KR20130031141A - Heat generation sheet and fabrication method thereof - Google Patents

Abstract

The present invention relates to a flexible heating plate and a method of manufacturing the same, specifically, the heating plate of the present invention is a base formed of a fabric structure; An exothermic layer formed on at least a portion of the first surface of the base, and physically necked with a plurality of conductive nanoparticles; A protective layer protecting the heating layer; And a power supply unit supplying power to the heat generating layer.

Description

Heat generating sheet and its manufacturing method {Heat generation sheet and fabrication method

The present invention relates to a flexible heating plate and a method for manufacturing the same, and more particularly, to a heating plate including a nanoparticle heating film and a method for manufacturing the same.

The general planar heating element utilizes radiant heat generated by electric current, so it is easy to control the temperature and is not sanitary because it is not polluted with air. It is widely used for residential heating equipment.

Metal resistance wires such as nichrome and copper nickel alloys are mainly used as a heating source of the planar heating element, but such metal resistance wires, such as nichrome, have a contact resistance at a connection portion between the metal resistance wire and the conductor because electric current flows through one wire. There was a problem of overheating, and there was a stiff feeling by using a polymer film or the like as the cloth fabric.

Further, as a woven heating element, a fabric is formed by weaving by a plane intersecting arrangement of warp yarns and weft yarns, which are general fiber yarns, and are replaced by electric resistance wires at regular intervals in the warp yarns or weft yarns, and are perpendicular to the direction of the electrical resistance wires at both ends of the fabric. Although a woven heating element in which conductor wires are arranged is used, there is a problem that overheating occurs due to contact resistance at an intersection between the electric resistance wire and the conductor wire. Further, the conventional woven heating element has a problem that the heat generated only around the place where the conductor wire passes, and the uneven heat generation problem and the general fiber can not stand the high temperature.

It is a heat generating structure by a conductive film that is proposed to improve the problems of the resistance wire as described above, that is, uneven heat generation. The conductive film generally includes a compound thin film such as tin oxide or indium oxide, or a metal thin film such as a noble metal or copper. In recent years, CNT (carbon nano tube) is also used as a conductive film.

However, the existing exothermic thin film is not only large in area due to thermal deposition, physical vapor deposition, chemical vapor deposition, etc., but also the manufacturing cost is high because the number of processes is very large. In addition, the heating rate is also slow and consumes a lot of power.

According to an exemplary embodiment of the present invention, a heat generating plate having easy heating and low heat spreading and low power consumption, high flexibility, fast heating and cooling, and high temperature resistant is provided.

In addition, according to an exemplary embodiment of the present invention, there is provided a manufacturing method for producing a heat generating plate that is easy to form a large area heat generating layer, good quality, high flexibility, fast heating, cooling and strong at high temperature.

Heating plate according to an embodiment of the present invention for solving the above problems is formed of a fabric structure base; An exothermic layer formed on at least a portion of the first surface of the base, and physically necked with a plurality of conductive nanoparticles; A protective layer protecting the heating layer; And a power supply unit supplying power to the heat generating layer.

The fibers forming the fabric structure of the base include oxides.

The fibers forming the fabric structure of the base include glass fibers.

The nanoparticles are formed of an oxide semiconductor material.

The nanoparticles are formed of at least one of an oxide of at least one of ZnO, SnO, MgO, InO and silica.

The oxide includes a dopant.

The dopant includes at least one of In, Sb, Al, Ga, C, and Sn.

The feeding part further includes a terminal layer electrically connected to the heating layer.

The heat generating layer has a multi-layer structure by a plurality of unit layers.

The heating layer includes a unit heating layer by heterogeneous nanoparticles.

An adhesion reinforcing layer is further provided between the heating layer and the base.

The adhesion reinforcing layer includes a plurality of nanoparticles interconnected.

The nanoparticles are formed of at least one of an oxide of at least one of ZnO, SnO, MgO, InO and silica.

The oxide includes a dopant.

The dopant includes at least one of In, Sb, Al, Ga, C, and Sn.

The heat generating layer is formed in at least one of the plurality of regions defined on the first surface of the base.

Method for manufacturing a heating plate according to an embodiment of the present invention for solving the above problems is the step of coating a dispersion liquid in which nanoparticles are dispersed in a solvent on the first surface of the base formed of a fiber structure; Removing the solvent of the dispersion to form a nanoparticle layer on the first surface of the base; Heat-treating the nanoparticle layer to form a heat generating layer in which nanoparticles are necked; And forming a protective layer protecting the heat generating layer.

