KR20120077665A - Radiation resistant resin and medical housings using the same - Google Patents
Radiation resistant resin and medical housings using the same Download PDFInfo
- Publication number
- KR20120077665A KR20120077665A KR1020100139711A KR20100139711A KR20120077665A KR 20120077665 A KR20120077665 A KR 20120077665A KR 1020100139711 A KR1020100139711 A KR 1020100139711A KR 20100139711 A KR20100139711 A KR 20100139711A KR 20120077665 A KR20120077665 A KR 20120077665A
- Authority
- KR
- South Korea
- Prior art keywords
- radiation
- resin
- resistant resin
- weight
- copolyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 67
- 239000011347 resin Substances 0.000 title claims abstract description 67
- 230000005855 radiation Effects 0.000 title claims abstract description 49
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 24
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 24
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 23
- 229920001634 Copolyester Polymers 0.000 claims abstract description 22
- -1 aliphatic phosphate compound Chemical class 0.000 claims abstract description 22
- 239000010452 phosphate Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 9
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims description 12
- 238000004383 yellowing Methods 0.000 claims description 11
- 239000000654 additive Substances 0.000 claims description 10
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 150000002009 diols Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000003086 colorant Substances 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000002667 nucleating agent Substances 0.000 claims description 4
- 230000000475 sunscreen effect Effects 0.000 claims description 4
- 239000000516 sunscreening agent Substances 0.000 claims description 4
- 239000002216 antistatic agent Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000004611 light stabiliser Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 230000000844 anti-bacterial effect Effects 0.000 claims 1
- 239000003017 thermal stabilizer Substances 0.000 claims 1
- 235000021317 phosphate Nutrition 0.000 description 20
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 230000001954 sterilising effect Effects 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- 238000004659 sterilization and disinfection Methods 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000008280 blood Substances 0.000 description 3
- 210000004369 blood Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 244000005700 microbiome Species 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- OSVXSBDYLRYLIG-UHFFFAOYSA-N dioxidochlorine(.) Chemical compound O=Cl=O OSVXSBDYLRYLIG-UHFFFAOYSA-N 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012567 medical material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- CNLGIQUFFSFRCH-XPBPLWSISA-N (2s,3s)-2-[4-[(1s)-1-amino-2-(4-hydroxyphenyl)ethyl]triazol-1-yl]-1-[4-[4-[4-[(2s,3s)-2-[4-[(1s)-1-amino-2-(4-hydroxyphenyl)ethyl]triazol-1-yl]-3-methylpentanoyl]piperazin-1-yl]-6-[2-[2-(2-prop-2-ynoxyethoxy)ethoxy]ethylamino]-1,3,5-triazin-2-yl]piperazin Chemical compound Cl.C([C@H](N)C1=CN(N=N1)[C@@H]([C@@H](C)CC)C(=O)N1CCN(CC1)C=1N=C(NCCOCCOCCOCC#C)N=C(N=1)N1CCN(CC1)C(=O)[C@H]([C@@H](C)CC)N1N=NC(=C1)[C@@H](N)CC=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 CNLGIQUFFSFRCH-XPBPLWSISA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- XBQRPFBBTWXIFI-UHFFFAOYSA-N 2-chloro-4-[2-(3-chloro-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(Cl)=CC=1C(C)(C)C1=CC=C(O)C(Cl)=C1 XBQRPFBBTWXIFI-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- NIRYBKWMEWFDPM-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-methylbutyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CCC1=CC=C(O)C=C1 NIRYBKWMEWFDPM-UHFFFAOYSA-N 0.000 description 1
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004155 Chlorine dioxide Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 231100000987 absorbed dose Toxicity 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000004450 alkenylene group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- IHWUGQBRUYYZNM-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-3,4-dicarboxylic acid Chemical compound C1CC2(C(O)=O)C(C(=O)O)=CC1C2 IHWUGQBRUYYZNM-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 235000019398 chlorine dioxide Nutrition 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000005724 cycloalkenylene group Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005155 haloalkylene group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 230000036512 infertility Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- WSWCOQWTEOXDQX-MQQKCMAXSA-N sorbic acid group Chemical class C(\C=C\C=C\C)(=O)O WSWCOQWTEOXDQX-MQQKCMAXSA-N 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/02—Applications for biomedical use
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Materials For Medical Uses (AREA)
Abstract
본 발명의 내방사선 수지는 (A)(a1) 폴리카보네이트 수지; 및 (a2) 코폴리에스테르 수지를 포함하는 기초수지; 및 (B) 고급 지방족 포스페이트 화합물을 포함하여 이루어진다. 상기 내방사선 수지는 우수한 내방사선, 투명성 및 색상 안정성을 가지므로 의료용 외장재에 적합하게 사용될 수 있다. Radiation-resistant resin of the present invention is (A) (a1) polycarbonate resin; And (a2) a base resin comprising a copolyester resin; And (B) a higher aliphatic phosphate compound. Since the radiation resistant resin has excellent radiation resistance, transparency and color stability, it can be suitably used for medical exterior materials.
Description
본 발명은 내방사선 수지 및 이를 이용한 의료용 외장재에 관한 것이다. 보다 구체적으로 본 발명은 고급 지방족 포스페이트를 도입하여 우수한 내방사선과 투명성 및 색상 안정성을 갖는 내방사선 폴리카보네이트계 수지 및 이를 이용한 의료용 외장재에 관한 것이다.
The present invention relates to a radiation-resistant resin and a medical exterior material using the same. More specifically, the present invention relates to a radiation-resistant polycarbonate resin having excellent radiation resistance, transparency and color stability by introducing a higher aliphatic phosphate, and a medical exterior material using the same.
최근 고분자 재료는 의료관련 기기 및 생채재료의 대체 등 의료용 소재로 그 사용이 점차 늘어나고 있다. 고분자 재료를 의료용 소재로 사용할 경우 직,간적접으로 생체와 접촉하여 사용되기 때문에 그 성형품의 물성 뿐만 아니라 무균성이 매우 중요하다. Recently, polymer materials have been increasingly used as medical materials such as replacement of medical devices and raw materials. When a polymer material is used as a medical material, since it is used in direct or indirect contact with a living body, the physical properties of the molded product as well as sterility are very important.
