KR20120054282A - Liquid crystal display device - Google Patents

Abstract

The present invention relates to a liquid crystal display device using an LED as a light source, and more particularly to an efficient heat dissipation design of the LED.
A feature of the present invention is to further include an LED housing on the back of the LED assembly, and to position the LED housing at the outermost portion of the liquid crystal display.
As a result, high-temperature heat generated from a plurality of LEDs can be more quickly and efficiently discharged to the outside, thereby reducing the lifespan of the LEDs or preventing the image quality of the liquid crystal display device from deteriorating due to a change in luminance.
In addition, it is possible to provide a lightweight and thin liquid crystal display device, it is possible to reduce the cost of manufacturing cover cover.

Description

[0001] Liquid crystal display device [0002]

The present invention relates to a liquid crystal display device using an LED as a light source, and more particularly to an efficient heat dissipation design of the LED.

Liquid crystal display devices (LCDs), which are used for TVs and monitors due to their high contrast ratio and are advantageous for displaying moving images, are characterized by optical anisotropy and polarization of liquid crystals. The principle of image implementation by

Such a liquid crystal display is an essential component of a liquid crystal panel bonded through a liquid crystal layer between two side-by-side substrates, and realizes a difference in transmittance by changing an arrangement direction of liquid crystal molecules with an electric field in the liquid crystal panel. do.

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required in order to display the difference in transmittance as an image. To this end, a backlight including a light source is disposed on the back of the liquid crystal panel.

Here, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED) are used as a light source of the backlight unit. .

Among them, LEDs are particularly widely used as light sources for displays with features such as small size, low power consumption, and high reliability.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As illustrated, a general liquid crystal display device includes a liquid crystal panel 10, a backlight unit 20, a support main 30, a cover bottom 50, and a top cover 40.

The liquid crystal panel 10 is a part that plays a key role in image expression and is composed of first and second substrates 12 and 14 bonded to each other with a liquid crystal layer interposed therebetween.

The backlight unit 20 is provided behind the liquid crystal panel 10.

The backlight unit 20 includes an LED assembly 29 arranged along at least one edge length direction of the support main 30, a white or silver reflecting plate 25 seated on the cover bottom 50, and a reflecting plate ( The light guide plate 23 mounted on the substrate 25 and the optical sheet 21 interposed thereon is included.

At this time, the LED assembly 29 is configured on one side of the light guide plate 23, and the plurality of LEDs 29a emitting white light and the LED PCB (printed circuit board: 29b, hereinafter, PCB) is mounted on which the LED 29a is mounted. ).

The liquid crystal panel 10 and the backlight unit 20 have a top cover 40 surrounding the top edge of the liquid crystal panel 10 and a back surface of the backlight unit 20 in a state where the edges are surrounded by the support main 30 having a rectangular frame shape. Cover cover 50 to cover each is coupled in front and rear are integrated through the support main 30 as a medium.

In addition, reference numerals 19a and 19b denote polarizers attached to the front and rear surfaces of the liquid crystal panel 10 to control the polarization direction of light, respectively.

Here, the LED (29a) is a light emitting device, the temperature is rapidly increased according to the use time, the temperature rise has a feature that is accompanied by a change in lifetime and brightness. Therefore, one of the most important matters when the LED 29a is used as the light source of the backlight unit 20 is a heat radiation design according to the temperature rise of the LED 29a.

However, in the general liquid crystal display device, the temperature of the LED 29a gradually increases during use since a specific method for rapidly discharging high-temperature heat generated from the LED 29a is not provided. The change in brightness eventually causes a decrease in image quality.

In addition, it causes a problem that the life of the LED (29a) is shortened.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a liquid crystal display device capable of effectively dissipating high temperature heat generated from an LED.

Accordingly, it is a second object of the present invention to shorten the life of the LED or to prevent deterioration of the image quality of the liquid crystal display due to a change in luminance.

