KR20110117387A - Tray transfer method and test handler using the same - Google Patents

Abstract

The present invention provides a first seating step of seating N trays held by a holding unit on a first support member located at a first lowered position, and a first lift to raise the first support member located at the first lowered position. The first lowering step of lowering the first support member to the first lowered position when the tray located at the uppermost end of the first support member is empty, the first holding unit is located in the first lowered position A first removing step of removing the empty tray from the supporting member, and repeatedly performing the first rising step, the first lowering step, and the first removing step until the first supporting member becomes empty; 1 relates to a tray transfer method including a repeat performance step and a test handler using the same.
According to the present invention, the time taken to supply the semiconductor devices to be tested can be reduced, thereby reducing the time taken for the loading process. According to the present invention, it is possible to reduce the time taken to receive the tested semiconductor device, thereby reducing the time taken for the unloading process.

Description

Method for transferring tray and Test Handler using the same}

The present invention relates to a test handler for connecting semiconductor devices to be tested to a test device and classifying the semiconductor devices tested by the test device according to the test result.

Memory or non-memory semiconductor devices (hereinafter referred to as "semiconductor devices") are manufactured through various test procedures. The equipment used in this test process is the test handler.

The test handler is connected to a separate test equipment for testing a semiconductor device. The test equipment includes a high fix board having a plurality of test sockets to which semiconductor devices are connected. The high fix board is coupled to the test handler.

The test handler performs a loading process, a test process, and an unloading process by using a test tray having a plurality of sockets for storing semiconductor elements.

The test handler performs a loading process of accommodating a semiconductor device to be tested contained in a tray into a test tray.

The test handler performs a test process of connecting the semiconductor devices stored in the test tray to the high fix board through the loading process. The test equipment tests the semiconductor devices connected to the high resolution board to confirm the performance of the semiconductor devices.

The test handler performs an unloading process of separating the semiconductor devices tested through the test process from the test tray and storing the semiconductor devices in a tray corresponding to the class according to the test result.

Here, as the time taken for the loading process and the unloading process is reduced, more semiconductor devices can be manufactured in a shorter time, and the competitiveness of the product can be enhanced, such as reducing the manufacturing cost of the semiconductor device. Therefore, there is a need for the development of a technology that enables a test handler to perform a loading process and an unloading process for more semiconductor devices in a short time.

The present invention has been made to solve the problems described above, an object of the present invention is a tray transfer method and a test handler using the same to perform a loading process and an unloading process for more semiconductor devices in a short time To provide.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

In the tray conveying method according to the present invention, the holding unit holds N trays (N is an integer greater than 1), and first seats for seating the held N trays on the first support member located at the first lowered position. step; A first raising step of raising the first supporting member located at the first lowering position; A first lowering step of lowering the first support member to the first lowered position when the tray located at the uppermost end of the first support member becomes empty; A first removing step of removing, by the holding unit, the empty tray from the first support member located at the first lowering position; And a first repeating step of repeatedly performing the first raising step, the first lowering step, and the first removing step until the first supporting member becomes empty.

In the tray conveying method according to the present invention, the holding unit holds M trays (M is an integer greater than 1), and the second seat for seating the held M trays on the second support member located at the second lowering position. step; A second raising step of raising the second supporting member located at the second lowering position; A second lowering step of lowering the second supporting member to the second lowering position when the tray located at the uppermost end of the second supporting member is filled with semiconductor elements; A second removing step of removing, by the holding unit, a tray filled with semiconductor elements from the second support member located at the second lowering position; And a second repeating step of repeatedly performing the second raising step, the second lowering step, and the second removing step until the second supporting member becomes empty.

The test handler according to the present invention includes a loading unit for performing a loading process for accommodating a semiconductor device to be tested in a test tray; A chamber unit for connecting the semiconductor element stored in the test tray to the high fix board through the loading process; An unloading unit which performs an unloading process of separating the tested semiconductor device from the test tray; And a stacker unit having a loading stacker for supplying a semiconductor device to be tested. The stacker unit may supply a semiconductor device to be tested using the tray transfer method.

The test handler according to the present invention includes a loading unit for performing a loading process for accommodating a semiconductor device to be tested in a test tray; A chamber unit for connecting the semiconductor element stored in the test tray to the high fix board through the loading process; An unloading unit which performs an unloading process of separating the tested semiconductor device from the test tray; And a stacker unit having an unloading stacker for storing the tested semiconductor device. The stacker unit may accommodate the semiconductor device tested using the tray transfer method.

According to the present invention can achieve the following effects.

The present invention can reduce the time taken to supply the semiconductor devices to be tested, thereby obtaining an effect of reducing the time taken for the loading process.

The present invention can reduce the time taken to store the tested semiconductor device, thereby reducing the time taken for the unloading process.

1 is a schematic block diagram of a test handler according to the present invention;
2 is a schematic view of a stacker unit according to the present invention;
3 is a schematic block diagram of a loading stacker and an unloading stacker according to the present invention;
4 is a flowchart illustrating a tray conveying method according to the first embodiment of the present invention.
5 to 16 is a schematic operation state of the tray transfer method according to a first embodiment of the present invention
17 is a flowchart illustrating a tray conveying method according to a second embodiment of the present invention.
18 to 29 is a schematic operation state diagram of the tray transfer method according to a second embodiment of the present invention

Hereinafter, a preferred embodiment of a test handler according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic block diagram of a test handler according to the present invention, FIG. 2 is a schematic diagram of a stacker unit according to the present invention, and FIG. 3 is a schematic block diagram of a loading stacker and an unloading stacker according to the present invention.

Referring to FIG. 1, the test handler 1 according to the present invention includes a loading unit 2, an unloading unit 3, a chamber unit 4, a rotator 5, a transfer unit 6, and a stacker unit. (7) may be included.

The loading unit 2 performs a loading process of accommodating a semiconductor device to be tested in a test tray. The loading unit 2 may include a loading picker 21 and a loading buffer 22.

The loading picker 21 may pick up a semiconductor device to be tested from a tray located in the stacker unit 7 and store it in a test tray. The tray located in the stacker unit 7 may be a customer tray (User-tray or Customer-tray). When the semiconductor element to be tested is stored in the test tray, the test tray may be positioned at the loading position.

The loading buffer 22 may temporarily receive a semiconductor device to be tested. The loading picker 21 may include a first loading picker and a second loading picker. The first loading picker may transfer the semiconductor device to be tested to the loading buffer 22 from a tray located in the stacker unit 7. The second loading picker may transfer the semiconductor device to be tested from the loading buffer 22 to a test tray located at the loading position. The first loading picker and the second loading picker may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down. When the semiconductor element to be tested is transferred from the tray located in the stacker unit 7 to the test tray by the first loading picker and the second loading picker, the loading buffer 22 is moved in the Y-axis direction. Can be. The loading picker 21 may include a plurality of first and second loading pickers, respectively.

Referring to FIG. 1, the unloading unit 3 performs an unloading process of separating the tested semiconductor device from the test tray. The unloading unit 3 may include an unloading picker 31 and an unloading buffer 32.

The unloading picker 31 may pick up the semiconductor device tested in the test tray and store it in a tray located in the stacker unit 7. When the semiconductor element tested in the test tray is picked up, the test tray may be located in an unloading position.

The unloading buffer 32 may temporarily receive the tested semiconductor device. The unloading picker 31 may include a first unloading picker and a second unloading picker. The first unloading picker may transfer the tested semiconductor device from the test tray to the unloading buffer 32. The second unloading picker may transfer the tested semiconductor device from the unloading buffer 32 to a tray located in the stacker unit 7. The second unloading picker may accommodate the semiconductor device picked up by the unloading buffer 32 in a tray corresponding to a class according to a test result. The first unloading picker and the second unloading picker may be moved in the X-axis direction and the Y-axis direction, and may be moved up and down. When the tested semiconductor device is transferred from the test tray to the tray located in the stacker unit 7 by the first unloading picker and the second unloading picker, the unloading buffer 32 is in the Y-axis direction. Can be moved to. The unloading picker 31 may include a plurality of the first unloading pickers and the second unloading pickers, respectively.

Referring to FIG. 1, in the chamber unit 4, a test process for testing a semiconductor device stored in a test tray is performed. A test equipment (not shown) may be connected to the chamber unit 4 and test a semiconductor device stored in a test tray. The chamber unit 4 may include the first chamber 41, the test chamber 42, and the second chamber so that the test equipment can test the semiconductor device not only at room temperature but also at high or low temperature. 43).

