KR20100052520A - Electric connection structure, terminal device, socket, device for testing electronic component, and method of manufacturing socket - Google Patents

Abstract

The electrical connection structure includes a conductive plate 30 and 40 to which electrical cables 11 and 12 are electrically connected, a first insulating plate 51 stacked between the conductive plates 30 and 40, and an IC. A plurality of contact pins 60 electrically contacting the input / output terminals 6 of the device 5, the plurality of contact pins 60 penetrating through the plates 30, 40, 51, and contact pins. Depending on the size of the through holes 32 and 42 of the conductive plates 30 and 40 into which the 60 is inserted, the plurality of contact pins 60 are in contact with one side of the conductive plates 30 and 40 or the conductive plates ( 30, 40) is not in contact.

Description

ELECTRIC CONNECTION STRUCTURE, TERMINAL DEVICE, SOCKET, DEVICE FOR TESTING ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING SOCKET}

The present invention is, for example, in an electronic component test apparatus for performing a test of various electronic components (hereinafter, referred to as IC devices) such as semiconductor integrated circuit elements, for example, contact pins (hereinafter referred to as conductive members or terminals) and the like. An electrical connection structure for selectively connecting an electrical cable (hereinafter referred to as a conductor), a terminal device using the same, a socket and electronic component test apparatus, and a method of manufacturing the socket.

In the manufacturing process of an IC device, an electronic device test apparatus is used to test the performance or function of the IC device. In this electronic component test apparatus, the IC device is brought into close contact with the socket of the test head, and the electronic component test apparatus main body (hereinafter referred to as a tester) is made while the input / output terminals of the IC device and the contact pins of the socket are electrically contacted. The IC device is tested by inputting and outputting a test signal to the IC device.

The socket is mounted on a circuit board called a socket board mounted on the upper part of the test head, and is electrically connected to the test head through the socket board. The lower surface of the socket board is equipped with a connector to which the plug of the electric cable is coupled. This electrical cable is connected to the pin electronics card in the test head.

A circuit pattern for electrically connecting the connector and the socket is formed inside the socket board. Each contact pin of the socket is selectively connected to various electric cables, such as for signal transmission, power supply, or ground, through this circuit pattern.

The use of socket boards composed of such circuit boards has the following disadvantages. In other words, since the circuit patterns in the socket board are wired very finely, it is sometimes difficult to adopt a coaxial structure in the socket board. In addition, since the wiring for power supply and ground is also composed of a thin circuit pattern in the socket board, there is a certain limit to these reinforcement.

The problem to be solved by the present invention is an electrical connection structure capable of selectively connecting a conductive member (terminal) and a conductor (electric cable) without using a circuit board, a terminal device, a socket and an electronic component test apparatus having the same And to provide a socket manufacturing method.

(1) In order to achieve the above object, according to a first aspect of the present invention, a plurality of conductive plates each having a first conductor electrically connected to each other, an insulating plate laminated between the plurality of conductive plates, and A conductive plate and a plurality of conductive members penetrating the insulating plate, and the conductive member contacts at least one of the plurality of conductive plates according to the size of the through hole of the conductive plate into which the conductive member is inserted. An electrical connection structure is provided or is in contact with the conductive plate (see claim 1).

Although not specifically limited in the invention, the conductive plate having a through hole having an inner diameter less than or equal to the outer diameter of the conductive member is in contact with the conductive member, and the conductive plate having a through hole having an inner diameter larger than the outer diameter of the conductive member is It is preferred that it is not in contact with the conductive member (see claim 2).

Although it does not specifically limit in the said invention, It is preferable to further provide the 2nd conductor electrically connected with the said electrically-conductive plate and the said non-contact electrically conductive member (refer Claim 3).

In the invention, although not particularly limited, it is preferable that the first and second conductors include an electric cable (see claim 4).

(2) In order to achieve the above object, according to a second aspect of the present invention, there is provided a terminal device electrically connected to a connected object, the plurality of conductive plates each of which is electrically connected to a first electric cable, A first insulating plate stacked between the conductive plates and a plurality of terminals electrically contacting the connected object, wherein the plurality of terminals pass through the plurality of conductive plates and the first insulating plate. In accordance with the size of the through-hole of the conductive plate into which the terminal is inserted, a terminal device is provided in which the terminal is in contact with at least one of the plurality of conductive plates or is not in contact with the conductive plate (see claim 5).