The fibers forming the fabric structure of the base include oxides.

Prior to forming the nanoparticles, further comprising the step of forming an adhesion strengthening layer for enhancing the adhesion of the heating layer to the base.

The fibers forming the fabric structure of the base include glass fibers.

Wherein the step of forming an adhesion reinforcing layer is a step of coating a dispersion in which nanoparticles are dispersed in a solvent; And drying the solvent and heat treating the nanoparticles.

The nanoparticles are formed of an oxide semiconductor material.

The nanoparticles include an oxide semiconductor material of at least one of an oxide of ZnO, SnO, MgO, and InO and at least one of silica.

The heat treatment is carried out at a temperature in the range of 200 ~ 500 ℃.

According to the flexible heating plate and the manufacturing method of the present invention by the above solution, the structure is simple and can be manufactured at low cost, and in particular, it can be efficiently generated because it is driven with low power consumption.

In addition, according to the heating plate and the manufacturing method of the present invention by the above solution means, the flexibility of the base does not have to take into account the shape of the secondary workpiece during manufacturing, making it easy to manufacture and deformation of the shape is easy to use wide.

In addition, according to the heating plate and the manufacturing method of the present invention by the above-described means, it is possible to extend the application range of the heating plate by reducing the heating and cooling time compared to the existing heating plate.

According to the heating plate and the manufacturing method of the present invention by the above solution, the adhesion between the base and the heat generating layer or the adhesive force between the base and the adhesion reinforcing layer can be improved and durability can be improved.

Furthermore, according to the heating plate and the manufacturing method of the present invention by the above-mentioned means, the heat dissipation treatment is not necessary when forming the heating layer or adhesive strength reinforcing layer of the base is high, the manufacturing process is easy and the manufacturing cost Can be lowered.

1 shows a basic structure of a heating plate according to an embodiment of the present invention.
FIG. 2 shows an example of a specific laminated structure of a heat generating layer of a heat generating plate according to the present invention shown in FIG. 1.
3 shows a laminated structure of a heating plate according to another embodiment of the present invention.
4 shows a laminated structure of a heating plate according to another embodiment of the present invention.
5a and 5b show a laminated structure of a heating plate according to another embodiment of the present invention having a temperature and humidity sensor
6A and 6B illustrate a planar layout of a heating layer with respect to a base in a heating plate according to still another embodiment of the present invention.
7 is a flowchart illustrating a process of manufacturing a heating plate according to an embodiment of the present invention.
8 is a flowchart illustrating a process of manufacturing a heating plate according to another embodiment of the present invention.
9 is a flowchart illustrating a process of manufacturing a heating plate according to another embodiment of the present invention.
10A and 10B show the structure of the glass fiber used for the base of the heat generating plate of the present invention.
11 is a graph showing a difference in heating and cooling rates between a heating plate using glass fibers and a heating plate using a conventional base.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing in detail the operating principle of the preferred embodiment of the present invention, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification.

In addition, when a part is said to "include" a certain component, this means that it may further include other components, except to exclude other components unless otherwise stated.

Hereinafter, a heating plate and a method of manufacturing the same according to embodiments of the present invention will be described with reference to the accompanying drawings.

1 shows a basic structure of a heating plate according to an embodiment of the present invention.

As shown in FIG. 1, the heat generating layer 11 and the protective layer 12 are sequentially stacked on the first surface, which is one side of the base 10. The protective layer 12 is formed of an insulating material to electrically and physically protect the heat generating layer 11.

The base 10 may be formed of a textile structure. In general, the base may serve as a support for supporting the heat generating layer 11 and the like stacked on top, and as an absorber to absorb heat generated from the heat generating layer. Therefore, the biggest influence on the flexibility of the heat generating plate (flexiblity) is the flexibility of the base, and the heat absorption and release power of the heat generating plate is a factor that greatly affects the temperature rise rate of the heat generating plate.

Since generally used bases are solid bases, the surface area capable of absorbing heat is only one side of the base, and the surface area capable of dissipating heat is out of the other side.