일반적으로 멸균방법에는 적당한 온도 및 압력의 포화 수증기 중에서 혹은 건열 공기 중에서 가열하여 미생물을 살멸하는 고압법이 있으며, 감마선, 전자선, X선을 조사하여 미생물을 살멸하는 조사법이 있다. 또한 에틸렌옥시드, 포름알데히드, 과산화수소 및 이산화염소 기체 등과 같은 멸균용 기체를 이용하여 미생물을 살멸하는 방법이 있다. 이중 멸균용 기체를 이용한 멸균법의 경우 기체의 종류에 따라 멸균시의 온도, 습도, 기체농도, 멸균시간이 다르며, 잔류하는 기체가 인체에 악영향을 초래하는 것도 있어서 사용 환경 및 잔류기체 농도에 대해 철저한 주의가 필요하다. 근래에는 감마선에 노출시켜 멸균하는 조사법이 바람직한 것으로 평가되고 있으나, 멸균을 위해 높은 에너지를 조사하기 때문에 고분자 재료의 경우 멸균 과정 중 악영향을 미칠 수 있다. 특히 폴리카보네이트의 경우 높은 투명성과 우수한 물성으로 인해 의료용 외장재로 사용되는데 유리한 조건을 가지고 있으나 폴리카보네이트를 이용하여 성형한 성형품에 감마선을 조사할 경우 황변현상이 심각하게 발생하고, 투명성이 현저히 저하되어 사용이 제한되고 있다.In general, the sterilization method is a high-pressure method for killing microorganisms by heating in saturated steam of a suitable temperature and pressure or dry heat air, and there is an irradiation method for killing microorganisms by irradiating gamma rays, electron beams, X-rays. In addition, there is a method of killing microorganisms using a sterilizing gas such as ethylene oxide, formaldehyde, hydrogen peroxide and chlorine dioxide gas. In case of sterilization using sterilization gas, the temperature, humidity, gas concentration and sterilization time during sterilization are different according to the type of gas, and the remaining gas may adversely affect the human body. Need attention In recent years, the irradiation method to sterilize by exposure to gamma rays is evaluated as preferable, but because of the high energy irradiation for sterilization, polymer materials may adversely affect during the sterilization process. In particular, polycarbonate has favorable conditions for being used as a medical exterior material due to its high transparency and excellent physical properties. However, when gamma rays are irradiated to molded products molded using polycarbonate, yellowing phenomenon occurs seriously, and transparency is significantly reduced. This is being limited.
JP1996-048859 에서는 폴리에스테르-폴리카보네이트 중합체, 폴리에스테르류, 코폴리에스테르류, 폴리설폰-카보네이트류, 폴리아미드류 등을 첨가하는 방법을 제시하고 있으며, US4,786,692 에서는 폴리카보네이트/코폴리에스테르 블렌드 조성물을 언급하고 있다. 그러나 폴리카보네이트에 코폴리에스터를 블렌드 한 수지 조성물은 감마선에 대한 내성은 향상되지만, 고온 가공 시 황변현상이 발생하여 초기 색상이 나빠지며, 이는 감마선 조사 후의 색상에도 크게 영향을 미친다. JP1996-048859 describes a method for adding polyester-polycarbonate polymers, polyesters, copolyesters, polysulfone-carbonates, polyamides, etc., and US Pat. No. 4,786,692 polycarbonate / copolyester blends. Reference is made to the composition. However, the resin composition blended with the polycarbonate copolyester is improved resistance to gamma rays, but yellowing occurs during high temperature processing, the initial color deteriorates, which greatly affects the color after gamma irradiation.
US 4,657949, US 4,757,104 및 US 4,804,692에서는 소르빈산 화합물, 실리콘 화합물, 술폰계화합물, 폴리알킬렌글리콜 등을 첨가하여 상기의 문제를 방지하고자 하였으나, 색상안정성이나 황변현상 문제는 근본적으로 해소하지 못하였다. In US 4,657949, US 4,757,104 and US 4,804,692, sorbic acid compounds, silicone compounds, sulfone compounds, and polyalkylene glycols have been added to prevent the above problems, but problems of color stability and yellowing are not fundamentally solved. .
따라서, 우수한 투명성 및 색상 안정성을 가지는 내방사선 폴리카보네이트 수지의 개발이 필요한 실정이다.
Therefore, the development of a radiation-resistant polycarbonate resin having excellent transparency and color stability is required.
본 발명의 목적은 우수한 투명성 및 색상 안정성을 가지는 내방사선 수지를 제공하기 위한 것이다.An object of the present invention is to provide a radiation resistant resin having excellent transparency and color stability.
본 발명의 다른 목적은 투명성 및 내방사선이 우수하여 의료용 외장재에 사용하기 적합한 내방사선 수지를 제공하기 위한 것이다.Another object of the present invention is to provide a radiation resistant resin that is excellent in transparency and radiation resistance and suitable for use in medical exterior materials.
본 발명의 상기 및 기타 목적들은 하기 설명되는 본 발명에 의하여 모두 달성될 수 있다.
The above and other objects of the present invention can be achieved by the present invention described below.
본 발명의 하나의 관점은 내방사선 수지에 관한 것이다. 상기 내방사선 수지는 (A)(a1) 폴리카보네이트 수지; 및 (a2) 코폴리에스테르 수지를 포함하는 기초수지; 및 (B) 고급 지방족 포스페이트 화합물을 포함하여 이루어진다. One aspect of the present invention relates to a radiation resistant resin. The radiation resistant resin is (A) (a1) polycarbonate resin; And (a2) a base resin comprising a copolyester resin; And (B) a higher aliphatic phosphate compound.
구체예에서 상기 (B) 고급 지방족 포스페이트 화합물은 하기 화학식 2 또는 3로 표시되는 화합물의 최소한 1종을 포함한다:
In embodiments, the (B) higher aliphatic phosphate compound includes at least one of the compounds represented by Formula 2 or 3 below:
[화학식 2][Formula 2]
[화학식 3](3)
상기 화학식 2 및 3에서 n 및 m은 11~20의 정수이고, n 및 m은 서로 같거나 다름.In Formulas 2 and 3, n and m are integers of 11 to 20, and n and m are the same as or different from each other.
