KR20080003487A - Exposing apparatus - Google Patents

Abstract

An exposure apparatus includes an LCD mask having a light source unit for generating light toward an object, an illumination system for condensing the light, and a liquid crystal layer disposed below the illumination system to selectively transmit the condensed light, and the LCD mask and the And a lens system disposed between the objects to reduce and project the light passing through the LCD mask onto the object. Accordingly, various circuit patterns may be implemented on one LCD mask by using the liquid crystal characteristics of the LCD mask.

Description

Exposure apparatus

1 is a schematic view showing an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an embodiment of the LCD mask shown in FIG. 1.

3 is a cross-sectional view taken along line II ′ of the LCD mask illustrated in FIG. 2.

4 is an enlarged cross-sectional view of portion 'A' shown in FIG. 2.

5 is an enlarged cross-sectional view of a portion 'B' illustrated in FIG. 2.

Explanation of symbols on the main parts of the drawings

1: light source 2: illumination system

3: lens system 5: stage

10 semiconductor substrate 11 photoresist film

30 control unit 100 mask

110: LCD module 111: first substrate

112: second substrate 113: liquid crystal

115: TFT layer 116,117: alignment film

121: first polarizing plate 122: second polarizing plate

130: power supply unit

The present invention relates to a semiconductor exposure apparatus, and more particularly, to a mask used in the exposure apparatus.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

The fab process includes a deposition process for forming a film on a semiconductor substrate, a chemical mechanical polishing process for planarizing the film, a photo lithography process for forming a photoresist pattern on the film, and a photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics by using a film, an ion implantation process for implanting specific ions into a predetermined region of the semiconductor substrate, a cleaning process for removing impurities on the semiconductor substrate, and the film Or an inspection process for inspecting the surface of the semiconductor substrate on which the pattern is formed.

In the exposure process, a photoresist pattern is formed by irradiating light onto a mask having a circuit pattern to be printed by transferring a circuit pattern on the mask onto a photoresist film applied on the semiconductor substrate. do.

 The photoresist pattern is influenced by the circuit pattern of the mask because the pattern formed on the mask is a result formed through a photo process.

In this case, several photolithography processes are performed to form the photoresist pattern. That is, the entire circuit pattern for transferring onto the photoresist film is formed by combining circuit patterns formed on several masks. In addition, since the photolithography process transfers the circuit pattern on one mask at a time, the entire circuit pattern is formed on the photoresist film by performing a photolithography process corresponding to the number of masks.

On the other hand, if there is any deformation in the circuit pattern on the mask, a new mask must be produced.

Therefore, there are problems in that several masks are required during the exposure process, an increase in the cost of manufacturing several masks, and an increase in process time due to the replacement of several masks.

An object of the present invention to solve the above problems is to provide an exposure apparatus that can implement a variety of circuit patterns on one LCD mask by controlling the power applied to the LCD mask by manufacturing a mask using a TFT LCD There is.

In order to achieve the object of the present invention, an exposure apparatus according to the present invention comprises a light source unit for generating light toward an object, an illumination system for condensing the light, and disposed below the illumination system to selectively transmit the condensed light. And a lens system disposed between the LCD mask and the object to reduce and project the light passing through the LCD mask onto the object.

In an exemplary embodiment, the LCD mask may include a liquid crystal encapsulated between a first substrate and a second substrate, a thin film transistor (TFT) layer disposed inside the liquid crystal encapsulated on the second substrate, A first polarizing plate and a second polarizing plate may be provided on the outer side of the first substrate and the second substrate, respectively.

The first polarizing plate and the second polarizing plate are preferably arranged such that the polarization directions cross each other by 90 °.

The LCD mask may further include a power applying unit for selectively applying power to the thin film transistor layer.

Therefore, the LCD mask according to the present invention can implement various circuit patterns on one mask by controlling the power applied to the TFT LCD.

Hereinafter, an exposure apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as "first" and "second" may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and, unless expressly defined in this application, are construed in ideal or excessively formal meanings. It doesn't work.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows an example of the exposure apparatus provided with the LCD mask which concerns on this invention.

As shown in FIG. 1, a photolithography apparatus collects a light source 1 that generates light having a specific wavelength and the light irradiated from the light source 1 to the semiconductor substrate 10. An LCD system 100 having an illumination system 2, a lens system 3 for projecting the collected light onto the semiconductor substrate 10, and a circuit pattern to be printed. And a stage 5 for holding the semiconductor substrate 10.

