KR20070106669A - Circuit board and manufacturing method - Google Patents
Circuit board and manufacturing method Download PDFInfo
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- KR20070106669A KR20070106669A KR1020070103834A KR20070103834A KR20070106669A KR 20070106669 A KR20070106669 A KR 20070106669A KR 1020070103834 A KR1020070103834 A KR 1020070103834A KR 20070103834 A KR20070103834 A KR 20070103834A KR 20070106669 A KR20070106669 A KR 20070106669A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 229920006254 polymer film Polymers 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229920000307 polymer substrate Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
본 발명은 금속 회로가 형성된 고분자 필름 및 그 제조방법에 관한 것이다.The present invention relates to a polymer film on which a metal circuit is formed and a method of manufacturing the same.
본 발명의 금속 회로기판은 고분자 필름과 그 상부에 형성된 금속배선으로 이루어진 것으로, 그 제조 방법에 있어서 임의의 도체기판(또는 도체화 된 기판)상에 회로모양으로 금속을 도금하는 수단과, 별도의 고분자 필름의 일면 또는 양면에 접착 기능을 지니게 하는 수단 및 도금에 의해 회로가 형성된 도체기판과 고분자필름을 접착시키는 단계, 고분자 필름이 접착된 도체기판에서 고분자 필름을 다시 분리할 때 도체기판 상에 형성된 회로배선을 고분자 필름 쪽으로 이전시키는 단계를 포함하여 고분자 필름에 금속배선을 형성하는 것이다.The metal circuit board of the present invention is composed of a polymer film and a metal wiring formed thereon, and means for plating a metal in a circuit shape on an arbitrary conductor substrate (or a conductor substrate) in the manufacturing method thereof, and Bonding the conductive substrate and the polymer film to which the circuit is formed by means of plating and plating on one or both sides of the polymer film, and formed on the conductive substrate when the polymer film is separated from the conductive substrate to which the polymer film is bonded Including the step of transferring the circuit wiring to the polymer film to form a metal wiring on the polymer film.
Description
도 1은 기존의 폴리머상의 금속회로기판을 제조하는 공정도,1 is a process chart for manufacturing a metal polymer substrate on a conventional polymer,
도 2는 본 발명에 따르는 폴리머상의 금속회로 형성 공정도,2 is a process diagram of forming a metal circuit on a polymer according to the present invention;
그림 1은 본 발명에 의해 구현된 폴리머상의 금속회로 패턴 사진Figure 1 is a photograph of the metal circuit pattern on the polymer implemented by the present invention
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
2-1 : 도체기판 2-2 : 절연체패턴2-1: Conductor board 2-2: Insulator pattern
2-3 : 도금된 배선 2-6 : 분리되어 형성된 폴리머 기판에 전사된 배선전극2-3: plated wiring 2-6: wiring electrode transferred to the separated polymer substrate
본 발명은 금속 회로가 형성된 고분자 필름 및 그 제조방법에 관한 것으로, 보다 상세하게는 연성회로기판(FPCB), RF태그 등으로 활용 가능한 금속회로기판이 형성된 고분자 필름에 관한 것이다.The present invention relates to a polymer film formed of a metal circuit and a method of manufacturing the same, and more particularly, to a polymer film formed of a metal circuit board that can be utilized as a flexible circuit board (FPCB), an RF tag, and the like.
주지하는 바와 같이 휴대폰, PDA 등의 이동통신기기, LCD, PDP, OLED 등의 평판디스플레이, 기타 다양한 수많은 종류의 전자소자나 제품에는 금속배선이 형성 된 회로기판이 폭넓게 활용되고 있다.As is well known, circuit boards having metal wirings are widely used in mobile communication devices such as mobile phones and PDAs, flat panel displays such as LCDs, PDPs, OLEDs, and many other kinds of electronic devices and products.
