KR20080042040A - 코팅 시스템용 모듈 및 연관된 기술 - Google Patents
코팅 시스템용 모듈 및 연관된 기술 Download PDFInfo
- Publication number
- KR20080042040A KR20080042040A KR1020077026888A KR20077026888A KR20080042040A KR 20080042040 A KR20080042040 A KR 20080042040A KR 1020077026888 A KR1020077026888 A KR 1020077026888A KR 20077026888 A KR20077026888 A KR 20077026888A KR 20080042040 A KR20080042040 A KR 20080042040A
- Authority
- KR
- South Korea
- Prior art keywords
- compartment
- module
- sputtering
- sufficient
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000576 coating method Methods 0.000 title abstract description 59
- 239000011248 coating agent Substances 0.000 title abstract description 50
- 238000005516 engineering process Methods 0.000 title 1
- 238000004544 sputter deposition Methods 0.000 claims abstract description 239
- 238000000034 method Methods 0.000 claims description 24
- 238000004891 communication Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 46
- 239000000758 substrate Substances 0.000 description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 28
- 230000005611 electricity Effects 0.000 description 19
- 239000007789 gas Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 239000012809 cooling fluid Substances 0.000 description 13
- 239000000498 cooling water Substances 0.000 description 13
- 238000000429 assembly Methods 0.000 description 10
- 230000000712 assembly Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000002826 coolant Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005086 pumping Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000013507 mapping Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 239000005328 architectural glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013479 data entry Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Accessories Of Cameras (AREA)
- Spray Control Apparatus (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68298505P | 2005-05-20 | 2005-05-20 | |
| US60/682,985 | 2005-05-20 | ||
| US11/382,240 US20060260938A1 (en) | 2005-05-20 | 2006-05-08 | Module for Coating System and Associated Technology |
| US11/382,240 | 2006-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080042040A true KR20080042040A (ko) | 2008-05-14 |
Family
ID=37447330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077026888A Withdrawn KR20080042040A (ko) | 2005-05-20 | 2006-05-10 | 코팅 시스템용 모듈 및 연관된 기술 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060260938A1 (fr) |
| EP (1) | EP1882051A4 (fr) |
| JP (1) | JP2008540848A (fr) |
| KR (1) | KR20080042040A (fr) |
| RU (1) | RU2007147465A (fr) |
| TW (1) | TW200710235A (fr) |
| WO (1) | WO2006127267A2 (fr) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070256934A1 (en) * | 2006-05-08 | 2007-11-08 | Perata Michael R | Apparatus and Method for Coating Substrates With Approximate Process Isolation |
| US20080011599A1 (en) * | 2006-07-12 | 2008-01-17 | Brabender Dennis M | Sputtering apparatus including novel target mounting and/or control |
| JP5104334B2 (ja) * | 2008-01-22 | 2012-12-19 | 株式会社島津製作所 | 真空ポンプ |
| US9812299B2 (en) * | 2008-04-28 | 2017-11-07 | Cemecon Ag | Apparatus and method for pretreating and coating bodies |
| JP5283475B2 (ja) * | 2008-10-21 | 2013-09-04 | Ｓｐｐテクノロジーズ株式会社 | プラズマ制御用電源装置 |
| US8040068B2 (en) * | 2009-02-05 | 2011-10-18 | Mks Instruments, Inc. | Radio frequency power control system |
| DE102010030006A1 (de) * | 2010-06-11 | 2011-12-15 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsanlage in modularer Bauweise |
| TWI554630B (zh) * | 2010-07-02 | 2016-10-21 | 應用材料股份有限公司 | 減少沉積不對稱性的沉積設備及方法 |
| MX346377B (es) * | 2011-04-20 | 2017-03-16 | Oerlikon Surface Solutions Ag Pfäffikon | Método para proporcionar impulsos de potencia secuenciales. |
| DE102011106196A1 (de) * | 2011-06-07 | 2012-12-13 | Oerlikon Trading Ag, Trübbach | Lackieranlage |
| BE1022682B1 (nl) * | 2015-01-11 | 2016-07-14 | Soleras Advanced Coatings Bvba | Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem |
| US20180108519A1 (en) * | 2016-10-17 | 2018-04-19 | Applied Materials, Inc. | POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS) |
| EP3541762B1 (fr) | 2016-11-17 | 2022-03-02 | Cardinal CG Company | Technologie de revêtement à dissipation statique |
| BE1026859B1 (nl) * | 2018-10-22 | 2020-07-14 | Soleras Advanced Coatings Bv | Magnetron met geïntegreerd circuit voor het monitoren en controle |
| KR102481390B1 (ko) * | 2020-10-14 | 2022-12-23 | 부산대학교 산학협력단 | 박막의 원자층 제어를 위한 rf 스퍼터링 장치 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3395089A (en) * | 1964-12-14 | 1968-07-30 | Bell Telephone Labor Inc | Method of depositing films of controlled specific resistivity and temperature coefficient of resistance using cathode sputtering |