Although not particularly limited, the first electric cable preferably includes a power supply cable for supplying power to the connected object and a ground cable for connecting the connected object to a reference potential point. (See claim 6).

Although not specifically limited in the said invention, the said electrically conductive plate which has the through-hole of the inner diameter below the outer diameter of the said terminal contacts with the said terminal, The said electrically conductive plate which has the through-hole of the inner diameter larger than the outer diameter of the said terminal is made with the said terminal. It is preferable to be in non-contact (see claim 7).

Although it does not specifically limit in the said invention, It is preferable to further provide the said electrically conductive plate with the 2nd electric cable electrically connected to the said non-contact terminal (refer Claim 8).

Although not particularly limited in the present invention, the second electric cable preferably includes a signal transmission cable for transmitting an electric signal to the connected object (see claim 9).

Although not specifically limited in the present invention, the apparatus further includes second and third insulating plates laminated with the plurality of conductive plates, and fixing means for fixing the plurality of conductive plates and the first to third insulating plates. The plurality of terminals preferably pass through the plurality of conductive plates and the first to third insulating plates (see claim 10).

Although not specifically limited in the said invention, It is preferable that the edge part of the said some conductive plates protrudes at least from the said 1st insulating plate (refer Claim 11).

Although it does not specifically limit in the said invention, It is preferable that the edge part of the said conductive plate is bent (refer Claim 12).

Although not specifically limited in the above invention, the electronic component is mounted, and further includes a circuit board electrically connected to at least two of the conductive plates, wherein the circuit board is provided between the ends of the at least two conductive plates. Preferably, see claim 13.

Although it does not specifically limit in the said invention, It is preferable to further provide the electronic component electrically connected to the at least 2 said conductive plates, and the said electronic component is provided between the edge parts of the said at least 2 conductive plates (claim 14). Reference).

(3) According to a third aspect of the present invention, in order to achieve the above object, a socket electrically connected to the electronic component under test at the time of testing the electronic component under test includes the terminal device. The connected object is provided with a socket including input and output terminals of the electronic component under test (see claim 15).

(4) In order to achieve the above object, according to a fourth aspect of the present invention, there is provided an electronic component test apparatus for performing a test of an electronic component under test, comprising: an electronic device having the socket and a test head equipped with the socket; Parts testing equipment is provided (see claim 16).

(5) In order to achieve the above object, according to a fifth aspect of the present invention, there is provided a method of manufacturing a socket electrically connected to the electronic component under test at the time of testing the electronic component under test, wherein the plurality of first conductive plates are provided. A first selection step of selecting one of the first conductive plates, a second selection step of selecting one second conductive plate from the plurality of second conductive plates, and the first and second conductive plates through the insulating plate There is provided a socket manufacturing method comprising a stacking step of laminating a through hole, and a through step of penetrating a terminal through the first conductive plate, the insulating plate and the second conductive plate (see claim 17).

In the present invention, depending on the size of the through hole, by contacting or non-contacting the conductive member and the conductive plate, it is possible to selectively connect the conductive member (terminal) and the conductor (electric cable) without using a circuit board.

In addition, by forming a terminal device (socket) without using a circuit board, it is easy to adopt a coaxial structure to the vicinity of the connected object (electronic component under test). In addition, by employing a conductive plate instead of a thin circuit pattern, wiring for power supply and ground can be greatly strengthened.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic sectional view showing an electronic component testing apparatus in a first embodiment of the present invention.
Fig. 2 is a side view showing the socket in the first embodiment of the present invention.
3 is a plan view showing a socket according to the first embodiment of the present invention;
Figure 4 is an enlarged cross-sectional view of the IV portion of FIG.
5 is a schematic cross-sectional view of the V portion of FIG.
Fig. 6 is a schematic plan view of a socket in a second embodiment of the present invention.
Fig. 7 is a side view showing the end of the socket in the third embodiment of the present invention.
Fig. 8 is a side view showing the end of the socket in the fourth embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic sectional view showing an electronic component testing apparatus according to a first embodiment of the present invention. Figs. 2 and 3 are side and plan views showing a socket in a first embodiment of the present invention. An enlarged cross-sectional view of section IV of FIG. 5, FIG. 5 is a schematic cross-sectional view of section V of FIG. 2, and FIG.