회로 기판 중에 폴리머필름에 금속배선이 형성된 FPCB(flexible printed circuit board)로 일컬어지는 연성회로 기판은 이들 분야뿐만 아니라 다양한 전자제품에 적용이 되고 있는데 이들 연성회로 기판의 구성은 크게 폴리이미드 기판과 그 상부에 형성된 금속배선회로로 구성된다. 그 제조에 있어서 동박이 적층된 폴리이미드 필름의 동박 부분을 식각하여 금속배선을 형성한다.Flexible printed circuit boards called FPCBs (flexible printed circuit boards) in which metal wires are formed on polymer films in circuit boards have been applied to a variety of electronic products as well as these fields. It is composed of a metal wiring circuit formed in. In manufacture, the copper foil part of the polyimide film in which copper foil was laminated | stacked is etched, and metal wiring is formed.
도 1에는 배선패턴이 형성된 폴리머기판의 일반적인 제조방법을 도시하였다. 즉 폴리이미드 등의 폴리머필름(1-1)과 얇은 동박(1-2)을 적층한 동박 적층 필름에, 여기에 감광성수지를 도포하여 건조시킨 다음, 자외선을 노광한다. 감광성수지를 도포한 다음 노광기에서 발생되는 자외선을 배선의 형상을 지니는 포토마스크를 통하여 조사시키면 노광이 된 부분이나 노광이 되지 않은 부분이 추후 현상과정에서 제거된다. 이 때 노광이 된 부분이 제거되는 것을 포지티브형 감광성수지라고 하며, 노광이 되지 않은 부분이 제거되는 것을 네거티브형 감광성수지라 한다.1 illustrates a general manufacturing method of a polymer substrate on which wiring patterns are formed. That is, the photosensitive resin is apply | coated to this copper foil laminated | multilayer film which laminated | stacked the polymer film (1-1), such as polyimide, and the thin copper foil (1-2), it is made to dry, and then it exposes an ultraviolet-ray. After the photosensitive resin is applied, ultraviolet rays generated by the exposure machine are irradiated through a photomask having a wiring shape to remove exposed portions or unexposed portions in a later development process. At this time, the portion where the exposure is removed is called a positive photosensitive resin, and the portion where the portion that is not exposed is removed is called a negative photosensitive resin.
노광 및 현상공정에 의해 감광성수지 패턴(1-3)을 형성한 다음, 이외의 노출된 동박 부분은 식각 공정에 의해서 제거(1-4)를 한다. 식각은 일반적으로 화학적으로 노출된 동박 부분을 제거하는 것으로 주로 염화철의 수용액을 이용한다. 노출된 부분의 동박을 에칭하면 회로배선(1-5)이 형성된다. 회로배선의 상부에는 잔류하고 있는 감광성수지 패턴이 있는 데 이것은 박리액으로 박리시키고, 수세건조하면 회로배선이 형성된 폴리이미드 기판이 되며, 이것을 소정의 형태로 잘라서 전자제품의 전기적 접속에 활용하고 있다.After the photosensitive resin pattern 1-3 is formed by the exposure and development processes, other exposed copper foil portions are removed (1-4) by the etching process. Etching generally removes chemically exposed copper foil parts and mainly uses an aqueous solution of iron chloride. When the exposed copper foil is etched, circuit wiring 1-5 is formed. There is a photosensitive resin pattern remaining on the upper part of the circuit wiring, which is peeled off with a stripping solution and washed with water to form a polyimide substrate on which circuit wiring is formed, which is cut into a predetermined shape and used for electrical connection of electronic products.
이와 같은 제조공법은 수 십 년 동안 폭넓게 이용되고 있다.This manufacturing process has been widely used for decades.
그런데 이런 공법을 사용하는 경우, 공정시간이 길고, 설비투자의 규모가 크며, 제조과정에서 사용되는 소재의 비용도 많이 드는 문제점이 있어왔다.However, when using such a method, there has been a problem that the process time is long, the amount of equipment investment is large, and the cost of the material used in the manufacturing process is also high.
따라서, 본 발명의 목적은 전술한 문제점을 해결할 수 있도록 수명이 긴 몰드상의 도금, 합착, 분리공정을 따르면서 폴리머기판에 금속 배선을 형성하므로 생산설비의 저감, 생산 공정의 단순화, 자재소모의 축소 등의 효과를 얻고자 하였다.Accordingly, an object of the present invention is to form a metal wiring on the polymer substrate while following the plating, bonding, and separation process of a long mold life to solve the above-described problems, reducing production equipment, simplifying the production process, reduction of material consumption, etc. To obtain the effect of.