| US3679571A (en) * | 1970-10-12 | 1972-07-25 | Bendix Corp | R-f sputtering apparatus |
| US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
| US4278528A (en) * | 1979-10-09 | 1981-07-14 | Coulter Systems Corporation | Rectilinear sputtering apparatus and method |
| US4682564A (en) * | 1980-11-25 | 1987-07-28 | Cann Gordon L | Magnetoplasmadynamic processor, applications thereof and methods |
| USRE34806E (en) * | 1980-11-25 | 1994-12-13 | Celestech, Inc. | Magnetoplasmadynamic processor, applications thereof and methods |
| US4445997A (en) * | 1983-08-17 | 1984-05-01 | Shatterproof Glass Corporation | Rotatable sputtering apparatus |
| US5016562A (en) * | 1988-04-27 | 1991-05-21 | Glasstech Solar, Inc. | Modular continuous vapor deposition system |
| JPH01309965A (ja) * | 1988-06-08 | 1989-12-14 | Matsushita Electric Ind Co Ltd | マグネトロンスパッタ装置 |
| US5021777A (en) * | 1988-10-14 | 1991-06-04 | Transition Technology, Inc. | Mode-selectable communications system |
| US5023768A (en) * | 1989-11-24 | 1991-06-11 | Varian Associates, Inc. | High voltage high power DC power supply |
| EP0439360A3 (en) * | 1990-01-26 | 1992-01-15 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
| US5241152A (en) * | 1990-03-23 | 1993-08-31 | Anderson Glen L | Circuit for detecting and diverting an electrical arc in a glow discharge apparatus |
| US5284521A (en) * | 1990-09-21 | 1994-02-08 | Anelva Corporation | Vacuum film forming apparatus |
| US5236509A (en) * | 1992-02-06 | 1993-08-17 | Spire Corporation | Modular ibad apparatus for continuous coating |
| DE4207525C2 (de) * | 1992-03-10 | 1999-12-16 | Leybold Ag | Hochvakuum-Beschichtungsanlage |
| DE4313353C2 (de) * | 1993-04-23 | 1997-08-28 | Leybold Ag | Vakuum-Beschichtungsanlage |
| US5527439A (en) * | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
| EP0822996B1 (fr) * | 1995-04-25 | 2003-07-02 | VON ARDENNE ANLAGENTECHNIK GmbH | Systeme de pulverisation au moyen de magnetrons cylindriques rotatifs alimentes par courant alternatif |
| US5703281A (en) * | 1996-05-08 | 1997-12-30 | Southeastern Univ. Research Assn. | Ultra high vacuum pumping system and high sensitivity helium leak detector |
| US6488824B1 (en) * | 1998-11-06 | 2002-12-03 | Raycom Technologies, Inc. | Sputtering apparatus and process for high rate coatings |
| WO2000028104A1 (fr) * | 1998-11-06 | 2000-05-18 | Scivac | Appareil de pulverisation cathodique et procede associe de depot a vitesse elevee |
| JP2002203883A (ja) * | 2000-12-27 | 2002-07-19 | Shibaura Mechatronics Corp | 多層膜の形成装置 |
| US6589657B2 (en) * | 2001-08-31 | 2003-07-08 | Von Ardenne Anlagentechnik Gmbh | Anti-reflection coatings and associated methods |
| US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
| US6837975B2 (en) * | 2002-08-01 | 2005-01-04 | Applied Materials, Inc. | Asymmetric rotating sidewall magnet ring for magnetron sputtering |
| US6878207B2 (en) * | 2003-02-19 | 2005-04-12 | Energy Conversion Devices, Inc. | Gas gate for isolating regions of differing gaseous pressure |
| DE102004006419A1 (de) * | 2004-02-09 | 2005-09-08 | Applied Films Gmbh & Co. Kg | Energie- und Medienanschluss für eine aus mehreren Kammern bestehende Beschichtungsanlage |
| EP1698715A1 (fr) * | 2005-03-03 | 2006-09-06 | Applied Films GmbH & Co. KG | machine de revêtement ayant des élèments sur un tiroir |
| EP1713110B1 (fr) * | 2005-04-08 | 2016-03-09 | Applied Materials GmbH & Co. KG | Dispositif pour appliquer un revêtement sur un substrat et module |
| US20060278164A1 (en) * | 2005-06-10 | 2006-12-14 | Petrach Philip M | Dual gate isolating maintenance slit valve chamber with pumping option |
| US20070256934A1 (en) * | 2006-05-08 | 2007-11-08 | Perata Michael R | Apparatus and Method for Coating Substrates With Approximate Process Isolation |
-
2006
- 2006-05-08 US US11/382,240 patent/US20060260938A1/en not_active Abandoned
- 2006-05-10 KR KR1020077026888A patent/KR20080042040A/ko not_active Withdrawn
- 2006-05-10 WO PCT/US2006/017911 patent/WO2006127267A2/fr not_active Ceased
- 2006-05-10 EP EP06759403A patent/EP1882051A4/fr not_active Withdrawn
- 2006-05-10 JP JP2008512348A patent/JP2008540848A/ja active Pending
- 2006-05-10 RU RU2007147465/02A patent/RU2007147465A/ru not_active Application Discontinuation
- 2006-05-17 TW TW095117522A patent/TW200710235A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1882051A2 (fr) | 2008-01-30 |
| TW200710235A (en) | 2007-03-16 |
| US20060260938A1 (en) | 2006-11-23 |
| WO2006127267A2 (fr) | 2006-11-30 |
| RU2007147465A (ru) | 2009-06-27 |
| JP2008540848A (ja) | 2008-11-20 |
| EP1882051A4 (fr) | 2012-01-04 |
| WO2006127267A3 (fr) | 2007-10-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20071119 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |