KR20080063461A - Efficient high power system in package LED lamp - Google Patents

Abstract

The present invention provides an efficient high power system package LED lamp. The LED lamp according to the present invention includes a light guide device (2). The diode light emitting device 44 converts electrical energy into light incident on at least one of the ends of the light guide device 2, and then the light is transmitted by the light guide device 2 to the light guide device 2. Guided out of Heat from the diode light emitting module 44 is led to at least one of the light dissipation pins 424 from the planar portion of the light conducting means 422 and is dissipated by the light dissipation pins 4240.

Description

Efficient High-Power System-in-Pack LED Lamps {AN EFFICIENT HIGH-POWER SYSTEM-IN-PACKAGE LED LAMP}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to light emitting diode lamps and, more particularly, to light emitting diode lamps of system in package, high power, and high efficiency.

Since light emitting diodes have the advantages of being suitable for power saving, vibration-resisting, rapid response, and mass production, lighting equipment using light emitting diodes as light sources has been continuously researched and developed. However, current light emitting diodes have a problem of being overheated after being used for a long life, causing a reduction in the luminous efficiency of the light emitting diodes and limiting the brightness. For this reason, all kinds of products applying light emitting diodes require good heat-dissipating mechanisms.

Accordingly, the scope of the present invention is to provide a system-in-package, high power, and high efficiency light emitting diode lamp that can solve the heat-dissipation problem of the prior art. In particular, the LED lamp according to the present invention, by guiding the light emitted by the light emitting device to the outside in a single or multiple directions, the light that can extend the point light source generated by the light emitting device in a stable line or plane It includes a guide device.

Summary of the Invention

The scope of the present invention is to provide a system-in-package, high power, and high efficiency light emitting diode lamp. A light emitting diode of a preferred embodiment according to the present invention comprises a light guide device and a first package system. The light guide device has a first end and a second end. The first package system mounted at the first end of the light guide device includes a first heat conduction / dissipation module and a first diode light emitting device. The first heat conduction / dissipation module includes a first heat conduction device and at least one first heat dissipation fin. The first heat conduction device has a planar portion and the at least one first heat dissipation fin is mounted around the first heat conduction device. The first diode light emitting device mounted on the planar portion of the first heat conduction device may be electrically connected to a power source, and may convert the first electrical energy supplied by the power source into the first light. When the first diode light emitting device emits the first light, the first light enters the light guide device and is guided to the outside by the light guide device. Heat generated during light emission of the first diode light emitting device is conducted by the first heat conduction device from its planar portion to the at least one first heat dissipation fin, and then it is the at least one first Dissipated by thermal dissipation pins.

Another scope of the present invention is to provide a diode lamp in which the heat conduction / dissipation modules and the light emitting device are packaged together and provided with a light guide device. The heat generated by the light emitting device can be dissipated directly into the atmosphere by the heat dissipation fins of the heat conduction / dissipation modules to greatly improve the heat dissipation efficiency. In addition, the light guide device may guide the light emitted by the light emitting device to the outside in a single or multiple direction in order to extend the point light source generated by the light emitting device to a stable line or plane.

1 is a schematic view of a light emitting diode lamp of a preferred embodiment according to the present invention,

2 is a schematic view of a light emitting diode lamp of a preferred embodiment according to the present invention;

3 is a structural diagram of a first diode light emitting device of another preferred embodiment according to the present invention; And

4 is a schematic view of a light guide plate for a light guide device of another preferred embodiment according to the present invention;

Advantages and technical features of the present invention will be understood by the following description in conjunction with the accompanying drawings.

The scope of the present invention is to provide a system-in-package, high power, and high efficiency light emitting diode lamp.

