KR20120035157A - Extreme flow rate and/or high temperature fluid delivery substrates - Google Patents

Abstract

The flow substrate includes a body having a first side and a second side, a plurality of pairs of ports formed on the first side of the body, extending between each pair of ports and for fluid transfer with each port of each pair of ports. A plurality of fluid passages, and at least one cap. Each fluid passageway is formed in the second side of the body. The at least one cap has a first face configured to seal the at least one fluid passageway and a second face opposite the first face. At least one of the body and the at least one cap includes a weld formation formed on at least one of the second face of the body and the second face of the at least one cap, the weld formation being at least one Surround the fluid passage and facilitate welding of the at least one cap to the body along the weld formation.

Description

Extreme flow rate and / or high temperature fluid delivery substrates

FIELD OF THE INVENTION The present invention relates to fluid delivery systems, and more particularly to extreme flow and / or hot surface mount fluid delivery systems for use in the semiconductor processing and petrochemical industries.

Fluid delivery systems are used in many modern industrial processes for conditioning and manipulating fluid flow to provide controlled control of certain materials. Practitioners have developed a full grade fluid delivery system having a fluid treatment component removably attached to a flow substrate comprising a fluid passage conduit. This placement of the flow substrate dictates the flow order in which the fluid processing components provide the desired fluid conditioning and control. The interface between the flow substrate and the removable fluid treatment component is standardized and hardly changes. Such fluid delivery systems are often described as modular or surface mount systems. Representative examples of surface mount fluid delivery systems include gas panels used in semiconductor manufacturing equipment and sampling systems used in petrochemical refining. Various types of manufacturing equipment used to perform semiconductor manufacturing process steps are collectively called tools. Embodiments of the present invention generally relate to a fluid delivery system for semiconductor processing, specifically surface mount fluid delivery that is particularly suitable for use in extreme flow and / or high temperature applications when the process fluid is heated to temperatures above ambient. It's about the system. Aspects of the present invention are applicable to surface mount fluid delivery system designs, whether localized or distributed around a semiconductor processing tool.

Industrial process fluid delivery systems have fluid passage conduits made of selected materials according to the mechanical properties and considerations of the potential chemical interactions through which the fluid is delivered. Stainless steel is generally chosen for corrosion resistance and robustness, but aluminum or brass may be suitable if cost and ease of manufacture are more important. The fluid passage may consist of polymeric material when metal is not available due to the possibility of ion contamination of the fluid. Methods of hermetically coupling fluid treatment components to flow substrate fluid passage conduits are usually standardized within specific surface mount system designs to reduce the number of different component types. Most joining methods utilize a deformable gasket provided between the fluid component and the flow substrate to which it is attached. The gasket may be a simple elastic O ring or a specialized metal sealing ring as disclosed in US Pat. No. 5,803,507 and US Pat. No. 6,357,760. Since the beginning of the semiconductor electronics industry, there has been an interest in the control delivery of high-purity fluids to semiconductor manufacturing equipment, and the construction of fluid delivery systems primarily using metal seals has been developed early. One initial example of a suitable bellows closed valve is disclosed in US Pat. No. 3,278,156, while a VCR fitting widely used for connecting fluid conduits is disclosed in US Pat. 5,730,423. Recent commercial interest in the fabrication of photovoltaic solar cells with purity requirements that are less stringent than those needed to fabricate modern microprocessor devices can benefit fluid transfer systems using elastic seals.

Collections of fluid processing components assembled in a sequence to process a single fluid species are often referred to as gas sticks. Equipment subsystems consisting of several gas sticks for delivering process fluids to a particular semiconductor process chamber are often referred to as gas panels. In the 1990s, several inventors created a gas panel by creating a gas stick consisting of a conventional fluid flow path with a passive metal structure that includes a valve and a conduit through which active (and passive) fluid handling components are removably attached and the process fluid moves through it. We tried to solve the problem of maintainability and size. Passive fluid flow path elements are variously called manifolds, substrates, blocks, etc., although there are some inconsistencies in the invention of the individual inventors. As used herein, a flow substrate is used as the term for describing a fluid delivery system element that includes a passive fluid flow path (s) in which other fluid processing devices may be mounted.

Embodiments of the present invention relate to surface mount fluid transfer flow substrates that are particularly suited for use in extreme flow and / or high temperature applications when the process fluid is heated (or cooled) to a temperature higher (or lower) than the ambient environment. will be. The expression “polar flow rate” used in connection with a semiconductor process fluid delivery system refers to gas flow rates above about 50 SLM or below about 50 SCCM. An important aspect of the present invention is the fabrication of a flow substrate having a fluid passageway having a cross-sectional area (size) that is substantially larger or smaller than other surface mount architectures.

The flow substrate according to the invention can be used to form part of a gas stick or to form an entire gas stick. Some embodiments of the present invention can be used to implement an entire gas panel using only one flow substrate. The flow substrate of the present invention is securely fastened to the standardized stick bracket described in Applicant's co-pending patent application serial number 12 / 777,327 filed on May 11, 2010 (hereinafter, Applicant's co-pending application), A tight mechanical alignment can be provided to obviate the need for interlocking flange structures in flow substrates. In addition, the flow substrate of the present invention may be configured as described in the applicant's co-pending application to further provide one or more manifold connection ports and to enable transverse connections between fluid transfer sticks.

The flow board configuration of the present invention provides for valves and other fluids having an asymmetric port arrangement (eg, a standard “C-seal” device) or a symmetrical port arrangement (eg, a W-room device) on the valve (or other fluid handling component) mounting surface. It can be adjusted for use with processing parts. Only asymmetric designs are shown here since such devices can be most commonly used in the semiconductor equipment market.

According to one aspect of the present invention, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; And at least one cap. The at least one cap is formed of a second material and has a first face configured to seal at least one fluid passage of the plurality of fluid passages and a second face opposite the first face of the at least one cap. At least one of the substrate body and the at least one cap includes a weld formation formed on at least one of the second face of the substrate body and the second face of the at least one cap, the weld formation being the Surrounds at least one fluid passageway and is configured to facilitate welding of the at least one cap to the substrate body along the weld formation.

According to one embodiment the component conduit port extends through the substrate body to the second side of the substrate body, wherein the first material and the second material are stainless steel of the same alloy type. In another embodiment, the first material is stainless steel and the second material may be a nickel alloy such as Hastelloy, a corrosion resistant metal alloy available from Haines International.

According to yet another embodiment, the substrate body comprises a first weld formation formed on the second side of the substrate body, wherein the at least one cap is formed on the second side of the at least one cap. A weld formation.

According to yet another embodiment, the at least one cap includes the weld formation, and the weld formation includes a groove formed in the second side of the at least one cap. According to one aspect of this embodiment, the groove is adapted to the substrate body by identifying a location where the at least one cap is to be welded to the substrate body and reducing the power required to weld the at least one cap to the substrate body. It facilitates welding of the at least one cap. According to another aspect of this embodiment, the groove is formed in the second side of the at least one cap by chemical etching. According to another aspect of this embodiment, the at least one cap has a thickness of about 0.5 mm and the groove has a depth of about 0.25 mm. According to another aspect of this embodiment, the flow substrate further includes a plate formed of a rigid material and configured to be disposed adjacent to the second side of the at least one cap, and may further include a seat heater. The seat heater is configured to be disposed between the plate and the second face of the at least one cap.

According to another embodiment, the at least one cap includes a plurality of weld formations, and each weld formation of the plurality of weld formations includes respective grooves formed in the second face of the at least one cap. Each groove of the plurality of grooves surrounds each of the plurality of fluid passages.

According to another embodiment of the present invention, the at least one cap includes a plurality of caps corresponding to each of the plurality of fluid passages, each cap of the plurality of caps being the second of the respective caps. Each groove formed in the face.

According to yet another embodiment, the substrate body comprises the weld formation formed on the second side of the substrate body, the weld formation including a recessed weld wall surface surrounding the at least one fluid passageway. do. According to one aspect of this embodiment, the weld formation further comprises a stress relief groove surrounding the recessed weld wall surface. According to another aspect of this embodiment, the weld formation includes a sweded lip provided between the at least one fluid passageway and the recessed weld wall surface and surrounding the at least one fluid passageway. do. According to a further aspect of this embodiment, the weld formation further comprises a stress relief groove surrounding the recessed weld wall surface.

According to another embodiment, the flow substrate forms part of a gas stick for delivering one of the semiconductor process fluid, the sampling fluid and the petrochemical fluid. According to another embodiment of the invention, the flow substrate substantially forms the entirety of the fluid transfer panel.

According to another aspect of the invention, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; A plurality of chambers corresponding to each of the plurality of fluid passages; And at least one cap. The at least one cap is formed of a second material and has a first face configured to seal at least one fluid passage of the plurality of fluid passages and a second face opposite the first face of the at least one cap. . The at least one cap receives and retains at least one seal of the plurality of seals that mates with the at least one cap and is configured to form a fluid seal seal with the at least one fluid passageway upon compression with respect to the substrate body. do.

According to one embodiment, the component conduit port extends through the substrate body to the second face of the substrate body.

According to one embodiment, the first material and the second material are plastics, and in yet another embodiment, the first material is plastics and the second material is metal.

According to one embodiment, the at least one cap comprises a groove formed in the first face of the at least one cap and sized to hold the at least one thread. According to a further aspect of this embodiment, the groove is formed in the first face of the at least one cap by one of molding and machining.

According to yet another embodiment, the at least one cap includes a plurality of grooves formed in the first surface of the at least one cap, each groove of the plurality of grooves being a respective thread of the plurality of threads. It is formed in a size to maintain.

According to yet another embodiment, the at least one cap comprises a plurality of caps corresponding to each of the plurality of fluid passages, each cap of the plurality of caps being the first and second of the respective caps. Configured to receive and retain each yarn of the plurality of yarns between faces. According to a further aspect of this embodiment, said first and second sides of each cap are separated by an intermediate portion of each cap, said intermediate portion being any of said first and second sides of each cap. Has a cross-sectional area smaller than one. According to a further aspect of this embodiment, the first and second sides of each cap are formed in the same size.

According to yet another embodiment, the flow substrate further comprises a plate formed of a rigid material and disposed adjacent the second side of the at least one cap and configured to compress the at least one cap against the substrate body. .

According to still another aspect of the present invention, there is provided a flow substrate, the flow substrate comprising: a substrate body formed of a solid block of a first material, the substrate body having a first side and a second side opposite the first side; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; And a cap. The cap is formed of two materials and has a first face positioned to mate with a second face of the substrate body and a second face opposite the first face of the cap. The second face of the cap has a plurality of weld formations formed therein, each weld formation of the plurality of weld formations surrounding a respective fluid passage of a plurality of fluid passages, It is configured to define on two sides where the cap is to be welded.

According to one embodiment, the first material and the second material are stainless steel of the same alloy type. The cap has a thickness of about 0.5 mm, and each of the plurality of weld formations has a depth of about 0.25 mm.

According to another embodiment, the flow substrate may comprise a plate and seat heater formed of a rigid material and configured to be disposed adjacent to the second side of the cap. The seat heater is configured to be disposed between the plate and the second side of the cap.

According to one aspect of the invention, the flow substrate forms at least a portion of a gas stick for delivering one of a semiconductor process fluid, a sampling fluid and a petrochemical fluid.

According to another aspect of the invention, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; And a plurality of caps. Each of the plurality of caps is formed of two materials, each cap of the plurality of caps opposing a first face that seals each fluid passage of the plurality of fluid passages and the first face of the respective cap. To have a second side. Each cap of the plurality of caps has a weld formation formed on the second face of each cap, the weld formation surrounding each fluid passage of the plurality of fluid passages, along the weld formation. And to facilitate welding of each cap to the substrate body.

According to one aspect of this embodiment, the substrate body includes a plurality of weld formations formed on the second face of the substrate body and surrounding each of the plurality of fluid passages.

According to another aspect of this embodiment, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; A plurality of weld formations formed on the second face of the substrate body and each surrounding a respective fluid passage of the plurality of fluid passages; And a plurality of caps.

Each of the plurality of caps is formed of two materials, and each cap of the plurality of caps is configured to be welded to the substrate body along each weld formation of the plurality of weld formations.

According to one embodiment, each weld formation includes swedish lips surrounding each fluid passageway.

According to yet another embodiment, each cap of the plurality of caps has a first face configured to seal each fluid passage of the plurality of fluid passages and a second face opposite the first face. Each cap includes a weld formation formed on the second side of each cap and to facilitate welding of each cap to the substrate body.

According to another aspect of this embodiment, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; A plurality of chambers corresponding to each of the plurality of fluid passages; And a cap. The cap is formed of a second material and configured to attach to the second side of the substrate body. The cap has a first face provided to mate with the second face of the substrate body and a second face opposite the first face of the cap. The cap includes a plurality of grooves defined therein. Each groove of the plurality of grooves surrounds each fluid passage of the plurality of fluid passages and is configured to receive each chamber of the plurality of chambers.

According to one aspect of this embodiment, each groove of the plurality of grooves is sized to receive and retain each yarn of the plurality of yarns in each groove before attaching the cap to the second face of the substrate body. Is formed.

According to another aspect of this embodiment, a flow substrate is provided. The flow substrate is formed of a solid block of a first material, the substrate body having a first face and a second face opposite the first face; A plurality of pairs of component conduit ports formed on the first face of the substrate body; A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each of the plurality of fluid passages formed in the second face of the substrate body; A plurality of chambers corresponding to each of the plurality of fluid passages; And a plurality of caps formed of a second material and corresponding to each of the plurality of fluid passages. Each cap of the plurality of caps is configured to receive and retain each seal of the plurality of seals to form a fluid sealing seal with each fluid passage of the plurality of fluid passages upon compression with respect to the substrate body.

According to one aspect of this embodiment, the flow substrate further comprises a plate formed of a rigid material and configured to mate with the second side of the substrate body and configured to compress each of the plurality of caps with respect to the substrate body. Can be.

According to each aspect of the above-described embodiment, the first fluid passage of the plurality of fluid passages may have a different cross-sectional area than the second fluid passage of the plurality of fluid passages. Further, according to each of the embodiments described above, the plurality of fluid passages may be a first plurality of fluid passages extending between each pair of component conduit ports in a first direction, the flow substrate being in the first direction. And at least one second fluid passageway formed in one of the first and second surfaces of the substrate body extending in a second transverse direction.

According to the present invention, it is possible to provide a surface mount fluid transfer flow substrate that is particularly suited for use in extreme flow and / or high temperature applications when the process fluid is heated (or cooled) to a temperature higher (or lower) than the ambient environment. Can be. In addition, it is possible to fabricate flow substrates having fluid passageways having a cross-sectional area (size) that is substantially larger or smaller than other surface mount architectures.

