KR20120089962A - A usb memory package - Google Patents

Abstract

The USB memory package includes a printed circuit board having a first surface and a second surface, a USB terminal disposed on the first surface of the printed circuit board, a passive element and an active element, and a second surface of the printed circuit board. And a first molding part surrounding a memory device, a passive element disposed on a first surface of the printed circuit board, and an active element, and a second molding part surrounding a memory device disposed on a second surface of the printed circuit board.
Therefore, the finished product can be made only by semiconductor packaging, which has the effect of improving the process and reducing costs.

Description

USB memory package {A USB MEMORY PACKAGE}

The present invention relates to a USB memory package, and more particularly, to a USB memory package in which an external case is formed by a molding member.

Universal Serial Bus (USB) memory storage has become an indispensable item for modern people. As memory devices become smaller and larger in size, USB memory devices are also able to store large amounts of data in a small size. Accordingly, USB memory devices, which are very convenient, have become a necessity of modern people.

In general, a USB memory package includes a substrate having a USB terminal formed at one end thereof, a flash memory connected to an opposite surface of the substrate including the USB terminal, a controller electrically connected to the substrate, and a case for protecting the flash memory and the like. Consists of However, the conventional USB memory package manufactures a case through a separate process after packaging the substrate and the memory chip. Since these separate processes must be further passed, the manufacturing cost and the number of processes increase by that amount.

In the case of packaging a memory chip, a portion in which a molding member for molding the chip exists is not exposed when a fluid such as water is invaded, but a portion in which the controller or the like is present is not molded by the molding member. Or the like. Therefore, when the user drowns the USB memory package, there is a problem that the control circuit is damaged.

Therefore, the technical problem of the present invention is conceived in this respect, the object of the present invention is to provide a USB memory package for molding both sides of the substrate.

USB memory package according to an embodiment for achieving the object of the present invention is a printed circuit board having a first surface and a second surface, a USB terminal disposed on the first surface of the printed circuit board, the printed circuit A control unit disposed on the first surface of the substrate, a memory unit disposed on the second surface of the printed circuit board, a first molding unit formed on the entire first surface except the USB terminal, and a second of the printed circuit board It includes a second molding formed on the entire surface.

The memory unit may be formed by stacking a plurality of memory semiconductors.

In an embodiment, the method may further include a third molding part surrounding the side part of the printed circuit board.

In one embodiment, the first molding portion and the second molding portion may be formed integrally.

In example embodiments, the method may further include a hole passing through the first molding part, the printed circuit board, and the second molding part.

In an embodiment, at least one of the first molding part and the second molding part may be formed of a color EMC (Epoxy Mold Compound).

According to the present invention described above, since the case of the USB memory package is formed at one time through the molding process, it is not necessary to form the outer case of the substrate through a separate process as in the conventional method. Therefore, the finished product can be made only by semiconductor packaging, which has the effect of improving the process and reducing costs.

In addition, since active elements and passive elements located above the substrate are also molded, the upper component elements can be protected from external impact, and furthermore, since they are sealed by the molding member, the waterproofing effect can also be brought. .

In addition, since the molding material color can be changed relatively easily, there is an advantage that the USB memory package of various colors can be easily produced.

1 is a perspective view of a USB memory package according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the USB memory package taken along line II ′ of FIG. 1.
3 is a perspective view of a USB memory package according to another embodiment of the present invention.
4 is a perspective view of a USB memory package according to another embodiment of the present invention.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in more detail with reference to the accompanying drawings.

1 is a perspective view of a USB memory package according to an embodiment of the present invention.

1, the USB memory package includes a substrate 500, a USB terminal 140, a controller 110, 120, and 130, a memory device 210, and first and second molding units 610 and 620. It includes. The substrate 500 includes a core portion 510, a first surface 520, and a second surface 530. The USB terminal 140 is disposed on the first surface 520, and the controllers 110, 120, and 130 are disposed. The controller may include a passive element 110, an active element 120, and a controller chip 130. The memory device 210 is formed on the second surface 530 of the substrate 500. In the memory device 210, a plurality of memory semiconductors may be stacked and a NAND flash memory may be used. The controllers 110, 120, and 130 perform control functions such as storing and loading data in the memory device 210. The USB terminal 140 is a terminal manufactured according to a general USB standard and may be connected to a computer PC.

The passive element 110, the active element 120, and the controller chip 130 of the controller are molded by the first molding part 610, and the memory device 210 is molded by the second molding part 620. do. As the first molding part 610 and the second molding part 620, a resin used in a general semiconductor package may be used, and is manufactured in substantially the same process as a molding process of a general semiconductor package.

FIG. 2 is a cross-sectional view of the USB memory package taken along line II ′ of FIG. 1.

Referring to FIG. 2, the USB memory package includes a substrate 500, a USB terminal 140, a controller 130, a memory device 210, and first and second molding units 610 and 620. The substrate 500 includes a core portion 510, a first surface 520, and a second surface 530. The first surface 520 includes a first circuit wiring portion 525, and the second surface 530 includes a second circuit wiring portion 515. The core part 510, the first surface 520, and the second surface 530 are electrically connected to each other by the first circuit wiring part 525 and the second circuit wiring part 515 to form a data signal and Send and receive control signals.