The first chamber 41 adjusts the semiconductor devices to be tested contained in the test tray to a first temperature. The first temperature is a temperature range of the semiconductor devices to be tested when the semiconductor devices to be tested are tested by the test equipment. The test tray containing the semiconductor devices to be tested is transferred from the loading position. At least one of an electrothermal heater or a liquefied nitrogen injection system may be installed in the first chamber 41 to adjust the semiconductor devices to be tested to the first temperature. When the semiconductor devices to be tested are adjusted to the first temperature, the test tray is transferred from the first chamber 41 to the test chamber 42.

The test chamber 42 connects the semiconductor devices to be tested contained in the test tray to test equipment. The semiconductor devices to be tested stored in the test tray are adjusted to the first temperature. The test equipment includes a high resolution board to which semiconductor devices to be tested are connected. The test chamber 42 includes a part or all of the high fix board inserted therein and a contact unit for connecting the semiconductor devices controlled to the first temperature to the high fix board. The test equipment tests the semiconductor devices connected to the high resolution board to confirm the performance of the semiconductor devices. The test chamber 42 may be provided with at least one of an electrothermal heater or a liquid nitrogen injection system to maintain the semiconductor devices to be tested at the first temperature. The test handler 1 may include a plurality of test chambers 42, and the high fix board may be installed in each of the plurality of test chambers 42. When the test for the semiconductor devices is completed, the test tray is transferred from the test chamber 42 to the second chamber 43.

The second chamber 43 adjusts the tested semiconductor devices stored in the test tray to a second temperature. The second temperature is a temperature range including or close to room temperature. At least one of an electrothermal heater or a liquid nitrogen injection system may be installed in the second chamber 43 to adjust the tested semiconductor devices to the second temperature. When the tested semiconductor devices are adjusted to the second temperature, the test tray may be transferred from the second chamber 43 to the unloading position.

In the chamber unit 4, the first chamber 41, the test chamber 42, and the second chamber 43 may be installed in a horizontal direction. In this case, the chamber unit 4 may include a plurality of test chambers 42, and a plurality of the test chambers 42 may be stacked up and down. In the test handler according to another embodiment of the present invention, the chamber unit 4 is the first chamber 41, the test chamber 42, and the second chamber 43 is to be stacked in a vertical direction It may be. That is, the first chamber 41, the test chamber 42, and the second chamber 43 may be stacked up and down. The first chamber 41 may be installed to be positioned above the test chamber 42, and the second chamber 43 may be installed to be positioned below the test chamber 42.

Referring to FIG. 1, the rotator 5 may rotate a test tray in which a semiconductor element to be tested is accommodated, and thus the test tray may be in a horizontal state to a vertical state. The rotator 5 may rotate a test tray in which the tested semiconductor device is accommodated, and thus the test tray may be horizontal in a vertical state. Therefore, the test handler 1 according to the present invention may perform the loading process and the unloading process on a test tray in a horizontal state, and may perform the test process on a test tray in a vertical state.

As described above, the test handler 1 according to the present invention may perform the loading process on the test tray located at the loading position, and perform the unloading process on the test tray located at the unloading position. Can be done.

Here, the test handler 1 according to the present invention may include the loading position and the unloading position formed at the same position. That is, the test handler 1 may perform the loading process and the unloading process for one test tray. When the unloading picker 31 separates the tested semiconductor device from the test tray, the loading picker 21 may store the semiconductor device to be tested in a place where the semiconductor device is separated and emptied. In this case, the test handler 1 according to the present invention may include one rotator 5.

The test handler 1 according to the present invention may include the loading position and the unloading position formed at different positions. That is, the test handler 1 may perform the loading process and the unloading process for different test trays, respectively. In this case, the rotator 5 may include a first rotator and a second rotator. The test tray containing the semiconductor device to be tested may be transferred to the first chamber 41 at the loading position, and may be rotated by the first rotator to be vertical in a horizontal state in this process. The test tray containing the tested semiconductor device may be transferred from the second chamber 43 to the unloading position, and in this process, may be rotated by the second rotator to be horizontal in a vertical state.

Although not shown, the test handler 1 according to the present invention may further include a connection portion. The test tray containing the semiconductor device to be tested may be transferred to the first chamber 41 via the connection part at the loading position. The test tray containing the tested semiconductor device may be transferred from the second chamber 43 to the unloading position via the connection part. In this case, the loading position and the unloading position may be formed at different positions, and the rotator 5 may be installed at the connection portion. The test tray containing the semiconductor element to be tested may be rotated by the rotator 5 to be in a horizontal state to a vertical state. The test tray containing the tested semiconductor element may be rotated by the rotator 5 to be in a vertical state. Can be leveled at.

Referring to FIG. 1, the transfer unit 6 may transfer a test tray between the components as described above. The transfer unit 6 may comprise a transfer means and an actuation means. The transfer means may transfer the test tray by pushing or pulling the test tray. The operation means may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. Can be moved.

1 and 2, the stacker unit 7 may position the tray C at a pickup position. The pick-up position is a position at which the loading picker 21 can pick up the semiconductor element to be tested from the tray C. The stacker unit 7 may position the tray C at a storage position. The storage position is a position at which the unloading picker 31 can accommodate the tested semiconductor device in the tray C. The stacker unit 7 may include a loading stacker 71, an unloading stacker 72, and a holding unit 73.

1 to 3, the loading stacker 71 may be provided to supply a semiconductor device to be tested. The loading picker 21 may pick up the semiconductor device to be tested from the tray C located in the loading stacker 71 and store it in the test tray located at the loading position. The loading stacker 71 may include a first storage mechanism 711 and a first support member 712.

The first storage device 711 may store a tray C containing the semiconductor devices to be tested. The loading stacker 71 may include a plurality of first storage mechanisms 711, and a plurality of trays C may be stacked and stored in the first storage mechanisms 711, respectively. The first storage mechanisms 711 may be disposed in the X-axis direction.

The tray C may be seated on the first support member 712. The first support member 712 may be installed to be positioned on the first storage mechanism 711. The loading stacker 71 may include a plurality of first support members 712, and the first support members 712 may be installed to be positioned on the first storage mechanisms 711, respectively.

The first support member 712 may be raised and lowered. When the holding unit 73 seats the tray C on the first support member 712 or removes the tray C from the first support member 712, the first support member 712 is provided. Can be lowered to be positioned in the first lowered position. When the loading picker 21 picks up the semiconductor device to be tested from the tray C, the first support member 712 may be raised so that the tray C seated thereon is positioned at the pickup position. The loading stacker 71 may include a first lifting device (not shown). The first lifting device uses a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The first support member 712 may be raised and lowered.

A plurality of trays C may be seated on the first support member 712. The loading picker 21 may pick up the semiconductor device to be tested from the tray C positioned at the top of the first support member 712. Therefore, the test handler 1 according to the present invention is the semiconductor to be tested for the empty tray (C) when the tray (C) located at the top of the first support member 712 is empty as the loading process is performed Reduce the time it takes to replace the tray (C) containing the elements. Accordingly, the test handler 1 according to the present invention can reduce the time taken for the loading process. Looking specifically at this, it is as follows.

First, when only one tray C may be seated on the first support member 712, when the tray C seated on the first support member 712 is empty, the first support member 712 is empty. Is lowered to the first lowered position. The holding unit 73 removes the empty tray C from the first support member 712, and holds the tray C containing the semiconductor devices to be tested from the first storage mechanism 711. After that, the held tray C is seated on the first support member 712. Thereafter, the first supporting member 712 is raised to the pick-up position, so that the empty tray C can be replaced with a tray C containing semiconductor elements to be tested.

In the test handler 1 according to the present invention, a plurality of trays C may be seated on the first support member 712. For example, when two trays C containing semiconductor elements to be tested are seated on the first support member 712, when the first tray C positioned at the top of the first support member 712 is empty, The first support member 712 is lowered to the first lowered position. When the holding unit 73 removes the empty first tray C from the first support member 712, the first support member 712 is placed in a state where the second tray C is seated. It may be raised to the pick-up position. Accordingly, the test handler 1 according to the present invention may replace the empty tray C with the tray C containing the semiconductor devices to be tested.