The accompanying drawings are not drawn to scale, and each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. Not all components may be shown in all drawings for clarity.
1A is a plan view of a first embodiment of a flow substrate according to the present invention.
FIG. 1B is a cross-sectional view of the flow substrate of FIG. 1A taken along line AA in FIG. 1A.
FIG. 1C is a view of the flow substrate of FIGS. 1A and 1B seen from below. FIG.
1D is an elevation view of the flow substrate of FIGS. 1A-1C.
FIG. 1E is a cross-sectional view of the flow substrate of FIG. 1B taken along line BB in FIG. 1B.
FIG. 1F is a cross-sectional view of the flow substrate of FIG. 1B taken along line CC in FIG. 1B.
1G is a cross-sectional view of the flow substrate of FIGS. 1A-1F.
FIG. 1H is an exploded view showing a portion of the flow substrate shown in FIG. 1B.
1I is an elevation view of the flow substrate of FIGS. 1A-1H seen from below.
1J is a cut away elevational view of the flow substrate of FIGS. 1A-1I.
2A is a plan view of a second embodiment of a flow substrate according to the present invention.
FIG. 2B is a cross-sectional view of the flow substrate of FIG. 2A taken along line AA in FIG. 2A.
2C is a view of the flow substrate of FIGS. 2A and 2B viewed from below.
FIG. 2D is an elevation view of the flow substrate of FIGS. 2A-2C.
FIG. 2E is a cross-sectional view of the flow substrate of FIG. 2B taken along line BB in FIG. 2B.
FIG. 2F is an exploded view showing a portion of the flow substrate shown in FIG. 2B.
FIG. 2G is several elevation views from below of the flow substrate of FIGS. 2A-2F prior to assembly of the cap.
2F is an elevation view from below of the flow substrate of FIGS. 2A-2G after assembly of the cap.
3A is a plan view of a third embodiment of a flow substrate according to the present invention.
3B is a cross-sectional view of the flow substrate of FIG. 3A taken along line AA in FIG. 3A.
3C is a view of the flow substrate of FIGS. 3A and 3B seen from below.
3D is an exploded cross-sectional view showing a portion of the flow substrate of FIGS. 3A-3C along the line BB in FIG. 3B.
3E is an exploded elevation view from below of a portion of the flow substrate of FIGS. 3A-3D showing a first weld formulation;
4A is a plan view of a fourth embodiment of a flow substrate according to the present invention.
4B is a cross-sectional view of the flow substrate of FIG. 4A taken along line AA in FIG. 4A.
4C is an exploded cross-sectional view showing a portion of the flow substrate of FIGS. 4A and 4B along the line BB in FIG. 4B.
4D is an exploded elevation view from below of a portion of the flow substrate of FIGS. 4A-4C showing a second weld formulation.
4E is a cross sectional view of the flow substrate of FIGS. 4A-4D with a welding cap positioned;
4F is an exploded cross-sectional view showing a portion of the flow substrate of FIG. 4E.
4G is an elevation view of the flow substrate of FIGS. 4A to 4F seen from below.
5 shows various aspects of a welding cap for use with the flow substrate of FIGS. 3A-4G in accordance with aspects of the present invention.
6A is a cross-sectional view of a flow substrate according to a fourth embodiment of the present invention including a third weld preparation.
6B is an exploded cross-sectional view showing a portion of the flow substrate of FIG. 6A along the line BB in FIG. 6A.
6C is an exploded elevation view from below of a portion of the flow substrate of FIGS. 6A and 6B showing a third weld formulation;
6D is a cross sectional view of the flow substrate of FIGS. 6A-6C with a welding cap positioned;
6E is an exploded cross-sectional view showing a portion of the cap and flow substrate of FIG. 6D.
7A is a cross-sectional view of a flow substrate according to a fourth embodiment of the present invention including a fourth weld preparation.
FIG. 7B is an exploded cross-sectional view showing a portion of the flow substrate of FIG. 7A along the line BB in FIG. 7A.
FIG. 7C is an exploded elevation view from below of a portion of the flow substrate of FIGS. 7A and 7B showing a fourth weld formulation. FIG.
FIG. 7D is a cross sectional view of the flow substrate of FIGS. 7A-7C with the welding cap positioned;
FIG. 7E is an exploded cross-sectional view showing a portion of the cap and flow substrate of FIG. 7D.
8A is a cross-sectional view of a flow substrate according to a fourth embodiment of the present invention including a fifth weld preparation.
8B is an exploded cross-sectional view showing a portion of the flow substrate of FIG. 8A along the line BB in FIG. 8A.
8C is an exploded elevation view from below of a portion of the flow substrate of FIGS. 8A and 8B showing a fifth weld formulation;
8D is a cross sectional view of the flow substrate of FIGS. 8A-8C with a welding cap positioned;
8E is an exploded cross-sectional view showing a portion of the cap and flow substrate of FIG. 8D.
9A and 9B show various aspects of a welding cap for use with the flow substrate of FIGS. 7A-8E in accordance with aspects of the present invention.
10A is a cross-sectional view of a flow substrate according to a fourth embodiment of the present invention including a cap and an elastic yarn.
FIG. 10B is an exploded cross-sectional view showing a portion of the flow substrate of FIG. 10A along the line BB in FIG. 10A.
10C is an exploded elevation view of a portion of the flow substrate of FIGS. 10A and 10B viewed from below.
10D is a cross-sectional view of the flow substrate of FIGS. 10A-10C with the cap and elastic seal positioned with the backup plate.
10E is an exploded cross-sectional view showing a portion of the cap and flow substrate of FIG. 10D.
FIG. 10F is an elevation view of the flow substrate, cap, elastic seal, and backup play of FIGS. 10A-10E prior to assembly.
10G is an elevation view of the flow substrate, cap, elastic yarn, and backup play of FIGS. 10A-10F after assembly of the cap and elastic yarn.
11A shows how one flow substrate is used to implement all or part of a heated gas panel in accordance with one embodiment of the present invention.
11B shows how one flow substrate is used to implement all or part of a heated gas panel according to another embodiment of the present invention.
12A shows a fluid flow panel for use with a liquid or gas in which the entire fluid panel according to one embodiment of the present invention is implemented with two fluid flow substrates.
12B is an elevation view of the fluid flow panel of FIG. 12A.
12C shows a portion of the fluid flow panel of FIGS. 12A and 12B in which a fluid passage formed within a fluid flow substrate is shown.

The invention is not limited in its application to the construction and arrangement of parts specified in the following description or shown in the drawings. The invention can be practiced and carried out in various ways in other embodiments. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of including, comprising or having, containing, involving, and variations thereof is intended to encompass additional items as well as the items listed thereafter and their equivalents. will be.

It should be understood that the fluid material treated in the fluid delivery flow substrate of the present invention may be a gas, liquid, or vapor material that may vary between liquid and gas depending on the specific temperature and pressure of the material. Exemplary fluid materials may be pure urea such as argon (Ar), vapor compounds such as boron trichloride (BCl 3), mixtures of liquid silicon tetrachloride in the carrier gas, or aqueous reagents.

1A-1J are for use with a fluid treatment component (eg, a C-seal component) having an asymmetric port arrangement in which one of the ports of the fluid treatment component is axially aligned with the center of the component and the other is off axis. Shows a modular flow substrate according to an embodiment of the present invention. Although not shown in the drawings, it is to be understood that embodiments of the present invention may be modified for use with a fluid treatment component having a symmetrical port arrangement, such as a W-seal component.

As shown, the flow substrate 100 includes a substrate body 101 composed of a block of solid material and a corresponding cap 195 (see FIG. 1I), each of which may be a suitable material (depending on the intended use of the flow substrate). Stainless steel, for example). The substrate 100 includes a component attachment surface 105 to which fluid processing components (eg, valves, pressure transducers, filters, regulators, mass flow controllers, etc.) are attached. One or more component conduit ports 120 are formed on the component attachment surface 105 of the flow substrate. Component conduit port 120a is generally fluidly connected to a first port (inlet or outlet) of the first fluid treatment component. Meanwhile component port 120b is generally fluidly connected to a second port (inlet or outlet) of the first fluid treatment component. Component conduit port 120c is generally fluidly connected to a port (inlet or outlet) of a second fluid treatment component different from the first fluid treatment component.

Component conduit ports 120c and 120d and component conduit ports 120e and 120f are respectively connected to the inlet and outlet of each fluid treatment component, so that flow substrate 100 is connected to fluid treatment components having an asymmetrical port arrangement. Especially suitable. Component port 120g is generally connected to an inlet or outlet port of a device, such as a mass flow controller, that can be used to transfer the flow of process fluid between flow substrates of a fluid transfer stick.

