KR20090009911A - 전자 기기 - Google Patents
전자 기기 Download PDFInfo
- Publication number
- KR20090009911A KR20090009911A KR1020087028934A KR20087028934A KR20090009911A KR 20090009911 A KR20090009911 A KR 20090009911A KR 1020087028934 A KR1020087028934 A KR 1020087028934A KR 20087028934 A KR20087028934 A KR 20087028934A KR 20090009911 A KR20090009911 A KR 20090009911A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- battery
- circuit board
- tuner
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
- 회로 기판을 수납하며, 상기 회로 기판의 실장면에 대향하는 위치에 배터리 수납부를 형성하도록 구성된 케이스와,상기 배터리 수납부에 수납되도록 구성된 배터리를 구비하되,상기 케이스는 상기 배터리 수납부를 형성하며, 상기 회로 기판에 대향하는 부위가 다른 부위에 비해서 열 전도율이 높은 전열 부재로 구성되는전자 기기.
- 제 1 항에 있어서,상기 회로 기판은, 상기 배터리 수납부에 대향하는 상기 실장면에 발열 모듈이 실장되는 전자 기기.
- 제 2 항에 있어서,상기 발열 모듈은, 상기 전열 부재에 대향하여 상기 회로 기판에 배열 설치되는 전자 기기.
- 제 2 항에 있어서,상기 발열 모듈은 상기 전열 부재에 당접하는 전자 기기.
- 제 4 항에 있어서,상기 발열 모듈은 열 전달 가능한 당접 부재를 통해서 상기 전열 부재에 당접하는 전자 기기.
- 제 2 항에 있어서,상기 발열 모듈은 상기 배터리 수납부에 대해서 상기 케이스의 두께 방향으로 겹치는 위치에 배치되는 전자 기기.
- 제 1 항에 있어서,상기 회로 기판은 그라운드부를 갖도록 구성되고,상기 전열 부재는 상기 회로 기판의 상기 그라운드부에 당접하는전자 기기.
- 제 1 항에 있어서,상기 회로 기판은, 상기 배터리 수납부에 대향하는 제 1 실장면에 제 1 발열 모듈이 실장되고, 상기 제 1 실장면과는 반대측의 제 2 실장면에 제 2 발열 모듈이 실장되며,상기 제 2 발열 모듈은 상기 제 1 발열 모듈에 대해서 상기 케이스의 두께 방향으로 겹치지 않는 위치에 배열 설치되는전자 기기.
- 제 1 항에 있어서,상기 전열 부재는 금속 부재로 구성되는 전자 기기.
- 제 9 항에 있어서,상기 케이스는 수지 부재로 형성되며, 상기 전열 부재를 구성하는 금속 부재와 일체적으로 구성되는 전자 기기.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006124480A JP2007300222A (ja) | 2006-04-27 | 2006-04-27 | 電子機器 |
| JP2006124495A JP4657972B2 (ja) | 2006-04-27 | 2006-04-27 | 電子機器 |
| JPJP-P-2006-124480 | 2006-04-27 | ||
| JPJP-P-2006-124495 | 2006-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090009911A true KR20090009911A (ko) | 2009-01-23 |
Family
ID=38655253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087028934A Ceased KR20090009911A (ko) | 2006-04-27 | 2007-03-29 | 전자 기기 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8325483B2 (ko) |
| KR (1) | KR20090009911A (ko) |
| WO (1) | WO2007125718A1 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150081134A (ko) * | 2014-01-03 | 2015-07-13 | 삼성전기주식회사 | 모바일 기기 |
| US9609787B2 (en) | 2013-09-17 | 2017-03-28 | Samsung Electronics Co., Ltd. | Portable electronic device and battery pack for the same |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8802266B2 (en) | 2009-05-26 | 2014-08-12 | The Invention Science Fund I, Llc | System for operating an electrical energy storage device or an electrochemical energy generation device using microchannels based on mobile device states and vehicle states |
| US8715875B2 (en) | 2009-05-26 | 2014-05-06 | The Invention Science Fund I, Llc | System and method of operating an electrical energy storage device or an electrochemical energy generation device using thermal conductivity materials based on mobile device states and vehicle states |
| US9065159B2 (en) * | 2009-05-26 | 2015-06-23 | The Invention Science Fund I, Llc | System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using microchannels |
| US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US7965514B2 (en) * | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| JP5580282B2 (ja) * | 2011-12-09 | 2014-08-27 | 本田技研工業株式会社 | バッテリの冷却装置 |
| CN102651464B (zh) * | 2012-05-25 | 2016-01-27 | 深圳市万拓电子技术有限公司 | 可拆式触点电源 |
| JP2014032997A (ja) * | 2012-08-01 | 2014-02-20 | Sharp Corp | 携帯端末 |
| JP5939102B2 (ja) * | 2012-09-18 | 2016-06-22 | 富士通株式会社 | 電子機器 |
| US9268376B2 (en) * | 2013-01-09 | 2016-02-23 | Google Technology Holdings LLC | Mobile computing device dock station with headset jack heat pipe interface |
| JP5606561B2 (ja) * | 2013-01-30 | 2014-10-15 | 株式会社東芝 | 電子機器 |
| KR102043396B1 (ko) * | 2013-02-22 | 2019-11-12 | 삼성전자주식회사 | 방열 안테나 장치, 이를 구비한 휴대 단말기와 배터리 커버 및 배터리 커버 제조 방법 |
| CN104253096A (zh) * | 2013-06-27 | 2014-12-31 | 鸿富锦精密工业(深圳)有限公司 | 电子设备 |
| CN204258880U (zh) * | 2014-11-24 | 2015-04-08 | 翁金柱 | 全包围保护套 |
| KR20160090144A (ko) * | 2015-01-21 | 2016-07-29 | 주식회사 아모그린텍 | 방열 시트 일체형 안테나 모듈 |