상기 내방사선 수지는 50kGy 방사선 조사후 ASTM D1925에 의한 황변지수(ΔYI)가 10 이하인 것을 특징으로 한다. The radiation-resistant resin is characterized in that the yellowing index (ΔYI) by ASTM D1925 after 50kGy irradiation is 10 or less.
구체예에서 상기 내방사선 수지는 (A)(a1) 폴리카보네이트 수지50 내지 90 중량%; 및 (a2) 코폴리에스테르 수지 10 내지 50 중량%를 포함하는 기초수지 100 중량부에 대하여 (B) 포스페이트 화합물 0.01 내지 2 중량부를 포함할 수 있다. In embodiments, the radiation resistant resin is (A) (a1) 50 to 90% by weight of a polycarbonate resin; And (a) 0.01 to 2 parts by weight of (B) phosphate compound based on 100 parts by weight of the base resin including 10 to 50% by weight of the copolyester resin.
상기 (a2) 코폴리에스테르 수지는 1,4-사이클로헥산다이메탄올로부터 유도된 단위를 포함할 수 있다. The (a2) copolyester resin may include units derived from 1,4-cyclohexanedimethanol.
구체예에서 상기 (a2) 코폴리에스테르 수지는 방향족 또는 지방족 다이에시드 잔기와 2종 이상의 다이올 잔기를 함유하고 있으며, 상기 다이올 잔기중 1,4-사이클로헥산다이메탄올이 50mol% 이상일 수 있다. In an embodiment, the (a2) copolyester resin contains an aromatic or aliphatic dieside residue and two or more diol residues, and 1,4-cyclohexanedimethanol of the diol residues may be 50 mol% or more.
상기 내방사선 수지는 폴리알킬렌옥사이드를 더 포함할 수 있다. The radiation resistant resin may further include a polyalkylene oxide.
구체예에서 상기 폴리알킬렌옥사이드는 수평균분자량이 500 내지 20,000 g/mol 일 수 있다. In embodiments, the polyalkylene oxide may have a number average molecular weight of 500 to 20,000 g / mol.
상기 내방사선 수지는 항균제, 열안정제, 산화방지제, 이형제, 광안정제, 무기물 첨가제, 계면활성제, 커플링제, 가소제, 안정제, 활제, 정전기방지제, 조색제, 내후제, 착색제, 자외선 흡수제, 자외선 차단제, 난연제, 충전제, 핵제 등의 첨가제를 더 포함할 수 있다. 상기 첨가제는 단독 또는 2종 이상 혼합하여 사용될 수 있다. The radiation-resistant resin is an antibacterial agent, a heat stabilizer, an antioxidant, a mold release agent, a light stabilizer, an inorganic additive, a surfactant, a coupling agent, a plasticizer, a stabilizer, a lubricant, an antistatic agent, a colorant, a weather agent, a colorant, a UV absorber, a sunscreen, a flame retardant Additives such as fillers and nucleating agents may be further included. The additives may be used alone or in combination of two or more thereof.
본 발명의 다른 관점은 상기 내방사선 수지로부터 성형된 성형품에 관한 것이다. 본 발명의 내방사선 수지는 투명성, 색상 안정성 및 충격강도 뿐만 아니라, 내방사선이 특히 우수하므로 의료용 외장재에 바람직하게 적용될 수 있다.
Another aspect of the present invention relates to a molded article molded from the radiation resistant resin. Radiation-resistant resins of the present invention, as well as transparency, color stability and impact strength, and particularly excellent radiation resistance can be preferably applied to medical exterior materials.
본 발명은 우수한 투명성 및 색상 안정성과 함께 내방사선이 우수하여 의료용 외장재에 사용하기 적합한 내방사선 수지를 제공하는 발명의 효과를 갖는다.
The present invention has the effect of the invention to provide a radiation resistant resin that is excellent in radiation resistance with excellent transparency and color stability and suitable for use in medical exterior materials.
이하, 본 발명의 구체예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구항의 범주에 의해 정의될 뿐이다. Hereinafter, specific embodiments of the present invention will be described in detail. However, this is presented as an example, by which the present invention is not limited and the present invention is defined only by the scope of the claims to be described later.
본 발명의 한 구체예에 따른 내방사선 수지는 (A)(a1) 폴리카보네이트 수지; 및 (a2) 코폴리에스테르 수지를 포함하는 기초수지; 및 (B) 고급 지방족 포스페이트 화합물을 포함한다.Radiation-resistant resin according to an embodiment of the present invention is (A) (a1) polycarbonate resin; And (a2) a base resin comprising a copolyester resin; And (B) higher aliphatic phosphate compounds.
이하 본 발명의 각 성분에 대하여 구체적으로 살펴본다.
Hereinafter, each component of the present invention will be described in detail.
(A) 기초수지(A) Basic resin
(a1)폴리카보네이트 수지(a1) polycarbonate resin
상기 폴리카보네이트 수지는 하기 화학식 1로 표시되는 디페놀류와 포스겐, 할로겐산 에스테르, 탄산 에스테르 또는 이들의 조합과 반응시켜 제조될 수 있다.The polycarbonate resin may be prepared by reacting diphenols represented by the following Chemical Formula 1 with phosgene, a halogen acid ester, a carbonate ester, or a combination thereof.
[화학식 1][Formula 1]
(상기 화학식 1에서, A는 단일 결합, 치환 또는 비치환된 C1 내지 C30 직쇄상 또는 분지상의 알킬렌기, 치환 또는 비치환된 C2 내지 C5 알케닐렌기, 치환 또는 비치환된 C2 내지 C5 알킬리덴기, 치환 또는 비치환된 C1 내지 C30 직쇄상 또는 분지상의 할로알킬렌기, 치환 또는 비치환된 C5 내지 C6 사이클로알킬렌기, 치환 또는 비치환된 C5 내지 C6 사이클로알케닐렌기, 치환 또는 비치환된 C5 내지 C10 사이클로알킬리덴기, 치환 또는 비치환된 C6 내지 C30 아릴렌기, 치환 또는 비치환된 C1 내지 C20 직쇄상 또는 분지상의 알콕실렌기, 할로겐산 에스테르기, 탄산 에스테르기, CO, S 또는 SO2 이고, R1 및 R2는 서로 동일하거나 상이하며, 치환 또는 비치환된 C1 내지 C30 알킬기, 또는 치환 또는 비치환된 C6 내지 C30 아릴기이며, n1 및 n2는 각각 0 내지 4의 정수이다.)(In Formula 1, A is a single bond, substituted or unsubstituted C1 to C30 linear or branched alkylene group, substituted or unsubstituted C2 to C5 alkenylene group, substituted or unsubstituted C2 to C5 alkylie Den groups, substituted or unsubstituted C1 to C30 straight or branched haloalkylene groups, substituted or unsubstituted C5 to C6 cycloalkylene groups, substituted or unsubstituted C5 to C6 cycloalkenylene groups, substituted or unsubstituted C5 to C10 cycloalkylidene group, substituted or unsubstituted C6 to C30 arylene group, substituted or unsubstituted C1 to C20 straight or branched alkoxylene group, halogen acid ester group, carbonate ester group, CO, S or SO 2 , R 1 and R 2 are the same as or different from each other, a substituted or unsubstituted C1 to C30 alkyl group, or a substituted or unsubstituted C6 to C30 aryl group, and n 1 and n 2 are each 0 to 4 Is an integer.)