As shown in FIG. 1, the electronic component test apparatus according to the embodiment of the present invention includes a handler 1 for processing an IC device under test, a test head 10 in which the IC device is in electrical contact, and a test. It consists of a tester 2 which sends a test signal to the head 10 to test the IC device. This electronic component test apparatus is a device that tests (inspects) whether an IC device operates properly in a state where high or low temperature heat stress is applied to the IC device, and classifies the IC device according to the test result.

As shown in FIG. 1, the upper part of the test head 10 is provided with the socket 20 electrically connected with the said IC device at the time of test of an IC device. As shown in FIG. 1, the socket 20 faces the inside of the handler 1 through the opening 1a formed in the handler 1, and the IC device conveyed in the handler 1 is provided. It is in close contact with the socket 20.

As shown in FIGS. 2 to 4, the socket 20 in the present embodiment includes a GND plate 30, a PPS (Programmable Power Supply) plate 40, and first to fourth insulating plates 51 to 54. And a plurality of contact pins 60 and a circuit board 70.

The GND plate 30 is a plate member having a thickness of about 150 to 200 µm, and is made of, for example, a conductive material such as copper or aluminum. One end of the GND plate 30 is connected to a GND cable 11 for connecting the IC device 5 to the reference potential point. This GND cable 11 is connected to a pin electronic card (not shown) accommodated in the test head 10.

In the substantially center of the GND plate 30, a plurality of first through holes 32 (35 in this example) for inserting the contact pins 60 are formed. These first through holes 32 are arranged in five rows and seven columns so as to correspond to the input / output terminals 6 of the IC device 5. In addition, insertion holes for inserting the screw 91 are formed in the four peripheral edges of these first through holes 32. On the other hand, the plurality of first through holes 32 include through holes of relatively large inner diameter and through holes of relatively small inner diameter with respect to the outer shape of the contact pin 60.

Similarly, the PPS plate 40 is a plate member having a thickness of about 150 to 200 µm, and is made of a conductive material such as copper or aluminum, for example. At one end of the PPS plate 40, a power supply cable 12 for supplying driving power to the IC device 5 is connected. This PPS cable 12 is also connected to a pin electronic card (not shown) housed in the test head 10.

Similarly to the GND plate 30, a plurality of second through holes 42 for inserting the contact pins 60 (35 in this example) are formed in the substantially center of the PPS plate 40. These second through holes 42 are arranged in five rows and seven columns in this embodiment so as to correspond to the input / output terminals 6 of the IC device 5. In addition, insertion holes for inserting the screw 91 are formed in the four peripheral edges of these second through holes 42. On the other hand, the plurality of second through holes 42 include through holes of relatively large inner diameter and through holes of relatively small inner diameter with respect to the outer shape of the contact pin 60.

The first to fourth insulating plates 51 to 54 are made of a material having excellent electrical insulation, heat resistance, and moldability, such as, for example, a liquid crystal polymer. Through-holes 51a to 54a respectively correspond to the first and second through-holes 32 and 42 of the GND plate 30 and the PPS plate 40 at approximately the center of each insulation plate 51 to 54, respectively. Formed.

Moreover, insertion holes for inserting the screw 91 are formed in the four peripheral edges of these through-holes 42, respectively. On the other hand, all the through holes 51a to 54a provided in the first to fourth insulating plates 51 to 54 have an inner diameter larger than that of the contact pin 60.

The six plates 30, 40, and 51 to 54 described above are the second insulation plate 52, the GND plate 30, the first insulation plate 51, the PPS plate 40, and the third from the top. The insulating plate 53 and the fourth insulating plate 54 are stacked in this order. In particular, since the first insulating plate 51 is interposed between the GND plate 30 and the PPS plate 40, the GND plate 30 and the PPS plate 40 do not conduct. On the other hand, in order to fix the contact pin 60, only the fourth insulating plate 54 is laminated after the contact pin 60 is inserted into the other plates 30, 40, 51-53.