In order to achieve the object as described above, the present invention is a reflection plate; A light guide plate mounted on the reflection plate; An LED assembly including a plurality of LEDs arranged along the light guide plate incident surface, and a PCB on which the plurality of LEDs are mounted; An LED housing surrounding the LED assembly and including a vertical portion in contact with the PCB and a first horizontal portion perpendicular to the vertical portion; A liquid crystal panel seated on the light guide plate; It includes a cover bottom consisting of a horizontal plane in close contact with the reflecting plate, one edge of the horizontal plane provides a liquid crystal display device located on the inner surface of the first horizontal portion of the LED housing.

In this case, the reflector is positioned on the lower side of the LED assembly, guides the lower side of the LED assembly, the heat dissipation pad having an adhesive is interposed between the first horizontal portion and the horizontal plane.

In addition, the upper side of the LED assembly is provided with a reflective tape for guiding the light emitted from the LED assembly toward the light guide plate, the LED housing is perpendicular to the vertical portion, the second horizontal facing the first horizontal portion Contains wealth.

In this case, the reflective tape is attached to the inside of the second horizontal portion, and a stepped portion is formed in the first horizontal portion of the LED housing between an area in contact with the horizontal plane and an area not in contact with the horizontal plane.

In addition, an optical sheet interposed between the light guide plate and the liquid crystal panel, and includes a support main covering the edge of the liquid crystal panel, covering an upper edge of the liquid crystal panel, and coupled to the support main and the cover bottom. It includes a top cover to be fastened.

As described above, according to the present invention, the LED housing is further provided on the rear surface of the LED assembly, and the LED housing is located at the outermost portion of the liquid crystal display device, thereby making it possible to more quickly and efficiently heat the high temperature generated from the plurality of LEDs. It can be released to the outside.

As a result, the lifespan of the LED may be shortened or the image quality of the liquid crystal display may be prevented from deteriorating due to the change in luminance.

In addition, there is an effect that can provide a lightweight and thin liquid crystal display device, there is an effect that can reduce the cost of manufacturing cover cover.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.
2 is an exploded perspective view schematically illustrating a liquid crystal display according to an exemplary embodiment of the present invention.
3 is a schematic cross-sectional view of a partial cross section of FIG. 2 modularized;
Figure 4 is a cross-sectional view schematically showing the movement path of heat generated from the LED according to the heat dissipation design of the LED assembly according to an embodiment of the present invention.
5 to 7 are cross-sectional views schematically illustrating various aspects of a liquid crystal display according to an exemplary embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

2 is an exploded perspective view schematically illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

As shown, the liquid crystal display device includes a liquid crystal panel 110, a backlight unit 120, a support main 130, a cover bottom 150, and a top cover for modularizing the liquid crystal panel 110 and the backlight unit 120. 140.

Looking at each of them in more detail, the liquid crystal panel 110 plays a key role in image expression, and the first substrate 112 and the second substrate 114 bonded to each other with the liquid crystal layer interposed therebetween. Include.

At this time, although not shown in the drawings under the premise of an active matrix method, a plurality of gate lines and data lines intersect each other and a pixel is defined on an inner surface of the first substrate 112, which is commonly referred to as a lower substrate or an array substrate. A thin film transistor (TFT) is provided at each crossing point to be connected one-to-one with a transparent pixel electrode formed in each pixel.

An inner surface of the second substrate 114, called an upper substrate or a color filter substrate, may correspond to each pixel, for example, a color filter of red (R), green (G), and blue (B) color, and these. A black matrix is provided covering each of the gate lines, the data lines, and the thin film transistors. In addition, a transparent common electrode covering the red (R), green (G), and blue (B) colors and the black matrix is provided.

A polarizer (not shown) for selectively transmitting only specific light is attached to the outer surfaces of the first and second substrates 112 and 114, respectively.

Along the at least one edge of the liquid crystal panel 110, the printed circuit board 117 is connected through a connecting member 116 such as a flexible circuit board or a tape carrier package (TCP) to support the modularization process. The side surface of the main 130 or the cover bottom 150 is properly folded to be in close contact.

When the thin film transistor selected for each gate line is turned on by the on / off signal of the gate driver circuit, the liquid crystal panel 110 transmits the signal voltage of the data driver circuit to the corresponding pixel electrode through the data line. The arrangement direction of the liquid crystal molecules is changed by the electric field between the pixel electrode and the common electrode, indicating a difference in transmittance.