Therefore, the test handler 1 according to the present invention can reduce the number of processes required to replace the empty tray C with the tray C containing the semiconductor devices to be tested, and the empty tray C can be tested. Reduce the time it takes to replace the tray (C) containing the elements. Accordingly, the test handler 1 according to the present invention can reduce the time taken for the loading process. 2 illustrates that two trays C may be seated on the first support member 712, but the present invention is not limited thereto and two or more trays C may be seated on the first support member 712. May be

1 to 3, the unloading stacker 72 may be provided to receive the tested semiconductor device. The unloading picker 31 may pick up the tested semiconductor device from the test tray positioned at the unloading position and store the tested semiconductor device in the tray C located at the unloading stacker 72. The unloading stacker 72 may include a second storage mechanism 721 and a second support member 722.

The tray C containing the tested semiconductor devices may be stored in the second storage device 721. The unloading stacker 72 may include a plurality of second storage mechanisms 721, and a plurality of trays C may be stacked and stored in the second storage mechanisms 721, respectively. . The second storage mechanisms 721 may be disposed in the X-axis direction.

The tray C may be seated on the second support member 722. The second support member 722 may be installed to be positioned on the second storage mechanism 721. The unloading stacker 72 may include a plurality of second support members 722, and the second support members 722 may be installed to be positioned on the second storage mechanisms 721, respectively. .

The second support member 722 may be raised and lowered. When the holding unit 73 seats the tray C on the second support member 722 or removes the tray C from the second support member 722, the second support member 722 is provided. Can be lowered to be positioned in the second lowered position. When the unloading picker 31 accommodates the tested semiconductor device in the tray C, the second support member 722 may be raised so that the tray C seated thereon is positioned at the storage position. The unloading stacker 72 may include a second lifting device (not shown). The second lifting device uses a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The second support member 722 may be raised and lowered.

A plurality of trays C may be seated on the second support member 722. The unloading picker 31 may accommodate the tested semiconductor device in the tray C positioned at the top of the second support member 722. Therefore, the test handler 1 according to the present invention is filled with semiconductor elements when the tray C located at the top of the second support member 722 is filled with semiconductor elements as the unloading process is performed. The time taken to replace the tray C with the empty tray C can be reduced. Accordingly, the test handler 1 according to the present invention can reduce the time taken for the unloading process. Looking specifically at this, it is as follows.

First, when only one tray C may be seated on the second support member 722, when the tray C seated on the second support member 722 is filled with semiconductor elements, the second support may be mounted. Member 722 is lowered to the second lowered position. After the holding unit 73 removes the tray C filled with semiconductor elements from the second support member 722, the empty tray C is seated on the second support member 722. Thereafter, the second support member 722 is raised to the storage position, whereby the tray C filled with semiconductor elements can be replaced with an empty tray C.

In the test handler 1 according to the present invention, a plurality of trays C may be seated on the second support member 722. For example, when two empty trays C are seated on the second support member 722, the first tray C positioned at the uppermost end of the second support member 722 is filled with semiconductor elements. The second support member 722 is lowered to the second lowered position. When the holding unit 73 removes the first tray C filled with semiconductor elements from the second support member 722, the second tray C is seated on the second support member 722. Can be raised to the storage position. Accordingly, the test handler according to the present invention can replace the tray C filled with the semiconductor elements with the empty tray C.

Therefore, the test handler 1 according to the present invention can reduce the number of processes required to replace the tray C filled with semiconductor elements with the empty tray C, and empty the tray C filled with the semiconductor elements. It can reduce the time taken to replace the tray (C). Accordingly, the test handler 1 according to the present invention can reduce the time taken for the unloading process. In FIG. 2, two trays C may be seated on the second support member 722. However, the present invention is not limited thereto, and two or more trays C may be seated on the second support member 722. May be

1 to 3, the holding unit 73 may hold the tray C and transfer the held tray C. FIG. The holding unit 73 may hold the tray C containing the semiconductor devices to be tested from the first storage device 711 and seat the tray C on the first support member 712. ) Can be removed from the first support member 712 by holding the empty tray (C). The holding unit 73 may hold the empty tray C to be seated on the second support member 722, and hold the tray C containing the semiconductor devices tested from the second support member 722. It may be held and removed from the second support member 722. The holding unit 73 may transfer the tray C removed from the second support member 722 to the second storage mechanism 721, according to the test results of the semiconductor devices contained in the tray C. It can be transferred to the second storage mechanism 721 corresponding to the class.

The holding unit 73 may be implemented to hold a plurality of trays (C). The holding unit 73 may include an installation member 731, a first gripper 732, a second gripper 733, a first driving mechanism 734, and a second driving mechanism 735.

The first gripper 732, the second gripper 733, the first driving mechanism 734, and the second driving mechanism 735 may be installed on the installation member 731. The installation member 731 may be moved in the X-axis direction (shown in FIG. 2) and may be moved up and down. 2, the installation member 731 may be moved in a left direction and a right direction, and may be moved up and down. The stacker unit 7 may include a driving means (not shown). The driving means may be a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. 731 can be moved in the X-axis direction, and can be moved up and down.

The first gripper 732 may hold the tray C, and may be installed to be movable to the installation member 731. The first gripper 732 may be moved by the first driving mechanism 734. The holding unit 73 may include a plurality of first grippers 732. The first grippers 732 may be in contact with one side and the other side of the tray C to hold the tray C by applying a force to the tray C. FIG. For example, the first grippers 732 may be in contact with the left side of the tray C and the right side of the tray C, respectively, to hold the tray C by applying a force to the tray C. FIG. Grooves are formed on the left side of the tray C and the right side of the tray C, respectively, and the first grippers 732 may be inserted into the grooves to hold the tray C. FIG. The first gripper 732 holding the left side of the tray C and the first gripper 732 holding the right side of the tray C may move closer to each other to hold the tray C, and are far from each other. The holding of the tray C can be released by moving the fork.

The second gripper 733 may hold the tray C and may be installed to be movable to the installation member 731. The second gripper 733 may be moved by the second driving mechanism 735. The second gripper 733 and the first gripper 732 may be moved separately, thereby holding the tray C or releasing the holding on the tray C separately. The holding unit 73 may include a plurality of second grippers 733. The second grippers 733 may be in contact with one side and the other side of the tray C to hold the tray C by applying a force to the tray C. For example, the second grippers 733 may be in contact with the left side of the tray C and the right side of the tray C to apply the force to the tray C, thereby holding the tray C. Grooves are formed on the left side of the tray C and the right side of the tray C, respectively, and the second grippers 733 may be inserted into the grooves to hold the tray C. FIG. The second gripper 733 holding the left side of the tray C and the second gripper 733 holding the right side of the tray C may move closer to each other to hold the tray C, and are far from each other. The holding of the tray C can be released by moving the fork.

When the second gripper 733 and the first gripper 732 respectively hold the tray C, the tray C held by the second gripper 733 holds the first gripper 732. It can be located under one tray (C). To this end, the second gripper 733 may be formed longer in the direction in which the first support member 712 is lowered than the first gripper 732. That is, the holding unit 73 may hold the plurality of trays C to be disposed up and down.

The holding unit 73 may include the grippers in a number corresponding to the maximum number of trays C that can be held at one time. In FIG. 2, the holding unit 73 includes the first gripper 732 and the second gripper 733 so as to hold the two trays C. However, the holding unit 73 is not limited thereto. Unit 73 may hold two or more trays C and may comprise two or more grippers for this purpose. For example, when the holding unit 73 can hold three trays C, the holding unit 73 includes the first gripper 732, the second gripper 733, and the third gripper ( Not shown). The maximum number of trays C that the holding unit 73 can hold at one time is the maximum number of trays C that can be seated on the first support member 712 and the second support member 722 at one time. May match the count. The grippers can be moved individually and can hold the tray C or release the holding on the tray C individually.

The first driving mechanism 734 may be installed on the installation member 731. The first driving mechanism 734 may move the first gripper 732. As the first driving mechanism 734 moves the first gripper 732, the first gripper 732 may hold the tray C or release the holding on the tray C. The first driving mechanism 734 may include a first driving source. The first driving source may be a cylinder such as a hydraulic cylinder or a pneumatic cylinder, or may be a motor. When the first driving source is a motor, the first driving mechanism 734 may include connecting means for connecting the first driving source and the first gripper 732. The connecting means may be a rack pinion gear, a ball screw, a pulley and a belt. When the holding unit 73 includes a plurality of first grippers 732, the first driving mechanism 734 may simultaneously move the first grippers 732 using one first driving source. It may also include a link means (not shown).

