the same, and more particularly, to a composite having high conductivity without decomposing even at high heat and a method for producing the same.
각종 기계장치, 전자제품 등 다양한 장치들은 내부에서 발생되는 열을 효과적으로 방출하기 위해 다양한 형태의 열교환 수단을 구비하고 있다.Various devices, such as various mechanical devices and electronic products, are equipped with various types of heat exchange means for effectively dissipating heat generated therein.
이러한 열교환 수단으로서, 종래에는 열전도성이 뛰어난 소재인 알루미늄, 구리 등 금속재를 이용하여 열교환 수단이 주로 제작되었다. 그러나 이러한 금속재 열교환 수단은 소재 가격이 비싸며, 초소형으로 정밀한 형상으로 제조되기 어렵다는 문제점이 있었다. As such a heat exchange means, conventionally, heat exchange means were mainly manufactured using metal materials, such as aluminum and copper, which are excellent in thermal conductivity. However, such a metal heat exchange means has a problem that the material price is expensive, it is difficult to manufacture in a very small and precise shape.
이러한 문제점을 개선하기 위하여 열전도성이 상온에서 길이방향으로 6,600W/m.K로 우수하고, 인장 강도가 높으며 전기전도도가 우수한 카본 나노튜브와 성형성이 뛰어나고, 가격이 금속재보다 유리한 고분자 수지를 서로 결합하여 열교환 수단용 소재를 개발하려는 노력이 이루어지고 있으며, 이러한 노력으로서 종래에는 고분자 수지에 탄소 나노 튜브를 분산시킴으로써 탄소 나노 튜브 함유 고분자 복합체를 제조하려는 방법이 다양하게 시도되고 있었다. In order to improve this problem, the thermal conductivity is excellent at 6,600W / mK in the longitudinal direction at room temperature, and the carbon nanotubes having excellent tensile strength and excellent electrical conductivity and excellent moldability, and the polymer resin which is more advantageous than the metal material are combined with each other. Efforts have been made to develop a material for heat exchange means, and various efforts have been made to manufacture a carbon nanotube-containing polymer composite by dispersing carbon nanotubes in a polymer resin.
그러나 종래기술은 탄소 나노 튜브가 특징상 가지는 서로 응집성이 강하여 고분자 수지에 균일하게 분산시키기 어렵다는 문제점을 해결하기 위하여 고분자 수지 내부에 탄소 나노 튜브의 분산성을 높이는 목적으로 강산, 계면활성제 등에 의한 화학적 방법을 사용함으로써 탄소 나노 튜브의 열전도도와 전기전도도 등의 물리적 특성이 현저히 감소하는 문제점이 있었다.However, in the prior art, in order to solve the problem that the carbon nanotubes are cohesive with each other and are difficult to uniformly disperse in the polymer resin, a chemical method using a strong acid or a surfactant is used to increase the dispersibility of the carbon nanotubes in the polymer resin. By using this, there was a problem in that physical properties such as thermal conductivity and electrical conductivity of carbon nanotubes were significantly reduced.
또한, 이러한 화학적 방법을 사용하여도 탄소 나노 튜브 함량을 10% 이내로 고분자 수지 내부에 분산시킬 수 있고, 이 경우에 열전도도가 산업상 이용할 정도보다는 낮은 수준이 된다는 문제점이 있었다.In addition, even using such a chemical method, the carbon nanotube content can be dispersed within the polymer resin within 10%, in which case there is a problem that the thermal conductivity is lower than the degree of industrial use.
이러한 문제를 해결하기 위해, 한국공개특허 제12011-0101855호는 탄소 나노 튜브를 기판상에 수직방향으로, 다발 상으로 성장시킨 후에 성장된 개개의 탄소 나노 튜브 사이에 고분자 수지를 일정 두께로 충전시켜 제조되는 열전도성 플라스틱을 개시하고 있다. 하지만, 여전히 고열 조건에서는 열내구성이 부족하고, 제조방법이 용이하지 않으며, 열전도의 방향이 탄소 나노 튜브를 성장시킨 방향으로만 우수하다는 단점이 있다.In order to solve this problem, Korean Patent Laid-Open Publication No. 12011-0101855 has a polymer resin filled in a predetermined thickness between individual carbon nanotubes grown after growing carbon nanotubes on a substrate in a vertical direction and in a bundle. Disclosed is a thermally conductive plastic produced. However, there is still a disadvantage in that the heat durability is insufficient in the high temperature conditions, the manufacturing method is not easy, and the direction of heat conduction is excellent only in the direction of growing the carbon nanotubes.
따라서 고분자 수지에 탄소 나노 튜브를 다량으로 결합시켜서 높은 열전도도를 가질 뿐만 아니라 고열에서도 열내구성이 우수한 열전도성 소재의 개발이 여전히 요구되고 있다.
Therefore, there is still a need to develop a thermally conductive material having high thermal conductivity as well as high thermal conductivity by combining a large amount of carbon nanotubes with a polymer resin.
본 발명은 열전도성이 우수한 수지 복합체 및 그 제조방법을 제공하는 것을 목적으로 한다.An object of the present invention is to provide a resin composite having excellent thermal conductivity and a method of manufacturing the same.
또한, 본 발명은 고열에서도 그 구조가 붕괴되지 않아 열내구성이 우수하며 열전도성을 유지할 수 있는 수지 복합체 및 그 제조방법을 제공하는 것을 목적으로 한다.
In addition, an object of the present invention is to provide a resin composite and a method for producing the resin composite that can maintain its thermal conductivity and excellent thermal durability because the structure does not collapse even at high temperatures.
1. 탄소 나노 튜브와 규소 산화물이 결합된 입자가 고분자 수지 내부에 분산된 열전도성 수지 복합체.1. A thermally conductive resin composite in which carbon nanotubes and silicon oxide combined particles are dispersed inside a polymer resin.
2. 청구항 1에 있어서, 탄소 나노 튜브와 규소 산화물의 결합은 물리적 결합 또는 화학적 결합인 열전도성 수지 복합체.2. The thermally conductive resin composite of claim 1, wherein the bond between the carbon nanotubes and the silicon oxide is a physical bond or a chemical bond.