The memory device 210 is formed by stacking a plurality of memory semiconductors. The plurality of memory semiconductors are connected to the circuit portion of the second surface 530 through wires 211 and 213. However, the connection between the second surface 530 and the memory semiconductor may be variously changed according to the type of the memory semiconductors 210. For example, in the case of a flip chip type memory semiconductor, the second surface 530 of the substrate may be electrically connected to each other through flip chip bumps.

The first molding part 610 molds the control part 130, and the second molding part 620 molds the memory device 210. Since the first molding part 610 and the second molding part 620 are moldings applied to a semiconductor package, the thickness of the USB memory package can be significantly reduced. 1 and 2 exaggerated the thickness of the USB memory, but the molding process is substantially performed in semiconductor packaging, so that the thickness can be manufactured.

3 is a perspective view of a USB memory package according to another embodiment of the present invention.

The USB memory package according to the embodiment shown in FIG. 3 includes a substrate 1500, a USB terminal 1140, a first molding part 1610, and a second molding part 1620. Although the memory device and the controller are formed in the substrate 1500, the first molding part 1610 and the second molding part 1620 surround the same, and thus are not illustrated in the drawing. Since the driving and control of the USB memory package according to the embodiment of FIG. 3 are substantially the same as the USB memory package according to the embodiment of FIG. 1, redundant description thereof will be omitted.

In the USB memory package according to the embodiment of FIG. 3, the first molding part 1610 and the second molding part 1620 use resins of different colors. Adding color to the resin used in the molding is as simple as choosing a colored resin, so different colors can be applied. Colors of the first molding part 1610 and the second molding part 1620 may be different from each other. In addition to the first molding part 1610 and the second molding part 1620, the side surface of the substrate 1500 is exposed to the outside, so that the color thereof may be implemented differently.

The substrate 1500 may further include a third molding part (not shown) surrounding the side surface of the substrate 1500 so as not to be exposed. When the third molding part is formed, in some cases, the first molding part 1610, the second molding part 1620, and the third molding part (not shown) may be integrally formed to form one molding. Can be. Therefore, the entire USB memory package can be molded in one molding.

4 is a perspective view of a USB memory package according to another embodiment of the present invention.

The USB memory package according to the embodiment shown in FIG. 4 includes a substrate 2500, a USB terminal 2140, a first molding part 2610, a second molding part 2620, and a through hole 2700. Although the memory device and the controller are formed in the substrate 2500, the first molding part 2610 and the second molding part 2620 surround the substrate 2500 and are not shown in the drawing. The driving and control of the USB memory package according to the embodiment of FIG. 4 is substantially the same as the USB memory package according to the embodiment of FIG.

The through hole 2700 is formed where the memory device or the other controller is not positioned on the substrate 2500 so that other components are not exposed to the outside. The through hole 2700 is used to wind a string to facilitate carrying a USB memory package. It is not necessary to form the central portion opposite the USB terminal 2140, and may be freely formed at a position that does not disturb other components such as an edge.

As described above, since the case of the USB memory package is formed at one time through the molding process, it is not necessary to form the outer case of the substrate through a separate process as in the conventional method. Therefore, the finished product can be made only by semiconductor packaging, which has the effect of improving the process and reducing costs. In addition, since active elements and passive elements located above the substrate are also molded, the upper component elements can be protected from external impact, and furthermore, since they are sealed by the molding member, the waterproofing effect can also be brought. . In addition, since the molding material can be changed color relatively easily, there is an advantage that can easily produce a USB memory package of various colors

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

110: passive element 120: active element
130: controller chip 140: USB terminal
210: memory device 500: printed circuit board
510: core part
520: first page 530: second page
610: first molding part 620: second molding part
1140: USB terminal 1500: Board
1610: first molding part 1620: second molding part
2140: USB terminal 2500: Board
2610: first molding part 2620: second molding part
2700: through hole

Claims (6)

A printed circuit board having a first side and a second side;
A USB terminal disposed on the first surface of the printed circuit board;
A controller disposed on the first surface of the printed circuit board;
A memory unit disposed on the second surface of the printed circuit board;
A first molding part formed on the entire first surface except for the USB terminal; And
And a second molding part formed on the entire second surface of the printed circuit board. The method of claim 1,
The memory unit USB memory package, characterized in that formed by stacking a plurality of memory semiconductors. The method of claim 1,
And a third molding part surrounding the side part of the printed circuit board. The method of claim 1,
And the first molding part and the second molding part are integrally formed. The method of claim 1,
And a hole penetrating through the first molding part, the printed circuit board, and the second molding part. The method of claim 1,
At least one of the first molding part and the second molding part is formed of a color EMC (Epoxy Mold Compound) characterized in that the USB memory package.

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