The second driving mechanism 735 may be installed on the installation member 731. The second driving mechanism 735 may move the second gripper 733. As the second driving mechanism 735 moves the second gripper 733, the second gripper 733 may hold the tray C or release the holding on the tray C. As shown in FIG. The second driving mechanism 735 may include a second driving source. The second driving source may be a cylinder such as a hydraulic cylinder or a pneumatic cylinder, or may be a motor. When the second driving source is a motor, the second driving mechanism 735 may include connecting means for connecting the second driving source and the second gripper 733. The connecting means may be a rack pinion gear, a ball screw, a pulley and a belt. When the holding unit 73 includes a plurality of second grippers 733, the second driving mechanism 735 may simultaneously move the second grippers 733 by using a single second driving source. It may also include a link means (not shown).

The holding unit 73 may include the driving mechanism in a number corresponding to the number of the grippers. FIG. 2 includes the first gripper 732 and the second gripper 733 so that the holding unit 73 can hold two trays C. The first driving mechanism 734 and the first Although shown as including a two drive mechanism 735, but not limited to the holding unit 73 can hold two or more trays (C) for this purpose two or more grippers and two or more drive mechanisms It may also include. For example, when the holding unit 73 can hold three trays C, the holding unit 73 includes the first gripper 732, the second gripper 733, and the third gripper ( The first driving mechanism 734, the second driving mechanism 735, and the third driving mechanism (not shown) may be included.

Referring to FIG. 2, the holding unit 73 may include a first holding mechanism 73a and a second holding mechanism 73b. The first holding mechanism 73a and the second holding mechanism 73b are respectively provided with the installation member 731, the first gripper 732, the second gripper 733, and the first driving mechanism 734. , And the second driving mechanism 735. The first holding mechanism 73a and the second holding mechanism 73b may be moved in the X-axis direction by separate driving means (not shown), and may be moved up and down. Although not shown, the holding unit 73 may include three or more holding mechanisms.

1 to 3, the stacker unit 7 may include a buffer storage mechanism 74. The empty tray C may be stored in the buffer storage mechanism 74. In the buffer storage mechanism 74, empty trays C may be stacked up and down, and a plurality of empty trays C may be stored. The buffer storage mechanism 74 may be installed to be located between the first storage mechanism 711 and the second storage mechanism 721. The holding unit 73 may remove the tray C, which is empty after the loading process is completed, from the first support member 712 and transfer it to the buffer storage mechanism 74. The holding unit 73 may hold the empty tray C in the buffer storage mechanism 74, and transfer the held tray C to the empty second support member 722. The stacker unit 7 may include a plurality of buffer storage mechanisms 74, in which case the buffer storage mechanisms 74 may be arranged in the X-axis direction. The first support member 712 or the second support member 722 may be installed on the buffer storage mechanism 74.

1 to 3, the test handler 1 according to the present invention may include a main body 8. The main body 8 includes the loading unit 2, the unloading unit 3, the chamber unit 4, the rotator 5, the transfer unit 6, and the stacker unit 7. Can be installed. The body 8 may include a through hole 81 and a stopper 82.

The through hole 81 may be formed in a portion in which the stacker unit 7 is installed in the main body 8. A plurality of through holes 81 may be formed in the main body 8, and the through holes 81 may be formed to be spaced apart from each other by a predetermined distance in the X-axis direction. As shown in FIG. 2, the first support member 712 and the second support member 722 may be inserted into the main body 8 through the through hole 81. Accordingly, the loading picker 21 may pick up the semiconductor device from the tray C seated on the first support member 712 through the through hole 81, and the unloading picker 31 may be The semiconductor device may be accommodated in the tray C seated on the second support member 722 through the through hole 71. The main body 8 may include the through hole 81 in a number approximately equal to the sum of the sum of the first support member 71 and the second support member 722.

The stopper 82 may protrude from the main body 8 in the direction toward the through hole 81. The body 8 may include the stoppers 82 in a number corresponding to the through holes 81.

The stopper 82 may be in contact with the tray C located at the top of the first support member 712. When the tray C positioned at the uppermost end of the first support member 712 contacts the stopper 82, the tray C may be positioned at the pickup position. In this case, the first elevating device (not shown) stops the first support member 712 when the tray C positioned at the uppermost end of the first support member 712 contacts the stopper 82. You can. Accordingly, even if the number of trays C seated on the first support member 712 is changed, the stopper 82 has the tray C positioned at the top of the first support member 712 at the pickup. Can be placed in position. Therefore, the loading picker 21 can always pick up the semiconductor element to be tested at the same height when picking up the semiconductor element to be tested from the tray C located at the pickup position, so that the loading process can be stably performed. Can be.

The stopper 82 may be in contact with the tray C located at the top of the second support member 722. When the tray C located at the uppermost end of the second support member 722 contacts the stopper 82, the tray C may be located at the storage position. In this case, the second lifting device (not shown) stops the second support member 722 when the tray C positioned at the uppermost end of the second support member 722 contacts the stopper 82. You can. Accordingly, even if the number of trays C seated on the second support member 722 is changed, the stopper 82 has the tray C positioned at the uppermost end of the second support member 722 in the housing. Can be placed in position. Accordingly, the unloading picker 31 can always store the tested semiconductor device at the same height when storing the tested semiconductor device in the tray C positioned at the storage position, thereby stably maintaining the unloading process. Can be done.

Here, the loading stacker 71 is provided in the first sensing unit 713 (FIG. 3) to check whether the tray C located at the top of the first support member 712 is in contact with the stopper 82. Shown).

As described above, when the tray C located at the top of the first support member 712 contacts the stopper 82, the tray C may be positioned at the pickup position. The first sensing unit 713 checks whether the tray C located at the uppermost end of the first support member 712 is in contact with the stopper 82, whereby the tray C is positioned at the pickup position. You can check whether The first sensing unit 713 may include a magnetic sensor, an optical sensor, a pressure sensor, or the like, and the tray C located at the uppermost end of the first support member 712 may be located at the pickup position by using the magnetic sensor, the optical sensor, or the pressure sensor. You can check if it is located.

The first sensing unit 713 detects a state in which the first elevating device (not shown) is operated so that the tray C located at the top of the first supporting member 712 is stopped at the stopper 82. You can check if the contact has been made. For example, when the first lifting device is a cylinder, the first detecting unit 713 may include a magnetic sensor for detecting the degree of movement of the rod of the cylinder. The first sensing unit 713 may include a plurality of magnetic sensors, and the magnetic sensors may be spaced apart from each other at intervals approximately equal to the thickness of the tray C. The first detecting unit 713 may check the degree of movement of the rod of the cylinder by checking the magnetic sensor that detects a magnet installed in the rod of the cylinder among the magnetic sensors. Accordingly, the first detection unit 713 can check whether the tray (C) located at the top of the first support member 712 is located in the pickup position.

When the tray C located at the top of the first support member 712 is located at the pick-up position by the first sensing unit 713, the test handler 1 according to the present invention is provided with a corresponding tray. The loading unit 2 may be controlled to perform the loading process for (C). If the tray C located at the top of the first support member 712 is not located at the pick-up position by the first sensing unit 713, the test handler 1 according to the present invention The loading unit 2 may be controlled so that the loading process is not performed on the tray C. In this case, the test handler 1 according to the present invention may control the first lifting device so that the tray C located at the uppermost end of the first support member 712 is located at the pick-up position.

1 to 3, the unloading stacker 72 is configured to check whether the tray C located at the top of the second support member 722 is in contact with the stopper 82. It may include a sensing unit 723 (shown in FIG. 3).

As described above, when the tray C positioned at the uppermost end of the second support member 722 contacts the stopper 82, the tray C may be positioned at the storage position. The second sensing unit 723 checks whether the tray C located at the uppermost end of the second support member 722 is in contact with the stopper 82, whereby the tray C is positioned at the storage position. You can check whether The second sensing unit 723 may include a magnetic sensor, an optical sensor, a pressure sensor, or the like, and the tray C located at the top of the second support member 722 may be located at the storage position by using the second sensor unit 723. You can check if it is located.

The second detecting unit 723 detects a state in which the second lifting device (not shown) is operated, whereby the tray C located at the top of the second supporting member 722 is stopped at the stopper 82. You can check if the contact has been made. For example, when the second lifting device is a cylinder, the second detecting unit 723 may include a magnetic sensor for detecting the degree of movement of the rod of the cylinder. The second sensing unit 723 may include a plurality of magnetic sensors, and the magnetic sensors may be spaced apart from each other at intervals substantially equal to the thickness of the tray C. The second detection unit 723 may check the degree of movement of the rod of the cylinder by checking the magnetic sensor that detects a magnet installed in the rod of the cylinder among the magnetic sensors. Accordingly, the second sensing unit 723 can check whether the tray C located at the top of the second support member 722 is located at the storage position.