In addition, the liquid crystal display according to the present invention is provided with a backlight unit 120 for supplying light from its rear surface such that the difference in transmittance of the liquid crystal panel 110 is expressed to the outside.

The backlight unit 120 includes an LED assembly 129, a white or silver reflecting plate 125, a light guide plate 123 seated on the reflecting plate 125, and an optical sheet 121 interposed thereon. .

The LED assembly 129 is located at one side of the light guide plate 123 to face the light incident surface of the light guide plate 123, and the LED assembly 129 has a plurality of LEDs 129a and a plurality of LEDs 129a at regular intervals. It includes a PCB (129b) to be spaced apart.

At this time, the plurality of LEDs 129a include LED chips (not shown) which emit all of the colors of RGB or emit white, and emit white light toward the light incident surface of the light guide plate 123. On the other hand, the plurality of LEDs (129a) emits light having a color of red (R), green (G), blue (B), respectively, by lighting the plurality of RGB LEDs (129a) at once to produce white light by color mixing It can also be implemented.

On the other hand, the LED 129a is a light emitting device, the temperature is rapidly increased according to the use time, the temperature rise has a feature that is accompanied by a change in the lifetime and brightness of the LED (129a). Therefore, one of the most important matters when the LED 129a is used as a light source of the backlight unit 120 is a heat dissipation design according to the temperature rise of the LED 129a.

Thus, the backlight unit 120 of the present invention further includes an LED housing 200 on the rear surface of the LED assembly 129, so that high temperature heat generated from the LED 129a is effectively emitted to the outside of the liquid crystal display.

Here, the LED housing 200 is composed of a vertical portion 210 and a horizontal portion 220 to cover the lower side and the outer side of the LED assembly 129, the overall cross section is configured in a form bent in the form "b", thermoelectric It is made of metal material with excellent conductivity.

Accordingly, the high temperature heat generated from the plurality of LEDs 129a is transferred to the LED housing 200 to be quickly and efficiently released to the outside. As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a.

Accordingly, the liquid crystal display of the present invention has a heat dissipation design of the efficient LED assembly 129 by the LED housing 200. We will discuss this in more detail later.

The light guide plate 123 into which the light emitted from the plurality of LEDs 129a is incident is spread evenly to a large area of the light guide plate 123 while the light incident from the LED 129a propagates through the light guide plate 123 by a plurality of total reflections. The surface light source is provided to the liquid crystal panel 110.

The light guide plate 123 may include a pattern of a specific shape on the rear surface to supply a uniform surface light source.

Here, the pattern may be configured in various ways, such as an elliptical pattern, a polygon pattern, a hologram pattern, and the like to guide the light incident into the light guide plate 123. The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

At this time, it is preferable to include a reflective tape 128 having a high reflection efficiency of light on the upper portion of the LED assembly 129. The reflective tape 128 prevents loss of light and concentrates the light emitted from the LED assembly 129 to the light incident surface of the light guide plate 123 as much as possible.

The reflective plate 125 is positioned on the rear surface of the light guide plate 123, and reflects light passing through the rear surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the brightness of the light.

The optical sheet 121 on the light guide plate 123 includes a diffusion sheet and at least one light collecting sheet, and diffuses or collects light passing through the light guide plate 123 to provide a more uniform surface light source to the liquid crystal panel 110. Make it incident.

The liquid crystal panel 110 and the backlight unit 120 are modularized through the top cover 140, the support main 130, and the cover bottom 150. The top cover 140 is the top and side surfaces of the liquid crystal panel 110. A rectangular frame having a cross section bent in a shape of “a” so as to cover an edge thereof is configured to open an entire surface of the top cover 140 to display an image implemented in the liquid crystal panel 110.

In addition, the cover bottom 150 on which the liquid crystal panel 110 and the backlight unit 120 are mounted, and which is the basis for assembling the entire apparatus of the liquid crystal display device, has a horizontal surface 151 and an edge thereof closely contacting the rear surface of the backlight unit 120. It consists of a side 153 vertically bent upwards.