상기 화학식 1로 표시되는 디페놀류는 2종 이상이 조합되어 폴리카보네이트 수지의 반복단위를 구성할 수도 있다. 상기 디페놀류의 구체적인 예로는, 히드로퀴논, 레조시놀, 4,4'-디히드록시디페닐, 2,2-비스(4-히드록시페닐)프로판('비스페놀-A'라고도 함), 2,4-비스(4-히드록시페닐)-2-메틸부탄, 비스(4-히드록시페닐)메탄, 1,1-비스(4-히드록시페닐)사이클로헥산, 2,2-비스(3-클로로-4-히드록시페닐)프로판, 2,2-비스(3,5-디메틸-4-히드록시페닐)프로판, 2,2-비스(3,5-디클로로-4-히드록시페닐)프로판, 2,2-비스(3,5-디브로모-4-히드록시페닐)프로판, 비스(4-히드록시페닐)술폭사이드, 비스(4-히드록시페닐)케톤, 비스(4-히드록시페닐)에테르 등을 들 수 있다. 바람직하게는 2,2-비스(4-히드록시페닐)프로판, 2,2-비스(3,5-디클로로-4-히드록시페닐)프로판 또는 1,1-비스(4-히드록시페닐)사이클로헥산을 사용할 수 있다. 더 바람직하게는 2,2-비스(4-히드록시페닐)프로판을 사용할 수 있다.The diphenols represented by the formula (1) may combine two or more kinds to constitute a repeating unit of the polycarbonate resin. Specific examples of the diphenols include hydroquinone, resorcinol, 4,4'-dihydroxydiphenyl, 2,2-bis (4-hydroxyphenyl) propane (also called 'bisphenol-A'), 2, 4-bis (4-hydroxyphenyl) -2-methylbutane, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 2,2-bis (3-chloro 4-hydroxyphenyl) propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dichloro-4-hydroxyphenyl) propane, 2 , 2-bis (3,5-dibromo-4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) sulfoxide, bis (4-hydroxyphenyl) ketone, bis (4-hydroxyphenyl) Ether and the like. Preferably 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (3,5-dichloro-4-hydroxyphenyl) propane or 1,1-bis (4-hydroxyphenyl) cyclo Hexane can be used. More preferably 2,2-bis (4-hydroxyphenyl) propane can be used.
상기 폴리카보네이트 수지는 중량평균 분자량이 10,000 g/mol 내지 200,000 g/mol인 것을 사용할 수 있으며, 구체예에서는 15,000 g/mol 내지 80,000 g/mol인 것을 사용할 수 있으나, 이에 한정되는 것은 아니다.The polycarbonate resin may use a weight average molecular weight of 10,000 g / mol to 200,000 g / mol, in the specific embodiment may be used 15,000 g / mol to 80,000 g / mol, but is not limited thereto.
상기 폴리카보네이트 수지는 2종 이상의 디페놀류로부터 제조된 공중합체의 혼합물일 수도 있다. 또한 상기 폴리카보네이트 수지는 선형 폴리카보네이트 수지, 분지형(branched) 폴리카보네이트 수지, 폴리에스테르카보네이트 공중합체 수지 등을 사용할 수 있다.The polycarbonate resin may be a mixture of copolymers prepared from two or more diphenols. In addition, the polycarbonate resin may be used a linear polycarbonate resin, branched (branched) polycarbonate resin, polyester carbonate copolymer resin and the like.
상기 선형 폴리카보네이트 수지로는 비스페놀-A계 폴리카보네이트 수지 등을 들 수 있다. 상기 분지형 폴리카보네이트 수지로는 트리멜리틱 무수물, 트리멜리틱산 등과 같은 다관능성 방향족 화합물을 디페놀류 및 카보네이트와 반응시켜 제조한 것을 들 수 있다. 상기 다관능성 방향족 화합물은 분지형 폴리카보네이트 수지 총량에 대하여 0.05 내지 2몰%로 포함될 수 있다. 상기 폴리에스테르카보네이트 공중합체 수지로는 이관능성 카르복실산을 디페놀류 및 카보네이트와 반응시켜 제조한 것을 들 수 있다. 상기 카보네이트로는 디페닐카보네이트 등과 같은 디아릴카보네이트, 에틸렌 카보네이트 등을 사용할 수 있다.Bisphenol-A type | system | group polycarbonate resin etc. are mentioned as said linear polycarbonate resin. Examples of the branched polycarbonate resins include those produced by reacting polyfunctional aromatic compounds such as trimellitic anhydride, trimellitic acid, and the like with diphenols and carbonates. The polyfunctional aromatic compound may be included in an amount of 0.05 to 2 mol% based on the total amount of the branched polycarbonate resin. As said polyester carbonate copolymer resin, what was manufactured by making bifunctional carboxylic acid react with diphenols and a carbonate is mentioned. As the carbonate, a diaryl carbonate such as diphenyl carbonate, ethylene carbonate, or the like may be used.
상기 폴리카보네이트 수지의 용융 흐름 지수(Melt Flow Index, MFI)는 310℃, 1.2kgf의 측정 조건 하에 3 내지 120 g/10min 일 수 있다.The melt flow index (MFI) of the polycarbonate resin may be 3 to 120 g / 10 min under measurement conditions of 310 ° C. and 1.2 kgf.