Component conduit ports 120a and 120b are connected with a plurality of internal thread component mounting openings 110a, 110b, 110c, 110d. Each component mounting opening 110a, 110b, 110c, 110d receives a threaded end of a fastener (not shown) used to hermetically mount a fluid processing component to the flow substrate 100. Conduit port 120g is connected to a pair of internal thread component mounting openings 110y and 110z. Each component mounting opening 110y, 110z receives a threaded end of a fastener (not shown) that is used to hermetically mount a port of a fluid processing component, such as a mass flow controller, to the flow substrate 100. It should be understood that adjacent flow substrates in the fluid transfer stick may generally provide an additional pair of mounting openings necessary for hermetically mounting other ports of the fluid processing component to the adjacent flow substrate. Each pair of component conduit ports is connected to a leak port 125a for component conduit ports 120a and 120b and a leak port 125b for component conduit ports 120c and 120d to treat the conduit ports and each fluid. It is configured to detect leaks between components.

Flow substrate 100 includes a number of fluid passages 175a, 175b, 175c, 175d used to transfer fluid longitudinally along the flow substrate 100 (ie, from left to right in FIG. 1A). do. For example, the fluid passage 175a extends between the tube stub connection 135 and the component conduit port 120a, and the fluid passage 175b extends between the component conduit ports 120b and 120c, and the fluid passage 175c extends between component conduit port 120d and component conduit port 120e and fluid passage 175d extends between component conduit ports 120f and 120g. Tube stub connections 135 are generally fluidly connected (eg, by welding) to a source or sink of process fluid.

A plurality of dowel pin openings 150a to 150h are formed in the flow substrate 100 to extend from the component attachment surface 105 to the connection attachment surface 115 on the side of the flow substrate opposite the component attachment surface 105. . As described in Applicant's co-pending application, connection attachment surface 115 may be used to connect substrate 100 to a fluid transfer stick bracket or manifold or both. Each dowel pin opening 150a-150h can accommodate a dowel pin (not shown) that can be used to perform different functions. The first function is to align the body 101 and the cap 195 of the flow substrate 100, and the second function is to align the fluid transfer stick bracket and the flow substrate in a manner similar to that described in the applicant's co-pending application. will be. In some installations, it should be understood that only the first of these functions is performed so that after alignment (and welding as detailed below), the dowel pin can be removed and reused with another flow substrate body and cap. According to another aspect of the present invention, the location of the dowel pins is backward compatible with existing modular flow substrate systems, such as K1s systems.

FIG. 1C is a view of the flow board 100 viewed from below to show the plurality of flow board mounting openings 130. A plurality of flow substrate mounting openings 130 are formed in the cap 195 and extend through the cap 195 into the body 101 of the flow substrate (shown more accurately in FIG. 1I). Within the flow substrate body, the flow substrate mounting opening 130 is threaded internally to receive fasteners (not shown) to mount the flow substrate 100 on a mounting surface, such as a fluid transfer stick bracket, from below. The arrangement of the flow substrate mounting opening 130 may be changed according to the arrangement of the mounting openings on the mounting surface to which the flow substrate 100 is to be attached.

As can be seen in the figure, component conduit port 120 and fluid passageway 175 are both machined in a cost effective manner. Accordingly, the component conduit ports 120a-120g can be formed by processing from the component attachment surface 105 to the first or upper surface of the body 101 of the flow substrate 100, respectively, and the fluid passages 175b, 175c, 175d may each be formed by processing from the second or lower surface of the body 101 of the flow substrate as shown in FIG. 1F, and the fluid passage 175a may be formed of the body of the flow substrate as shown in FIG. 1E. It can be formed by processing from the side. Fluid passageway 175 may be treated to improve corrosion resistance. It should be understood that the dimensions of the fluid passage 175 shown in the figures are particularly suitable for high flow rates, such as about 50 SLM or more. In fact, according to the dimensions of the fluid passages shown in the figures, the flow substrate 100 can be used at high flow rates (eg, about 50-100 SLM) as well as very high flow rates (eg, 200 SLM or more). Thus, embodiments of the present invention can be used with modern semiconductor manufacturing equipment designed to operate at very high flow rates of about 200 SLM to 1000 SLM. For example, it should be understood that by simply reducing the cross-sectional area of one or more fluid passages 175b, 175c, 175d, the dimensions of the fluid passage can be reduced in a straight forward manner for low flow applications. In practice, since the component conduit port 120 is formed in a process step different from the fluid passage, the dimension of the fluid passage is not limited by the dimension of the component conduit port. Thus, the cross-sectional area of the fluid passageway may be significantly larger, smaller or equal to the cross-sectional area of the component conduit port to accommodate a wider range of flow rates.

1H and 1I show various details of a cap 195 according to one aspect of the present invention. According to one embodiment specifically configured for use with a semiconductor process fluid that can be frequently heated to temperatures above ambient, the cap 195 is formed from a thin sheet of stainless steel to a thickness of about 0.02 inch (0.5 mm). The thickness of the sheet of stainless steel allows heat to be easily transferred to the process fluid flowing in the flow substrate by applying heat to the connection attachment surface 115 of the substrate. The source of heat is by a block heater, by a cartridge heater inserted into a groove of a fluid transfer stick bracket with a flow substrate attached in a manner similar to that of the applicant's co-pending application, or by a thin film heater as described in US Pat. No. 7,307,247. May be provided by If desired, it should be understood that the thickness of the cap also allows cooling of the fluid flowing in the flow substrate.

In accordance with one aspect of the present invention, the sheet of stainless steel is chemically etched to form grooves 123 that surround and define fluid passageways 175b, 175c, and 175d. Such chemical etching can be performed accurately and can be cheaper than other methods of forming grooves, for example, by processing that may alternatively be used. According to one embodiment, the grooves may be etched to a thickness of about 0.01 inch (0.25 mm). Grooves 123 surrounding and defining fluid passages 175b, 175c, and 175d are provided for various purposes. For example, the thickness of the grooves allows the cap to be welded to the body 101 of the flow substrate using, for example, electron beam welding, using less time and energy than if the grooves 123 were not provided. Welding may be performed around each fluid passageway defined by the grooves to form a fluid sealing seal. Electron beam welding can be performed in a vacuum environment to minimize contamination. If the materials used for the flow body 101 and the cap 195 are high purity metals, such as stainless steel, the vacuum welding environment also serves to remove contaminants (eg, carbon, sulfur, manganese, etc.) at the weld point. . Although electron beam welding is generally preferred, it should be understood that other types of welding may also be used, such as laser welding.

Since the groove 123 defines the periphery of the fluid passage, the groove 123 also serves as a guide during welding. The corresponding dowel pin holes 150a and 150b in the body 101 of the flow substrate and the corresponding dowel pin holes 150a and 150b in the cap 195 are formed by the cap 195 being welded to the body of the flow substrate 100. Accepts a dowel pin to align and mate. Dowel pins may be removed and reused when welding is complete, or stored as a tool to align the flow substrate with the mounting surface.

Although only four fluid passages are shown in the figures, it should be understood that the number of fluid passages and component ports defined in the flow substrate may vary for ease and low cost of manufacturing embodiments of the present invention. In this regard, all fluid passageways and component connection ports for the entire fluid transfer stick can be formed in only one flow substrate. Alternatively, the fluid transfer stick may be formed using two or more flow substrates, such as the flow substrate 100 described above.

2A-2H illustrate a modular flow substrate in accordance with another embodiment of the present invention. As with the first embodiment, this embodiment provides a fluid treatment component (eg, a C-seal) with an asymmetric port arrangement where one of the ports of the fluid treatment component is axially aligned with the center of the component and the other is off axis. Parts) in particular for use. Although not shown in the figures, it should be understood that this embodiment may be modified for use with a fluid treatment component having a symmetrical port arrangement, such as a W-sealed component, as in the previous embodiment. The second embodiment is specifically configured to be used in an example of a high capacity (ie, a high flow rate), as in the first embodiment, but can also be configured to be used in an example of a low capacity of about 50 SCCM or less. Since the second embodiment has a configuration similar to that of the first embodiment, only the differences will be described in detail below.