The illumination system 2 is provided on the LCD mask 100, and collects the light irradiated from the light source unit 1 to irradiate the LCD mask 100.

The lens system 3 is provided between the LCD mask 100 and the semiconductor substrate 10, and the photoresist coated with the condensed light passing through the LCD mask 100 on the semiconductor substrate 10 ( photo resist).

Therefore, the light irradiated from the light source unit 100 passes through the illumination system 2 and the lens system 3 to expose a region corresponding to the circuit pattern on the LCD mask 100 on the photoresist film 11. . In addition, the circuit pattern transferred to the photoresist film 11 may etch the semiconductor substrate 10 in a subsequent process.

The LCD mask 100 implements a circuit pattern by using characteristics of the liquid crystal 113 (see FIG. 3) and a thin film transistor (hereinafter TFT) layer 115 (see FIG. 3) for selectively applying power to the liquid crystal. do. That is, the LCD mask 100 may implement a circuit pattern by using the characteristics of the liquid crystal to selectively transmit and block the light depending on whether power is applied. In addition, since the power applied to the liquid crystal is controlled in the TFT layer 115, it is easy to implement and change the circuit pattern by selectively applying power to the TFT layer 115.

On the other hand, the exposure apparatus is provided with a controller 30 for selectively applying power to the LCD mark 100. The LCD mask 100 includes a power applying unit 130 for electrically connecting the controller 30 and the LCD mask 100 and selectively applying power to the TFT layer 115.

In particular, the controller 30 preferably stores electronic data for implementing a circuit pattern on the LCD mask 100. Here, the data is data stored whether power is applied to the TFT 115 at each position of the LCD mask 100 corresponding to a specific circuit pattern to be exposed.

That is, the LCD mask 100 is selectively supplied with power to the TFT layer 115 according to the circuit pattern data stored in the controller 30, and the portion to which power is applied to the TFT layer 115 is the light. The portion of the TFT layer 115 to which power is not applied transmits the light. As described above, a circuit pattern may be realized through a portion through which the light is transmitted and a portion not through the LCD mask 100.

Hereinafter, a preferred embodiment of the LCD mask 100 will be described in detail with reference to FIGS. 2 to 5.

2 is a perspective view of the LCD mask 100 according to an embodiment of the present invention, Figure 3 is a cross-sectional view for explaining the structure of the LCD mask 100 shown in FIG.

As shown in FIGS. 2 and 3, the LCD mask 100 includes an LCD module 110 in which a liquid crystal 113 is encapsulated, and first and second polarizing plates provided above and below the LCD module 110. 121 and 122 and a controller 30 and a power applying unit 130 for controlling the LCD module 110.

The LCD module 110 is formed by filling a liquid crystal 113 between the first and second substrates 111 and 112 made of transparent glass.

In the second substrate 112, a TFT layer 115 for selectively applying power to the liquid crystal 113 is disposed on an inner surface of the liquid crystal 113 encapsulated.

The TFT layer 115 is for applying power to the liquid crystal 113 and is composed of a plurality of transistors.

Alignment layers 116 and 117 are applied to the inner side surface of the first substrate 111 and the inner side surface of the TFT layer 115 so that the molecules of the liquid crystal 113 are aligned in a predetermined direction.

First and second polarizing plates 121 and 122 are provided outside the first and second substrates 111 and 112 to polarize the light incident to the LCD module 110 in one direction. In particular, the first polarizing plate 121 and the second polarizing plate 122 are preferably arranged such that the polarization directions cross each other by 90 °.

In the LCD mask 100, the molecules of the liquid crystal 113 are aligned along the polarization directions of the polarizers 121 and 122. In particular, when the first polarizing plate 121 and the second polarizing plate 122 are disposed 90 ° as described above, the molecules of the liquid crystal 113 are also formed of the molecules of the liquid crystal 113 adjacent to the first polarizing plate 121. The molecules of the liquid crystal 113 adjacent to the second polarizing plate 122 are aligned with each other by 90 °. That is, the molecules of the liquid crystal 113 are aligned in a 90 ° direction by gradually distorting the alignment direction toward the second polarizing plate 122 from the first polarizing plate 121 in the LCD module 110.

Here, the light irradiated onto the LCD mask 100 travels along the surface of the molecules of the liquid crystal 113.

On the other hand, the liquid crystal 113 is aligned along each polarization direction of the polarizing plates 121 and 122 in a state where no power is applied, but when the power is applied to the liquid crystal 113, the alignment is changed, whereby the light is transmitted. Whether or not it changes.