On the other hand, the number of sheets of the GND plate 30 and the PPS plate 40 is not limited to one sheet each, but can be any number of sheets. In addition to the GND plate 30 and the PPS plate 40, the conductive plate in the present invention also includes a plate used for other purposes such as signal transmission. It is not necessary to provide the GND plate 30 and the PPS plate 40 over the entire surface, and as shown in Fig. 6, for example, two PPS plates 40A and 40B may be partially provided.

In this embodiment, the plates 30, 40, and 51 to 54 are laminated in the following procedure.

First, one GND plate suitable for the socket 20 is selected from a plurality of GND plates prepared in advance. In the present embodiment, the plurality of GND plates prepared in advance are common in that all thirty-five first through holes 32 are formed substantially in the center, but the arrangement of the through holes of large inner diameter and the through holes of small inner diameter is different from each other. In the selected GND plate 30, the first through hole into which the contact pin 60 to be connected to the GND cable 11 is inserted among the 35 first through holes 32 is less than or equal to the outer diameter of the contact pin 60. It has an inner diameter and the first through hole other than this has an inner diameter larger than the outer diameter of the contact pin 60.

Next, one PPS plate suitable for the socket 20 is selected from the plurality of PPS plates prepared in advance. In the present embodiment, the plurality of PPS plates prepared in advance are common in that each of the 35 second through holes 42 is formed approximately in the center, but the arrangement of the through holes having a large inner diameter and the through holes having a small inner diameter are different from each other. . In addition, in the selected PPS plate 40, out of the 35 second through holes 42, the second through hole into which the contact pin 60 to be connected to the power supply cable 21 is inserted is the outer diameter of the contact pin 60. It has the following inner diameter, and the other 2nd through hole has the inner diameter larger than the outer diameter of the contact pin 60. As shown in FIG.

Next, the first insulating plate 51 is laminated between the GND plate 30 and the PPS plate 40, and the second, third and fourth insulating plates 52, 53, and 54 are also stacked. Is laminated on these top and bottom.

Thus, by selecting and combining the plates from the plate groups prepared in advance, it is possible to easily cope with various kinds of IC devices.

As shown in Figs. 2 and 3, the laminated plates 30, 40, 51 to 54 are screws 91 inserted into respective insertion holes from the second insulating plate 52 side, respectively, It is fixed by the nut 92 screwed to the screw 91 by the 4th insulating plate 54 side. In addition, in this embodiment, the fixing method of the plates 30, 40, 51-54 is not limited to a fixing screw, For example, you may fix using a clamp etc.

In addition, contact pins 60 are inserted into the through holes 32, 42, and 51a to 54a coaxially positioned in the laminated plates 30, 40 and 51 to 54, respectively. It is. Examples of the contact pins 60 include pogo pins, bellows type or coaxial contact pins, and the like. At the rear end of the contact pin 60, a large diameter portion 61 having a large outer diameter is formed, and the contact pin 60 is caught by the fourth insulating plate 554 at this large diameter portion 61 and stopped.

In the present embodiment, the inner diameter of the first through hole 32a is equal to or smaller than the outer diameter of the contact pin 60 with respect to the first and second through holes 32a and 42a shown at the right end of FIG. 4. On the other hand, the inner diameter of the second through hole 42a is larger than the outer diameter of the contact pin 60. For this reason, although the GND plate 30 and the contact pin 60 contact, the PPS plate and the contact pin 60 do not contact. Therefore, the contact pin 60 shown at the right end of FIG. 4 is electrically connected only to the GND cable 11 via the GND plate 30.

On the other hand, with respect to the first and second through holes 32b and 42b shown in the center of FIG. 4, the inner diameter of the first through hole 32b is larger than the outer diameter of the contact pin 60. The inner diameter of the second through hole 42b is equal to or smaller than the outer diameter of the contact pin 60. For this reason, although the GND plate 30 and the contact pin 60 do not contact, the PPS plate 40 and the contact pin 60 contact. Therefore, the contact pin 60 shown in the center of FIG. 4 is electrically connected only to the power supply cable 12 via the PPS plate 40.

In addition, with respect to the first and second through holes 32c and 42c shown at the left end of FIG. 4, all of the first and second through holes 32c and 42c are outlines of the contact pins 60. Since it has a larger inner diameter, the contact pin 60 is not in contact with either the GND plate 30 or the PPS plate 40. Therefore, the contact pin 60 at the left end of FIG. 4 is not connected to either the GND cable 11 or the power supply cable 12, and the signal transmission cable 13 for transmitting the test signal to the IC device is provided. It is directly connected by soldering or the like. The signal transmission cable 13 is made of, for example, a coaxial cable for transmitting high frequency signals, and is connected to a pin electronic card (not shown) accommodated in the test head 10.