As shown, the flow substrate 400 includes a substrate body 401 composed of a block of solid material and a corresponding cap 495 (see FIG. 2G), each of which may be a suitable material (depending on the intended use of the flow substrate). Stainless steel, for example). In examples where mainly non-metallic materials (eg, materials of concern for ionic contamination) can be used, as well as for cost reasons, the body 401 and / or cap 495 of the flow substrate may also be formed of a polymeric material such as plastic (eg, a mold or Processing). The use of other materials, such as plastics, may be particularly suitable for biological examples where ion contamination is a concern, or chemical delivery examples and / or where cost is a concern.

As with the first embodiment, the flow substrate 400 includes a component attachment surface 105 to which fluid processing components (eg, valves, pressure transducers, filters, regulators, mass flow controllers, etc.) are attached. The component attachment surface 105 of the flow substrate 400 is formed with one or more component conduit ports 120 having functions similar to those described in the first embodiment. In a manner similar to that described above, each component conduit port 120 is connected to a plurality of internal thread component mounting openings 110a, 110b, 110c, 110d, 110y, 110z, each component mounting opening being a fluid treatment component. A thread end of a fastener (not shown) used to hermetically mount (not shown) to the flow substrate 400 may be accommodated. Each pair of component conduit ports is connected to a leak port 125a for component conduit ports 120a and 120b and a leak port 125b for component conduit ports 120c and 120d to treat the conduit ports and each fluid. It is configured to detect leaks between components.

As in the first embodiment, the flow substrate 400 includes a plurality of fluid passages 175a and 175b used to deliver fluid along the flow substrate 400 in the longitudinal direction (ie, from left to right in FIG. 2A). 175c, 175d). As noted above, the tube stub connections 135 may generally be fluidly connected (eg, by welding or using a suitable adhesive such as epoxy) to a source or sink of process fluid.

As in the first embodiment, the plurality of dowel pin openings 150a to 150h flow to extend from the component attachment surface 105 to the connection attachment surface 115 on the side of the flow substrate opposite the component attachment surface 105. It is formed on the substrate 400. As described in Applicant's co-pending application, connection attachment surface 115 may be used to connect substrate 400 to a fluid transfer stick bracket or manifold or both.

As noted above, each dowel pin opening 150a-150h can accommodate a dowel pin (not shown) that can be used to perform different functions. The first function is to align the body 401 and the cap 195 of the flow substrate 400, and the second function is to align the fluid transfer stick bracket and the flow substrate in a manner similar to that described in the applicant's co-pending application. It is. In some installations, it should be understood that only the first of these functions can be performed. For example, depending on the length of the dowel pin used, the dowel pin may protrude through the cap 495 and extend beyond the connection attachment surface 115. Accordingly, the dowel pin may be used to align the flow substrate with the corresponding opening in the fluid transfer stick bracket or other mounting surface. If the dowel pin extends beyond the connection attachment surface 115, the position of the dowel pin may be backward compatible with existing modular flow board systems. Alternatively, the length of the dowel pin may be such that it does not extend beyond the connection attachment surface, but is engaged with the cap 495 to ensure alignment.

FIG. 2C is a view of the flow board 400 viewed from below to show the plurality of flow board mounting openings 130. A plurality of flow substrate mounting openings 130 are formed in the cap 495 and extend through the cap 495 into the body 401 of the flow substrate (shown more accurately in FIG. 2G). Within the flow substrate body, the flow substrate mounting opening 130 (130a, 130b in FIG. 2g) is threaded internally to receive the fastener 421 (FIG. 2h) to seal the flow substrate 400 such as a fluid transfer stick bracket. We mount from the bottom to scene. Fastener 421 is also used to compress deformable gasket 455, such as an elastic O-ring, to form a seal around each fluid passageway 175b, 175c, 175d, as described below. As can be seen in the figure, component conduit port 120 and fluid passageway 175 can be reprocessed or molded in a cost effective manner.

2D-2H show various details of cap 495 according to one aspect of the present invention. As shown in FIGS. 2B and 2E, the thickness of the cap 495 is considerably thick compared to the first embodiment (eg, 0.13 inch (3.3 mm) to 0.02 inch (0.5 mm)). This is particularly true when the cap 495 and the body 401 of the flow substrate 400 are formed of a non-conductive material such as plastic and when the heat is transferred or cooled to a fluid flowing through the flow substrate. If heat or cold is provided from below, it is rather ineffective. However, the thickness of the cap 495 allows the cap 195 to have sufficient rigidity to act as a mounting surface, and to form the groove 423 deep enough therein to maintain the elastic seal 455. In contrast to the cap 195 of the first embodiment, as shown most clearly in FIG. 2G, the groove 423 is the surface of the cap 495 (ie, the first implementation) to mate with the body 401 of the flow substrate. As in the example, it is processed on the non-exposed surface of the cap 495 when mated with the body 401 of the substrate 400 rather than the exposed surface 115 positioned to mate with the fluid transfer stick bracket or other mounting surface. The groove 423 is formed to a size that holds the elastic seal 455 in a proper position while assembling the cap 495 to the body 401 of the flow substrate 400 without the use of a separate seal retainer. When assembling, referring to FIG. 2G, the elastic seal 455 may be located in a groove 423 formed on the top surface of the cap 495 together with the top surface of the cap 495 mated with the body 401 of the substrate. Accordingly, the dowel pin opening 150a 'of the cap 495 is aligned with the dowel pin opening 150a of the body 401, and the dowel pin opening 150b' of the cap 495 is the body 401. ) And the dowel pin openings 130a 'and 130b' of the cap 495 are aligned with the dowel pin openings 130a and 130b of the body 401, respectively. Although the grooves 423 in this embodiment have been described as being machined to the surface of the cap, it should be understood that they may be formed by other processes such as molding.

As shown in FIG. 2H, a plurality of fasteners 421 are used to mount the cap 495 to the body 401 of the flow substrate 400. This fastener 421 serves two purposes: mounting the flow substrate 400 on the fluid transfer stick bracket from below, compressing the elastic seal 455 to seal the fluid sealing seal around the fluid passage 175b-d. Can be used for securing. In use, the resilient seal 455 is generally disposed at the location of the groove 423 of the cap 495. The dowel pins, which then extend through the dowel pin openings 150a ', 150b', etc. of the cap 495, are positioned in place with the body 401 of the flow substrate 400 and the cap 495 and elastic seal 455. ), The cap is aligned with the body 401 of the flow substrate 400 by a dowel pin inserted into the dowel pin opening 150 to form a unit. The flow substrate 400 is disposed at a desired position on the fluid transfer stick bracket or other mounting surface, and the fastener 421 is inserted from below the bracket or other mounting surface. Tightening of the fastener 421 mounts the flow substrate to the mounting surface, the elastic seal 455 so that the fluid sealing seal is formed around the fluid passageway and the cap 495 mates with the body 401 of the flow substrate 400. )

Since the cap 495 is not welded to the body 401 of the flow substrate 400, the cap 495 and its corresponding elastic seal 455 can later be removed with minimal force. Thus, for example, if the fluid passageway 175b, 175c, or 175d is to be cleaned or repaired, the cap 495 is easily removed for exposing and / or cleaning the fluid passageway, replacing one or more elastic seals 455, and the like. Can be.

Although only four fluid passages are shown in the drawings with respect to the second embodiment, it should be understood that the number of fluid passages and component ports defined in the flow substrate may vary for ease and low cost of the fabrication embodiment of the present invention. In this regard, all fluid passageways and component connection ports for the entire fluid delivery stick or chemical or biological delivery system may be formed on a single flow substrate (by machining, molding, or a combination of machining and molding).