상기 폴리카보네이트 수지는 기초수지를 구성하며, 전체 기초수지중 50 내지 90 중량%로 포함될 수 있다. 바람직하게는 60 내지 80 중량%로 포함될 수 있다. 폴리카보네이트 수지가 상기 함량 범위 내로 포함되는 경우 충격강도, 투명성, 내방사선 및 가공성의 물성 밸런스를 얻을 수 있다.
The polycarbonate resin constituting the base resin, it may be included in 50 to 90% by weight of the total base resin. Preferably it may be included in 60 to 80% by weight. When the polycarbonate resin is included in the content range, it is possible to obtain a balance of physical properties of impact strength, transparency, radiation resistance and processability.
(a2) 코폴리에스테르 수지(a2) copolyester resin
상기 코폴리에스테르 수지는 1,4-사이클로헥산다이메탄올로부터 유도된 단위를 포함한다. The copolyester resin comprises units derived from 1,4-cyclohexanedimethanol.
구체예에서, 상기 (a2) 코폴리에스테르 수지는 방향족 또는 지방족 다이에시드 잔기와 2종 이상의 다이올 잔기를 함유하고 있으며, 상기 다이올 잔기중 1,4-사이클로헥산다이메탄올이 50mol% 이상, 바람직하게는 60 % 이상인 것을 특징으로 한다. 구체예에서는 1,4-사이클로헥산다이메탄올이 50~99 mol%, 바람직하게는 60~80 mol%이다. 상기 범위에서 우수한 유동성과 투명성의 물성 발란스를 부여할 수 있다.In an embodiment, the (a2) copolyester resin contains an aromatic or aliphatic dieside residue and two or more diol residues, wherein 1,4-cyclohexanedimethanol is preferably at least 50 mol% of the diol residues. Preferably 60% or more. In specific embodiments, 1,4-cyclohexanedimethanol is 50 to 99 mol%, preferably 60 to 80 mol%. It is possible to give excellent balance of physical properties of fluidity and transparency in the above range.
상기 (a2) 코폴리에스테르 수지는 방향족 또는 지방족 다이에시드와 2종 이상의 다이올을 축중합하여 통상의 방법으로 제조될 수 있다. The (a2) copolyester resin may be prepared by a conventional method by condensation polymerization of an aromatic or aliphatic dieside and two or more diols.
상기 다이에시드는 아디픽산, 아젤릭산, 디카르복실도데카노익산, 숙신산, 노보넨 디카르복실산, 1,4-사이클로헥산디카르보실산, 프탈산, 이소프탈산, 테레프탈산, 1,4-혹은 1,5-나프탈렌디카르복실산, 4,4-디페닐디카르복실산 등이 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. 이중 바람직하게는 테레프탈산, 이소프탈산 이다. The dieside may be adipic acid, azelic acid, dicarboxylic dodecanoic acid, succinic acid, norbornene dicarboxylic acid, 1,4-cyclohexanedicarbosilic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4- or 1, 5-naphthalenedicarboxylic acid, 4,4-diphenyldicarboxylic acid, and the like, but are not necessarily limited thereto. These may be used alone or in combination of two or more. Among these, terephthalic acid and isophthalic acid are preferable.
상기 다이올로는 1,4-사이클로헥산다이메탄올과 함께 탄소수 2 내지 12의 선형, 가지형, 고리형 알칸 디올이 사용될 수 있다. 예를 들면, 에틸렌글리콜, 프로필렌글리콜, 부탄디올, 펜탄디올, 헥산디올 등이 사용될 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. 바람직하게는 1,4-사이클로헥산다이메탄올과 에틸렌글리콜의 조합이다. As the diol, linear, branched, cyclic alkane diols having 2 to 12 carbon atoms may be used together with 1,4-cyclohexanedimethanol. For example, ethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol and the like may be used, and these may be used alone or in combination of two or more thereof. Preferably, it is a combination of 1,4-cyclohexanedimethanol and ethylene glycol.
구체예에서 상기 (a2) 코폴리에스테르 수지는 무정형(amorphous) 일 수 있다. In embodiments, the (a2) copolyester resin may be amorphous.
상기 (a2) 코폴리에스테르 수지의 용융 흐름 지수(Melt Flow Index, MFI)는 250℃, 1.2kgf의 측정 조건 하에 3 내지 50 g/10min 일 수 있다.Melt Flow Index (MFI) of the (a2) copolyester resin may be 3 to 50 g / 10 min under measurement conditions of 250 ° C. and 1.2 kgf.
상기 (a2) 코폴리에스테르 수지는 기초수지를 구성하며, 전체 기초수지중 10 내지 50 중량%로 포함될 수 있다. 바람직하게는 20 내지 40 중량%로 포함될 수 있다. 코폴리에스테르 수지(a2)가 상기 함량 범위 내로 포함되는 경우 충격강도, 투명성, 내방사선 및 가공성의 물성 밸런스를 얻을 수 있다.
The (a2) copolyester resin constitutes a base resin, and may be included in 10 to 50% by weight of the total base resin. Preferably it may be included in 20 to 40% by weight. When the copolyester resin (a2) is included in the content range, it is possible to obtain a balance of physical properties of impact strength, transparency, radiation resistance and processability.
(B) 고급 지방족 포스페이트 화합물(B) higher aliphatic phosphate compounds
상기 고급 지방족 포스페이트 화합물(B)은 탄소수 13이상의 알킬기를 함유하는 포스페이트가 사용될 수 있다. 상기 알킬기는 선형 알킬기가 바람직하다. The higher aliphatic phosphate compound (B) may be a phosphate containing an alkyl group having 13 or more carbon atoms. The alkyl group is preferably a linear alkyl group.
구체예에서 상기 (B) 포스페이트 화합물은 하기 화학식 2 또는 3로 표시되는 화합물의 최소한 1종을 포함한다:
In embodiments, the (B) phosphate compound includes at least one of the compounds represented by Formula 2 or 3:
[화학식 2][Formula 2]
[화학식 3](3)
상기 화학식 2 및 3에서 n 및 m은 11~20의 정수이고, n 및 m은 서로 같거나 다름.
In Formulas 2 and 3, n and m are integers of 11 to 20, and n and m are the same as or different from each other.