3. 청구항 2에 있어서, 화학적 결합은 산처리된 탄소 나노 튜브의 표면 상에 형성된 반응성기와 규소 산화물 사이의 결합인 열전도성 수지 복합체.3. The thermally conductive resin composite of claim 2, wherein the chemical bond is a bond between a silicon oxide and a reactive group formed on the surface of the acid treated carbon nanotubes.
4. 청구항 1에 있어서, 상기 입자는 열전도성 수지 복합체 100 중량부에 대하여 30 중량부 이하로 포함되는 열전도성 수지 복합체.4. The thermally conductive resin composite of claim 1, wherein the particles are included in an amount of 30 parts by weight or less based on 100 parts by weight of the thermally conductive resin composite.
5. 청구항 1에 있어서, 고분자 수지는 에폭시 수지, 페놀 수지 및 멜라민 수지로 이루어진 군에서 선택되는 적어도 하나인 열경화성 수지; 폴리에틸렌 수지, 폴리프로필렌 수지, 폴리 스티렌 수지, 폴리염화비닐 수지, 폴리아미드 수지, 폴리에틸렌테레프탈레이트 수지 및 아크릴 수지로 이루어진 군에서 선택되는 열가소성 수지; 또는 이들의 혼합물인 열전도성 수지 복합체.5. The method according to claim 1, wherein the polymer resin is at least one selected from the group consisting of an epoxy resin, a phenol resin and a melamine resin thermosetting resin; Thermoplastic resins selected from the group consisting of polyethylene resins, polypropylene resins, polystyrene resins, polyvinyl chloride resins, polyamide resins, polyethylene terephthalate resins and acrylic resins; Or a thermally conductive resin composite thereof.
6. (S1) 탄소 나노 튜브 분산액을 준비하는 단계; (S2) 상기 탄소 나노 튜브 분산액과 실리카졸의 혼합액을 제조하는 단계; 및 (S3) 상기 혼합액으로부터 얻어지는 침전물을 여과 및 건조하여 탄소 나노 튜브와 규소 산화물이 결합된 입자의 분말을 제조하는 단계; 및 (S4) 상기 분말을 고분자 수지와 혼합하고 경화시키는 단계;를 포함하는 열전도성 복합체의 제조방법.6. (S1) preparing a carbon nanotube dispersion; (S2) preparing a mixture of the carbon nanotube dispersion and silica sol; And (S3) filtering and drying the precipitate obtained from the mixed solution to prepare a powder of carbon nanotubes and silicon oxide combined particles; And (S4) mixing and curing the powder with a polymer resin.
7. 청구항 6에 있어서, 상기 탄소 나노 튜브 분산액은 탄소 나노 튜브, 분산제 및 분산매를 포함하는 열전도성 복합체의 제조방법.7. The method of claim 6, wherein the carbon nanotube dispersion comprises a carbon nanotube, a dispersant, and a dispersion medium.
8. 청구항 7에 있어서, 상기 탄소 나노 튜브는 미리 산처리되거나 처리되지 않은 탄소 나노 튜브인 열전도성 복합체의 제조방법.8. The method for producing a thermally conductive composite according to claim 7, wherein the carbon nanotubes are carbon nanotubes which have not been acid treated or pretreated.
9. 청구항 7에 있어서, 상기 분산제는 도데실술폰산나트륨, 도데실벤젠술폰산나트륨 또는 이들의 혼합물인 열전도성 복합체의 제조방법.9. The method according to claim 7, wherein the dispersing agent is sodium dodecyl sulfonate, sodium dodecylbenzenesulfonate or a mixture thereof.
10. 청구항 6에 있어서, 상기 실리카졸은 알콕시기의 탄소수가 1-20인 테트라알콕시실란 화합물 1몰에 대하여, 알코올계 용매 2 내지 15몰, H2O 2 내지 5몰 및 산촉매 0.001 내지 0.01몰이 혼합되어 형성되는 열전도성 복합체의 제조방법.10. The method according to claim 6, wherein the silica sol is based on 1 mol of tetraalkoxysilane compound having 1-20 carbon atoms of the alkoxy group, 2-15 mol of alcohol solvent, 2-5 mol of H 2 O and 0.001-0.01 mol of acid catalyst. Method for producing a thermally conductive composite is formed by mixing.
11. 청구항 6에 있어서, 상기 고분자 수지는 에폭시 수지, 페놀 수지 및 멜라민 수지로 이루어진 군에서 선택되는 적어도 하나인 열경화성 수지; 폴리에틸렌 수지, 폴리프로필렌 수지, 폴리 스티렌 수지, 폴리염화비닐 수지, 폴리아미드 수지, 폴리에틸렌테레프탈레이트 수지 및 아크릴 수지로 이루어진 군에서 선택되는 열가소성 수지; 또는 이들의 혼합물인 열전도성 복합체의 제조방법.11. The method according to claim 6, wherein the polymer resin is at least one selected from the group consisting of an epoxy resin, a phenol resin and a melamine resin thermosetting resin; Thermoplastic resins selected from the group consisting of polyethylene resins, polypropylene resins, polystyrene resins, polyvinyl chloride resins, polyamide resins, polyethylene terephthalate resins and acrylic resins; Or a mixture thereof.
12. 청구항 6에 있어서, (S4) 단계에서 경화제를 추가적으로 더 혼합하는 열전도성 복합체의 제조방법.
12. The method for preparing a thermally conductive composite according to claim 6, wherein the curing agent is further mixed in the step (S4).
본 발명의 열전도성 수지 복합체는 다량의 탄소 나노 튜브를 함유할 수 있다.The thermally conductive resin composite of the present invention may contain a large amount of carbon nanotubes.
또한, 본 발명의 열전도성 수지 복합체는 열전도성이 우수하며, 특히 고열에서도 그 구조가 붕괴되지 않아 열내구성이 우수하다.In addition, the thermally conductive resin composite of the present invention is excellent in thermal conductivity, and in particular, its structure does not collapse even at high temperatures, and thus is excellent in thermal durability.
본 발명의 열전도성 수지 복합체의 제조방법은 다량의 탄소 나노 튜브를 함유하는 수지 복합체를 제조할 수 있다.The method for producing a thermally conductive resin composite of the present invention can produce a resin composite containing a large amount of carbon nanotubes.
본 발명의 열전도성 수지 복합체의 제조방법은 간단한 방법으로 열전도성 수지 복합체를 제조할 수 있다.
The method for producing a thermally conductive resin composite of the present invention can produce a thermally conductive resin composite by a simple method.
본 발명은 탄소 나노 튜브와 규소 산화물이 결합된 입자가 고분자 수지 내부에 분산됨으로써, 다량의 탄소 나노 튜브를 함유하여 열전도성이 우수하며, 특히 고열에서도 그 구조가 붕괴되지 않아 열내구성이 우수한 탄소 나노 튜브를 함유한 열전도성 수지 복합체 및 그 제조방법에 관한 것이다.
According to the present invention, carbon nanotubes and silicon oxide-bonded particles are dispersed in a polymer resin, thereby containing a large amount of carbon nanotubes, and having excellent thermal conductivity. The present invention relates to a thermally conductive resin composite containing a tube and a method of manufacturing the same.
이하 본 발명을 보다 상세하게 설명하도록 한다.Hereinafter, the present invention will be described in more detail.
본 발명의 열전도성 수지 복합체는 탄소 나노 튜브와 규소 산화물이 결합된 입자가 고분자 수지 내부에 분산된 구조를 갖는다.The thermally conductive resin composite of the present invention has a structure in which particles in which carbon nanotubes and silicon oxides are bonded are dispersed in a polymer resin.
본 발명의 열전도성 수지 복합체의 내부에 분산된 탄소 나노 튜브와 규소 산화물이 결합된 입자는 탄소 나노 튜브와 규소 산화물이 물리적으로 결합되거나 화학적으로 결합되어 형성된 입자이다. 물리적 결합은 탄소 나노 튜브와 규소 산화물이 단순히 부착되어 있는 구조이며, 화학적 결합은 탄소 나노 튜브와 규소 산화물이 화학적 결합으로 연결된 구조이다. The particles in which the carbon nanotubes and the silicon oxide dispersed in the heat conductive resin composite of the present invention are bonded are particles formed by physically or chemically bonding the carbon nanotubes and the silicon oxide. Physical bonds are structures in which carbon nanotubes and silicon oxides are simply attached, and chemical bonds are structures in which carbon nanotubes and silicon oxides are connected by chemical bonds.
탄소 나노 튜브와 규소 산화물 사이에 화학적 결합을 형성하는 일 구현예로는 탄소 나노 튜브를 산처리함으로써 그 표면에 반응성기를 도입하고, 이를 실리카졸과 반응시킴으로써 화학적 결합으로 연결된 탄소 나노 튜브와 규소 산화물의 입자를 얻을 수 있다.In one embodiment of forming a chemical bond between the carbon nanotubes and the silicon oxide, the carbon nanotubes are acid-treated to introduce a reactive group on the surface thereof, and react with the silica sol to form a chemical bond between the carbon nanotubes and the silicon oxide. Particles can be obtained.
본 발명의 열전도성 수지 복합체는 탄소 나노 튜브를 규소 산화물과 결합시킨 입자를 사용함으로써 종래기술과는 달리 고분자 수지 내에 탄소 나노 튜브를 다량으로 분산시킬 수 있다. 예를 들면, 상기 입자는 열전도성 수지 복합체 100 중량부에 대하여 30 중량부까지(이하), 보다 바람직하게는 25 중량부까지 포함될 수 있다. 실제적으로는 이를 초과하는 함량도 가능하나, 30 중량부를 초과하게 되면 수지 복합체가 성형이나 경화가 효과적으로 수행되지 않을 수 있다. 본 발명의 열전도성 수지 복합체는 탄소 나노 튜브를 다량으로 포함하는 것이 특징이므로, 그 하한에는 특별한 제한이 없다. 예를 들면 열전도성 수지 복합체 100 중량부에 대하여 0.5 중량부까지 포함될 수 있으나, 이에 한정되는 것은 아니다.The thermally conductive resin composite of the present invention can disperse a large amount of carbon nanotubes in a polymer resin unlike the prior art by using particles in which carbon nanotubes are bonded to silicon oxide. For example, the particles may be included up to 30 parts by weight (less than), more preferably up to 25 parts by weight with respect to 100 parts by weight of the thermally conductive resin composite. In practice, the content exceeding this is possible, but when it exceeds 30 parts by weight, the resin composite may not be effectively formed or cured. Since the thermally conductive resin composite of the present invention is characterized by including a large amount of carbon nanotubes, the lower limit thereof is not particularly limited. For example, it may be included up to 0.5 parts by weight based on 100 parts by weight of the thermally conductive resin composite, but is not limited thereto.
또한, 규소 산화물을 그 자체로 열전도성을 가지고 있는데, 본 발명에 따라 탄소 나노 튜브와 결합하게 되는 경우, 그 복합체의 열전도성이 현저하게 상승하게 된다.In addition, the silicon oxide itself has a thermal conductivity, when combined with the carbon nanotubes according to the present invention, the thermal conductivity of the composite is significantly increased.
본 발명의 열전도성 수지 복합체에 있어서, 사용가능한 고분자 수지는 특별한 제한이 없다. 통상적인 열경화성 수지, 열가소성 수지 또는 이들의 혼합물을 사용할 수 있다. 열경화성 수지로는 에폭시 수지, 페놀 수지, 멜라민 수지 등을 각각 단독으로 또는 2종 이상 혼합하여 사용할 수 있으며, 열가소성 수지로는 폴리에틸렌 수지, 폴리프로필렌 수지, 폴리 스티렌 수지, 폴리염화비닐 수지, 폴리아미드 수지, 폴리에틸렌테레프탈레이트 수지, 아크릴 수지 등을 각각 단독으로 또는 2종 이상 혼합하여 사용할 수 있다.
In the thermally conductive resin composite of the present invention, the polymer resin usable is not particularly limited. Conventional thermosetting resins, thermoplastic resins or mixtures thereof can be used. As the thermosetting resin, an epoxy resin, a phenol resin, a melamine resin, or the like may be used alone or as a mixture of two or more thereof.As the thermoplastic resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and polyamide resin may be used. , Polyethylene terephthalate resin, acrylic resin and the like can be used alone or in combination of two or more thereof.
이하에서는 본 발명의 열전도성 수지 복합체를 제조하는 방법의 일 구현예를 상세하게 설명하도록 한다.Hereinafter will be described in detail an embodiment of a method for producing a thermally conductive resin composite of the present invention.
먼저, 탄소 나노 튜브 분산액을 준비한다(S1).First, a carbon nanotube dispersion is prepared (S1).
탄소 나노 튜브 분산액은 탄소 나노 튜브, 분산제 및 분산매를 포함하여 제조될 수 있다. The carbon nanotube dispersion may be prepared by including carbon nanotubes, a dispersant, and a dispersion medium.
탄소 나노 튜브(CNT)는 통상의 아크(arc) 방전법, 레이저 증착법, 플라즈마 화학기상증착법, 기상 합성법, 열분해법 등과 같은 방법으로 제조된 후 열처리된 것일 수 있다. 위 합성법에 의해 제조된 생성물에는 합성된 탄소 나노 튜브와 함께 비정질 탄소 또는 결정성 흑연 입자와 같은 탄소 불순물과 촉매 전이금속 입자 등이 존재한다. 예컨대, 아크 방전법으로 제조되는 경우 생성물 100중량% 중에 탄소 나노 튜브 15-30중량%, 탄소 불순물 45-70중량% 및 촉매 전이금속 입자 5-25중량%가 포함된다. 이와 같이 불순물이 함유된 탄소 나노 튜브를 정제과정 없이 직접 코팅액에 적용하는 경우 코팅액의 분산성과 코팅성이 저하되고 탄소 나노 튜브 고유의 독특한 물성이 제대로 발현되기 어렵다. 따라서, 본 발명에서는 아크 방전법으로 제조된 생성물을 열처리하여 불순물을 최대한 제거시킨 탄소 나노 튜브를 사용한다. 구체적으로, 위 합성법에 의해 제조된 생성물을 시트 또는 평균직경이 2-5㎜인 과립 형상으로 만든 후 진행방향(수평 기준)에 대하여 아래쪽으로 1-5° 각도로 경사진 회전성 반응기에 투입하고, 회전성 반응기를 350-500℃로 가열하면서 산화성 가스를 위 투입된 생성물 1g에 대하여 200-500㏄/분의 속도로 공급하여 60-150분 동안 열처리한다. 이때, 경사진 회전성 반응기가 5-20rpm의 속도로 회전함으로써 생성물이 분산되면서 접촉 표면적이 최대화되는 동시에 자동적으로 진행방향으로 이동하여 산화성 가스와의 접촉 표면적이 최대화되고 국부적인 산화가 방지된 상태로 열처리된다. 이 방법에 의하면, 투입된 생성물의 무게가 60-85% 감소되어 고순도의 탄소 나노 튜브가 수득된다.The carbon nanotubes (CNTs) may be manufactured by a conventional method such as an arc discharge method, a laser deposition method, a plasma chemical vapor deposition method, a vapor phase synthesis method, a pyrolysis method, or the like and then heat-treated. The carbon nanotubes synthesized by the above synthesis method include carbon impurities such as amorphous carbon or crystalline graphite particles and catalyst transition metal particles. For example, when manufactured by an arc discharge method, 15-30 wt% of carbon nanotubes, 45-70 wt% of carbon impurities, and 5-25 wt% of catalyst transition metal particles are contained in 100 wt% of the product. When the impregnated carbon nanotubes are directly applied to the coating solution without purification, the dispersibility and coating properties of the coating solution are deteriorated, and unique physical properties inherent to the carbon nanotubes are hardly manifested. Therefore, in the present invention, carbon nanotubes in which impurities are removed as much as possible by heat treatment of a product produced by an arc discharge method are used. Specifically, the product prepared by the above synthesis method is made into a sheet or granule shape having an average diameter of 2-5 mm, and then put into a rotary reactor inclined at an angle of 1-5 ° downward with respect to the advancing direction (horizontal basis). Heat the rotary reactor to 350-500 ° C. while supplying an oxidizing gas at a rate of 200-500 kPa / min to 1 g of the product introduced above and heat-treating for 60-150 minutes. At this time, the inclined rotatable reactor rotates at a speed of 5-20 rpm to maximize the contact surface area while dispersing the product and automatically move in the advancing direction to maximize the contact surface area with the oxidizing gas and prevent local oxidation. Heat treatment. According to this method, the weight of the charged product is reduced by 60-85%, so that high-purity carbon nanotubes are obtained.
탄소 나노 튜브는 총 100중량% 중에 탄소 불순물이 40중량% 이하, 보다 바람직하게는 25중량% 이하로 포함된 것이 분산성과 안정성뿐만 아니라 수지 복합체의 열전도성 확보에 있어서 좋다.The carbon nanotubes contain carbon impurities in an amount of not more than 40% by weight, more preferably not more than 25% by weight, in the total 100% by weight of the carbon nanotubes in terms of dispersibility and stability as well as securing the thermal conductivity of the resin composite.
탄소 나노 튜브는 단일벽 탄소 나노 튜브, 이중벽 탄소 나노 튜브 또는 다중벽 탄소 나노 튜브일 수 있으며, 이들은 단독 또는 2종 이상 조합하여 사용할 수 있다.The carbon nanotubes may be single-walled carbon nanotubes, double-walled carbon nanotubes, or multi-walled carbon nanotubes, which may be used alone or in combination of two or more.
본 발명에 따른 탄소 나노 튜브는 분산액에 포함되기 전에 미리 산처리되거나 산처리 되지 않은 것일 수 있다. 산처리된 탄소 나노 튜브는 그 표면에 반응성기를 갖게 된다. 이러한 반응성기는 추후 규소 산화물과 화학적 결합을 형성하게 되는 부분이다. 반응성기의 구체적인 예로는 히드록시기 또는 카르복시기를 들 수 있다.The carbon nanotubes according to the present invention may be acid-treated or acid-treated before being incorporated into the dispersion. The acid-treated carbon nanotubes have a reactive group on their surface. This reactive group is the part which will form a chemical bond with silicon oxide later. Specific examples of the reactive group include a hydroxy group and a carboxy group.
분산제는 음이온계 계면활성제라면 그 종류가 특별히 한정되지 않으나, 도데실술폰산나트륨(sodium dodecylsulfonate, SDS) 또는 도데실벤젠술폰산나트륨(sodium dodecyl benzene sulfonate, NaDDBS) 탄소 나노 튜브와의 상용성이 우수하여 분산성을 극대화시킬 수 있다는 점에서 바람직하다.The dispersant is not particularly limited as long as it is an anionic surfactant. However, it is excellent in compatibility with sodium dodecylsulfonate (SDS) or sodium dodecyl benzene sulfonate (NaDDBS) carbon nanotubes, It is preferable in terms of maximizing acidity.
분산매로는 통상적으로 물(H2O)이 사용될 수 있다.As a dispersion medium, water (H 2 O) may be generally used.
다음으로, 탄소 나노 튜브 분산액과 실리카졸의 혼합액을 제조한다(S2).Next, a mixture of carbon nanotube dispersions and silica sol is prepared (S2).
실리카졸은 알콕시기의 탄소수가 1-20인 테트라알콕시실란 화합물 1몰에 대하여, 알코올계 용매 2 내지 15몰, H2O 2 내지 5몰 및 산촉매 0.001 내지 0.01몰이 혼합되어 졸-겔 반응에 의해 형성될 수 있다. 상기 성분들이 상기 함량 범위로 혼합되는 경우에 졸-겔 반응이 잘 일어나며 탄소 나노 튜브 분산액과의 혼합 시에 탄소 나노 튜브와 규소 이산화물이 결합된 입자를 제조하는 데에 우수한 수율을 나타낼 수 있다.Silica sol is mixed with 2 to 15 mol of alcohol solvent, 2 to 5 mol of H 2 O, and 0.001 to 0.01 mol of acid catalyst with respect to 1 mol of tetraalkoxysilane compound having 1-20 carbon atoms in the alkoxy group, and then sol-gel reaction. Can be formed. When the components are mixed in the content range, the sol-gel reaction occurs well, and when mixed with the carbon nanotube dispersion, the carbon nanotubes and the silicon dioxide may be combined to produce an excellent yield.
테트라알콕시실란 화합물은 실리카졸을 형성하기 위한 성분으로서 알콕시기는 직쇄 또는 분지쇄일 수 있으며 탄소수가 1-20인 것이 바람직하다. 그 중에서도 테트라에톡시실란, 테트라메톡시실란, 테트라-n-프로폭시실란 또는 이들의 올리고머 등이 바람직하며, 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The tetraalkoxysilane compound is a component for forming a silica sol. The alkoxy group may be linear or branched, and preferably has 1-20 carbon atoms. Especially, tetraethoxysilane, tetramethoxysilane, tetra-n-propoxysilane, these oligomers, etc. are preferable, These can be used individually or in mixture of 2 or more types.
알코올계 용매와 물은 실리카졸의 형성 시 가수분해에 영향을 미치기 위한 것이다. 알코올계 용매는 가수분해 반응에 사용되는 점을 고려하여 친수성 알코올계 용매인 것이 좋다. 구체적으로, 메탄올, 에탄올, n-프로판올, 이소프로판올, n-부탄올, 이소부탄올, sec-부탄올, tert-부탄올, n-아밀알코올, 이소아밀알코올, sec-아밀알코올, tert-아밀알코올, 1-에틸-1-프로판올, 2-메틸-1-부탄올, n-헥산올 또는 시클로헥산올 등을 들 수 있으며, 이들은 단독 또는 2종 이상 조합하여 사용할 수 있다.Alcohol solvents and water are intended to affect the hydrolysis during the formation of the silica sol. The alcohol solvent is preferably a hydrophilic alcohol solvent in consideration of being used in the hydrolysis reaction. Specifically, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, n-amyl alcohol, isoamyl alcohol, sec-amyl alcohol, tert-amyl alcohol, 1-ethyl -1-propanol, 2-methyl-1-butanol, n-hexanol, cyclohexanol, etc. are mentioned, These can be used individually or in combination of 2 or more types.
산촉매는 실리카졸에 적정 가교도를 부여하기 위한 것으로서, 염산, 황산, 인산, 질산, 희석된 플루오르화 수소산 등을 들 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다.The acid catalyst is for imparting an appropriate degree of crosslinking to the silica sol, and may include hydrochloric acid, sulfuric acid, phosphoric acid, nitric acid, diluted hydrofluoric acid, and the like, which may be used alone or in combination of two or more thereof.
상기 성분들을 적절하게 혼합함으로써 졸-겔 반응에 의한 실리카졸을 얻을 수 있게 된다. 본 발명에 따른 상기 실리카졸은 별도로 제조된 탄소 나노 튜브 분산액과 혼합하게 된다. 이 때 탄소 나노 튜브 분산액과 실리카졸의 혼합은 상기 분산액 내의 탄소 나노 튜브의 구체적인 농도나 실리카졸 내의 알콕시실란 화합물의 구체적인 농도에 따라 적절한 비율로 수행될 수 있다. 바람직하게는, 혼합되어 추후 제조되는 탄소 나노 튜브와 규소 산화물의 결합 입자에서 탄소나노튜브:규소산화물의 중량비가 1:10 내지 1:1 정도가 되도록 혼합하는 것이 바람직하다. 결합입자에서 탄소 나노 튜브와 규소 산화물의 중량비가 상기 범위인 경우에 가공성, 열전도성 등의 측면에서 바람직하다.By appropriately mixing the above components, it is possible to obtain a silica sol by a sol-gel reaction. The silica sol according to the present invention is mixed with the carbon nanotube dispersion prepared separately. In this case, mixing of the carbon nanotube dispersion and the silica sol may be performed at an appropriate ratio depending on the specific concentration of the carbon nanotubes in the dispersion or the specific concentration of the alkoxysilane compound in the silica sol. Preferably, it is preferable to mix so that the weight ratio of carbon nanotube: silicon oxide is about 1:10 to 1: 1 in the combined particles of the carbon nanotube and silicon oxide which are mixed and manufactured later. In the case where the weight ratio of carbon nanotubes to silicon oxide in the bonded particles is in the above range, it is preferable in view of processability, thermal conductivity and the like.
다음으로, 상기 혼합액으로부터 얻어지는 침전물을 여과 및 건조하여 탄소 나노 튜브와 규소 산화물이 결합된 입자의 분말을 제조한다(S3).Next, the precipitate obtained from the mixed solution is filtered and dried to prepare a powder of particles in which carbon nanotubes and silicon oxide are combined (S3).
제조된 실리카졸을 별도로 제조된 탄소 나노 튜브 분산액과 교반하면서 충분히 혼합하면, 침전물이 생성된다. 이 때 필요에 따라 알코올계 용매를 제거하고 수세하는 과정을 더 거칠 수 있다.When the prepared silica sol is sufficiently mixed with the separately prepared carbon nanotube dispersion with stirring, a precipitate is produced. At this time, the process of removing the alcohol solvent and washing with water may be further subjected to necessity.
상기 얻어진 침전물을 여과하고, 필요에 따라 감압증류를 수행하여 용매를 제거하면 탄소 나노 튜브와 규소 산화물이 결합된 입자들의 분말을 얻을 수 있다. 이 때, 산처리 되지 않은 탄소 나노 튜브를 사용하게 되면 탄소 나노 튜브와 규소 산화물이 물리적으로 결합된 입자를 얻게 되며, 산처리된 탄소 나노 튜브를 사용하게 되면 탄소 나노 튜브와 규소 산화물이 화학적으로 결합된 입자를 얻게 된다.The obtained precipitate is filtered, and if necessary, distillation under reduced pressure is carried out to remove the solvent, thereby obtaining a powder of particles in which carbon nanotubes and silicon oxide are combined. In this case, when carbon nanotubes that are not acid treated are used, particles obtained by physically combining carbon nanotubes and silicon oxides are obtained. When carbon nanotubes that are acid treated are used, carbon nanotubes and silicon oxides are chemically bonded. You get the particles.
다음으로, 상기 분말을 고분자 수지와 혼합하고 경화시킨다(S4).Next, the powder is mixed with the polymer resin and cured (S4).
고분자 수지는 앞서 설명한 바와 같이, 통상적으로 사용되는 고분자 수지가 특별한 제한이 없이 사용 가능하다. 고분자 수지와 상기 얻어진 분말을 혼합한 후, 구체적인 고분자 수지의 종류에 따라 적절한 방법으로 경화시켜 본 발명의 열전도성 수지 복합체를 얻을 수 있다.As described above, the polymer resin may be used without any particular limitation. After mixing a polymer resin and the said powder, it can harden by an appropriate method according to the kind of specific polymer resin, and the thermally conductive resin composite of this invention can be obtained.
고분자 수지와 상기 얻어진 분말을 혼합한 후에는 구체적인 용도에 따라 수지 복합체를 성형하는 공정을 더 거칠 수 있다. 요구되는 형태에 따라 성형을 한 후에 경화과정을 거치게 되면 필요한 형태의 수지 복합체를 제조할 수 있다.After mixing the polymer resin and the obtained powder may be further subjected to the step of molding the resin composite according to the specific use. After molding according to the required shape and the curing process can be produced a resin composite of the required form.
필요에 따라, 상기 경화 과정은 경화제를 더 포함시켜 수행될 수 있다. 경화제의 구체적인 종류는 사용되는 고분자 수지의 구체적인 종류 및 경화 조건에 따라 당분야에서 사용되는 경화제가 제한 없이 사용될 수 있다. 예를 들어, 고분자 수지로서 페놀수지를 사용하는 헥사메틸렌테트라민계 화합물을 경화제로 사용할 수 있으며, 에폭시 수지를 사용하는 경우에는 아민계 화합물을 경화제로 사용할 수 있다. 아민계 화합물의 보다 구체적인 예로는 저분자 아민 화합물과 아민 부가생성물을 사용할 수 있으며, 이들은 병용하여 사용할 수 있다. 저분자 아민 화합물로는 1급, 2급 또는 3급 아미노기를 갖는 저분자 화합물을 들 수 있으며, 아민 부가생성물은 카르복실산 화합물, 술폰산 화합물, 이소시아네이트 화합물, 요소 화합물 또는 에폭시 수지 화합물 중 1종 이상의 화합물과 아민 화합물을 반응시켜 얻어지는 아미노기를 갖는 화합물을 의미한다.
If necessary, the curing process may be performed by further including a curing agent. Specific types of the curing agent may be used without limitation, the curing agent used in the art according to the specific type and curing conditions of the polymer resin used. For example, a hexamethylenetetramine compound using a phenol resin as a polymer resin can be used as a curing agent, and when an epoxy resin is used, an amine compound can be used as a curing agent. As a more specific example of the amine compound, a low molecular amine compound and an amine adduct may be used, and these may be used in combination. As the low molecular amine compound, there may be mentioned a low molecular compound having a primary, secondary or tertiary amino group, and the amine adduct may be a carboxylic acid compound, a sulfonic acid compound, an isocyanate compound, a urea compound or an epoxy resin compound. The compound which has an amino group obtained by making an amine compound react is meant.
이하, 본 발명의 이해를 돕기 위하여 바람직한 실시예를 제시하나, 이들 실시예는 본 발명을 예시하는 것일 뿐 첨부된 특허청구범위를 제한하는 것이 아니며, 본 발명의 범주 및 기술사상 범위 내에서 실시예에 대한 다양한 변경 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속하는 것도 당연한 것이다. Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims, which are within the scope and spirit of the present invention. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.
실시예Example 1 One
<탄소 나노 튜브 분산액 제조><Preparation of Carbon Nanotube Dispersion>
아크 방전법으로 합성된 탄소 나노 튜브(SA100, ㈜나노솔루션)를 경사각도가 3°인 로터리 킬른 회전성 반응기를 이용하여 5-20rpm의 회전속도, 420℃의 온도, 250㏄/분의 산화성 가스 공급 속도로 100분 동안 열처리하여 탄소 불순물의 함량이 15%인 탄소 나노 튜브를 사용하였다. 상기 탄소 나노 튜브 0.08중량부, 도데실벤젠술폰산나트륨(NaDDBS) 0.08중량부 및 물 99.90중량부를 혼합하고 30분 동안 초음파분산기로 처리하였다. 처리된 용액을 6,000rpm으로 12분 동안 원심분리하여 탄소 나노 튜브 분산액을 제조하였다.The carbon nanotubes (SA100, NanoSolution Co., Ltd.), synthesized by the arc discharge method, were rotated at a speed of 5-20 rpm, a temperature of 420 ° C., and an oxidizing gas of 250 mW / min using a rotary kiln rotary reactor having an inclination angle of 3 °. Heat treatment for 100 minutes at the feed rate was used to the carbon nanotubes with a carbon impurity content of 15%. 0.08 parts by weight of the carbon nanotube, 0.08 parts by weight of sodium dodecylbenzenesulfonate (NaDDBS) and 99.90 parts by weight of water were mixed and treated with an ultrasonic disperser for 30 minutes. The treated solution was centrifuged at 6,000 rpm for 12 minutes to prepare a carbon nanotube dispersion.
<< 실리카졸Silica sol 제조> Manufacturing>
테트라에톡시실란 20.83g, 에탄올 46g, 염산수용액(0.18% 수용액) 0.36g 및 물(DI) 7.2g을 24시간 동안 혼합하여 졸-겔 반응시켜 실리카졸을 제조하였다.20.83 g of tetraethoxysilane, 46 g of ethanol, 0.36 g of aqueous hydrochloric acid solution (0.18% aqueous solution), and 7.2 g of water (DI) were mixed for 24 hours to prepare a sol-gel reaction.
<탄소 나노 튜브-규소 산화물 결합 입자 제조><Production of Carbon Nanotube-Silicon Oxide Bond Particles>
제조된 탄소 나노 튜브 분산액과 실리카졸을 10:1의 중량비로 혼합하고 Rotary Evaporator를 사용하여 에탄올을 제거하고, 암모니아수로 수세하였다. 이 후 침전물이 생성되면 이를 여과하고 건조하여 탄소 나노 튜브-규소 산화물 결합 입자의 분말을 얻었다.The prepared carbon nanotube dispersion and silica sol were mixed in a weight ratio of 10: 1, ethanol was removed using a rotary evaporator, and washed with ammonia water. After the precipitate was produced it was filtered and dried to obtain a powder of carbon nanotube-silicon oxide bonding particles.
<< 열전도성Thermal conductivity 수지 복합체 제조> Resin Composite Manufacturing>
제조된 분말 13.9 중량부를 에폭시 수지(YD128, 국도화학) 100 중량부 및 경화제(KFH-150, 국도화학) 25중량부와 혼합하고, 이를 성형후 치수가 지름 25.4 mm, 두께 1~1.5mm인 금형에 주입하고 80℃ 건조기에 넣고 50분간 1차 경화를 진행 후 hot press를 이용하여 100℃ 에서 1시간 동안 2차 경화를 실시하여 열전도성 수지 복합체를 제조하였다.13.9 parts by weight of the prepared powder is mixed with 100 parts by weight of epoxy resin (YD128, Kukdo Chemical) and 25 parts by weight of a curing agent (KFH-150, Kukdo Chemical), and after molding, a mold having a diameter of 25.4 mm and a thickness of 1 to 1.5 mm Injected into a 80 ℃ drier and the primary curing for 50 minutes and then subjected to secondary curing for 1 hour at 100 ℃ using a hot press to prepare a thermally conductive resin composite.
실시예Example 2-5 2-5
하기 표 1에 나타낸 바와 같은 조성으로 탄소 나노 튜브 분산액 및 실리카졸을 제조 및 혼합한 것을 제외하고는 실시예 1과 동일하게 열전도성 수지 복합체를 제조하였다.A thermally conductive resin composite was prepared in the same manner as in Example 1, except that the carbon nanotube dispersion and the silica sol were prepared and mixed in the composition as shown in Table 1 below.
(단위는 중량%)Carbon Nanotube Dispersion (A)
(Unit is weight%)
(단위는 g)Silica sol (B)
(Unit is g)
(A:B)Mixed weight ratio of A and B
(A: B)
(CNT:규소산화물)Weight Ratio of CNT and Silicon Oxide in Bound Particles
(CNT: silicon oxide)
(중량부)Content of binder particles compared to 100 parts by weight of resin composite
(Parts by weight)
분산제: NaDDBS
산촉매: 0.18% 염산 수용액CNT: carbon nanotube heat-treated with SA100 (carbon impurity content: 15%)
Dispersant: NaDDBS
Acid catalyst: 0.18% hydrochloric acid aqueous solution
비교예Comparative example 1 One
탄소 나노 튜브 분말 13.9 중량부를 에폭시 수지(YD128, 국도화학) 100 중량부 및 경화제(KFH-150, 국도화학) 25중량부와 혼합한 후, 실시예 1과 동일한 방법으로 수지 복합체를 제조하였다.After mixing 13.9 parts by weight of carbon nanotube powder with 100 parts by weight of epoxy resin (YD128, Kukdo Chemical) and 25 parts by weight of a curing agent (KFH-150, Kukdo Chemical), a resin composite was prepared in the same manner as in Example 1.