The embodiments shown in FIGS. 2A-2H are not effective when transferring thermal energy (heat or cold) to a fluid flowing in a flow substrate when heated or cooled from below, but the second embodiment can be modified for this use. Should understand. For example, the thickness of the cap 495 may be increased for the formation of longitudinal heater openings and the insertion of one or more cartridge type heaters that directly heat the cap 495 to heat the fluid flowing through the fluid passage 175. Can be. Such a deformation can be used when the body 401 of the flow substrate is formed of a nonconductive material such as plastic. For example, to improve thermal conductivity, cap 495 may be formed of a thermally conductive material, such as aluminum, and the body 401 of the flow substrate is formed of another material of, for example, plastic.

Although not specifically shown, it should be understood that other forms described in the applicant's co-pending application may be used with the flow substrate described herein. For example, in addition to the longitudinally formed fluid passages, the flow substrate can include transversely formed manifold fluid passages. In this embodiment, a tube stub connection similar to the tube stub connection 135 extends from the side of the body 101 (401) of the flow substrate with a manifold fluid passage formed similarly as described for the fluid passage 175a. can do.

While embodiments of the present invention have primarily been described for the use of fluid handling components having two ports, it should be understood that embodiments of the applicant's invention may be modified for use with three port components, such as a three port valve. However, since such fluid handling components are less common and usually more expensive, two port fluid treatment components are generally preferred.

1A-2H described above relates to a flow substrate in which a plurality of fluid passages formed within the body are sealed by a general or integrated cap attached to the bottom of the body. 1A-1J use an integrated cap welded to the bottom surface of the flow substrate around each fluid passageway to seal each fluid passageway. 2A-2H, on the other hand, uses an integrated cap that compresses a plurality of elastic seals disposed around each fluid passageway to seal each fluid passageway when extruded with respect to the bottom surface of the body. According to another aspect of Applicant's invention, instead of using an integrated cap to seal each of the plurality of fluid passageways in the flow substrate shown in FIGS. 1A-2H, a plurality of individual caps may be used. An embodiment of Applicants' invention using a plurality of individual caps is described with reference to FIGS. 3A-12C.

3A-3E relate to a flow substrate comprising a plurality of corresponding caps, each cap corresponding to each fluid passage formed in the body of the flow substrate. The cap may have a structure similar to the cap 595 shown in FIG. 5, recessed in the body of the substrate and seam welded in place. The cap may be formed by machining or stamping a piece of metal, such as stainless steel, for example. 3A-3C show that not only can accommodate a fluid treatment component having two ports, but some embodiments of the present invention can be modified to accommodate a fluid treatment component having three ports.

As best seen in FIGS. 3D and 3E, each fluid passageway includes a weld formation (also known as a weld formulation) comprising a weld edge 805, a stress relief wall 810, and a stress relief groove 815. Surrounded by. The stress relief groove 815 prevents bowing, twisting, or other distortion that may occur during seam welding cap 595 to the body of the flow substrate along the weld edge 805. Serves to align the exposed surface of the weld cap 595 within the body of the flow substrate. Welding the cap to the body of the substrate generally leaves a small bump at the welding position, but does not extend beyond the bottom of the body of the flow substrate and may remain so there is no need to prepare additional surfaces to remove these bumps. .

4A-4G illustrate another type of flow substrate of the present invention that includes a fluid passageway sealed by corresponding individual caps. Although FIGS. 4A-4G show only one fluid passageway interconnecting two component conduit ports formed on the component attachment surface of the substrate, FIGS. 4A-4G shown here illustrate the weld formation used in this particular embodiment. Since it is mainly used to describe the structure, the substrate body may include a plurality of fluid passages similar to those shown in FIGS. 3A-3E. The cap used in this embodiment may be formed from a piece of metal or sheet by processing or stamping, as shown in FIG.

As best shown in FIG. 4C, the weld formation includes a weld edge 1005, a stress relief wall 1010 and a stress relief groove 1015, each similar to that described above with reference to FIGS. 3A-3E. Perform the function. However, unlike the embodiment of FIGS. 3A-3E, the embodiment shown in FIGS. 4A-4G further includes swaged lip 1020. In manufacturing, each cap 595 (FIG. 5) is placed in each fluid passageway to be sealed, and then swedled lip 1020 surrounding each fluid passageway, for example, using a dyna jig made for this purpose. Apply mechanical force. The mechanical force on the dyna jig pushes or folds the lip inwards toward the weld edge to capture and retain each cap 595 within the body of the flow substrate. The substrate having the corresponding cap can be operated in one unit. Each cap may be seam welded along the folded swipped lip and weld edge to form a leak seal. As with the embodiment of FIGS. 3A-3E, no additional surface preparation or processing is required to remove weld bumps that may form along the weld edge because they do not extend beyond the bottom of the substrate body. As with the embodiments of FIGS. 3A-3E described above, the stress relief grooves may be bowed, twisted, or otherwise generated during seam welding cap 595 to the body of the flow substrate along the weld edge 1005. Or to prevent other distortions.

5 shows a cap 595 that can be used with the embodiments of FIGS. 3A-4G. Advantageously, the cap 595 can be machined or stamped into a metal sheet at a very low cost. In one embodiment of the present invention, the thickness of the cap 595 is about 0.035 inches (0.9 mm), which is almost twice the thickness of the integrated weld cap 195, and no additional reinforcement is required even at high pressures.

6A-6E illustrate another form of flow substrate of the present invention that includes a fluid passageway sealed by corresponding individual caps. As with the embodiments of FIGS. 3A-3E, the substrate bodies shown here are similar to those shown in FIGS. 3A-3E since FIGS. 6A-6E are used primarily to describe the structure of the weld formation used in this particular embodiment. It may include a plurality of fluid passages. The cap 595 used in this embodiment is the same as described with reference to FIG. 5 above, and may be formed from a piece of metal or sheet by machining or stamping, as shown in FIG. 5.

As best shown in FIG. 6B, the weld formation of this embodiment is substantially similar to that described above with reference to FIGS. 4A-4G, such that a weld edge 1505, a recessed flat bottom 1510, and a swab Wedge lip 1520. As with the embodiment of FIGS. 4A-4G, each cap 595 as shown in FIG. 5 may be seam welded to seal each fluid passageway. However, the weld formation in this embodiment does not include stress relief grooves as in the embodiment of FIGS. 4A-4G. Although the stress relief grooves of FIGS. 3A-3E and 4A-4G can prevent deformation of the body of the flow substrate during welding, seam welding processes are generally more in the body of the substrate than other forms of welding processes such as stake welding. Stress relief grooves are not necessary because they transfer less heat. Therefore, if cost is an important consideration, the stress relief groove can be omitted as shown in connection with this embodiment. As with the embodiments of FIGS. 3A-3E and 4A-4G, no additional surface preparation or processing is required to remove weld bumps that may form along the weld edge because they do not extend beyond the bottom of the substrate body. .

7A-7E and 8A-8E illustrate further embodiments of the invention using separate caps to seal respective fluid passages formed in the bottom surface of the body of the flow substrate. Each embodiment of FIGS. 7A-7E and 8A-8E employs a welding cap (shown in FIGS. 9A and 9B) in which weld formation is formed around the cap 995 in the form of a heat penetrating groove 2600. Although FIGS. 7A-7E and 8A-8E show only one fluid passageway to be sealed by each cap, FIGS. 7A-7E and 8A-8E shown here illustrate the weld formation used in certain embodiments. Since it is mainly used to describe the structure, the substrate body may include a plurality of fluid passages similar to those shown in FIGS. 3A-3E.