At this time, one edge 155 of the cover bottom 150 in which the LED assembly 129 is positioned is formed in a state in which the side surface is removed and is opened. In this case, the horizontal surface of the open edge 155 of the cover bottom 150 ( The 151 contacts the inner side surface of the horizontal portion 220 of the LED housing 200 and is seated on the inner side surface of the horizontal portion 220 of the LED housing 200.

Thus, the LED housing 200 in which the LED assembly 129 is mounted is positioned at the outermost portion of the liquid crystal display.

Through this, the high temperature heat generated from the LED 129a is directly discharged to the outside through the LED housing 200. The liquid crystal display of the present invention has a heat dissipation design of the LED assembly 129 by the LED housing 200 more efficient.

Then, the support main 130 having a rectangular frame shape, which is seated on the cover bottom 150 and opens at one edge of the liquid crystal panel 110 and the backlight unit 120, has a top cover 140 and a cover. It is coupled with the bottom 150.

The support main 130 is provided with a protrusion 131 that distinguishes the positions of the liquid crystal panel 110 and the backlight unit 120 from the inside thereof, and the liquid crystal panel 110 is mounted on and supported by the protrusion 131.

In this case, the top cover 140 may also be referred to as a case top or a top case, and the support main 130 may also be referred to as a guide panel, a main support, or a mold frame, and the cover bottom 150 may be referred to as a bottom cover or a lower cover. It is also built.

In this case, the backlight unit 120 having the above-described structure is generally called a side light method, and according to the purpose, a plurality of LEDs 129a may be arranged on the PCB 129b.

The above-described liquid crystal display device has an LED housing 200 on the back of the LED assembly 129, and in particular, by placing the LED housing 200 on the outermost side of the liquid crystal display device, LED (by more efficient heat dissipation design) The high temperature heat from 129a is efficiently released to the outside.

3 is a schematic cross-sectional view of some cross-section of FIG. 2 modularized.

As shown, the optical sheet 121 on the reflective plate 125, the light guide plate 123, the LED assembly 129 provided on one side of the light guide plate 123, the LED housing 200 and the light guide plate 123. These layers are stacked to form a backlight unit (120 of FIG. 2).

In addition, a liquid crystal panel 110 including a liquid crystal layer (not shown) is disposed between the backlight unit 120 and the first and second substrates 112 and 114 and the first and second substrates 120 and 120. On each of the outer surfaces of the two substrates 112 and 114, polarizing plates 119a and 119b for selectively transmitting only specific light are attached.

The backlight unit (120 of FIG. 2) and the liquid crystal panel 110 are surrounded by edges by the support main 130, and a cover bottom 150 formed of a horizontal surface 151 and a side surface 153 is coupled to the rear surface thereof. The top cover 140 covering the upper edge and the side of the liquid crystal panel 110 is coupled to the support main 130 and the cover bottom 150.

At this time, the support main 130 of the present invention is provided with a protrusion 131 for supporting the liquid crystal panel 110 inward, the cover bottom 150 has a side (153 of FIG. 2) of one edge 155 It is arranged to be removed and opened.

Meanwhile, although only one LED 129a of the LED assembly 129 is shown in the drawing, a plurality of LEDs 129a are mounted on the PCB 129b at a predetermined interval and receive driving power from the outside.

Here, the PCB 129b is an electronic circuit board that enables mounting and electrical connection of various electronic devices by printing a wiring pattern (not shown) on an insulating layer such as resin or ceramic. The PCB 129b is an epoxy-based FR4 PCB. Or FPCB (flexible printed circuit board), MCPCB can be formed.

Recently, in order to quickly dissipate heat generated from the LEDs (129a), more and more MCPCBs are used. In this case, when the MCPCB is formed, it is preferable to further form an insulation layer (not shown) such as a polyimide resin material for electrical insulation between the metal MCPCB and the wiring pattern (not shown).

At this time, the high temperature heat generated from the LED 129a is quickly transferred to the PCB 129b.