As described above, in the present embodiment, the contact pins 60 and the conductive plates 30 and 40 are brought into contact with each other or non-contacted according to the sizes of the first and second through holes 32 and 42. It is possible to selectively connect the contact pins 60 and the electric cables 11 to 13 without using a substrate. In the present invention, the same contact pin 60 may be in contact with a plurality of conductive plates.

In addition, by configuring the socket 20 without using a circuit board, it is easy to adopt a coaxial structure to the vicinity of the IC device 5, thereby improving test accuracy. In addition, by employing the conductive plates 30 and 40 instead of the thin circuit pattern, the wiring for power supply and ground can be greatly strengthened, so that noise can be reduced.

As shown in FIG. 2, the GND plate 30 and the PPS plate 40 protrude from the both ends of the laminated plates 30, 40, and 51-54, respectively. The GND plate 30 has bending portions 31 that are bent at substantially right angles at both ends thereof. Similarly, the PPS plate 40 also has bent portions 41 at both ends that are bent at right angles to both ends thereof. The bent portion 31 of the GND plate 30 and the bent portion 41 of the PPS plate 40 are substantially parallel, and the circuit board 70 is disposed between the bent portions 31 and 41. It is installed.

As shown in FIG. 5, the circuit board 70 has circuit patterns 71 and 72 therein. The first circuit pattern 71 electrically connects the GND plate 30 and the GND cable 11. Similarly, the second circuit pattern 72 electrically connects the PPS plate 40 and the power supply cable 12. In addition, a capacitor 80 is mounted on this circuit board 70. The capacitor 80 is connected to the first and second circuit patterns 71 and 72, respectively. The capacitor 80 is a bypass capacitor for supplying a large current to the IC device under test.

In this way, the capacitor 80 is mounted on the circuit board 70 provided between the GND plate 30 and the PPS plate 40, whereby the bypass capacitor 80 can be arranged in the vicinity of the IC device under test. Therefore, test accuracy can be improved.

Further, by bending the protruding portions of the GND plate 30 and the PPS plate 40, the socket 20 can be miniaturized. In particular, when a plurality of sockets 20 are mounted on the test head in order to test a plurality of IC devices simultaneously, the mounting density of the sockets 20 can be improved.

In addition, in the conventional socket, a connector is mounted on a circuit board, and the circuit pattern must be enlarged (fan out), which causes a problem of high density mounting of the socket. In contrast, in the present embodiment, since the GND cable 11 and the power supply cable 12 are directly connected to the GND plate 30 and the PPS plate 40 without using a connector, the socket 20 is mounted. The density can be improved.

In FIG. 5, only one capacitor 80 is shown for convenience of description, but in reality, as illustrated in FIG. 2, a plurality of capacitors 80 are mounted on the circuit board 70. In the present invention, the electronic component mounted on the circuit board is not limited to the capacitor 80, and for example, a relay for switching ON / OFF of the capacitor 81 may be mounted on the circuit board.

Fig. 7 is a side view showing the end of the socket in the third embodiment of the present invention, and Fig. 8 is a side view showing the end of the socket in the fourth embodiment of the present invention. As shown in FIG. 7, the capacitor 80 is disposed between the bent portions 31 and 41 of the plates 30 and 40 without a circuit board, so that the capacitor 80 is GND. It may be directly connected to the bent portion 31 of the plate 30 and may be directly connected to the bent portion 41 of the PPS plate 40. Alternatively, as shown in FIG. 8, the condenser 80 may be provided at the ends of the plates 30 and 40 without bending both ends of the plates 30 and 40.

In addition, embodiment described above is described in order to make understanding of this invention easy, and is not described in order to limit this invention. Therefore, each element disclosed in the said embodiment is intended to include all the design changes and equivalents which belong to the technical scope of this invention.

For example, in the above-described embodiment, the contact pin 60 is illustrated as an example of the conductive member, and the electric cables 11 and 12 are illustrated as an example of the conductor, but the electrical connection structure according to the present invention is specifically limited thereto. It doesn't work.