| KR102376981B1 (ko) | 2015-04-22 | 2022-03-21 | 삼성전자주식회사 | 방열 구조를 갖는 전자 장치 |
| KR101609642B1 (ko) * | 2015-07-10 | 2016-04-08 | 주식회사 아모그린텍 | Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기 |
| US10377000B2 (en) | 2015-08-26 | 2019-08-13 | Apple Inc. | Heat dissipation case and methods for navigating heat from an electronic device |
| US10120423B1 (en) * | 2015-09-09 | 2018-11-06 | Amazon Technologies, Inc. | Unibody thermal enclosure |
| JP2017188597A (ja) * | 2016-04-07 | 2017-10-12 | アズビル株式会社 | 基板ユニットおよび基板ユニットの製造方法 |
| JP6773295B2 (ja) * | 2016-07-14 | 2020-10-21 | 株式会社ザクティ | 撮像装置 |
| JP2022085080A (ja) * | 2020-11-27 | 2022-06-08 | 日東電工株式会社 | 電池モジュールおよび配線回路基板付き電池モジュール |
| CN112739154A (zh) * | 2020-12-09 | 2021-04-30 | 维沃移动通信有限公司 | 可穿戴设备 |
| CN115086511A (zh) | 2021-03-11 | 2022-09-20 | 松下知识产权经营株式会社 | 摄像装置 |
| JP7676169B2 (ja) * | 2021-03-12 | 2025-05-14 | キヤノン株式会社 | 撮像装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5043845A (en) * | 1989-10-16 | 1991-08-27 | Eastman Kodak Company | High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
| JP2586389B2 (ja) | 1993-09-17 | 1997-02-26 | 日本電気株式会社 | Lsiケースのシールド構造 |
| JP2821376B2 (ja) | 1993-12-09 | 1998-11-05 | 日本電気株式会社 | 携帯無線機 |
| JP2003060369A (ja) * | 2001-08-08 | 2003-02-28 | Hitachi Ltd | 携帯型電子装置 |
| DE10234500A1 (de) | 2002-07-23 | 2004-02-19 | Siemens Ag | Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät |
| US20040132503A1 (en) * | 2003-01-03 | 2004-07-08 | Chia-Pin Chiu | Thermal management for telecommunication devices |
| JP4314090B2 (ja) * | 2003-09-30 | 2009-08-12 | アイコム株式会社 | 電子機器の放熱構造 |
| JP2005129734A (ja) | 2003-10-23 | 2005-05-19 | Sony Corp | 電子機器 |
| KR100608730B1 (ko) * | 2003-12-20 | 2006-08-04 | 엘지전자 주식회사 | 방열기능을 구비한 이동단말기의 케이스 |
| JP2005244493A (ja) | 2004-02-25 | 2005-09-08 | Nec Corp | 携帯通信機および携帯通信機の放熱方法 |
| US20050195573A1 (en) * | 2004-03-04 | 2005-09-08 | Huang Ming T. | Heat dissipation module for a CPU |
-
2007
- 2007-03-29 WO PCT/JP2007/056836 patent/WO2007125718A1/ja not_active Ceased
- 2007-03-29 US US12/298,734 patent/US8325483B2/en not_active Expired - Fee Related
- 2007-03-29 KR KR1020087028934A patent/KR20090009911A/ko not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9609787B2 (en) | 2013-09-17 | 2017-03-28 | Samsung Electronics Co., Ltd. | Portable electronic device and battery pack for the same |
| KR20150081134A (ko) * | 2014-01-03 | 2015-07-13 | 삼성전기주식회사 | 모바일 기기 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090310311A1 (en) | 2009-12-17 |
| US8325483B2 (en) | 2012-12-04 |
| WO2007125718A1 (ja) | 2007-11-08 |
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Legal Events
| Date | Code | Title | Description |
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| A201 | Request for examination | ||
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Patent event date: 20081126 Patent event code: PA01051R01D Comment text: International Patent Application |
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Comment text: Notification of reason for refusal Patent event date: 20100818 Patent event code: PE09021S01D |
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| AMND | Amendment | ||
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Patent event date: 20110223 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20100818 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
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Patent event date: 20110328 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20110223 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20111123 Appeal identifier: 2011101002442 Request date: 20110328 |
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Patent event code: PJ13011S01D Patent event date: 20111123 Comment text: Trial Decision on Objection to Decision on Refusal Appeal kind category: Appeal against decision to decline refusal Request date: 20110328 Decision date: 20111123 Appeal identifier: 2011101002442 |