KR20080084216A - Sorting handler for burn-in test - Google Patents

Abstract

The present invention relates to a one-time test sorting handler to increase a unit per hour (UPH), the burn-in test sorting handler comprising: a main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having a tray containing semiconductor packages to be burn-in tested; An unloading unit disposed at one side of the loading unit and having a tray for storing the tested semiconductor packages conveyed from the burn-in board; A burn-in board moving unit for moving the burn-in board taken out of the rack to a desired position at a work position at which the semiconductor package is taken out and / or inserted; A DC test socket connected to the semiconductor package to be tested returned from the loading unit to perform an electrical performance test; A buffer unit configured to temporarily classify the tested semiconductor package drawn out from the burn-in board and to wait for a test result; A first guide frame and a second guide frame which are installed to extend in parallel in the X-axis direction on an upper portion of the main body; First and second loading pickers installed on the first guide frame to move in the X-Y-axis direction and transporting and storing the semiconductor package from the loading unit to the DC test unit and the DC test unit to the burn-in board at the working position; The first and second unloading pickers installed in the second guide frame to move in the XY axis direction to transport the semiconductor package from the burn-in board at the work position to the buffer unit and to the unloading unit from the buffer unit to be stored for each test result. Characterized in that configured to include.

Description

Sorting Handler for Burn-in Test}

1 is a plan view schematically showing the configuration of one embodiment of the sorting handler for burn-in test according to the present invention

Explanation of symbols on the main parts of the drawings

1: body 2: rack

3: Loading unit 4: Unloading unit

41: good quality unloading part 42, 43: 1st and 2nd rejection part

44: DC reject portion 5: DC test socket

6: buffer section 61: good quality buffer section

62, 63: First and second defective product buffer unit 64: DC defective buffer unit

71: first guide frame 72: second guide frame

81: first loading picker 82: second loading picker

91: the first unloading picker 92: the second unloading picker

B: Burn-in board WP: Work position

The present invention relates to a sorting handler for a burn-in test, and more particularly, to perform a heat resistance test at a high temperature before shipping a semiconductor package, and to classify it according to the test result and store it in a tray, and to burn-in a new semiconductor package to be tested. The burn-in test sorting handler for the burn-in board.

In general, semiconductor packages have been tested for electrical performance by a test apparatus after production is completed, so that only the products classified as good results can be shipped to ensure the reliability of the product.

As one of the tests of the semiconductor package, a burn-in test is performed to minimize the occurrence of defects due to high temperature in the actual use environment. In the burn-in test, the semiconductor packages to be tested in the burn-in test sorting handler are mounted on the burn-in board, and then the burn-in board is returned to the burn-in tester to perform a heat resistance test at a high temperature, and the burn-in board is again burn-in test. It is returned to the sorting handler for sorting and storing in the shipping tray for each test result.

In this burn-in test process, the burn-in test sorting handler separates the semiconductor package tested by the burn-in tester from the burn-in board, sorts it into the shipping tray for each test result, and mounts a new semiconductor package to be tested on the burn-in board. Do it automatically.

In a typical conventional burn-in tester sorting handler, one or two loading pickers are loaded in a loading portion while one or two unloading pickers pick up a tested semiconductor package from a burn-in board and return them to a tray of an unloading portion. The new semiconductor package was picked up from the tray and returned to the DC test socket, followed by a simple DC test, and then sorted by filling the blank on the burn-in board.

However, the sorting handler for the burn-in tester according to the related art has a limitation in the number of semiconductor packages that can be held in the picker at one time because the plurality of pickers are movably installed in one guide frame, thereby increasing the throughput per unit time (UPH). There is a limit to increasing the unit per hour.

That is, the pickers of the sorting handler for the burn-in tester have a plurality of vacuum nozzles for vacuum adsorption of the semiconductor package, and the pickers of the sorting handler for the burn-in tester have four vacuum nozzles. Therefore, if the number of semiconductor packages that can be held in the picker at one time is increased, the number of the vacuum nozzles may be increased and arranged.

However, since the pickers of the conventional burn-in tester sorting handlers are all installed in one guide frame, when the number of vacuum nozzles is increased, the length of the entire sort-in sorting handler for the burn-in tester increases because the length of the guide frame has to be increased. The problem arises.