Referring to FIG. 1, FIG. 1 is a schematic diagram of a light emitting diode lamp of a preferred embodiment according to the present invention. The LED lamp according to the invention comprises a light guide device 2 and a first package system 4. The light guide device 2 has a first end and a second end. The first package system is mounted at the first end of the light guide device 2. The first package system 4 includes a first heat conduction / dissipation module 42 and a first diode light emitting device 44. The first heat conduction / dissipation module 42 includes a first heat conduction device 422 and at least one heat-dissipating fin 424. The first heat conduction device 422 has a flat portion, and the at least one first heat dissipation fin 424 is mounted around the first heat conduction device 422. The first diode light emitting device 44 mounted on the planar portion of the first heat conduction device 422 may be electrically connected to a power source. The first diode light emitting device 44 may convert first electrical energy supplied by the power source into first light. When the first diode light emitting device 44 emits the first light 442, the first light 442 is introduced into the light guide device 2 and guided to the outside by the light guide device. . Heat generated during light emission of the first diode light emitting device 44 is conducted by the first heat conducting device 422 to the at least one first heat dissipating fin 424 in its planar portion, It is then dissipated by the at least one first heat dissipation pin 424.

2, in a preferred embodiment, the LED lamp further comprises a second package system 4b. The second package system 4b mounted at the second end of the light guide device 2 includes a second heat conduction / dissipation module 42b and a second diode light emitting device 44b. The second heat conduction / dissipation module 42b includes a second heat conduction device 422b and at least one second heat dissipation fin 424b. The second heat conduction device 422b has a flat portion, and the at least one second heat dissipation fin 424b is mounted around the second heat conduction device 422b. The second diode light emitting device 44b mounted on the planar portion of the second heat conduction device 422b may be electrically connected to a power source. The second diode light emitting device 44b may convert the second electrical energy supplied by the power source into the second light 442b. When the second diode light emitting device 44b emits the second light 442b, the second light 442b enters the light guide device 2 and is guided to the outside by the light guide device. do. Heat generated during light emission of the second diode light emitting device 44b is conducted by the second heat conducting device 422b from its planar portion to the at least one second heat dissipating fin 424b, It is then dissipated by the at least one second heat dissipation pin 424b.

Similarly, referring to FIG. 2, in another preferred embodiment, the light emitting diode lamp according to the invention further comprises a first sleeve 8 and a second sleeve 8b, wherein the first sleeve ( One end of 8) is adapted to the insertion of the first diode light emitting device 44 and the other end of the first sleeve 8 is adapted to the insertion of the first end of the light guide device 2. One end of the second sleeve 8b is adapted for insertion of the second diode light emitting device 44b, and the other end of the second sleeve 8b is for insertion of the second end of the light guide device 2. Is adapted.

Referring to FIG. 3, FIG. 3 is a structural diagram of a first diode light emitting device of another preferred embodiment according to the present invention. The first diode light emitting device 44 may include a first substrate 440 made of a semiconductor material, a metal material, a polymer material, or a ceramic material, a first light emitting module 448, and two first electrodes 446. Include. The first light emitting module 448 and the two second electrodes 446 are each formed on the first substrate 440, and they are insulated. The first light emitting module 448 is connected to the two first electrodes 446, respectively. In another preferred embodiment, the second diode light emitting device includes a second substrate formed of a semiconductor material, a metal material, a polymer material, or a ceramic material, a second light emitting module, and two second electrodes. The second light emitting module and the two second electrodes are formed on the second substrate in an insulated state. The second light emitting module is connected to the two second electrodes, respectively.

In another preferred embodiment, each of the first light emitting module and the second light emitting module includes at least one light emitting diode or at least one laser diode.

In another preferred embodiment, the first and second heat conductors are heat pipes or column columns, respectively. The first thermal conductor and the second thermal conductor are formed of a copper material, an aluminum material or a material having high thermal conductivity.

In another preferred embodiment, the light guide device is a tubular device, a cylindrical device, or a light guide plate. Referring to FIG. 4, FIG. 4 is a schematic diagram of a light guide plate 2 for a light guide device. The light guide plate 2 is a cubic object with two opposing corners modified into two opposing planes. The first package system 4 and the second package system 4b are mounted on the two opposing planes. The light guide plate 2 may guide the single light radiated from the package system to the diode light emitting device as a planar light source.