At this time, the upper side of the LED assembly 129 is provided with a reflective tape having a high reflection efficiency of the light, the reflective tape 128 is attached to the back of the protrusion 131 of the support main 130, a plurality of LED The light emitted from 129a serves to concentrate the light guide plate 123 toward the light incident surface as much as possible.

The LED assembly 129 is attached to the LED housing 200, so that the high temperature heat generated from the plurality of LEDs (129a) is more easily discharged to the outside.

Here, the LED housing 200 is composed of a vertical portion 210 to which the PCB 129b is attached and a horizontal portion 220 formed perpendicularly to the vertical portion 210, and the overall cross section is bent in a “b” shape. do.

In this case, when the LED housing 200 defines one surface facing the light guide plate 123 of the vertical portion 210 as the inner side, the LED assembly 129 is erected inside the vertical portion 210 to form an adhesive material such as a double-sided tape ( (Not shown).

In addition, the horizontal portion 220 is vertically bent inward from the vertical portion 210, and configured to guide the lower side of the LED assembly 129.

The LED housing 200 is preferably formed of, for example, aluminum (Al), an aluminum (Al) having a purity of 99.5%, and an anodizing treatment. It is preferable that the oxide film of is formed on the surface.

Therefore, since the LED housing 200 is black, the heat absorption rate is increased, and thus the LED housing 200 has a high thermal conductivity. Thus, heat transferred from the LED assembly 129 to the LED housing 200 is effectively diffused throughout the LED housing 200.

Thus, the high temperature heat generated from the LED assembly 129 is quickly and efficiently released to the outside through the LED housing 200.

At this time, the LED housing 200 is made of a length corresponding to the LED assembly 129, the horizontal portion 220 of the LED housing 200 has a constant width so as to completely cover the lower side of the LED assembly 129.

Here, as the area of the horizontal portion 220 of the LED housing 200 increases, the high temperature heat from the LED 129a can be quickly and efficiently discharged to the outside.

The LED assembly 129 and the LED housing 200 according to the embodiment of the present invention are located at one open edge 155 of the cover bottom 150, such that the LED housing 200 is located at the outermost side of the liquid crystal display. Will be located.

That is, the horizontal surface 151 of the open one edge 155 of the cover bottom 150 is in contact with the inner surface of the horizontal portion 220 of the LED housing 200, the horizontal portion 220 of the LED housing 200. It is seated on the inner side.

Therefore, the LED housing 200 is located on the outermost side of the liquid crystal display device, whereby the liquid crystal display device of the present invention can more efficiently and quickly discharge the high temperature heat generated from the LED 129a. do.

That is, the high temperature heat generated from the LED 129a is transferred to the LED housing 200 through the PCB 129b and emitted to the outside. In particular, the LED housing 200 is located at the outermost part of the liquid crystal display and immediately. By being exposed to the outside, the LED housing 200 is in direct contact with the external air to more quickly release the high temperature heat generated from the LED (129a).

In this case, the horizontal surface 151 of the open edge 155 of the cover bottom 150 is seated on the inner surface of the horizontal portion 220 of the LED housing 200 to surround the lower side of the LED assembly 129, The reflective plate 125 mounted on the horizontal surface 151 of the cover bottom 150 is also preferably positioned to surround the lower side of the LED assembly 129.

Therefore, the LED assembly 129 is guided by the reflecting tape 128 at the upper side and the reflecting plate 125 at the lower side, so that the light emitted from the plurality of LEDs 129a is more likely to enter the light guide plate 123. It can be focused to face the light plane.

Thus, the light efficiency of the backlight unit 120 (in FIG. 2) is further improved.

4 is a cross-sectional view schematically showing a movement path of heat generated from the LED according to the heat dissipation design of the LED assembly according to an embodiment of the present invention.

As shown, when high temperature heat is generated from the LED 129a, the heat is transferred to the vertical portion 210 of the LED housing 200 through the PCB 129b.

The high temperature heat transferred to the vertical portion 210 of the LED housing 200 is transferred to the top cover 140 in contact with the vertical portion 210 and diffused to the horizontal portion 220 of the LED housing 200.

The heat transferred to the top cover 140 is diffused to the whole of the top cover 140, and the heat of high temperature diffused to the entire top cover 140 increases the area in contact with external air, thereby increasing the LED 129a. The heat generated from the high temperature is released to the outside.