When it is confirmed by the second sensing unit 723 that the tray C located at the uppermost end of the second support member 722 is located at the storage position, the test handler 1 according to the present invention is provided with the corresponding tray. The unloading unit 3 may be controlled to perform the unloading process with respect to (C). If it is confirmed by the second sensing unit 723 that the tray C located at the uppermost end of the second support member 722 is not located at the storage position, the test handler 1 according to the present invention corresponds to The unloading unit 3 may be controlled such that the unloading process is not performed on the tray C. In this case, the test handler 1 according to the present invention may control the second lifting device so that the tray C located at the top of the second support member 722 is located at the storage position.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the tray transfer method according to the present invention will be described in detail. The test handler according to the present invention described above may use the tray transfer method according to the present invention to be described below. The tray conveying method according to the present invention includes a first embodiment and a second embodiment, which will be described sequentially.

First Embodiment

4 is a flowchart illustrating a tray conveying method according to the first embodiment of the present invention, and FIGS. 5 to 16 are schematic operation state diagrams of the tray conveying method according to the first embodiment of the present invention.

Referring to Figure 4, the tray transfer method according to the first embodiment of the present invention is to supply a semiconductor device to be tested, the first seating step (S11), the first rising step (S12), the first lowering step ( S13), the first removing step S14, and the first repeating step S15.

1 to 6, in the first seating step S11, the holding unit 73 holds N trays (where N is an integer greater than 1) and holds the N trays in which the holding trays are held. It may be made by seating on the first support member 712 located in the lowered position (B). Looking at the first seating step (S11) in more detail, as follows.

First, the holding unit 73 is moved above the first storage mechanism 711. The holding unit 73 does not hold the tray C, and the first storage mechanism 711 stores a plurality of trays C containing semiconductor elements to be tested. The holding unit 73 may be moved in the X-axis direction by the driving means (not shown) and positioned on the first storage mechanism 711. When the loading stacker 71 includes a plurality of the first storage mechanisms 711, the holding unit 73 may be moved above any one of the first storage mechanisms 711.

Next, the holding unit 73 is lowered toward the tray C stored in the first storage mechanism 711. The holding unit 73 may be lowered by the driving means, and thus may be positioned at a position capable of holding the tray C stored in the first storage mechanism 711.

Next, the holding unit 73 holds the tray C stored in the first storage mechanism 711. The holding unit 73 may hold N trays C using the grippers. In FIG. 5, the holding unit 73 holds two trays C. However, the holding unit 73 is not limited thereto, and the holding unit 73 may hold two or more trays C.

Next, the holding unit 73 is raised in the state of holding the N trays (C). The holding unit 73 may be lifted by the driving means. The holding unit 73 has a height at which a bottom surface of the tray C positioned at the lowermost end of the N trays C substantially coincides with an upper surface of the first support member 712 positioned at the first lowered position B. FIG. Can be raised to be located at.

Next, the holding unit 73 is moved above the first support member 712 located in the first lowered position B. The holding unit 73 is in a state of holding N trays C, and the first support member 712 is in an empty state. The holding unit 73 may be moved in the X-axis direction by the driving means and positioned on the first support member 712.

Next, the holding unit 73 seats the held N trays C on the first support member 712 located at the first lowered position B. The holding unit 73 releases the holding of the N trays C using the grippers, and then moves in the X-axis direction by the driving means as shown in FIG. 712 may be located next to it. Accordingly, N trays C may be seated on the first support member 712 positioned at the first lowered position B. FIG. After the holding unit 73 releases the holding of the N trays C, the holding unit 73 may be moved in the X-axis direction after being increased by a predetermined distance by the driving means.

4 and 6, the first rising step S12 may be performed by raising the first supporting member 712 located at the first lowering position B. Referring to FIGS. Looking at the first rising step (S12) in more detail, as follows.

First, the first support member 712 is raised in a direction opposite to the direction in which the first storage mechanism 711 is located. The first support member 712 may be lifted by the first elevating device (not shown).

Next, the first support member 712 may be raised such that the tray C located at the top thereof is positioned at the pickup position A. FIG. When the tray C located at the uppermost end of the first support member 712 is located at the pickup position A, the first support member 712 is stopped. When the tray C positioned at the uppermost end of the first support member 712 contacts the stopper 82 (shown in FIG. 2), the first lifting device stops the first support member 712. You can. The loading picker 21 may pick up the semiconductor device to be tested from the tray C located at the pick-up position A through the through hole 81 (shown in FIG. 5). A loading process may be performed to transfer the test tray positioned at the loading position.

Here, the first rising step (S12) may further include a first sensing step of checking whether the tray (C) located at the top of the first support member 712 is located in the pickup position (A). have. As described above, the distance at which the first elevating device raises the first support member 712 varies according to the number of trays C seated on the first support member 712. In the first detecting step, the loading process may be stably performed by checking whether the tray C located at the uppermost end of the first support member 712 is located at the pickup position A. FIG. In the first sensing step, the tray C having the first sensing unit 713 (shown in FIG. 3) positioned at the top of the first support member 712 is illustrated in the stopper 82 (FIG. 2). This can be done by verifying contact with. The first sensing unit 713 detects a state in which the first elevating device (not shown) is operated so that the tray C located at the uppermost end of the first supporting member 712 has the stopper 82, It can be confirmed whether the contact is made (shown in Figure 2).

4 and 7, when the tray C located at the uppermost end of the first supporting member 712 is empty, the first lowering step S13 may be performed by removing the first supporting member 712 from the first supporting member 712. It can be made by descending to one falling position (B). Looking at the first falling step (S13) in more detail, as follows.

First, the first support member 712 is lowered in the direction in which the first storage mechanism 711 is located. The tray C located at the uppermost end of the first support member 712 is in an empty state as the loading process is performed. The first support member 712 may be lowered by the first elevating device (not shown).

Next, when the first support member 712 is located in the first lowered position B, the first support member 712 is stopped. When the first support member 712 is located in the first lowered position B, the first elevating device may stop the first support member 712.

4, 8, and 9, the first removing step S14 may include an empty tray from the first support member 712 in which the holding unit 73 is located at the first lowering position B. Referring to FIGS. By removing Looking at the first removal step (S14) in more detail, as follows.

First, the holding unit 73 is moved above the first support member 712 located in the first lowered position B. The empty tray C is positioned at the top of the first support member 712. The holding unit 73 may be moved in the X-axis direction by the driving means and positioned on the first support member 712.

Next, the holding unit 73 holds the empty tray C seated on the first support member 712. The holding unit 73 may hold the empty tray C using the grippers. The gripper positioned at the bottom of the grippers may hold the empty tray C. FIG. The holding unit 73 may be lowered toward the empty tray C seated on the first support member 712 by the driving means, and then hold the empty tray C by using the grippers.

Next, the holding unit 73 may be moved in the X-axis direction to be positioned next to the first support member 712. After holding the empty tray C using the grippers, the holding unit 73 is moved in the X-axis direction by the driving means, as shown in FIG. 8, next to the first support member 712. Can be located. Accordingly, the empty tray may be removed from the first support member 712 positioned at the first lowered position B. FIG. After holding the empty tray C, the holding unit 73 may be moved in the X-axis direction after being raised by a predetermined distance by the driving means.

4 and 8 to 10, the first repeating step (S15) is the first rising step (S12), the first until the first support member 712 is empty It can be achieved by repeating the falling step (S13), and the first removal step (S14). Looking at the first iteration step (S15) in more detail, as follows.

First, after the first removal step S14 is performed as shown in FIG. 8, if the tray C in which the semiconductor element to be tested is contained in the first support member 712 is left, it is shown in FIG. 9. As described above, the first rising step S12 is performed again. Accordingly, the tray C located at the top of the first support member 712 may be located at the pick-up position A, and the loading picker 21 performs a loading process on the tray C. Can be done. Therefore, the tray transfer method according to the first embodiment of the present invention can replace the empty tray C with the tray C containing the semiconductor devices to be tested only by performing the first rising step S12 again. The time taken to replace the empty tray C with the tray C containing the semiconductor devices to be tested may be reduced, and the time required for the loading process may be shortened.