The present invention provides a diode lamp in which thermal conduction / dissipation modules and a diode light emitting device are packaged together and provided with a light guide device. The heat generated by the light emitting device can be dissipated directly into the atmosphere by the heat dissipation fins of the heat conduction / dissipation modules to greatly improve the heat dissipation efficiency. In addition, the light guide device may guide light emitted by the light emitting device to the outside in a single or multiple directions in order to extend the point light source generated by the light emitting device to a stable line or plane. Thus, in comparison with the prior art, the system of the package light emitting diode of the present invention includes a light guide device, which is more suitable for application in diode lamp lighting devices requiring high power, high efficiency, and a wide range of performance.

Together with the above examples and descriptions, the features and technical ideas of the present invention will be hopefully well described. Many modifications will be readily apparent to those skilled in the relevant art, and changes in the device may be made while retaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the limitations and boundaries of the appended claims.

Claims (9)

As a system-in-package, high efficiency, and high power light emitting diode lamp, the light emitting diode lamp is: A light guide having a first end and a second end; And A first package system mounted to the first end of the light guide device, wherein the first package system comprises: A first heat conduction / dissipation module comprising a first heat conduction device and at least one first heat dissipation fin, wherein the first heat conduction apparatus has a planar portion, and the at least one first heat dissipation fin is the first heat conduction fin. The first heat conduction / dissipation module mounted around a heat conduction device; And And a first diode light emitting device mounted on a planar portion of the first heat conduction device and electrically connected to a power source, and configured to convert first electrical energy supplied by the power source into first light. When the first diode light emitting device emits the first light, the first light enters the light guide device and is guided to the outside by the light guide device, and is generated during light emission of the first diode light emitting device. Heat is conducted by the first heat conduction device from the planar portion thereof to the at least one first heat dissipation fin, and then dissipated by the at least one first heat dissipation fin. The method of claim 1, And a second package system mounted to a second end of the light guide device, wherein the second package system comprises: A second heat conduction / dissipation module comprising a second heat conduction device and at least one second heat dissipation fin, wherein the second heat conduction apparatus has a planar portion and the at least one second heat dissipation fin is selected from the second heat conduction fin. The second heat conduction / dissipation module mounted around a heat conduction device; And And a second diode light emitting device mounted on a planar portion of the second heat conduction device and electrically connected to the power supply, and configured to convert second electrical energy supplied by the power supply into second light. Here, when the second diode light emitting device emits the second light, the second light enters the light guide device and is guided to the outside by the light guide device, and during the light emission of the second diode light emitting device. The generated heat is conducted by the second heat conduction device from the planar portion thereof to the at least one second heat dissipation pin, which is then dissipated by the at least one second heat dissipation pin. . The method of claim 2, The first diode light emitting device includes a first substrate, a first light emitting module formed on the first substrate, and two first electrodes formed to be insulated from the first substrate, and the second diode light emitting device includes: And a second substrate, a second light emitting module formed on the second substrate, and two second electrodes formed in an insulated state on the second substrate. The method of claim 3, wherein The first light emitting module and the second light emitting module, respectively, at least one light emitting diode or at least one laser diode. The method of claim 3, wherein The first substrate and the second substrate are each formed of a semiconductor material, a metal material, a polymer material, or a ceramic material. The method of claim 2, And said first and second heat conduction devices are heat pipes or heat columns, respectively. The method of claim 2, And the first and second heat conduction devices are each formed of a copper material, an aluminum material, or a material having high thermal conductivity. The method of claim 2, And a first sleeve and a second sleeve, wherein one end of the first sleeve is adapted to the insertion of the first diode light emitting device, and the other end of the first sleeve is adapted to the insertion of the first end of the light guide device. Wherein the one end of the second sleeve is adapted to the insertion of the second diode light emitting device and the other end of the second sleeve is adapted to the insertion of the second end of the light guide device. The method of claim 2, The light guide device may be a tubular device, a cylindrical device or a light guide plate.

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