In addition, the hot heat diffused into the horizontal part 220 is directly contacted with external air from the horizontal part 220 and is immediately discharged to the outside without another heat transfer path.

Therefore, the high temperature heat generated from the plurality of LEDs 129a is quickly and efficiently released to the outside. As a result, the liquid crystal display of the present invention minimizes the temperature rise due to the use of the LED 129a, and cannot rapidly dissipate high temperature heat generated from the LED 129a to the outside. The problem that image quality deteriorates can be prevented.

In addition, it is possible to prevent the problem that the life of the LED (129a) is shortened.

Table 1 below shows experimental results comparing the heat dissipation characteristics of a liquid crystal display device having a general LED housing with a liquid crystal display device according to an embodiment of the present invention.

Sample 1 Sample 2 LED emitting surface (℃) 103.0 96.5 PCB (℃) 70.4 65.0 LED housing (℃) 54.0 47.4 Light guide plate incident surface (℃) 81.7 70.2

Here, Sample 1 is a test result of a general liquid crystal display device including an LED housing, and Sample 2 is a test result of a liquid crystal display device in which the LED housing is located at the outermost part of the liquid crystal display device according to an embodiment of the present invention.

Referring to Table (1), it can be seen that the temperature of Sample 2 is significantly lower than that of Sample 1. Through this, it can be seen that the heat dissipation characteristics of Sample 2 are better than that of Sample 1.

That is, by placing the LED housing 200 at the outermost portion of the liquid crystal display device, the high temperature heat generated from the plurality of LEDs 129a through the LED housing 200 can be quickly and efficiently discharged to the outside. will be.

In addition, the liquid crystal display of the present invention deletes the side surface (153 of FIG. 2) of one edge 155 of the cover bottom 150 where the LED assembly 129 is located, whereby the liquid crystal display is a bezel. ) Width can be reduced to achieve a so-called narrow bezel method.

Therefore, a light weight and a thin liquid crystal display device can be provided, and the manufacturing cost of the cover bottom 150 can be reduced.

At this time, the stiffness degradation by deleting the side surface (153 of FIG. 2) of one edge 155 of the cover bottom 150 is reinforced through the vertical portion 210 of the LED housing 200.

On the other hand, the LED housing 200 of the present invention by assembling and fastening the horizontal portion 220 of the LED housing 200 and the horizontal surface 151 of the cover bottom 150 through a screw or caulking, the position is fixed In this case, as shown in FIG. 5, adhesiveness is provided between the horizontal surface 151 of the open one edge 155 of the cover bottom 150 and the inner surface of the horizontal portion 220 of the LED housing 200. A thermal pad 160 is provided to bond the horizontal surface 151 of the cover bottom 150 to the horizontal portion 220 of the LED housing 200 through the heat pad 160. It is also possible to form a heat dissipation path connecting the LED housing 200 with.

That is, some of the heat generated from the LED 129a may be directly transferred to the one open edge 155 of the cover bottom 150 located at the lower side of the LED assembly 129. The heat transferred to the heat transfer pad 160 is transferred to the horizontal portion 220 of the LED housing 200 to radiate heat to the outside.

Alternatively, the high temperature heat transferred to the LED housing 200 is transferred to the cover bottom 150 through the heat dissipation pad 160, and spreads to the entire cover bottom 150, thus spreading to the entire cover bottom 150. The high temperature heat may increase the area in contact with the outside air, thereby releasing the high temperature heat generated from the LED 129a to the outside.

Here, the heat dissipation pad 160 may be formed of a silicone composition having excellent thermal conductivity, and the thermal conductive silicone composition has flexibility to easily deform to an external force, thereby covering the horizontal portion 220 and the cover of the LED housing 200. Closely coupled between one edge 155 of the horizontal surface 151 of the (150).

Alternatively, the heat dissipation pad 160 may be provided in a form in which a heat transfer filler is contained in a resin composition such as epoxy, and the heat transfer filler may be provided in a powder form of a material having excellent thermal conductivity such as aluminum, graphite, and copper.