In addition, a sorting handler for a burn-in tester according to the related art includes a rack in which a burn-in board is stacked on one side of a main body, and a work position for drawing a semiconductor package from the burn-in board and storing a new semiconductor package in the center of the main body. The unloading part (the part where the tray containing the tested semiconductor package is located) and the loading part (the part where the tray containing the new semiconductor package to be tested is located) are separated and disposed on both sides of the work position. Has a structure.

Therefore, the distance between the work position and the rack is far, and the burn-in board of the work position moves to the rack, and the time required for the burn-in board of the rack to move to the work position (this is called 'rack changing time') increases productivity. This has a problem of deterioration.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to increase the throughput per unit time (UPH) by increasing the number of vacuum nozzles of pickers carrying semiconductor packages without increasing the overall size of the equipment. It provides a sorting handler for burn-in testing that can be done.

Another object of the present invention is to provide a burn-in test sorting handler which can further increase the throughput per unit time (UPH) by reducing the rack changing time.

The present invention for achieving the above object, the main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having a tray containing semiconductor packages to be burn-in tested; An unloading unit disposed at one side of the loading unit and having a tray for storing the tested semiconductor packages conveyed from the burn-in board; A burn-in board moving unit for moving the burn-in board taken out of the rack to a desired position at a work position at which the semiconductor package is withdrawn and / or inserted; A DC test socket connected to the semiconductor package to be tested returned from the loading unit to perform an electrical performance test; A buffer unit configured to temporarily classify the tested semiconductor package drawn out from the burn-in board and to wait for a test result; A first guide frame and a second guide frame which are installed to extend in parallel in the X-axis direction on the top of the main body; First and second loading pickers installed on the first guide frame to move in the X-Y-axis direction and transporting and storing the semiconductor package from the loading unit to the DC test unit and the DC test unit to the burn-in board at the working position; The first and second unloading pickers installed in the second guide frame to move in the XY axis direction to transport the semiconductor package from the burn-in board at the work position to the buffer unit and to the unloading unit from the buffer unit to be stored for each test result. Provides a sorting handler for burn-in tests configured to include

According to the present invention, since the plurality of pickers are configured to convey the semiconductor packages to the designated positions while moving in the XY direction on two separate guide frames, the overall size of the equipment is increased even if the number of vacuum nozzles of each picker is increased. Unit Per Hour (UPH) can be increased without significant increase.

In addition, since the work position of the burn-in board is disposed right next to the rack, the rack changing time is shortened, thereby increasing the unit per hour (UPH).

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the sorting handler for the burn-in test according to the present invention.

As shown in FIG. 1, a rack 2 on which a plurality of burn-in boards B are stacked is installed on one side of the main body 1 of the sorting handler according to the present invention. The rack 2 is loaded with a burn-in board B or a blank burn-in board in which the burn-in tested semiconductor packages are stored.

At one side of the rack 2, a work position WP is inserted into which the semiconductor package is inserted into the burn-in board B, and the semiconductor package is drawn out from the burn-in board B. The burn-in board movable unit (not shown) which moves the burn-in board B by one step to a Y-axis direction is installed in the lower side. Although not shown in the drawing, the burn-in board B is drawn out from the rack 2 at the lower portion of the main body 1 and conveyed onto the burn-in board movable unit (not shown), and the burn-in board movable unit is not shown. The burn-in board conveying robot (not shown) which conveys the burn-in board B of the upper box to the rack 2 is comprised.

In addition, one side of the working position (WP) is provided with a loading unit 3 is loaded with a tray containing a semiconductor package to be newly tested. In the loading section 3, the tray T is configured to move along the Y-axis direction from the front of the main body 1 to the rear by a linear motion device not shown in the drawing.

In addition, one side of the loading unit 3 is provided with an unloading unit 4 having trays in which semiconductor packages are classified and stored for each burn-in test result. The unloading unit 4 includes a good quality unloading unit 41 in which semiconductor packages determined to be good as a result of a burn-in test are accommodated, and first and second reject units for storing semiconductor packages determined as defective or reinspected as a result of burn-in test. (42, 43), and the DC reject portion 44 that houses the semiconductor package that is determined to be defective as a result of the DC test.