The power applying unit 130 selectively drives power to the TFT layer 130 according to the circuit pattern data stored in the controller 30 to drive the TFT.

The power applying unit 130 may be electrically connected to the TFT layer 130 and may be formed by a tab automated bonding (TAB) method disposed along the side surface of the LCD module 110.

On the other hand, the LCD mask 100 according to the present invention may not form a color filter unlike a typical TFT LCD module because the circuit pattern only needs to be expressed in black and white.

Next, the operation of the LCD mask according to the present invention will be described with reference to FIGS. 4 and 5.

4 is a cross-sectional view illustrating a close portion of the LCD mask 100 in which power is applied to the TFT layer 115. FIG. 5 is a cross-sectional view illustrating an open portion of the LCD mask 100 in which power is not applied to the TFT layer 115.

A portion 'A' shown in FIG. 4 is a closed portion that looks dark by blocking light on the LCD mask 100.

When power is applied to the TFT layer 115 in the LCD mask 100, the molecules of the liquid crystal 113 are aligned in a direction perpendicular to the first polarizing plate 121 and the second polarizing plate 122.

Therefore, when the light incident through the first polarizing plate 121 travels along the surface of the molecules of the liquid crystal 113 and arrives at the second polarizing plate 122, the light is polarized by the second polarizing plate 122. It is a direction perpendicular to the direction. The light does not pass through the second polarizing plate 122 and is blocked, so that the LCD mask 100 is in a closed state that is displayed dark.

A portion 'B' shown in FIG. 5 is an open portion that is brightly visible by transmitting light on the LCD mask 100.

When no power is applied to the LCD mask 100, the molecules of the liquid crystal 113 are arranged along the polarization direction of each of the polarizing plates 121 and 122, so that the liquid crystal 113 molecules adjacent to the first polarizing plate 121 and the liquid crystal 113 molecules are arranged. The molecules of the liquid crystal 113 adjacent to the second polarizing plate 122 are aligned with each other by 90 °.

Therefore, when the light incident through the first polarizing plate 121 travels along the surface of the molecules of the liquid crystal 113 and arrives at the second polarizing plate 122, the direction of the light is directed to the second polarizing plate 122. It becomes a horizontal direction with respect to a polarization direction. In addition, the light passes through the second polarizing plate 122 and is emitted outside, and the LCD mask 100 is in an open state that is displayed brightly.

The closed portion 'A' and the open portion 'B' are determined according to whether the liquid crystal 113 is supplied with power, and the closed portion and the open portion are controlled by controlling the power applied to the LCD mask 100. Free control

Then, the light irradiated from the light source unit 1 passes through the open portion B to expose the photoresist film 11 coated on the semiconductor substrate 10 through the lens system 3.

That is, a specific circuit pattern can be realized by appropriately adjusting the arrangement of the open portion B and the closed portion A, and the light selectively transmitted through the LCD mask 100 in which the circuit pattern is implemented is The circuit pattern is exposed on the semiconductor substrate 10.

In addition, by controlling the power applied to the LCD mask 100 to change the position of the open portion (B) and the closed portion (A) it is possible to easily implement the circuit pattern even if the circuit pattern is changed.

As described above, since the LCD mask according to the preferred embodiment of the present invention manufactures a mask using a TFT LCD, it is possible to simply implement a variety of circuit patterns by controlling the electrical signal applied to the TFT, one LCD mask Can replace multiple masks. Therefore, the mask fabrication process and the exposure process are simplified, and the semiconductor product production yield is improved.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (4)

A light source unit generating light toward an object; An illumination system for condensing the light; An LCD mask disposed under the illumination system, the LCD mask having a liquid crystal layer for selectively transmitting the focused light; And a lens system disposed between the LCD mask and the object to reduce and project the light passing through the LCD mask onto the object. The method of claim 1, wherein the LCD mask, A first substrate; A second substrate disposed to face the first substrate, wherein the liquid crystal is enclosed therebetween; A thin film transistor (TFT) layer disposed inside the liquid crystal encapsulated on the second substrate; And And a first polarizing plate and a second polarizing plate respectively provided on the outer side of the first substrate and the second substrate. The exposure apparatus according to claim 2, wherein the first polarizing plate and the second polarizing plate are arranged such that the polarization directions cross each other by 90 °. The exposure apparatus of claim 2, wherein the LCD mask further comprises a power applying unit for selectively applying power to the thin film transistor layer.

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