In addition, as shown in FIG. 6, the horizontal portion 220 of the LED housing 200 is flat with the horizontal surface 151 of one open edge 155 of the cover bottom 150 seated on the horizontal portion 220. In order to maintain the view, the area where the horizontal surface 151 of the open one edge 155 of the cover bottom 150 is in contact with the horizontal surface 151 of the open one edge 155 of the cover bottom 150 is not contacted. Step 240 may be formed between the regions do not.

In addition, as shown in FIG. 7, when the direction of the LED housing 200 toward the light incident surface of the light guide plate 123 is an inner side, the PCB 129b of the LED assembly 129 is attached with the inner side opened. The upper portion of the LED assembly 129 parallel to the first horizontal portion 220 and the first horizontal portion 220 that guides the lower portion of the LED assembly 129 perpendicular to the vertical portion 210 and the vertical portion 210. The second horizontal portion 230 may be configured to guide the side.

That is, the LED housing 200 may be configured in a form bent in a cross-section "c" shape to cover the upper, lower and outer sides of the LED assembly 129.

In this case, the second horizontal portion 230 of the LED housing 200 may preferably cover up to a part of the edge of the light guide plate 123 facing the LED assembly 129. In this case, the reflective tape 128 may be formed on the second horizontal portion 230 of the LED housing 200 facing the LED assembly 129.

As described above, the liquid crystal display of the present invention further includes an LED housing 200 on the rear surface of the LED assembly 129 for heat dissipation of the LED 129a, and the LED housing 200 is the outermost portion of the liquid crystal display. By being located at, the high temperature heat generated from the plurality of LEDs 129a can be discharged to the outside more quickly and efficiently.

As a result, the lifespan of the LED 129a may be shortened or the image quality of the liquid crystal display may be prevented from deteriorating due to a change in luminance.

In addition, the liquid crystal display of the present invention eliminates the side surface (153 of FIG. 2) of the edge 155 of the cover bottom 150 where the LED assembly 129 is located, thereby providing a lightweight and thin liquid crystal display device. It can be, and can reduce the cover bottom 150 manufacturing cost.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

110: liquid crystal panel 112: first substrate, 114: second substrate
119a and 119b: first and second polarizing plates
121: optical sheet, 123: light guide plate, 125: reflector plate,
129: LED assembly (129a: LED, 129b: PCB)
130: support main, 140: top cover
150: cover bottom (151: horizontal plane, 153: side, 155: one edge)
200: LED housing (210: vertical portion, 220: horizontal portion)

Claims (9)

A reflector;
A light guide plate mounted on the reflection plate;
An LED assembly including a plurality of LEDs arranged along the light guide plate incident surface, and a PCB on which the plurality of LEDs are mounted;
An LED housing surrounding the LED assembly and including a vertical portion in contact with the PCB and a first horizontal portion perpendicular to the vertical portion;
A liquid crystal panel seated on the light guide plate;
Cover bottom consisting of a horizontal plane in close contact with the reflector
And an edge of the horizontal plane positioned on an inner side of the first horizontal portion of the LED housing.
The method of claim 1,
The reflective plate is located on the lower side of the LED assembly, the liquid crystal display device for guiding the lower side of the LED assembly.
The method of claim 1,
And a heat dissipation pad having an adhesive property between the first horizontal portion and the horizontal surface.
The method of claim 1,
And a reflective tape on the upper side of the LED assembly to guide the light emitted from the LED assembly toward the light guide plate.
The method of claim 4, wherein
And the LED housing is perpendicular to the vertical portion and includes a second horizontal portion facing the first horizontal portion.
The method of claim 5, wherein
And a reflective tape attached to the inside of the second horizontal portion.
The method of claim 1,
And a step is formed in the first horizontal portion of the LED housing between an area in contact with the horizontal plane and an area not in contact with the horizontal plane.
The method of claim 1,
And an optical sheet interposed between the light guide plate and the liquid crystal panel.
The method of claim 1,
And a top cover covering an edge of the liquid crystal panel and covering an upper edge of the liquid crystal panel, the top cover being coupled to the support main and the cover bottom.

Images