For example, when heating by applying a voltage of 100V to a heating plate of 100X100 mm for 2 minutes, the time required to raise the temperature from room temperature to 300 ° C is about 60 seconds, and the time taken to drop the temperature from 400 ° C to 200 ° C. It takes about 2 minutes and the time required for the temperature to drop below 100 ° C is about 5 minutes.

However, referring to FIGS. 10A and 10B, when the base 10 is formed of a fabric structure, air flows into these pores because of many voids formed of the fabric, and thus has a large surface area compared to the same volume. In addition, the mass to be heated or cooled relative to the same surface area is also reduced. Therefore, the rate of change of temperature can be increased. When the base 10 is changed to a fabric structure and tested under the same conditions, the time required to raise the temperature to 300 ° C. is similar to about 60 seconds, but the time required to lower the temperature to 100 ° C. or lower is 45 You can see that it is significantly shortened to seconds.

Therefore, when the base 10 of the heating plate has a fabric structure, the temperature response of the heating plate may be improved.

In addition, the fabric structure is a structure having high flexibility because the fibers are woven to form a void. Therefore, when the base 10 is formed into a fabric structure, the shape of the base 10 may be changed in the process of producing the second processed product using the heating plate after manufacture, and thus the usability of the heating plate may be improved. That is, when manufacturing the existing heating plate, the heating plate must be designed and manufactured according to the shape of the second processed product, and thus, once manufactured, the heating plate is difficult to be applied to other processed products. However, if the base 10 is taken in a fabric structure, the manufacturing cost and the range of utilization of the product may be extremely wide because the shape of the second processed product does not have to be considered.

The fabric structure of the base 10 may be formed of a fiber of a transparent, translucent, opaque material, preferably may be formed of a fiber of an oxide material, in particular may be formed using a glass fiber (glass fiber). .

The heat generating layer 11 may have a loose texture structure in which a plurality of conductive nanoparticles made of silica or an oxide semiconductor are physically necked. This may be due to the heat treatment conditions in the manufacturing process described below may have a dense structure (Close-Packed Texture), according to another embodiment may have a complete film state.

The heat treatment process is generally carried out at 200 ℃ or more preferably 400 ℃ or more. By the way, the film made of a polymer resin used as a conventional base 10 has a problem that can not maintain the shape at a temperature of about 200 ℃ solves the problem through the heat-resistant coating to withstand heat treatment. However, when glass fiber is used, the shape and strength can be easily maintained up to about 700 ° C., so that the nanoparticles can be heat-treated without any heat dissipation coating on the base.

In addition, the CNT (carbon nano tube) material used as a heating element has a problem in that it is separated into carbon dioxide and maintains physical properties when it reaches 350 ° C., but there is a problem that rapid heating is difficult, but the heating layer 11 withstands 400 ° C. or more. This allows for faster heating. In addition, the base substrate is also made to withstand the heat generated in the heat generating layer 11 by using a glass fiber instead of a conventional polymer resin.

The heat generating layer 11 may be formed as a single layer, but may have a stacked structure in which a plurality of unit heat generating layers 11a are integrated into one, as shown in FIG. 2. This can be applied when the physical or electrical properties required for the heating plate can not be obtained from one heating layer.

Meanwhile, an adhesion reinforcing layer 13 may be provided between the heating layer 11 and the base 10 to firmly fix the heating layer 11 to the base 10. The adhesion enhancing layer 12 may be formed of silica or polymer, and may include conductive particles such as nanoparticles. The adhesion reinforcing layer 13 has an electrical resistance as a conductor, and thus can have a function as an element of the heat generating layer. This adhesion enhancing layer 12 is an optional element and, as the case may be, omitted from the description and the drawings in some cases.

However, when using the fabric structure using the oxide fiber as the base 10, there is an effect that the adhesion between the base 10 and the heat generating layer 11 is improved, it may not use a separate adhesion reinforcing layer (13). . Silica or oxide semiconductor constituting the heat generating layer 13 at the interface and the oxide fiber of the base 10 has an oxygen atom, so that the intermolecular bonding force can be strong because the intermolecular bond is formed around the oxygen atom.