Next, while the first rising step S12 is performed again, the holding unit 73 may transfer the held empty tray C to the buffer storage mechanism 74. After the holding unit 73 is lowered toward the buffer storage mechanism 74, the holding unit 73 may release the holding of the empty tray C by using the grippers. Accordingly, the empty tray C may be stored in the buffer storage mechanism 74. The holding unit 73 may be raised after storing the empty tray C in the buffer storage mechanism 74. Although not shown, the holding unit 73 may transfer the held empty tray C to the second support member 722 (shown in FIG. 2).

Next, as the loading process is performed, when the tray C positioned at the top of the first support member 712 becomes empty, the first lowering step S13 and the first removal as shown in FIG. 10. Step S14 is performed again. The first ascending step S12, the first lowering step S13, and the first removal until all of the trays C seated on the first support member 712 are removed to become empty. Step S14 may be repeated again.

Here, when the first support member 712 is empty, the tray transfer method according to the first embodiment of the present invention seats a tray containing semiconductor elements to be tested on the first support member 712. In operation S16, the first repeating operation S15 may be performed. The tray transfer method according to the first embodiment of the present invention may be configured in various modified embodiments according to the form in which the process S16 is performed.

In the tray transfer method according to the first embodiment of the present invention, the process (S16) may be performed by performing the first seating step (S11) again. That is, in step S16, as shown in FIGS. 5 and 6, the holding unit 73 holds the N trays C, and the N trays C held by the holding unit 73 are moved to the first lowered position ( It may be made by seating on the first support member 712 located in B). The first repeating step S15 may be performed until the first supporting member 712 becomes empty. The tray transfer method according to the first exemplary embodiment of the present invention provides a semiconductor device to be tested by repeatedly performing the processes described above until the trays C stored in the first storage mechanisms 711 are exhausted. Can supply

4 and 11 to 14, in the tray transfer method according to the first modified embodiment of the present invention, the first removing step S14 may include the semiconductor elements to be tested by the holding unit 73. The empty tray C1 may be removed from the first support member 712 while holding the contained tray C2 (N-1). When the first supporting member 712 is empty, the tray transfer method according to the first modified embodiment of the present invention includes (N-1) trays C2 held by the holding unit 73. ) Is seated on the empty first support member 712 (S16), the first repeating step (S15) can be performed. Looking specifically at this, it is as follows.

First, as shown in FIG. 11, only one empty tray C1 is seated in the first support member 712 positioned at the first lowered position B. As shown in FIG. In addition, the holding unit 73 may hold (N-1) the tray C2 containing the semiconductor devices to be tested, and the gripper positioned at the lowermost of the grippers may be empty. 11 illustrates that the holding unit 73 holds one tray C2 containing the semiconductor devices to be tested. However, the holding unit 73 is not limited thereto. Two or more trays C2 containing semiconductor elements may be held.

Next, as shown in FIG. 12, the holding unit 73 holds (N-1) the tray C2 containing the semiconductor devices to be tested, and the bin seated on the first support member 712. The tray C1 can be further held. Thereafter, the holding unit 73 is moved in the X-axis direction by the driving means, thereby removing the empty tray C1 from the first support member 712. Accordingly, the first support member 712 is in an empty state.

Next, as shown in FIG. 13, the holding unit 73 may transfer the held empty tray C1 to the buffer storage mechanism 74. Although not shown, the holding unit 73 may transfer the held empty tray C1 to the second support member 722 (shown in FIG. 2).

Next, as shown in FIG. 14, the holding unit 73 may seat the tray C2 containing the semiconductor devices to be tested on the empty first support member 712. Accordingly, (N-1) trays C2 containing semiconductor elements to be tested may be seated on the first support member 712. The first repeating step S15 may be performed until the first supporting member 712 becomes empty. The tray transfer method according to the first modified embodiment of the present invention is a semiconductor to be tested by repeatedly performing the processes described above until the trays C stored in the first storage mechanisms 711 are exhausted. The device can be supplied.

4, 15 and 16, in the tray transfer method according to another modified embodiment of the present invention, the first removing step (S14) is the first provided in the holding unit 73 The holding mechanism 73a may be achieved by removing the empty tray from the first support member 712. In addition, when the first support member 712 is empty, the tray transfer method according to another modified first embodiment of the present invention may include a second holding mechanism 73b provided in the holding unit 73. After the plurality of trays C are seated on the empty first support member 712 (S16), the first repeating step (S15) may be performed. Looking specifically at this, it is as follows.

First, as shown in FIG. 15, only one empty tray C1 is seated in the first support member 712 positioned at the first lowered position B. As shown in FIG. The first holding mechanism 73a is positioned at one side of the first support member 712 positioned at the first lowered position B. As shown in FIG. The second holding mechanism 73b is located on the other side of the first support member 712 positioned at the first lowered position B, and holds a plurality of trays C2 containing semiconductor elements to be tested. to be. 15 illustrates that the second holding mechanism 73b holds two trays C2 containing semiconductor devices to be tested, but is not limited thereto. Three or more trays C2 containing semiconductor devices to be tested are included. It may be in a holding state. The second holding mechanism 73b may be in a state of holding N trays C2 as in the first seating step S11, and holds a plurality of trays C2 more than or less than N. It may be in a state.

Next, as shown in FIG. 16, when the first supporting member 712 becomes empty by removing the empty tray C1 from the first supporting member 712, the second holding member 73a becomes empty. The plurality of trays C2 held by the holding mechanism 73b may be seated on the first support member 712. Accordingly, a plurality of trays C2 containing semiconductor elements to be tested may be seated on the first support member 712. The first repeating step S15 may be performed until the first supporting member 712 becomes empty. The tray conveying method according to another modified embodiment of the present invention may be tested by repeatedly performing the processes described above until the trays C stored in the first storage mechanisms 711 are exhausted. A semiconductor device can be supplied.

In a tray conveying method according to another modified embodiment of the present invention, the first holding mechanism 73a removes the empty tray C1 from the first supporting member 712 and the second holding. The process by which the mechanism 73b seats the trays C2 containing the semiconductor elements to be tested on the first support member 712 may be continuously performed. Therefore, the tray transfer method according to another modified embodiment of the present invention may include the semiconductor devices to be tested on the first support member 712 after the empty tray C1 is removed from the first support member 712. The time taken until the contained trays C2 are seated may be reduced, and thus the time taken for the loading process may be further reduced.

Second Embodiment

17 is a flow chart of the tray transfer method according to a second embodiment of the present invention, Figures 18 to 29 is a schematic operation state diagram of a tray transfer method according to a second embodiment of the present invention.

Referring to FIG. 17, a tray transfer method according to a second embodiment of the present invention is for accommodating a tested semiconductor device, and includes a second seating step S21, a second rising step S22, and a second lowering step ( S23), the second removing step S24, and the second repeating step S25.

17 to 19, in the second seating step S21, the holding unit 73 holds M trays (where M is an integer greater than 1) and holds the M trays held by the second unit. It may be made by seating on the second support member 722 located in the lowered position (D). Looking at the second seating step (S21) in more detail, as follows.

First, the holding unit 73 is moved above the buffer storage mechanism 74. The holding unit 73 does not hold the tray C, and a plurality of empty trays C are stored in the buffer storage mechanism 74. The holding unit 73 may be moved in the X-axis direction by the driving means (not shown) and positioned on the buffer storage mechanism 74. When the stacker unit 7 includes a plurality of the buffer storage mechanisms 74, the holding unit 73 may be moved above any one of the buffer storage mechanisms 74.

Next, the holding unit 73 is lowered toward the tray C stored in the buffer storage mechanism 74. The holding unit 73 may be lowered by the driving means, and thus may be positioned at a position capable of holding the tray C stored in the buffer storage mechanism 74.

Next, the holding unit 73 holds the tray C stored in the buffer storage mechanism 74. The holding unit 73 may hold the M trays C using the grippers. In FIG. 18, the holding unit 73 holds two trays C. However, the holding unit 73 is not limited thereto, and the holding unit 73 may hold two or more trays C.

Next, the holding unit 73 is raised while holding the M trays (C). The holding unit 73 may be lifted by the driving means. The holding unit 73 has a height in which bottom surfaces of the trays C located at the lowermost end of the M trays C substantially coincide with an upper surface of the second support member 722 positioned at the second lowering position D. FIG. Can be raised to be located at.

Next, the holding unit 73 is moved above the second support member 722 positioned at the second lowering position D. The holding unit 73 holds M trays C, and the second support member 722 is in an empty state. The holding unit 73 may be moved in the X-axis direction by the driving means and positioned on the second support member 722.