상기 화학식 2 및 3에서 n 및 m은 11~20의 정수이고, n 및 m은 서로 같거나 다름.In Formulas 2 and 3, n and m are integers of 11 to 20, and n and m are the same as or different from each other.
상기 n 및 m은 바람직하게는 15~20이다. N and m are preferably 15 to 20.
바람직하게는 상기 (B) 고급 지방족 포스페이트 화합물은 2종 이상 혼합하여 사용할 수 있다. 예를 들면 화학식 2의 디알킬에시드포스페이트와 화학식 3의 모노알킬에시드포스페이트를 혼합하여 사용할 수 있다. Preferably, the (B) higher aliphatic phosphate compound may be used in combination of two or more kinds. For example, the dialkyl acid phosphate of general formula (2) and the monoalkyl acid phosphate of general formula (3) can be mixed and used.
상기 (B) 고급 지방족 포스페이트 화합물은 기초수지 100 중량부에 대하여 0.01 내지 2 중량부, 바람직하게는 0.05 내지 1 중량부, 더욱 바람직하게는 0.1 내지 0.5 중량부로 사용될 수 있다. 상기 범위에서 우수한 내방사선과 투명성의 물성 발란스를 가질 수 있다.
The (B) higher aliphatic phosphate compound may be used in an amount of 0.01 to 2 parts by weight, preferably 0.05 to 1 part by weight, more preferably 0.1 to 0.5 parts by weight, based on 100 parts by weight of the base resin. It can have excellent radiation resistance and balance of physical properties in the above range.
(C)폴리알킬렌옥사이드(C) polyalkylene oxide
본 발명의 내방사선 수지는 선택적으로 폴리알킬렌옥사이드를 더 포함할 수 있다. 상기 폴리알킬렌옥사이드의 예로는 폴리에틸렌옥사이드, 폴리프로필렌옥사이드, 폴리부틸렌옥사이드 등이 있다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. Radiation-resistant resin of the present invention may optionally further comprise a polyalkylene oxide. Examples of the polyalkylene oxide include polyethylene oxide, polypropylene oxide, polybutylene oxide and the like. These may be used alone or in combination of two or more.
구체예에서 상기 폴리알킬렌옥사이드는 수평균분자량이 500 내지 20,000 g/mol 일 수 있다. 상기 범위에서 우수한 내방사선을 부여할 수 있다. In embodiments, the polyalkylene oxide may have a number average molecular weight of 500 to 20,000 g / mol. Excellent radiation resistance can be given in the above range.
상기 폴리알킬렌옥사이드를 포함할 경우 고급 지방족 포스페이트 화합물(B)과 시너지 효과를 발휘하여 보다 우수한 내방사선 효과를 가질 수 있다. 상기 폴리알킬렌옥사이드는 기초수지 100 중량부에 대하여 0.01 내지 2 중량부, 바람직하게는 0.1 내지 1 중량부로 사용할 수 있다. 상기 범위에서 우수한 내방사선과 성형성의 물성 발란스를 얻을 수 있다. When the polyalkylene oxide is included, the synergistic effect with the higher aliphatic phosphate compound (B) may be exerted to have a better radiation resistance effect. The polyalkylene oxide may be used in an amount of 0.01 to 2 parts by weight, preferably 0.1 to 1 part by weight, based on 100 parts by weight of the base resin. Excellent balance of radiation resistance and moldability in the above range can be obtained.
상기 내방사선 수지는 항균제, 열안정제, 산화방지제, 이형제, 광안정제, 무기물 첨가제, 계면활성제, 커플링제, 가소제, 안정제, 활제, 정전기방지제, 조색제, 내후제, 착색제, 자외선 흡수제, 자외선 차단제, 난연제, 충전제, 핵제 등의 첨가제를 더 포함할 수 있다. 상기 첨가제는 단독 또는 2종 이상 혼합하여 사용될 수 있다. The radiation-resistant resin is an antibacterial agent, a heat stabilizer, an antioxidant, a mold release agent, a light stabilizer, an inorganic additive, a surfactant, a coupling agent, a plasticizer, a stabilizer, a lubricant, an antistatic agent, a colorant, a weather agent, a colorant, a UV absorber, a sunscreen, a flame retardant Additives such as fillers and nucleating agents may be further included. The additives may be used alone or in combination of two or more thereof.
상기 산화방지제로는 페놀형, 포스파이트(phosphite)형, 티오에테르형 또는 아민형 산화방지제를 사용할 수 있다. As the antioxidant, a phenol type, phosphite type, thioether type or amine type antioxidant may be used.
상기 이형제로는 불소 함유 중합체, 실리콘 오일, 스테아린산(stearic acid)의 금속염, 몬탄산(montanic acid)의 금속염, 몬탄산 에스테르 왁스 또는 폴리에틸렌 왁스를 사용할 수 있다. The release agent may be a fluorine-containing polymer, silicone oil, metal salt of stearic acid, metal salt of montanic acid, montanic acid ester wax or polyethylene wax.
상기 내후제로는 벤조페논형 또는 아민형 내후제를 사용할 수 있고, 상기 착색제로는 염료 또는 안료를 사용할 수 있다. As the weathering agent, a benzophenone type or an amine weathering agent may be used, and the coloring agent may be a dye or a pigment.
상기 자외선 차단제로는 이산화티타늄(TiO2) 또는 카본 블랙을 사용할 수 있다. Titanium dioxide (TiO 2 ) or carbon black may be used as the sunscreen.
상기 충전제로는 유리섬유, 탄소섬유, 실리카, 마이카, 알루미나, 점토, 탄산칼슘, 황산칼슘 또는 유리 비드를 사용할 수 있다. 상기 핵 형성제로는 탈크 또는 클레이를 사용할 수 있다. The filler may be glass fiber, carbon fiber, silica, mica, alumina, clay, calcium carbonate, calcium sulfate or glass beads. Talc or clay may be used as the nucleating agent.
상기 첨가제는 상기 내방사선 수지의 물성을 저해하지 않는 범위 내에서 적절히 포함될 수 있으며, 구체예에서는 상기 기초수지 100 중량부에 대하여 40 중량부 이하로 포함될 수 있으며, 더욱 구체예에서는 0.1 내지 30 중량부로 포함될 수 있다. The additive may be suitably included within a range that does not impair the physical properties of the radiation-resistant resin, in specific embodiments may be included in 40 parts by weight or less with respect to 100 parts by weight of the base resin, more specifically in the 0.1 to 30 parts by weight May be included.