4 illustrates a heat generating plate according to another embodiment of the present invention. The heat generating layer 11 is formed on the base 10, and a power feeding part 14 including an electrode 14a, a wiring 14b, a connection part or a terminal 14c is provided on both sides thereof. In FIG. 4, the electrode 14a is in direct contact with the heating layer 11, the wiring 14b connects the heating layer 11 to an external circuit, and the terminal 14c is connected to the wiring 14b. It is fixed stably to this electrode 14a. A protective layer 12 is provided on the heat generating layer 11, which covers the power supply unit 14 including the electrodes 14a on both sides of the heat generating layer 10, and may not be covered according to another embodiment. . In the following drawings, the electrode 14a of the power supply unit 14 is shown symbolically, and the remaining parts are omitted to avoid the complexity of the drawing.

5a and 5b illustrate a heating plate according to still another embodiment of the present invention. The basic structure has the same structure as the heating plate of the embodiment shown in FIG. 4, but includes a temperature sensor, a humidity sensor, or a temperature / humidity sensor 15a, 15b for detecting temperature and humidity. The heating plate shown in FIG. 5A is provided with a sensor 15a on the first surface side of the base 10, and the heating plate shown in FIG. 5B has a sensor 15b on the second surface that is the other side of the base 10. Has a structure that is provided.

In the above-described embodiment, a heating plate having a front heating structure in which a heating layer is formed on the entire surface of the base 10 has been described. However, according to another embodiment of the present invention, the first surface of the base 10 may be divided or defined into a plurality of regions, and may be formed only in any one region or a plurality of selected regions of the plurality of regions thus defined. have.

FIG. 6A illustrates the heat generating plate according to the embodiment in which the heat generating layer 11 is formed only in the center rectangular area when the first surface of the base 10 is defined as the center rectangular area and the rim area around the center 10. Here, the area of the heat generating layer 11 can be greatly expanded by adjusting the width of the edge region in which the heat generating layer 11 is not formed. In this case, it is not necessary to generate heat functionally, but rather as a fixing part for fixing to another structure. Effective when you need to leave a border.

FIG. 6B illustrates a heating plate having a structure in which a checkerboard-shaped region is provided by a line defining a first surface of the base 10 in a lattice form and the heating layer 11 is arranged in a diamond or rhombus form. This symbolically illustrates that the first surface of the base 10 is divided or defined into a plurality of regions, and the heat generating layer 11 may be selectively formed in the entire region.

The heating plate having the above structure can be applied to various fields. For example, the present invention can be applied to exterior glass of a building, windows, bathroom mirrors, left and right front and rear car windows for automobiles, and can be applied to surface protection screens of displays installed outdoors. Such a heat generating plate may use a transparent, translucent, opaque base according to the application. In addition, the heating layer and the protective layer may also have a transparent, translucent, opaque structure depending on the application. The base may use a variety of forms of plate, it may have a plate-like form, the curved form may have a variety of forms, such as a semi-cylindrical, hemispherical surface, the technical scope of the present invention is any particular form It is not limited to. Furthermore, when the base is formed into a fabric structure, it may be manufactured in the form of a plate, and may be used by processing the heating plate in a required form in an individual application field.

Hereinafter, a method of manufacturing a heating plate according to embodiments of the present invention.

The base 10 is a plate, semi-cylindrical, hemispherical, or the like, and is formed of a transparent, translucent, or opaque material. The material usable as the base 10 is a base of woven structure of oxide fiber, preferably a base of woven structure of glass fiber.

The heat generating layer 11 formed on the base 10 includes at least one unit heat generating layer 11a as described above, and preferably, an adhesion reinforcing layer made of a material having excellent adhesion to the base 10 under the base 10. (13) is formed.

The adhesion reinforcing layer 13 may be formed by spray coating, spin coating, dipping, brushing, or other wet coating methods as a nanoparticle dispersion having excellent adhesion with the base 10.

However, when using the fabric structure using the oxide fiber as the base 10, there is an effect that the adhesion between the base 10 and the heat generating layer 11 is improved, it may not use a separate adhesion reinforcing layer (13). . Silica or oxide semiconductor constituting the heat generating layer 13 at the interface and the oxide fiber of the base 10 has an oxygen atom, so that the intermolecular bonding force can be strong because the intermolecular bond is formed around the oxygen atom.

Since the nanoparticles are dispersed in a solvent, they are easy to apply to the large-area base 10 and the total thickness can be easily controlled by controlling the number of layers. In addition, the conductivity of the heat generating layer 11 can be easily adjusted by adjusting the concentration of nanoparticles in the dispersion.