Next, the holding unit 73 seats the held M trays C on the second support member 722 located at the second lowered position D. FIG. After the holding unit 73 releases the holding of the M trays C by using the grippers, the holding unit 73 is moved in the X-axis direction by the driving means as shown in FIG. 722 may be located next to it. Accordingly, M trays C may be seated on the second support member 722 positioned at the second lowering position D. FIG. The holding unit 73 may be moved in the X-axis direction after the predetermined distance is increased by the driving means after releasing the holding of the M trays (C).

Referring to FIGS. 17 and 19, the second raising step S22 may be performed by raising the second supporting member 722 positioned at the second lowering position D. Referring to FIGS. Looking at the second rising step (S22) in more detail, as follows.

First, the second support member 722 is raised in a direction opposite to the direction in which the second storage mechanism 721 is located. The second support member 722 may be lifted by the second lifting device (not shown).

Next, the second support member 722 may be raised such that the tray C located at the top thereof is positioned at the storage position C. FIG. When the tray C located at the uppermost end of the second support member 722 is located at the storage position C, the second support member 722 is stopped. When the tray C located at the uppermost end of the second support member 722 contacts the stopper 82 (shown in FIG. 2), the second lifting device stops the second support member 722. You can. The unloading picker 31 may perform an unloading process of storing the tested semiconductor device in the tray C located at the storage position C through the through hole 81 (shown in FIG. 8). have.

Here, the second rising step S22 may further include a second sensing step of checking whether the tray C located at the top of the second supporting member 722 is located at the storage position C. FIG. have. As described above, the distance at which the second lifting device raises the second support member 722 varies according to the number of trays C seated on the second support member 722. In the second detecting step, the unloading process may be stably performed by checking whether the tray C located at the uppermost end of the second support member 722 is located at the storage position C. FIG. In the second sensing step, the tray C having the second sensing unit 723 (shown in FIG. 3) positioned at the top of the second support member 722 is the stopper 82 (shown in FIG. 2). This can be done by verifying contact with. The second sensing unit 723 detects a state in which the second elevating device (not shown) is operated so that the tray C located at the top of the second supporting member 722 is stopped at the stopper 82. It can be confirmed whether the contact is made (shown in Figure 2).

17 and 20, when the tray C located at the uppermost end of the second support member 722 is filled with semiconductor elements, the second support member 722 may be used. ) Can be made by lowering to the second lowering position (D). Looking at the second falling step (S23) in more detail, as follows.

First, the second support member 722 is lowered in the direction in which the second storage mechanism 721 is located. The tray C positioned at the uppermost end of the second support member 722 is filled with semiconductor elements as the unloading process is performed. The second support member 722 may be lowered by the second lifting device (not shown).

Next, when the second support member 722 is located in the second lowered position D, the second support member 722 is stopped. When the second support member 722 is positioned at the second lowering position D, the second lifting device may stop the second support member 722.

Referring to FIGS. 17, 21, and 22, the second removing step S24 may include a semiconductor device from the second support member 722 in which the holding unit 73 is positioned at the second lowering position D. Referring to FIGS. This can be done by removing the tray C filled with the. Looking at the second removal step (S24) in more detail, as follows.

First, the holding unit 73 is moved above the second support member 722 located at the second lowered position D. The tray C filled with semiconductor elements is positioned on the second support member 722. The holding unit 73 may be moved in the X-axis direction by the driving means and positioned on the second support member 722.

Next, the holding unit 73 holds the tray C filled with the semiconductor elements in the second support member 722. The holding unit 73 may hold the tray C filled with semiconductor elements by using the grippers. A gripper positioned at the bottom of the grippers may hold the tray C filled with semiconductor elements. The holding unit 73 may be lowered toward the tray C seated on the second support member 722 by the driving means, and then hold the tray C filled with semiconductor elements using the grippers. have.

Next, the holding unit 73 may be moved in the X-axis direction to be positioned next to the second support member 722. The holding unit 73 holds the tray C filled with semiconductor elements by using the grippers, and then is moved in the X-axis direction by the driving means as shown in FIG. 722 may be located next to it. Accordingly, a tray filled with semiconductor elements may be removed from the second support member 722 positioned at the second lowering position D. FIG. The holding unit 73 may hold the tray C filled with semiconductor elements, and may be moved in the X-axis direction after being raised by a predetermined distance by the driving means.

Referring to FIGS. 17 and 21 to 23, in the second repeating step S25, the second rising step S22 and the second step are performed until the second supporting member 722 becomes empty. It may be achieved by repeating the falling step (S23), and the second removal step (S24). Looking at the second iteration step (S25) in more detail, as follows.

First, when the empty tray C remains in the second supporting member 722 after the second removing step S24 is performed, as shown in FIG. The second rising step S22 is performed again. Accordingly, the tray C located at the top of the second support member 722 may be located at the storage position C, and the unloading picker 31 is unloaded with respect to the tray C. The process can be carried out. Therefore, the tray transfer method according to the second embodiment of the present invention can replace the tray C filled with semiconductor elements with an empty tray C only by performing the second rising step S22 again. The time taken to replace the tray C filled with the semiconductor elements with the empty tray C can be reduced, and the time taken for the unloading process can be shortened.

Next, while the second rising step S22 is performed again, the holding unit 73 may transfer the tray C filled with the semiconductor elements to the second storage mechanism 721. After the holding unit 73 is lowered toward the second storage mechanism 721, the holding unit 73 may release the holding of the tray C filled with the semiconductor elements using the grippers. Accordingly, the tray C filled with the semiconductor elements may be stored in the second storage mechanism 721. The holding unit 73 may be raised after storing the tray C filled with semiconductor elements in the second storage mechanism 721. The holding unit 73 may transfer the held tray C to the second storage mechanism 721 corresponding to the grade of the semiconductor devices contained in the held tray C. As shown in FIG. 22, the holding unit 73 is moved to the side of the second support member 722 on which the holding tray C is seated, and is positioned next to the second support member 722. The tray C held by the second storage mechanism 721 may be transferred. Although not shown, the holding unit 73 may transfer the held tray C to the second storage mechanism 721 located under the second support member 722, and the operation may be performed by the second storage mechanism 721. It may be made after the support member 722 is raised.

Next, as the unloading process is performed, when the tray C located at the uppermost end of the second support member 722 is filled with semiconductor elements, the second lowering step S23 as shown in FIG. 23. And the second removal step S24 are performed again. The second ascending step (S22), the second lowering step (S23), and the second removal until all the trays (C) seated on the second support member 722 are removed to an empty state. Step S24 may be repeated again.

Here, when the second support member 722 is empty, the tray transfer method according to the second embodiment of the present invention seats the empty tray on the second support member 722 (S26), The second repeat performing step S25 may be performed. The tray conveying method according to the second embodiment of the present invention may be configured in various modified embodiments according to the form in which the process S26 is performed.

In the tray transfer method according to the second embodiment of the present invention, the process (S26) may be performed by performing the second seating step (S21) again. That is, in the step S26, as shown in FIGS. 18 and 19, the holding unit 73 holds M trays C, and holds the M trays C held in the second lowering position ( It may be made by seating on the second support member 722 located in D). The second repeating step S25 may be performed until the second supporting member 722 becomes empty. In the tray transfer method according to the second embodiment of the present invention, all the semiconductor devices to be tested stored in the first storage device 711 (shown in FIG. Until it is stored, the tested semiconductor device can be stored by repeatedly performing the above-described processes.

Referring to FIGS. 17 and 24 to 27, in the tray conveying method according to the second modified embodiment of the present invention, the second removing step S24 may include a tray C1 in which the holding unit 73 is empty. ) May be formed by removing the tray C2 filled with semiconductor elements from the second support member 722 while holding (M-1). When the second supporting member 722 is empty, the tray transfer method according to the second modified embodiment of the present invention includes (M-1) trays C1 held by the holding unit 73. ) Is seated on the empty second support member 722 (S26), the second repeating step (S25) can be performed. Looking specifically at this, it is as follows.

First, as shown in FIG. 24, only one tray C2 filled with semiconductor elements is seated in the second support member 722 positioned at the second lowering position D. FIG. In addition, the holding unit 73 may hold (M-1) empty trays C1, and a gripper positioned at the bottom of the grippers may be empty. FIG. 24 illustrates that the holding unit 73 holds one empty tray C1. However, the present invention is not limited thereto. If the gripper positioned at the lowermost of the grippers is empty, the empty tray C1 may be empty. You can also hold more than one.