In addition, although the socket was demonstrated as an example of a terminal device in the above-mentioned embodiment, it does not specifically limit in the terminal device which concerns on this invention, For example, it connects to a connector for connecting a circuit board, electrical cables, or a circuit board and an electrical cable. You may apply.

One… Handler
1a... Opening
5... IC device
6... I / O terminal
10... Test head
11 ... GND cable
12... Power supply cable
13... Signal transmission cable
20... socket
30... GND Plate
31... Bend
32,32a-32c... First through hole
40, 40A, 40B... PPS Plate
41... Bend
42, 42a to 42c... First through hole
51 to 54. 1st-4th Insulation Plate
51a to 54a. Through hole
60... Contact pin
61... The great neck
70... Circuit board
71,72... Circuit pattern
80 ... Condenser
91... screw
92... nut

Claims (17)

A plurality of conductive plates to which the first conductors are electrically connected;
An insulating plate laminated between the plurality of conductive plates;
And a plurality of conductive members penetrating the conductive plate and the insulating plate.
And the conductive member is in contact with at least one of the plurality of conductive plates or is in non-contact with the conductive plate according to the size of the through hole of the conductive plate into which the conductive member is inserted. The method according to claim 1,
The conductive plate having a through hole having an inner diameter less than or equal to the outer diameter of the conductive member is in contact with the conductive member,
And the conductive plate having a through hole having an inner diameter larger than the outer diameter of the conductive member is in non-contact with the conductive member. The method according to claim 1 or 2,
And a second conductor electrically connected to the conductive plate and to the non-contact conductive member. The method according to claim 3,
And the first and second conductors comprise electrical cables. A terminal device electrically connected to a connected object,
A plurality of conductive plates each having a first electrical cable electrically connected thereto;
A first insulating plate stacked between the plurality of conductive plates;
A plurality of terminals in electrical contact with the connected object,
The plurality of terminals pass through the plurality of conductive plates and the first insulating plate,
And the terminal is in contact with at least one of the plurality of conductive plates or is not in contact with the conductive plate according to the size of the through hole of the conductive plate into which the terminal is inserted. The method according to claim 5,
And the first electrical cable includes a power supply cable for supplying power to the connected object and a ground cable for connecting the connected object to a reference potential point. The method according to claim 5 or 6,
The conductive plate having a through hole having an inner diameter less than or equal to the outer diameter of the terminal is in contact with the terminal,
And the conductive plate having a through hole having an inner diameter larger than the outer diameter of the terminal is in contact with the terminal. The method according to any one of claims 5 to 7,
And a second electric cable electrically connected to the non-contacting terminal on the conductive plate. The method according to claim 8,
And the second electrical cable comprises a signal transmission cable for transmitting an electrical signal to the connected object. The method according to any one of claims 5 to 9,
Second and third insulating plates laminated with the plurality of conductive plates;
Fixing means for fixing the plurality of conductive plates and the first to third insulating plate,
And the plurality of terminals pass through the plurality of conductive plates and the first to third insulating plates. The method according to any one of claims 5 to 10,
End portions of the plurality of conductive plates protrude from at least the first insulating plate. The method of claim 11,
And an end portion of the conductive plate is bent. The method according to claim 11 or 12,
And a circuit board on which the electronic component is mounted and electrically connected to at least two of the conductive plates,
And the circuit board is provided between the ends of the at least two conductive plates. The method according to claim 11 or 12,
Further comprising an electronic component electrically connected to at least two said conductive plates,
And said electronic component is provided between the ends of said at least two conductive plates. A socket electrically connected to the electronic component under test at the time of testing the electronic component under test,
The terminal device according to any one of claims 5 to 14,
And the connected object includes an input / output terminal of the electronic component under test. An electronic component test apparatus for performing a test of an electronic component under test,
The socket according to claim 15,
And a test head equipped with the socket. A manufacturing method of a socket electrically connected to the electronic component under test at the time of testing the electronic component under test,
A first selection step of selecting one first conductive plate from the plurality of first conductive plates,
A second selection step of selecting one second conductive plate from the plurality of second conductive plates,
A stacking step of stacking the first and second conductive plates through an insulating plate;
And a through step for penetrating the terminal through the first conductive plate, the insulating plate and the second conductive plate.

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