In the case of the heat generating plate material requiring light transmission, the band gap energy of the adhesion reinforcing layer 13 and the heat generating layer 11 made of a material having a band gap energy of 3.3 eV or more does not absorb 400 to 700 nm visible light. It is preferable to form the adhesion reinforcing layer 13 and the heat generating layer 11 by using a material of 3.3 eV or more.

The adhesion reinforcing layer 13 and the heat generating layer 11 are obtained by applying a nanoparticle dispersion liquid to the whole or part of the surface of the base 10 and heat treatment. Application and heat treatment of the dispersion may be carried out one or more times, thereby obtaining a heat generating layer having a multilayer structure. The conductive nanoparticle dispersion for obtaining the exothermic layer 11 may be formed by spray coating, spin coating, dipping, brushing, or other wet coating methods. The film by the nanoparticle dispersion is dried by heat treatment, and the nanoparticles remaining after drying are heated to near the melting point of the nanoparticles to be sintered to obtain an adhesion reinforcing layer 13 and a heat generating layer 11 of coarse or dense tissue. . The heat treatment temperature depends on the particle size of the nanoparticles, and the smaller the particle diameter, the lower the heat treatment temperature.

The manufacturing method of the present invention, which obtains a heat generating layer by coating a dispersion of such nanoparticles and then heat-treating it, has an advantage that heat treatment at a relatively low temperature is possible as compared to the conventional metal thin film formation method.

The heat treatment of the coating layer or nanoparticle layer by the nanoparticle dispersion of the base 10 can be carried out using a heating plate (hot plate) or an oven (oven), the temperature is preferably in the range of 200 ~ 500 ℃. In the heat treatment using the heating plate, the heating plate is positioned above and below the base 10 so that radiant heat is reached to both sides of the base.

However, in general, the film made of a polymer resin that can be used for the base 10 has a low melting point, so it is not easy to withstand the above-mentioned temperature in the oven, and thus, it is necessary to perform a heat treatment such as a coating treatment before heat treatment in the oven. However, when the glass fiber is used for the base 10, the shape and strength can be easily maintained up to about 700 ° C., so that the nanoparticles can be heat treated without a separate preprocessing process.

The total thickness of the heat generating layer 11 is adjusted to be 100 nm or less in consideration of the transmission of visible light, thereby obtaining a heat generating layer transparent to visible light.

The electrodes or terminals included in the feed parts 14a and 14b may be formed of a metal material, a conductive epoxy, a conductive paste, a solder, a conductive film, or the like as the conductive material. The metal material electrode may be obtained by a deposition method, an electrode by a conductive epoxy or a conductive paste may be obtained by screen printing, a solder by a soldering method, and a conductive film by a laminating method.

The wire 14b may also be formed by a wire bonding or soldering method so as to be connected to the electrode 14a.

The protective layer 12 is formed on the heat generating layer 11 formed on the base 10 and the power supply unit 14 including the electrode 14a to protect them from the outside.

The protective layer 18 is formed of a dielectric oxide, perylene, nanoparticles, a polymer film, or the like, and the protective layer 12 of the dielectric oxide or perylene is formed by a deposition method, and includes a protective layer including nanoparticles ( 12) can be formed by spray coating, spin coating, dipping, brushing or other wet coating methods.

The above-described temperature, humidity or temperature and humidity sensor 15a, 15b sends the detected signal to a separate feedback circuit so that the heat generated by the heat generating layer 11 is feedback-controlled, so that appropriate heat is generated according to the change of temperature or humidity. Remove the seaweed and frost.

Meanwhile, the feeding part on the base 10 may be provided between the adhesion reinforcing layer 13 and the heating layer 11, in which case the electrodes of the feeding parts 14a and 14a are formed in the adhesion reinforcing layer 13. After this, the heat generating layer 11 is formed. At this time, the heat generating layer 11 may be formed only in a portion away from the feed parts 14a and 14a in order to form terminals and wires later.

Hereinafter, a method of manufacturing a heating plate according to embodiments of the present invention.

Figure 7 shows the basic process of the heating plate manufacturing method according to the present invention.

S100 step:

Cleaning of the base is required. The cleaning may use a known solvent or etchant corresponding to the material of the base. The base may be a material formed of a fabric structure, the fibers forming the fabric structure may be a fiber comprising an oxide, in particular the fibers forming the fabric structure may be a glass fiber.