본 발명의 다른 관점은 상기 내방사선 수지로부터 성형된 성형품에 관한 것이다. 본 발명의 내방사선 수지는 투명성, 색상 안정성 및 충격강도 뿐만 아니라, 내방사선이 특히 우수하므로 blood oxygenator, blood collective reservoir, blood separation device, b1ood collection device, 외과 수술용 도구, kidney analysis equipment centrifuge bowl, medical lab equipment, hemodialyzer 등 등과 같은 의료용 외장재에 유용하게 적용될 수 있다. Another aspect of the present invention relates to a molded article molded from the radiation resistant resin. Radiation-resistant resin of the present invention is not only excellent in transparency, color stability and impact strength, but also radiation resistance, blood oxygenator, blood collective reservoir, blood separation device, b1ood collection device, surgical instrument, kidney analysis equipment centrifuge bowl, medical It can be usefully applied to medical exterior materials such as lab equipment, hemodialyzer and the like.
본 발명의 내방사선 수지는 50kGy 방사선 조사후 ASTM D1925에 의한 황변지수(ΔYI)가 10 이하, 바람직하게는 0.1 내지 7 , 더욱 바람직하게는 0.1 내지 5 의 값을 가질 수 있다.
The radiation resistant resin of the present invention may have a yellowing index (ΔYI) of 10 or less, preferably 0.1 to 7, more preferably 0.1 to 5, according to ASTM D1925 after 50 kGy irradiation.
본 발명은 하기의 실시예에 의하여 보다 더 잘 이해될 수 있으며, 하기의 실시예는 본 발명의 예시 목적을 위한 것이며 첨부된 특허청구범위에 의하여 한정되는 보호범위를 제한하고자 하는 것은 아니다.
The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.
실시예Example
하기의 실시예 및 비교 실시예에서 사용된 각 성분의 사양은 다음과 같다.
The specification of each component used in the following Example and the comparative example is as follows.
(A) 기초수지(A) Basic resin
(a1)폴리카보네이트 수지(a1) polycarbonate resin
비스페놀A로부터 유도된 PC로서 비스페놀A와 디페닐카보네이트를 용융상태에서 에스테르 교환반응에 의하여 제조하였으며 유동지수(300℃, 1,2kg)는 약8.0 g/10min인 폴리카보네이트 수지를 사용하였다.
Bisphenol A and diphenyl carbonate were prepared by transesterification in a molten state as a PC derived from bisphenol A, and a polycarbonate resin having a flow index (300 ° C., 1,2 kg) of about 8.0 g / 10 min was used.
(a2) 코폴리에스테르 수지(a2) copolyester resin
테레프탈릭에시드, 에틸렌글리콜 및 1,4-사이클로핵산다이메탄올을 기본 구조로 하는 PCTG로서, 유동지수(250℃, 1.2kg)는 약 8.9 g/10min인 에스케이케미칼주식회사의 JN200을 사용하였다.
As PCTG based on terephthalic acid, ethylene glycol and 1,4-cyclonucleic acid dimethanol, the flow index (250 ° C., 1.2 kg) was used as JN200 of SK Chemical Co., Ltd., which was about 8.9 g / 10 min.
(B) 고급 지방족 포스페이트(B) higher aliphatic phosphates
아데카에서 제조된 AX-71을 사용하였다.
AX-71 manufactured by Adeka was used.
(B') 방향족 포스페이트 : DAIHACHI P에서 제조된 PHOSFLEX TPP(트리페닐포스페이트)를 사용하였다.
(B ′) Aromatic Phosphate: PHOSFLEX TPP (triphenylphosphate) made from DAIHACHI P was used.
(B") 저급 지방족 포스페이트 : sigma-aldrich에서 제조된 tributyl phosphate 를 사용하였다.
(B ") Lower aliphatic phosphate: tributyl phosphate prepared from sigma-aldrich was used.
(C) 폴리알킬렌옥사이드 : 바스프 Mn=2,000의 PPG를 사용하였다.(C) Polyalkylene oxide: PPG of BASF Mn = 2,000 was used.
(D) 첨가제 : 포스파이트계 산화방지제 아데카의 PEP-36을 사용하였다.
(D) Additive: PEP-36 of the phosphite antioxidant Adeka was used.
실시예Example 1?7 및 1? 7 and 비교예Comparative example 1?6 1? 6
상기 각 구성성분을 하기 표 1에 기재된 바와 같은 함량으로 첨가한 후 230~280℃온도에서 45φ 이축 압출기로 압출 후 펠렛 형태로 제조하였다. 상기 제조된 펠렛을 80~120℃에서 3시간 이상 열풍건조한 후, 6 oz의 사출성형기를 사용하여, 240~290℃의 온도에서 두께 3mm의 시편을 제작하고 물성시편을 제조하였다. 상기 제조된 물성시편은 하기의 방법으로 물성을 측정하여 그 결과를 하기 표 1에 나타내었다. Co60에 의해 생성되는 감마선을 이용하여 시간당 10kGy의 선량으로 25kGy와 50kGy의 흡수선량으로 조사하여 감마선 조사 전과, 조사 후 2일 후의 황변지수(ΔYI)와 전광선투과율(TT)을 측정하였다.
Each component was added in an amount as described in Table 1 below, and then extruded in a 45 φ twin screw extruder at a temperature of 230˜280 ° C. to prepare pellets. After drying the pellets hot air at 80 ~ 120 ℃ for 3 hours or more, using a 6 oz injection molding machine, to produce a specimen of thickness 3mm at a temperature of 240 ~ 290 ℃ and to prepare a physical specimen. The prepared physical property specimens were measured for physical properties by the following method and the results are shown in Table 1 below. The gamma rays produced by Co 60 were irradiated with absorbed doses of 25 kGy and 50 kGy at doses of 10 kGy per hour to measure the yellowing index (ΔYI) and total light transmittance (TT) before and after gamma irradiation.
물성측정방법: Property measurement method:
1) 전광선투과율(TT): 두께 3mm의 시편을 이용하여 ASTM D1003에 준하여 측정하였다(단위: %).1) Total light transmittance (TT): measured in accordance with ASTM D1003 using a specimen of thickness 3mm (unit:%).
2) 황변지수(ΔYI) : 방사선 조사 2일 후 YI - 조사전 YI로 ASTM D1925에 따라 투과법으로 평가하였다.
2) Yellowing index (ΔYI): 2 days after irradiation, YI-YI before irradiation was evaluated by permeation according to ASTM D1925.
전광선
투과율Before investigation
Light rays
Transmittance
전광선
투과율After 50kGy irradiation
Light rays
Transmittance
황변지수
(ΔYI)After 50kGy irradiation
Yellowness Index
(ΔYI)
상기 표 1에 나타난 바와 같이, 실시예 1~7은 자외선 조사후 투명성 저하가 3 % 미만이고 황변지수도 낮은 것을 확인할 수 있다. 특히 폴리아킬렌옥사이드를 적용한 실시예 5 및 6은 황변지수가 현저히 낮은 것을 알 수 있다. 이에 비해 고급 지방족 포스페이트 화합물을 적용하지 않은 비교예 1~3은 황변지수가 상당히 높게 나타났으며, 고급 지방족 포스페이트 대신 방향족 포스페이트를 적용하거나 저급 지방족 포스페이트를 적용한 비교예 4 및 5는 내방사선 효과가 전혀 없는 것을 알 수 있다. 또한 고급 지방족 포스페이트 화합물을 과량 적용한 비교예 6은 사출 성형시 다량의 가스가 발생하였다.
As shown in Table 1, Examples 1 to 7 can be confirmed that the decrease in transparency after UV irradiation is less than 3% and the yellowing index is low. In particular, it can be seen that Examples 5 and 6 to which a polyalkene oxide is applied are significantly lower in the yellowing index. On the other hand, Comparative Examples 1 to 3 without applying the higher aliphatic phosphate compound showed significantly higher yellowing index, and Comparative Examples 4 and 5 using the aromatic aliphatic phosphate instead of the higher aliphatic phosphate or the lower aliphatic phosphate had no radiation-resistant effect. It can be seen that there is no. In addition, Comparative Example 6, in which an excess aliphatic phosphate compound was applied, generated a large amount of gas during injection molding.
본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The present invention is not limited to the above embodiments, but may be manufactured in various forms, and a person skilled in the art to which the present invention pertains has another specific form without changing the technical spirit or essential features of the present invention. It will be appreciated that the present invention may be practiced as. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.
Claims (9)
(B) 고급 지방족 포스페이트 화합물 0.01 내지 2 중량부
을 포함하여 이루어지는 내방사선 수지.
(A) 50 to 90% by weight of (a1) polycarbonate resin; And (a2) 100 parts by weight of a base resin including 10 to 50% by weight of a copolyester resin;
(B) 0.01 to 2 parts by weight of the higher aliphatic phosphate compound
Radiation-resistant resin comprising a.
[화학식 2]
[화학식 3]
상기 화학식 2 및 3에서 n 및 m은 11~20의 정수이고, n 및 m은 서로 같거나 다름.
The radiation-resistant resin according to claim 1, wherein (B) the higher aliphatic phosphate compound is at least one of the compounds represented by the following Chemical Formulas 2 or 3:
(2)
(3)
In Formulas 2 and 3, n and m are integers of 11 to 20, and n and m are the same as or different from each other.
The radiation resistant resin of claim 1, wherein the radiation resistant resin has a yellowing index (ΔYI) of 10 or less according to ASTM D1925 after 50 kGy irradiation.
The radiation resistant resin according to claim 1, wherein the (a2) copolyester resin comprises a unit derived from 1,4-cyclohexanedimethanol.
The copolyester resin of claim 1, wherein the (a2) copolyester resin contains an aromatic or aliphatic dieside residue and two or more diol residues, wherein 1,4-cyclohexanedimethanol is 50 mol% or more in the diol residues. Radiation-resistant resin, characterized in that.
The radiation resistant resin of claim 1, wherein the radiation resistant resin further comprises a polyalkylene oxide.
The radiation-resistant resin of claim 1, wherein the polyalkylene oxide has a number average molecular weight of 500 to 20,000 g / mol.
The method of claim 1, wherein the radiation-resistant resin is antibacterial, thermal stabilizer, antioxidant, release agent, light stabilizer, inorganic additives, surfactants, coupling agents, plasticizers, stabilizers, lubricants, antistatic agents, colorants, weathering agents, colorants, ultraviolet rays A radiation resistant resin comprising at least one additive selected from the group consisting of absorbents, sunscreens, flame retardants, fillers and nucleating agents.
A medical exterior material molded from the radiation resistant resin according to any one of claims 1 to 8.
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| DE102016112050A1 (en) | 2015-06-30 | 2017-01-05 | Samsung Sdi Co., Ltd. | An ionizing radiation resistant polycarbonate resin composition and molded article containing the same |
| US10144826B2 (en) | 2015-04-13 | 2018-12-04 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation resistant polycarbonate resin composition and article comprising the same |
| US10767044B2 (en) | 2015-10-27 | 2020-09-08 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation resistant polycarbonate resin composition and molded article containing same |
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| JP2001270982A (en) * | 2000-03-28 | 2001-10-02 | Teijin Chem Ltd | Ionizing radiation stabilized polycarbonate resin composition and polycarbonate resin composition for members of medical instruments |
| US7342059B2 (en) * | 2003-01-13 | 2008-03-11 | Eastman Chemical Company | Polyester-polycarbonate blends useful for extrusion blow-molding |
| AU2003297380A1 (en) * | 2003-01-13 | 2004-08-13 | Eastman Chemical Company | Polymer blends |
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| US10144826B2 (en) | 2015-04-13 | 2018-12-04 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation resistant polycarbonate resin composition and article comprising the same |
| DE102016112050A1 (en) | 2015-06-30 | 2017-01-05 | Samsung Sdi Co., Ltd. | An ionizing radiation resistant polycarbonate resin composition and molded article containing the same |
| US10150864B2 (en) | 2015-06-30 | 2018-12-11 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation resistant polycarbonate resin composition and article comprising the same |
| US10767044B2 (en) | 2015-10-27 | 2020-09-08 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation resistant polycarbonate resin composition and molded article containing same |
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