As best shown in FIG. 7B, the embodiment of FIGS. 7A-7E includes a weld formation formed in the body of a flow substrate that includes a stress relief wall, a weld face 1910, and a stress relief groove 1915. The stress relief groove 1915 serves to prevent bowing, twisting, or other distortions that may occur while welding the cap to the body of the flow substrate. However, in the embodiment of FIGS. 7A-7E, the cap is steak welded to the stress relief wall and the weld surface 1910 along the heat penetrating grooves 2600 formed in the caps 995 (FIGS. 9A and 9B). In manufacturing, after placing each cap 995 for each fluid passageway to be sealed, each cap is staked to the stress relief wall and the weld surface 1910. This staking can be accomplished by welding the cap 995 to the stress relief wall and the weld surface 1910 at several different locations along the periphery of the fluid passageway, or by mechanical forces, for example using punches at different locations. 995 may be performed by staking the stress relief walls and the weld surface 1910. Staking allows the substrate with the corresponding retaining cap to be operated in one unit and prevents movement of the cap 995 during welding. Each cap 995 may be stake welded along a heat penetrating groove 2600 to form a continuous weld seal. As detailed below with reference to FIGS. 9A and 9B, the heat penetrating groove 2600 substrates the cap 995 with less strain on the substrate body, faster, with less energy than it would be without. Let it weld. 7E shows how welding penetrates the body of the substrate.

8A-8E illustrate yet another embodiment of the present invention using separate caps to seal each fluid passageway formed in the bottom surface of the body of the flow substrate. As with the embodiment of FIGS. 7A-7E described above, this embodiment uses a welding cap 995 (shown in FIGS. 9A and 9B) in which a weld formation is formed around the cap 995 in the form of a heat penetrating groove 2600. use. Unlike the embodiment of FIGS. 7A-7E, as best seen in FIG. 8B, the weld formation of the embodiment of FIGS. 8A-8E is a planar surface 2310 recessed in the bottom surface of the body of the flow substrate surrounding the fluid passageway. ) Only. In manufacture, each cap 995 is positioned for each fluid passageway to be sealed, and then, for example, by welding the cap with a plane at different locations along the periphery of the fluid passage, or by mechanical force, as described above. Each cap may be staked in plane 2310. As mentioned above, staking allows the substrate with the corresponding retaining cap to be operated in one unit and prevents the cap's movement during welding. Each cap may be stake welded along heat penetrating grooves 2600 to form a continuous weld seal. Due to the heat penetrating grooves formed along the periphery of the cap 995, with less energy than it would be without, and with less deformation (or without deformation) to the body of the flow substrate, the cap was steaked into the body of the flow substrate. Can be welded. 8E shows how welding penetrates the body of the substrate.

9A and 9B show a welding cap configured to be stake welded to a body of a flow substrate. As shown in FIGS. 9A and 9B, the welding cap 995 includes a heat penetrating groove 2600 that surrounds the periphery of the welding cap 995. The heat penetrating grooves 2600 may be formed by chemical etching or by processing. Heat penetrating grooves 2600 reduce the thickness of the weld cap at the location of the grooves by about 30% to 50%, and in the illustrated embodiment by about 40%. In the illustrated embodiment, the weld cap 995 is about 0.02 inches (0.5 mm) thick, and the groove is about 0.020 to 0.025 inches (0.5 mm to 0.6 mm) wide and about 0.008 to 0.01 inches (0.2 mm) at its widest point. mm to 0.25 mm). While shown in a semicircular shape, it should be understood that other shapes may also be used. By reducing the thickness of the weld cap, heat penetrating grooves 2600 reduce the time and power required to form a continuous stake weld with the body of the flow substrate. The heat penetrating groove 2600 in the cap also serves as a guide for the person or machine performing the welding. It is to be understood that the weld cap 995 is similar to the integrated weld cap 195 in that the grooves 123 and 2600 serve as guides in welding and can seal the fluid passage with less power and time.

10A-10G illustrate a flow substrate and corresponding cap in accordance with another embodiment of the present invention. Unlike the embodiments of FIGS. 3A-9B in which the cap is welded to the body of the flow substrate, the embodiments of FIGS. 10A-10G use an elastic seal to seal the fluid passageway as the embodiments of FIGS. 2A-2H. In the embodiment of FIGS. 10A-10G, the flow substrate, cap or both the flow substrate and the cap may be formed of a metal or nonmetallic material. For example, a metal material may be used when heating or cooling a fluid in a flow substrate, and a nonmetal material may be used when ion contamination is a concern.

As shown in FIG. 10B, fluid passage 175 is compressed in pocket region 1040 and pocket region 1040 sized to receive cap 1050 and corresponding elastic seal 1055 (FIGS. 10D-10F). 10e, positive stop projections 1030 formed to prevent further movement of the cap 1050 and the corresponding elastic seal 1055.

10D-10G show how the backup plate 1060 can be used to compress the cap 1050 and its elastic seal 1055 within the pocket region of the fluid passage 175. Threaded fasteners (not shown) received in the internal thread flow substrate mounting opening 1065 compress the backup plate 1060 relative to the body of the substrate and into cap 1050 and corresponding elastic seal into the sealing engagement in pocket area 1040. Push it in. Depending on the application in which this embodiment is used, the flow substrate and cap can be formed of metal or plastic. The backup plate 1060 may be formed of a suitable metal, such as aluminum, or of plastic when it is desired to heat or cool the fluid in the fluid passage.

As most clearly shown in FIGS. 10E and 10F, the cap 1050 includes a pair of solders 1051, 1052 that hold the elastic seal 1055 in position relative to the cap 1050. And the elastic thread 1055 may be inserted into one unit. The cap 1050 and corresponding elastic seal 1055 may be inserted with a solder 1051 that couples with the positive stop protrusion 1030 or with a solder 1052 that engages with the positive stop protrusion 1030. 1051 and 1052 have the same dimensions.

11A and 11B show several different aspects of the present invention. As shown in FIGS. 11A and 11B, instead of forming a gas stick or an entire gas panel using a plurality of flow substrates, only one material block 1100 may be used to form a gas stick or an entire gas panel. . 11A also shows how backup plate 1120 can be used to reinforce the cap (or caps) in high pressure applications. For example, when used as an integrated thin welding cap as shown in FIGS. 1A-1J, where a plurality of passageway sealing welding locations are defined in a thin sheet of material (eg, by the groove 123 shown in FIG. 1I), Backup plate 1120 may be used to reinforce the welding cap, particularly in high pressure applications. The backup plate 1120 may be formed of a metal material such as aluminum or a nonmetal material such as plastic. As also shown in FIG. 11A, the seat heater 1110 may be positioned between the flow substrate (with the corresponding cap or caps) and the backup plate 1120. The combination of a thin integrated cap with a seat heater and a backing plate securely seals the fluid passageway for use at high pressures while heat is easily transferred to the fluid flowing therein. As shown in FIG. 11B, instead of using an integrated weld cap, a plurality of individual weld caps may be used, such as cap 595 and cap 995 (FIGS. 5 and 9A-9B). 11B also shows that instead of using the seat heater 1110, snake-shaped heater 1112 with a snake-shaped groove formed in the backup plate 1120 may be used, or a number of conventional cartridge-type heaters 1114 may be used. Shows.

The backing plate shown in FIG. 11A can be used with the thin welding caps used in the embodiments of FIGS. 1A-1J as well as in conjunction with the embodiment of FIGS. 10A-10E to be used to seal each fluid passageway. It should be understood that O-ring seals can be compressed. In addition, when the body of the flow substrate is formed of a non-metallic material, the backup plate 1120 may be formed of a metallic material to provide additional support for fluid component mounting. For example, the fluid processing component provided on the upper surface of the flow substrate may extend through a through hole formed in the body of the substrate and may be mounted down to the body of the flow substrate through thread fasteners received in the thread opening of the backup plate 1120. .