S110 step:

Apart from the cleaning, a nanoparticle dispersion is prepared (prepared). Step S110 is parallel to base cleaning and may generally be preceded by base cleaning. As a solvent, a mixture of methanol and calcium hydroxide, a mixture of methanol and calcium hydroxide, and a benzene single substance are used. As a nanoparticle, at least one of ZnO, SnO, MgO, and InO and silica as a doped oxide semiconductor is used. Either can be used. At least one of In, Sb, Al, Ga, C, and Sn is used as the dopant. In preparing the dispersion, the above-mentioned oxide semiconductor nanoparticle is added as a precursor while the solvent is heated to 50 to 200 ° C.

S120 step:

The nanoparticle dispersion is coated on the cleaned base. As the coating method, various methods as described above may be used, and the coating area is at least one region defined in the entirety of the base or in the base.

S130 step:

After the nanoparticle dispersion is coated, a heat treatment layer is formed by nanoparticles by heat treatment. At this time, the heat treatment is accompanied by evaporation (drying) of the solvent in which the nanoparticles are dispersed. In some cases, the evaporation of the solvent may be carried out separately, but generally it may proceed simultaneously with the heat treatment. However, during the heat treatment, drying proceeds first, followed by sintering of the remaining nanoparticles, thereby obtaining a heat generating layer in which the nanoparticles are physically necked.

S140 step:

An electrode is formed on the heat generating layer. The electrode may be formed of a metal, a conductive epoxy, a conductive paste, a solder, a conductive film, or the like. The metal electrode may be formed by a deposition method, the conductive epoxy or conductive paste electrode may be formed by known screen printing, the solder by a soldering method, and the conductive film may be formed by a laminating method.

S150 step:

The wiring is connected by the method as described above. The wiring may be formed by wire bonding, soldering, or the like with respect to the electrode.

S160 step:

Finally, a protective layer is formed on the heat generating layer. The protective layer is formed using a dielectric oxide, perylene nanoparticles, a polymer film, etc., the nanoparticles, dielectric oxide or perylene protective layer is formed by a deposition method, the nanoparticle protective layer is spray coating, spin coating or dipping method Or the like.

In the step described above, the step S120 and the step S130 are repeatedly performed a plurality of times, thereby obtaining a heat generating layer having a multilayer structure. On the other hand, according to another embodiment of the present invention, the step S140 of forming the electrode may be preceded by the step S120, in which case the electrode may be electrically connected to the heat generating layer in a state located below the heat generating layer.

8 shows a method of manufacturing a heating plate according to another embodiment of the present invention.

S200 steps:

After coating the first dispersion in which separately prepared nanoparticles are dispersed on the cleaned base, it is dried / heat-treated to form an adhesion reinforcing layer. As a solvent, a mixture of methanol and calcium hydroxide, a mixture of methanol and calcium hydroxide and a benzene single substance are used. As the nanoparticles, any one of ZnO, SnO, MgO, InO, or silica may be used as the oxide semiconductor. Can be. The oxide semiconductor may include a dopant, and at least one of In, Sb, Al, Ga, C, and Sn may be used as the dopant. In preparing the dispersion, the above-mentioned oxide semiconductor nanoparticle is added as a precursor while the solvent is heated to 50 to 200 ° C.

S210 step:

After coating the second dispersion in which nanoparticles are dispersed on the adhesion reinforcing layer to form a heat generating layer by drying / heat treatment. The second dispersion may comprise different nanoparticles from the first dispersion, and the solvent may be different. As the first dispersion, a mixture of methanol and calcium hydroxide, a mixture of methanol and calcium hydroxide, and a benzene single substance are used. As nanoparticles, ZnO, SnO, MgO, InO, etc. are used as oxide semiconductors. At least one or silica may be used. The oxide semiconductor may include a dopant, and at least one of In, Sb, Al, Ga, C, and Sn may be used as the dopant. In preparing the dispersion, the above-mentioned oxide semiconductor nanoparticle is added as a precursor while the solvent is heated to 50 to 200 ° C.

The coating area of the adhesion reinforcing layer and the heating layer may be at least one region defined in the whole or the base, and may not coincide with the adhesion reinforcing layer and the heating layer, for example, the adhesion reinforcing layer of the base The heating layer may be coated on all or a portion thereof and the heating layer may be formed on at least one region selected from all or a portion of the adhesion enhancing layer.

The heat treatment of the coated second dispersion involves the evaporation (drying) of the solvent in which the nanoparticles are dispersed. In some cases, the evaporation of the solvent may be carried out separately, but generally it may proceed simultaneously with the heat treatment. However, during the heat treatment, drying proceeds first, followed by sintering of the remaining nanoparticles, thereby obtaining a heat generating layer in which the nanoparticles are physically necked. In this case, the heating layer may have a physical connection structure according to the linkage between nanoparticles, and voids may exist in the tissue, and in some cases, a completely dense tissue without voids may be obtained.

S220 step:

An electrode is formed on the heat generating layer. The electrode may be formed of a metal, a conductive epoxy, a conductive paste, a solder, a conductive film, or the like. The metal electrode may be formed by a deposition method, the conductive epoxy or conductive paste electrode may be formed by known screen printing, the solder by a soldering method, and the conductive film may be formed by a laminating method.

S230 step:

The wiring connected to the electrode is formed. The wiring may be formed by wire bonding, soldering, or the like with respect to the electrode.

S240 step:

Finally, a protective layer is formed on the heat generating layer. The protective layer is formed using a dielectric oxide, perylene nanoparticles, a polymer film, etc., the nanoparticles, dielectric oxide or perylene protective layer is formed by a deposition method, the nanoparticle protective layer is spray coating, spin coating or dipping method Or the like.

In the above-described step, the step S200 and step 210 may be repeatedly performed a plurality of times, thereby obtaining a bonding strength reinforcing layer and a heating layer having a multilayer structure. Meanwhile, according to another embodiment of the present disclosure, the step S220 of forming the electrode may be preceded by the step S210, in which case the electrode may be electrically connected to the heat generating layer in a state located below the heat generating layer.

9 shows a method of manufacturing a heating plate according to another embodiment of the present invention.

S300 step:

An adhesion reinforcing layer is formed on the cleaned base using a first dispersion in which nanoparticles prepared under the conditions described above are dispersed. According to another embodiment of the present invention, the adhesion reinforcing layer may have a structure of a single layer or multiple layers. Herein, the adhesion reinforcing layer may be formed of silica or a polymer according to another embodiment of the present invention, nanoparticles may be included therein, and may be formed by various conventional methods such as deposition or spin coating. In addition, the adhesion reinforcing layer may be formed of a transparent, opaque, or translucent material.

S310 step:

Electrodes are formed on both sides of the adhesion reinforcing layer. The electrode may be formed of a metal, a conductive epoxy, a conductive paste, a solder, a conductive film, or the like. The metal electrode may be formed by a deposition method, the conductive epoxy or conductive paste electrode may be formed by known screen printing, the solder by a soldering method, and the conductive film may be formed by a laminating method.

S320 step:

The second dispersion is coated on the adhesion reinforcing layer and the electrode and then dried / heated to form a heat generating layer. The formation of the exothermic layer may be repeated a plurality of times, and nanoparticles or solvents used in the repeating process may be differently applied.

S330 step:

The wiring connected to the electrode is formed. The wiring may be formed by wire bonding, soldering, or the like with respect to the electrode.

S340 step:

Finally, a protective layer is formed on the heat generating layer. The protective layer is formed using a dielectric oxide, perylene nanoparticles, a polymer film, etc., the nanoparticles, dielectric oxide or perylene protective layer is formed by a deposition method, the nanoparticle protective layer is spray coating, spin coating or dipping method Or the like.

In the above-described step, the step S300 and the step 320 may be repeatedly performed a plurality of times, respectively, to obtain a bonding strength reinforcing layer and a heat generating layer. On the other hand, according to another embodiment of the present invention, the step S310 to form the electrode may be preceded by the step S300, in which case the electrode may be electrically connected to the heat generating layer in a state located below the adhesion reinforcing layer.

In the above-described embodiment, the heat generating layer of the multilayer structure may include unit stacking by different nanoparticles. After the final protective layer is formed, the step of providing a temperature and humidity sensor and a feedback circuit on the protective layer or on the opposite side of the base may be added. However, these temperature and humidity sensors and feedback circuits are optional and do not limit the technical scope of the present invention. In addition, the specific form of the power supply unit for supplying power to the heating layer, for example, the position and form of the electrode, the form and arrangement of the wiring can be implemented in a wide variety of forms, which can successfully supply power to the heating layer Modifications in any form are possible, which also does not limit the technical scope of the present invention.

The heat generating plate obtained by the structure and manufacturing method as described above is simple in structure and can be manufactured at low cost. In particular, since it is driven with low power consumption, efficient heat can be generated, and by having a temperature and humidity sensor, it can be automatically operated before steaming light is visually confirmed.

In addition, the heating plate obtained by the structure and manufacturing method including the base of the fabric structure as described above has a high flexibility of the base does not have to consider the shape of the secondary workpiece during manufacturing, and is easy to manufacture and easy deformation of the shape Wide range of applications In addition, in the case of the heating plate using the base of the fabric structure using the fiber containing the oxide, the adhesion between the base and the heat generating layer or the adhesion between the base and the adhesion reinforcing layer may be improved and durability may be improved. Furthermore, in the case of the heating plate using the base of the fabric structure using glass fiber, the melting point of the base is high, so that no heat dissipation treatment is required when forming the heating layer or the adhesion reinforcing layer, which facilitates the manufacturing process and lowers the manufacturing cost. have.

In the following shows the actual production and results for determining the performance and feasibility of the heating plate according to the present invention.

11 is a graph showing a difference in heating and cooling rates between a heating plate using glass fibers and a heating plate using a conventional base.

Referring to Figure 11, it can be seen that the heating and cooling rate change at an applied voltage of 100 V for the ITO heating layer heat-treated at 400 ℃.

A solution containing ITO nanoparticles was coated on D263 (Schott's product name) glass and glass fiber to form an ITO layer. After heat-treating this ITO thin film for 30 minutes at 400 degreeC, the heat generating layer was produced. A silver electrode was formed on the finally obtained heating layer, and the heating and cooling characteristics of the heater (heating layer) were compared and analyzed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those skilled in the art.

10: base 11, 11a: heating layer
12: protective layer 13: adhesive strength layer
14a: power supply unit 14b: wiring
15a, 15b: temperature / humidity sensor

Claims (15)

A base formed into a fabric structure;
An exothermic layer formed on at least a portion of the first surface of the base, and physically necked with a plurality of conductive nanoparticles;
A protective layer protecting the heating layer; And
A heating plate comprising a feeder for supplying power to the heating layer. The heating plate of claim 1, wherein the fibers forming the fabric structure of the base include an oxide. The heating plate of claim 1, wherein the fibers forming the fabric structure of the base include glass fibers. The heating plate of claim 1, wherein the nanoparticles are formed of an oxide semiconductor material. The method according to claim 1, wherein
The nanoparticles are heat generating plate, characterized in that formed with at least one of oxides and silica of at least one of ZnO, SnO, MgO, InO. The method of claim 5,
The heating plate, characterized in that the oxide comprises a dopant. The method according to claim 6,
The dopant is a heating plate, characterized in that it comprises at least one of In, Sb, Al, Ga, C, Sn. The method according to claim 1, wherein
Heat generating plate, characterized in that the adhesive strengthening layer is further provided between the heating layer and the base. 9. The method of claim 8,
The adhesive strength reinforcing layer is a heating plate, characterized in that it comprises a plurality of nanoparticles interconnected. Coating a dispersion in which nanoparticles are dispersed in a solvent on a first surface of a base formed of a fiber structure;
Removing the solvent of the dispersion to form a nanoparticle layer on the first surface of the base;
Heat-treating the nanoparticle layer to form a heat generating layer in which nanoparticles are necked; And
Method of manufacturing a heating plate comprising the step of forming a protective layer to protect the heating layer. The fiber of claim 10, wherein the fibers forming the fabric structure of the base are:
Method for producing a heating plate comprising an oxide. The fiber of claim 10, wherein the fibers forming the fabric structure of the base are:
A method for producing a heating plate comprising glass fiber. The method according to claim 10, wherein
The nanoparticle is a method of manufacturing a heating plate, characterized in that formed of an oxide semiconductor material. The method according to claim 10, wherein
The nanoparticles are ZnO, SnO, MgO, Method for producing a heating plate comprising an oxide semiconductor material of at least one of any one of the oxide and silica of InO. The method according to claim 10, wherein
The heat treatment is a method of manufacturing a transparent plane heater, characterized in that carried out at a temperature in the range of 200 ~ 500 ℃.

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