비교예Comparative example 2 2
탄소 나노 튜브 분말 2.5 중량부를 에폭시 수지(YD128, 국도화학) 100 중량부 및 경화제(KFH-150, 국도화학) 25중량부와 혼합한 후, 실시예 1과 동일한 방법으로 수지 복합체를 제조하였다.2.5 parts by weight of carbon nanotube powder After mixing with 100 parts by weight of epoxy resin (YD128, Kukdo Chemical) and 25 parts by weight of a curing agent (KFH-150, Kukdo Chemical), a resin composite was prepared in the same manner as in Example 1.
비교예Comparative example 3 3
에폭시 수지(YD128, 국도화학) 100 중량부 및 경화제(KFH-150, 국도화학) 25중량부와 혼합하여 에폭시수지로 형성된 수지를 제조하였다.
A resin formed of an epoxy resin was prepared by mixing 100 parts by weight of an epoxy resin (YD128, Kukdo Chemical) and 25 parts by weight of a curing agent (KFH-150, Kukdo Chemical).
실험예Experimental Example : 열전도도 측정: Thermal conductivity measurement
상기 제조된 실시예들 및 비교예들의 수지 복합체로 열전도도 측정용 시편을 제조 하였다. 단, 비교예 1의 경우에는 금형 내부에서 수지의 경화가 제대로 진행되지 않아 시편 자체가 제조되지 않았다.Specimens for measuring thermal conductivity were prepared using the resin composites of the prepared examples and comparative examples. However, in Comparative Example 1, the curing of the resin did not proceed properly in the mold, and thus the specimen itself was not manufactured.
열전도도의 측정은 독일 Netzsch사의 Nanoflash (모델명: NFA447)을 이용하여, In Plane 열전도도를 측정하였으며, 그 결과는 하기 표 2에 기재하였다.In the measurement of thermal conductivity, Inplane thermal conductivity was measured using Nanoflash (model name: NFA447) manufactured by Netzsch, Germany, and the results are shown in Table 2 below.
(W/mK)In Plane
(W / mK)
표 2를 참고하면, 실시예들의 시편이 비교예들보다 열전도성이 현저하게 우수한 것을 알 수 있다.Referring to Table 2, it can be seen that the specimens of the examples are significantly superior in thermal conductivity than the comparative examples.
구체적으로는, 탄소 나노 튜브를 첨가하지 않은 비교예 3에 비해서는 최소 3배, 최대 12배까지 열전도도가 상승하였음을 알 수 있다.Specifically, it can be seen that the thermal conductivity is increased by at least 3 times and at most 12 times as compared with Comparative Example 3 without adding the carbon nanotubes.
또한, 탄소 나노 튜브를 시편을 제조할 수 있는 최대 함량으로 첨가한 비교예 2와 비교하면, 최소 약 2배, 최대 8배만큼 열전도도가 향상된 것을 알 수 있다. In addition, it can be seen that the thermal conductivity is improved by at least about 2 times and at most 8 times compared to Comparative Example 2 in which the carbon nanotubes are added in the maximum content to prepare the specimen.
Claims (12)
A thermally conductive resin composite in which carbon nanotubes and silicon oxide-bonded particles are dispersed in a polymer resin.
The thermally conductive resin composite of claim 1, wherein the bond between the carbon nanotubes and the silicon oxide is a physical bond or a chemical bond.
The thermally conductive resin composite according to claim 2, wherein the chemical bond is a bond between a silicon oxide and a reactive group formed on the surface of the acid treated carbon nanotubes.
The thermally conductive resin composite of claim 1, wherein the particles are included in an amount of 30 parts by weight or less based on 100 parts by weight of the thermally conductive resin composite.
The method of claim 1, wherein the polymer resin is at least one selected from the group consisting of an epoxy resin, a phenol resin and a melamine resin thermosetting resin; Thermoplastic resins selected from the group consisting of polyethylene resins, polypropylene resins, polystyrene resins, polyvinyl chloride resins, polyamide resins, polyethylene terephthalate resins and acrylic resins; Or a thermally conductive resin composite thereof.
(S2) 상기 탄소 나노 튜브 분산액과 실리카졸의 혼합액을 제조하는 단계; 및
(S3) 상기 혼합액으로부터 얻어지는 침전물을 여과 및 건조하여 탄소 나노 튜브와 규소 산화물이 결합된 입자의 분말을 제조하는 단계; 및
(S4) 상기 분말을 고분자 수지와 혼합하고 경화시키는 단계;
를 포함하는 열전도성 복합체의 제조방법.
(S1) preparing a carbon nanotube dispersion;
(S2) preparing a mixture of the carbon nanotube dispersion and silica sol; And
(S3) filtering and drying the precipitate obtained from the mixed solution to prepare a powder of carbon nanotubes and silicon oxide combined particles; And
(S4) mixing and curing the powder with a polymer resin;
Method for producing a thermally conductive composite comprising a.
The method of claim 6, wherein the carbon nanotube dispersion comprises a carbon nanotube, a dispersant, and a dispersion medium.
The method of claim 7, wherein the carbon nanotubes are pre-acid treated or untreated carbon nanotubes.
The method of claim 7, wherein the dispersant is sodium dodecyl sulfonate, sodium dodecylbenzene sulfonate, or a mixture thereof.
The method of claim 6, wherein the silica sol is mixed with 2 to 15 mol of alcohol solvent, 2 to 5 mol of H 2 O 2 and 0.001 to 0.01 mol of acid catalyst with respect to 1 mol of tetraalkoxysilane compound having 1-20 carbon atoms in the alkoxy group. Method for producing a thermally conductive composite formed.
The method of claim 6, wherein the polymer resin is at least one selected from the group consisting of an epoxy resin, a phenol resin and a melamine resin thermosetting resin; Thermoplastic resins selected from the group consisting of polyethylene resins, polypropylene resins, polystyrene resins, polyvinyl chloride resins, polyamide resins, polyethylene terephthalate resins and acrylic resins; Or a mixture thereof.
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