In the unloading part 4, the trays T store the semiconductor packages while moving in the Y-axis direction from the rear of the main body 1 to the front by linear motion devices (not shown).

In addition, above the rear part of the main body 1, the tray conveying apparatus 35 which transfers the empty tray after all the semiconductor packages have been loaded from the loading section 3 to the unloading section 4 has an X-axis direction. Installed to move along.

On the other hand, between the working position (WP) and the loading unit 3, the DC test socket 5, the DC package is carried out DC test of the semiconductor packages conveyed from the loading unit 3, and the burn-in board (B) of the working position (WP) The buffer part 6 which accommodates the semiconductor packages which were taken out and conveyed is installed.

Here, the buffer unit 6 is a good-quality buffer unit 61 in which the semiconductor packages determined as good quality among the semiconductor packages drawn out from the burn-in board B, and the defective products among the semiconductor packages drawn out from the burn-in board B. First and second defective product buffer units 62 and 63 in which semiconductor packages determined as being disposed are placed according to grades, and DC defective buffer unit 64 in which semiconductor packages determined to be defective in the DC test socket 5 are placed. It consists of.

The DC test socket 5 and the buffer unit 6 may be transported at a time by the first and second loading pickers 81 and 82 and the first and second unloading pickers 91 and 92 which will be described later. It is preferable to have the same number of squares (10 squares in this embodiment) as the number of.

Above the middle portion of the main body 1, the first guide frame 71 and the second guide frame 72 are installed side by side in the X-axis direction. In addition, the first and second X-axis movable blocks 73 and 74 are configured to move in the X-axis direction along the first guide frame 71 by the linear motion device in the first guide frame 71. First and second X-axis movable blocks 73 and 74 include a first loading picker 81 for picking up a semiconductor package from the loading unit 3 and transporting the semiconductor package to the DC test socket 5, and the DC test socket 5. ), The second loading picker 82 which picks up the semiconductor package and conveys it to the burn-in board B at the work position WP is installed to be movable in the Y-axis direction by the linear motion device.

In addition, the second and second guide frame 72 is configured such that the third and fourth X-axis movable blocks 75 and 76 move in the X-axis direction along the second guide frame 72 by the linear motion device. The 3,4 X-axis movable blocks 75 and 76 include a first unloading picker 91 which picks up a semiconductor package from the burn-in board B at the work position WP and conveys it to the buffer unit 6, and The second unloading picker 92 which picks up the semiconductor package from the buffer part 6 and conveys it to the unloading part 4 is installed to be movable in the Y axis direction by the linear motion device.

That is, the first and second loading pickers 81 and 82 are configured to be movable on the XY axis in the first guide frame 71, and the first and second unloading pickers 91 and the second guide frame 72 are movable in the XY axis. 92 is configured to be movable on the XY axis to convey the semiconductor packages to a predetermined position.

The first and second loading pickers 81 and 82 and the first and second unloading pickers 91 and 92 may include a plurality of vacuum nozzles (10 in this embodiment) for vacuum suction of semiconductor packages. Has a structure.

Burn-in test sorting handler of the present invention configured as described above is operated as follows.

After the burn-in test (B) in the burn-in tester is loaded into the rack (2), and the sorting handler is operated, the burn-in board conveying robot (not shown) is moved from the rack (2) among the burn-in boards (B). One is taken out and seated on a burn-in board movable unit (not shown).

In the loading unit 3, one tray T is moved from the front to the rear to be positioned below the first loading picker 81.

Subsequently, the first loading picker 81 vacuum-adsorbs the test target semiconductor package contained in the tray T of the loading unit 3, and then transfers the same to the DC test socket 5. During the DC test of the semiconductor packages in the DC test socket 5, the first loading picker 81 returns to the loading unit 3, absorbs the new semiconductor package, and transfers the new semiconductor package to the DC test socket 5.

At this time, the second loading picker 82 moves to the upper side of the DC test socket 5 and waits. When the DC test is completed, the second loading picker 82 vacuum-adsorbs the semiconductor packages of the DC test socket 5, and the DC test result is a defective product. The determined thing is returned to the DC defective buffer part 64, and the thing determined as good quality as a result of DC test is conveyed to the burn-in board B of the work position WP.