Next, as shown in FIG. 25, the holding unit 73 is a tray filled with semiconductor elements in the second support member 722 while holding (M-1) empty trays C1. C2) can be held further. Thereafter, the holding unit 73 is moved in the X-axis direction by the driving means, thereby removing the tray C2 filled with semiconductor elements from the second support member 722. Accordingly, the second support member 722 is in an empty state.

Next, as shown in FIG. 26, the holding unit 73 may transfer the tray C2 filled with semiconductor elements to the second storage mechanism 721.

Next, as shown in FIG. 27, the holding unit 73 may seat the empty trays C1 (M-1) on the empty second support members 722. Accordingly, (2) empty trays C1 may be seated on the second support member 722. The second repeating step S25 may be performed until the second supporting member 722 becomes empty. In the tray transfer method according to the second embodiment of the present invention, all the semiconductor devices to be tested stored in the first storage device 711 (shown in FIG. Until stored in 721, the tested semiconductor device may be stored by repeatedly performing the above-described processes.

17, 28 and 29, in the tray transfer method according to another modified embodiment of the present invention, the second removing step (S24) is the first provided in the holding unit 73 The holding mechanism 73a may be achieved by removing the tray C2 filled with semiconductor elements from the second support member 722. And, if the second support member 722 is empty, the tray transfer method according to another modified embodiment of the present invention is the second holding mechanism (73b) provided in the holding unit 73 After the plurality of trays C1 are seated on the empty second support member 722 (S16), the second repeating step (S25) may be performed. Looking specifically at this, it is as follows.

First, as shown in FIG. 28, only one tray C2 filled with semiconductor elements is seated in the second support member 722 positioned at the second lowering position D. FIG. The first holding mechanism 73a is positioned at one side of the second support member 722 positioned at the second lowering position D. FIG. The second holding mechanism 73b is located on the other side of the second support member 722 positioned at the second lowering position D, and is in a state of holding a plurality of empty trays C1. Although FIG. 28 illustrates that the second holding mechanism 73b holds two empty trays C1, the present invention is not limited thereto and may hold three or more empty trays C1. The second holding mechanism 73b may be in a state of holding M trays C1 in the same manner as in the second seating step S21, and holding a plurality of trays C1 more than or less than M in number. It may be in a state.

Next, as shown in FIG. 29, when the first support mechanism 73a removes the tray C2 filled with semiconductor elements from the second support member 722, the second support member 722 becomes empty. The plurality of trays C1 held by the second holding mechanism 73b may be seated on the second support member 722. Accordingly, a plurality of empty trays C1 may be seated on the second support member 722. The second repeating step S25 may be performed until the second supporting member 722 becomes empty. In the tray transfer method according to the second embodiment of the present invention, all the semiconductor devices to be tested stored in the first storage device 711 (shown in FIG. Until it is stored, the tested semiconductor device can be stored by repeatedly performing the above-described processes.

In the tray transfer method according to another modified embodiment of the present invention, the first holding mechanism (73a) to remove the tray (C2) filled with semiconductor elements from the second support member 722 and The process of seating the empty trays C1 on the second support member 722 by the second holding mechanism 73b may be continuously performed. Accordingly, in the tray transfer method according to another modified embodiment of the present invention, the tray C2 filled with semiconductor elements is removed from the second support member 722 and then is empty in the second support member 722. The time taken for the trays C1 to be seated can be reduced, and thus the time taken for the unloading process can be further reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It will be clear to those who have knowledge.

1: test handler 2: loading unit 3: unloading unit 4: chamber unit
5: Rotator 6: Transfer Unit 7: Stacker Unit 8: Main Body
21: loading picker 22: loading buffer 31: unloading picker 32: unloading buffer
41: first chamber 42: test chamber 43: second chamber 71: loading stacker
72: unloading stacker 73: holding unit 73a: first holding mechanism
73b: second holding mechanism 74: buffer storage mechanism 81: through hole 82: stopper
711: first storage mechanism 712: first support member 713: first sensing unit
721: second storage mechanism 722: second support member 723: second detection unit
731: mounting member 732: first gripper 733: second gripper 734: first driving mechanism
735: second drive mechanism C: tray

Claims (16)

A first seating step in which the holding unit holds N trays (N is an integer greater than 1) and seats the held N trays on a first supporting member located at a first lowering position;
A first raising step of raising the first supporting member located at the first lowering position;
A first lowering step of lowering the first support member to the first lowered position when the tray located at the uppermost end of the first support member becomes empty;
A first removing step of removing, by the holding unit, the empty tray from the first support member located at the first lowering position; And
And a first repeating step of repeating the first raising step, the first lowering step, and the first removing step until the first supporting member is empty. The method of claim 1,
And when the first support member is empty, performing the first repeating step after performing the first seating step again. The method of claim 1,
In the first removing step, the empty tray is removed from the first support member in a state in which the holding unit holds (N-1) the trays containing the semiconductor devices to be tested.
When the first support member is in an empty state, the first repeating step may be performed after seating (N-1) trays held by the holding unit on the empty first support member. Tray transport method. The method of claim 1,
In the first removing step, the first holding mechanism provided in the holding unit removes the empty tray from the first support member.
When the first support member is in an empty state, the second holding mechanism provided in the holding unit seats a plurality of trays on the empty first support member, and then performs the first repeating step. Tray conveying method. The method of claim 1,
The first raising step raises the first support member such that the tray located at the top of the first support member is located at a pick-up position, wherein the pick-up position is provided by a loading picker for transferring the semiconductor element from the tray. Tray transfer method, characterized in that the pickup position. 6. The tray conveying method of claim 5, wherein the first raising step further comprises a first sensing step of checking whether a tray located at the top of the first supporting member is located at the pick-up position. A second seating step of holding the M trays (where M is an integer greater than 1) and seating the held M trays on a second support member located at a second lowering position;
A second raising step of raising the second supporting member located at the second lowering position;
A second lowering step of lowering the second supporting member to the second lowering position when the tray located at the uppermost end of the second supporting member is filled with semiconductor elements;
A second removing step of removing, by the holding unit, a tray filled with semiconductor elements from the second support member located at the second lowering position; And
And a second repeating step of repeating the second raising step, the second lowering step, and the second removing step until the second supporting member is empty. The method of claim 7, wherein
And if the second support member is empty, performing the second repeating step after performing the second seating step again. The method of claim 7, wherein
In the second removing step, the trays filled with semiconductor elements are removed from the second support member while the holding unit holds (M-1) empty trays.
When the second support member is in an empty state, the second repeating step may be performed after seating (M-1) trays held by the holding unit on the empty second support member. Tray transport method. The method of claim 1,
In the second removing step, the first holding mechanism provided in the holding unit removes a tray filled with semiconductor elements from the second support member.
When the second support member is in an empty state, the second holding mechanism provided in the holding unit seats a plurality of trays on the empty second support member, and then performs the second repeating step. Tray conveying method. The method of claim 7, wherein
In the second raising step, the second support member is raised so that the tray located at the uppermost end of the second support member is positioned at a storage position, wherein the storage position is an unloading picker for transferring the semiconductor elements to the tray. Tray transport method, characterized in that the position that can accommodate. 12. The method of claim 11, wherein the second raising step further comprises a second sensing step of checking whether the tray located at the top of the second support member is located at the storage position. A loading unit performing a loading process for accommodating a semiconductor device to be tested in a test tray;
A chamber unit for connecting the semiconductor element stored in the test tray to the high fix board through the loading process;
An unloading unit which performs an unloading process of separating the tested semiconductor device from the test tray; And
A stacker unit having a loading stacker for supplying a semiconductor device to be tested,
The stacker unit is a test handler, characterized in that for supplying a semiconductor device to be tested using any one of the tray transfer method of any one of claims 1 to 6. The method of claim 13,
And a stopper to which the tray located at the uppermost end of the first support member is in contact.
And the loading stacker comprises a first sensing unit for checking whether the tray located at the top of the first support member is in contact with the stopper. A loading unit performing a loading process for accommodating a semiconductor device to be tested in a test tray;
A chamber unit for connecting the semiconductor element stored in the test tray to the high fix board through the loading process;
An unloading unit which performs an unloading process of separating the tested semiconductor device from the test tray; And
A stacker unit having an unloading stacker for storing the tested semiconductor device,
The stacker unit is a test handler, characterized in that for receiving a semiconductor device tested by using any one of the tray transport method of claim 7. 16. The method of claim 15,
And a stopper to which the tray located at the uppermost end of the second support member is in contact.
And said unloading stacker comprises a second sensing unit for checking whether the tray located at the top of said second supporting member is in contact with said stopper.

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