12A-12C illustrate another embodiment of the present invention and show a gas panel for use with liquid, gas or a combination of liquid and gas. For example, as shown in FIG. 12A, the entire gas panel can be formed using only two flow substrates 1200, 1201, each of which has several gas sticks (left to right in FIG. 12A). Individual gas sticks) within the substrate for delivering the fluid. In addition, as shown in FIGS. 12A-12C, the substrates 1200, 1201 of this embodiment are configured for use with a fluid processing component having a symmetric port arrangement, such as a W-seal device, rather than having an asymmetric port arrangement. . In addition, as most clearly shown in FIG. 12C, the substrate 1200 may include fluid passageways having different flow capacities, fluid passages facing different directions, and / or fluid passageways formed on corresponding surfaces of the substrate body. For example, as shown in FIG. 12C, the substrate 1200 is a large diameter fluid passage 1275a, 1275b, 1275c formed on a lower surface (pathway 1275a or upper surface (fluid passage 1275b)) of the substrate 1200. Fluid may be delivered along a first or second direction (fluid passage 1275c), including a large diameter fluid passage that may be used to deliver a purge gas or fluid, such as argon. The upper surface or the lower surface of the substrate 1200 (including the small diameter fluid passages 1275d, 1275e, and 1275f formed in the passage 1275d) not only transfers the fluid in the first direction, but also the upper surface (fluid passage 1275e) or the lower surface ( The small diameter fluid passages 1275d, 1275e, and 1275f may be used to deliver a solvent or other liquid or gas, including small diameter fluid passages formed in the passage 1275f. The embodiment shown in 12a to 12c is a bar of a substrate. Although configured for use with a metal weld cap welded to the die, it should be understood that the present embodiment may be configured for use with an elastic seal, for example, for a fluid passage formed on the bottom surface of the substrate, 11A and 11B) may be used to compress the cap and the resilient seal, while the fluid passageway formed on the top surface of the substrate may be coupled with the cap so that the fluid component mounted so as to mate with the top surface of the substrate. It may be configured to compress the cap and seal when mounted down on the seal and fastened from above upon sealing engagement with the conduit port in the substrate.

While various aspects of at least one embodiment of the invention have been described, those skilled in the art will understand that various changes, modifications, and improvements are possible. Such changes, modifications, and improvements are part of this specification and are considered within the scope of the present invention. Therefore, the foregoing description and drawings are regarded only as examples.

100: flow substrate
101: substrate body
105: part attachment surface
120: conduit port

Claims (30)

A substrate body formed of a solid block of a first material, said substrate body having a first face and a second face opposite said first face;
A plurality of pairs of component conduit ports formed on the first face of the substrate body;
A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each formed on the second face of the substrate body; And
At least one cap formed of a second material and having a first face configured to seal at least one fluid passage of the plurality of fluid passages and a second face opposite the first face,
At least one of the substrate body and the at least one cap includes a weld formation formed on at least one of the second face of the substrate body and the second face of the at least one cap, the weld formation being the A flow substrate surrounding at least one of the fluid passageways and configured to facilitate welding of the at least one cap to the substrate body along the weld formation. The method of claim 1,
The component conduit port extends through the substrate body to a second side of the substrate body. The method of claim 1,
Wherein said first material and said second material are stainless steel of the same alloy type. The method of claim 1,
The substrate body includes a first weld formation formed on the second side of the substrate body and the at least one cap includes a second weld formation formed on the second side of the at least one cap. Board. The method of claim 1,
Wherein said at least one cap comprises said weld formation and said weld formation comprises grooves formed in said second face of said at least one cap. The method of claim 5, wherein
The groove is formed in the second surface of the at least one cap by chemical etching. The method of claim 5, wherein
The groove allows for identification of the location where the at least one cap is to be welded to the substrate body and reduces the power required to weld the at least one cap to the substrate body, thereby reducing welding of the at least one cap to the substrate body. Flow substrate to facilitate. The method of claim 1,
The at least one cap includes a plurality of weld formations, each weld formation of the plurality of weld formations including a respective groove formed in the second side of the at least one cap, wherein Each groove encircling each of the plurality of fluid passages. The method of claim 1,
The at least one cap includes a plurality of caps corresponding to each of the plurality of fluid passages, each cap of the plurality of caps including a respective groove formed in the second face of the respective cap Board. The method of claim 1,
The substrate body comprises the weld formation formed on the second side of the substrate body, the weld formation including a recessed weld wall surface surrounding the at least one fluid passageway. The method of claim 10,
And the weld formation further includes a stress relief groove surrounding the recessed weld wall surface. The method of claim 10,
And the weld formation includes sweded lip provided between the at least one fluid passageway and the recessed weld wall surface and surrounding the at least one fluid passageway. The method of claim 12,
And the weld formation further includes a stress relief groove surrounding the recessed weld wall surface. The method of claim 1,
Wherein the flow substrate forms part of a gas stick for delivering one of a semiconductor process fluid, a sampling fluid, and a petrochemical fluid. The method of claim 1,
Wherein said flow substrate substantially constitutes the entirety of the fluid delivery panel. The method according to any one of claims 1 to 15,
And the first fluid passage of the plurality of fluid passages has a different cross-sectional area than the second fluid passage of the plurality of fluid passages. The method according to any one of claims 1 to 16,
The plurality of fluid passages is a first plurality of fluid passages extending between each pair of component conduit ports in a first direction, and the flow substrate is formed of the substrate body extending in a second direction crossing the first direction. And at least one second fluid passageway formed in one of said first side and said second side. A substrate body formed of a solid block of a first material, said substrate body having a first face and a second face opposite said first face;
A plurality of pairs of component conduit ports formed on the first face of the substrate body;
A plurality of fluid passages extending between each pair of component conduit ports and in fluid communication with each component conduit port of each pair of component conduit ports, each formed on the second face of the substrate body;
A plurality of seals corresponding to each of the plurality of fluid passages; And
At least one cap formed of a second material, said at least one cap having a first face configured to seal at least one fluid passage of said plurality of fluid passages and a second face opposite said first face of said at least one cap Including one cap,
The at least one cap is configured to receive and retain at least one of the plurality of seals that mate with the at least one cap and to form a fluid sealing seal with the at least one fluid passageway upon compression with respect to the substrate body. Flow substrate. The method of claim 18,
The component conduit port extends through the substrate body to the second side of the substrate body. The method of claim 18,
And the first material and the second material are plastics. The method of claim 18,
Wherein said first material is plastic and said second material is metal. The method of claim 18,
Wherein said at least one cap comprises a groove formed in said first face of said at least one cap and sized to hold said at least one seal. The method of claim 22,
And said groove is formed in said first face of said at least one cap by one of molding and processing. The method of claim 18,
The at least one cap includes a plurality of grooves formed in the first surface of the at least one cap, wherein each groove of the plurality of grooves is sized to hold each thread of the plurality of threads. . The method of claim 18,
The at least one cap includes a plurality of caps corresponding to each of the plurality of fluid passages, each cap of the plurality of caps being between the first and second surfaces of the respective caps; A flow substrate configured to receive and maintain each seal of the. The method of claim 25,
The first and second faces of each cap are separated by a middle portion of each cap, the middle portion having a cross-sectional area smaller than any one of the first and second faces of each cap. . The method of claim 26,
Wherein said first and second sides of each cap are formed to be the same size. The method of claim 18,
And a plate formed of a rigid material and disposed adjacent the second face of the at least one cap and configured to compress the at least one cap against the substrate body. The method according to any one of claims 18 to 28,
And the first fluid passage of the plurality of fluid passages has a different cross-sectional area than the second fluid passage of the plurality of fluid passages. The method according to any one of claims 18 to 28,
The plurality of fluid passages is a first plurality of fluid passages extending between each pair of component conduit ports in a first direction, and the flow substrate is formed of the substrate body extending in a second direction crossing the first direction. And at least one second fluid passageway formed in one of said first side and said second side.

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