Meanwhile, while the first and second loading pickers 81 and 82 carry the test target semiconductor packages to the DC test socket 5 and perform the DC test as described above, the first unloading picker 91 moves to the working position ( The tested semiconductor packages are vacuum-adsorbed from the burn-in board B of WP and returned to the buffer unit 6. The first unloading picker 91 places the goodness of the semiconductor packages conveyed in the good quality buffer unit 61 as a result of burn-in test, and the first and second bad quality buffers according to the bad grade. Place it in (62, 63).

When the first unloading picker 91 draws out and transports the semiconductor packages from the burn-in board B, the second loading picker 82 moves a predetermined distance in the Y-axis direction to test the semiconductor packages that have been DC-tested. Fill in the blanks on the burn-in board (B). That is, when the first unloading picker 91 draws out the tested semiconductor packages of the burn-in board B, the second loading picker 82 immediately returns the DC test result to the empty position of the burn-in board B. The determined new semiconductor packages are mounted.

In this process, the burn-in board moving unit (not shown) moves the burn-in board B in the Y-axis direction by one step at the work position WP, and the semiconductor packages of the burn-in board B are first unloaded picker ( 91 to be placed in a position that can be withdrawn or inserted by the second loading picker 82.

On the other hand, the second unloading picker 92 reciprocates between the buffer unit 6 and the unloading unit 4 and conveys the semiconductor packages of the buffer unit 6 to the unloading unit 4 to test results. Sort and store in trays accordingly. At this time, except for a very special case, the probability of generating a defective semiconductor package in one burn-in board is about 5%, and the probability of generating a DC test defect among the semiconductor packages to be filled in one burn-in board is about 3%. In order to withdraw the tested semiconductor package from one burn-in board and to fill a new semiconductor package, the defective parts of the first and second defective product buffer units 62 and 63 and the DC defective buffer unit 64 are defective. Semiconductor packages are not completely filled.

Therefore, the second unloading picker 92 is only good quality semiconductor packages of the good quality buffer unit 61 of the buffer unit 6 while drawing out the tested semiconductor package from the burn-in board and filling the new semiconductor package. Only the operation of picking up and conveying to the good quality unloading part 41 of the unloading part 4 is repeatedly performed. After the replacement of the semiconductor package of one burn-in board is completed, the rack-in boarding time is re-stored in the rack 2, the new burn-in board B is drawn out and returned to the work position WP. During the rack changing time, the second unloading picker 92 may remove the defective semiconductor packages on the first and second defective buffer portions 62 and 63 from the first and second reject portions 42 and 42 of the unloading portion 4. 43, the first loading picker 81 conveys the DC defective semiconductor packages on the DC defective buffer unit 64 to the DC reject unit 44 for storage in the tray T.

As described above, in the sorting handler of the present invention, the first and second loading pickers 81 and 82 move in the XY axis direction on the first guide frame 71, respectively. The semiconductor package loading operation for transporting and mounting the semiconductor packages of the DC test socket 5 to the DC test buffer 5 or the burn-in board B of the working position WP. Meanwhile, the first and second unloading pickers 91 and 92 move in the XY axis direction on the second guide frame 72, respectively, from the burn-in board B of the work position WP to the buffer unit 6. Thus, the unloading operation of conveying the semiconductor packages of the buffer unit 6 to the unloading unit 4 and storing them in the tray is continuously performed.

On the other hand, when all the semiconductor packages are taken out from one tray T of the loading unit 3 during the operation of replacing the semiconductor package on the burn-in board B, the empty tray T is rearward of the main body 1. Move. And the tray conveyance apparatus 35 picks up the said empty tray T, conveys it to the back of any one of the unloading parts 4, for example, the goods unloading part 41, and the goods unloading part 41 ) To recycle the tested semiconductor package to a tray.

As described above, the sorting handler of the present invention is provided on the first and second guide frames 71 and 72 of the first and second loading pickers 81 and 82 and the first and second unloading pickers 91 and 92 respectively. Since it is configured to move in the XY direction, even if the number of vacuum nozzles of each picker is increased to 10 (10 para) as in this embodiment, the total size of the sorting handler is not greatly increased, and the first and second loading pickers 81 and 82 are used. ) And the first and second unloading pickers 91 and 92 can be performed quickly and efficiently.

In addition, since the loading part 3 and the unloading part 4 are configured adjacent to each other on one side of the main body 1, and the working position WP and the rack 2 are configured adjacent to each other, the working position WP From the completed burn-in board (B) is moved to the rack (2) and the work object burn-in board (B) of the rack (2) is shortened rack changing time, which is the time required to move to the work position (WP) It is possible to increase the unit per hour (UPH) than before.

On the other hand, the embodiment of the operation of the sorting handler described above exemplifies that the work to remove the tested semiconductor package from the burn-in board (B) and to mount the semiconductor package to be newly tested.

However, when the empty burn-in board B is loaded in the rack 2, that is, during the first burn-in test operation, the first and second loading pickers 81 and 82 are newly tested on the burn-in board B. Only the mounting of the package will be performed continuously and repeatedly. Of course, in this case, the first and second unloading pickers 91 and 92 may not operate at all, or may be configured to perform the same operation together with the first and second loading pickers 81 and 82.

In addition, since there is no semiconductor package to be newly mounted on the burn-in board at the end of the burn-in test, in this case, the first and second unloading pickers 91 and 92 draw the semiconductor package from the burn-in board B and unload it. Only the operation of accommodating the tray T of the unit 4 will be continuously and repeatedly performed. Of course, even in this case, the first and second loading pickers 81 and 82 may not operate at all, or may be configured to perform the same operation together with the first and second unloading pickers 91 and 92.

As described above, according to the present invention, since the plurality of pickers are configured to convey the semiconductor packages to the designated positions while moving in the XY direction on two separate guide frames, even if the number of vacuum nozzles of each picker is increased, The overall size has the advantage of increasing unit per hour (UPH) without significant increase.

In addition, according to the present invention, since the working position of the burn-in board is disposed right next to the rack, the time until the replacement and replacement of the semiconductor package on the burn-in board with the new burn-in board, that is, the rack chaining time, It is possible to shorten and increase the unit per hour (UPH) by the shortened time.

Claims (4)

A main body; A rack disposed at one side of the main body and having a plurality of burn-in boards loaded therein; A loading unit disposed at the other side of the main body and having a tray containing semiconductor packages to be burn-in tested; An unloading unit disposed at one side of the loading unit and having a tray for storing the tested semiconductor packages conveyed from the burn-in board; A burn-in board moving unit for moving the burn-in board taken out of the rack to a desired position at a work position at which the semiconductor package is taken out and / or inserted; A DC test socket connected to the semiconductor package to be tested returned from the loading unit to perform an electrical performance test; A buffer unit in which the tested semiconductor package is temporarily classified according to a test result and waiting; A first guide frame and a second guide frame which are installed to extend in parallel in the X-axis direction on an upper portion of the main body; First and second loading pickers installed on the first guide frame to move in the X-Y-axis direction and transporting and storing the semiconductor package from the loading unit to the DC test unit and the DC test unit to the burn-in board at the working position; The first and second unloading pickers installed in the second guide frame to move in the XY axis direction to transport the semiconductor package from the burn-in board at the work position to the buffer unit and to the unloading unit from the buffer unit to be stored for each test result. A sorting handler for burn-in tests, including. 2. The burn-in test sorting handler according to claim 1, wherein the work position and the rack are arranged adjacent to each other. The method of claim 1, wherein the buffer unit, A DC defective buffer unit in which semiconductor packages determined as defective by the DC test unit are placed; A non-defective buffer unit in which semiconductor packages determined as good of the semiconductor packages withdrawn from the burn-in board are placed; The sorting handler for burn-in test, characterized in that consisting of a defective buffer unit in which semiconductor packages determined as defective among the semiconductor packages drawn out from the burn-in board. 2. The method of claim 1, wherein the returning of the defective semiconductor package of the buffer unit to the unloading unit is performed by a first loading picker or a first loading picker or rack during a rack changing operation in which the burn-in board of the working position is returned to the rack and the burn-in board of the rack is carried out to the working position. Burn-in test sorting handler, characterized in that made by the 2 unloading picker.

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