본 발명의 구현을 위해서 패턴 부가 도금이 되도록 만든 몰드와, 상기 몰드에 전기도금(이하 도금으로 칭함)을 하는 단계 및 폴리머필름을 부착하는 단계 및 폴리머필름을 다시 탈착하면서 배선을 폴리머필름으로 전사시키는 단계를 포함한다.In order to implement the present invention, a mold made of pattern addition plating, electroplating (hereinafter referred to as plating) on the mold, attaching a polymer film, and transferring the wiring to the polymer film while detaching the polymer film again. Steps.
도 2에 이에 대한 설명을 하였다.This is described in FIG. 2.
주요공정은 다음과 같다.The main process is as follows.
(1) 몰드 형성 공정 : 도체기판과 절연체 패턴이 형성된 몰드 제작(1) Mold Forming Process: Mold Forming with Conductor Board and Insulator Pattern
(2) 도금 공정 : 도체기판에 전기도금을 하는 공정(2) Plating process: Process of electroplating conductor board
(3) 합착공정 : 폴리머필름을 접착이 가능하도록 처리를 한 다음 도금된 도체기판과 합착하는 공정(3) Bonding Process: Process of bonding the polymer film to the plated conductor substrate
(4) 분리공정 : 폴리머필름과 도체필름을 분리하면서 배선을 폴리머필름으로 전사시키는 공정.(4) Separation process: The process of transferring the wiring to the polymer film while separating the polymer film and the conductor film.
먼저 특정의 도체기판(또는 표면이 도체화 된 기판: 이것도 도체기판으로 총칭함)(2-1)에 회로부분만 남겨두고 나머지 부분은 절연체 패턴(2-2)을 형성한 기판을 마련한다. 이렇게 만들어진 기판을 편의상 몰드기판이라고 칭한다.First, a circuit board is formed in a specific conductor substrate (or a substrate having a conductive surface: also referred to as a conductor substrate) 2-1, leaving only a circuit portion and the insulator pattern 2-2. The substrate thus produced is referred to as a mold substrate for convenience.
도체기판은 스테인레스 강 또는 티타늄을 사용할 수 있으며, 유리나 실리콘을 기판으로 사용하는 경우 그 표면에 스테인레스 강박막이나 티타늄박막, 또는 산화주석(SnO2)이나 산화아연박막(ZnO)이나 인듐주석산화물박막(ITO박막) 등을 코팅하여 표면을 도체화하여 사용할 수가 있다.The conductor substrate may be made of stainless steel or titanium, and in the case of using glass or silicon as a substrate, a stainless steel thin film or titanium thin film, tin oxide (SnO 2 ), zinc oxide thin film (ZnO) or indium tin oxide thin film ( ITO thin film) etc. can be coated and a surface can be used as a conductor.
이와 같은 몰드를 형성하는 방법으로는 도체기판 상에 절연체박막을 코팅한 다음 이것을 사진식각공정 (포토리소그라피 공정)에 의해 패턴으로 형성할 수 있다.As a method of forming such a mold, an insulator thin film may be coated on a conductor substrate and then formed into a pattern by a photolithography process (photolithography process).
또한 패턴을 형성할 수 있는 레이저 패터닝 기술, 스크린 프린팅 등 다른 기술을 사용할 수도 있다. 절연체 물질은 산화물, 질화물, 폴리머 수지 등 여러 가지를 사용할 수 있다. 여기서는 포토리소그라피 공법으로 몰드를 제작하였으며 몰드의 장기 사용을 위해서, SiO2(산화규소)박막을 기상화학증착방식 (CVD;chemical vapor deposition)이나, 기상물리증착방식 (PVD;physical vapor deposition-스퍼터링이나 진공증착 등의 방식) 등으로 증착한 것을 이용하였다. 절연체가 증착된 기판을 마련한 다음, 여기에 감광성수지를 도포한 다음 건조하고 노광을 하여 회로부분만 제거를 한다. 감광성수지가 현상되면 노출된 산화규소박막을 화학식각 시킨다.It is also possible to use other techniques such as laser patterning technology, screen printing, which can form a pattern. As the insulator material, various kinds of oxides, nitrides, and polymer resins can be used. In this case, the mold is manufactured by photolithography method. For long-term use of the mold, the SiO 2 (silicon oxide) thin film may be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD). Vapor deposition by a method such as vacuum deposition). After preparing the substrate on which the insulator is deposited, the photosensitive resin is applied thereto, dried and exposed to remove only the circuit part. When the photosensitive resin is developed, the exposed silicon oxide thin film is chemically etched.
산화규소박막과 같은 절연체의 두께는 만들고자 하는 배선에 따라 달라지지만, 0.1um∼10um 이내로 함이 바람직하다. 산화규소박막과 같은 절연체 박막의 두께를 작게 하는 것이 몰드를 만들기 위한 포토리소그라피 공정 과정에서 더욱 미세한 몰드을 만들 수 있으므로, 미소한 회로을 만들기에 더 유리하다. 식각의 방법은 불산 수용액을 이용한 화학식각 방법을 사용해도 되며, RIE(reactive ion etching)를 사용할 수도 있다. 또한 레이저로 직접 패턴을 새길 수도 있다.The thickness of the insulator, such as a silicon oxide thin film, depends on the wiring to be made, but is preferably within 0.1um to 10um. Reducing the thickness of an insulator thin film, such as a silicon oxide thin film, can make a finer mold during the photolithography process for making a mold, which is more advantageous for making a fine circuit. The etching method may be a chemical etching method using an aqueous solution of hydrofluoric acid, or may use reactive ion etching (RIE). You can also engrave the pattern directly with the laser.
화학 식각이 되면 산화규소 상부에 남아있는 감광성수지를 박리시킨다.Upon chemical etching, the photosensitive resin remaining on top of the silicon oxide is peeled off.
이와 같은 공정을 따르면 회로기판의 도체부분만 노출된 도체기판이 마련된다.According to such a process, a conductor substrate in which only the conductor portion of the circuit board is exposed is provided.
다음에는 이 위에 금속을 도금(2-3)한다. 도금물질은 구리, 니켈, 금, 은 등 다양한 물질이 가능한데 여기서는 니켈을 1um 이내로 도금한 다음 구리를 5um이상 도금을 하여 배선을 형성하였다. 도금물질은 회로의 특성에 따라 선택될 수 있으며, 구리, 니켈, 금, 은의 단체 또는 이들을 한 가지 이상 함유한 합금이나 다층막을 사용할 수도 있다. 여기서 니켈을 먼저 한 것은 니켈이 납땜성이 좋고, 구리의 산화를 방지하는 역할을 하기 때문이다.Next, the metal is plated (2-3) thereon. The plating material may be various materials such as copper, nickel, gold, and silver. In this case, nickel was plated within 1 μm and then copper was plated over 5 μm to form wiring. The plating material may be selected according to the characteristics of the circuit, and a single body of copper, nickel, gold, silver, or an alloy or a multilayer film containing one or more thereof may be used. Nickel is used first because nickel has good solderability and prevents oxidation of copper.
배선이 형성되면 폴리이미드 수지, PET수지, 폴리카보네이트 수지 등의 폴리머필름을 접착 가능하도록 처리한 다음 배선이 형성된 도체기판에 접합(2-4) 시킨다. 이 때 접착층과 회로배선의 접착력이 도체기판과 회로배선의 접착력보다 크게 해야 한다. 접합이 된 후 다시 폴리이미드 기판을 도체기판으로부터 분리(2-5)해내면 회로배선과 도체기판의 밀착력이 회로기판과 폴리이미드의 접착력보다 작기 때 문에 회로배선은 도체기판에서 폴리이미드 기판으로 전사(2-6)되게 된다. 이것은 시중에서 판매되고 있는 일반적인 스카치테이프로도 확인될 수 있다. 분리된 몰드에는 다시 도금을 하고 폴리머필름을 합착시킨 다음 분리하는 공정을 반복하여 작업을 할 수 있다.When the wiring is formed, a polymer film such as polyimide resin, PET resin, or polycarbonate resin is treated to be adhesive, and then bonded to the conductive substrate on which the wiring is formed (2-4). At this time, the adhesive force between the adhesive layer and the circuit wiring should be greater than that between the conductor substrate and the circuit wiring. After bonding, the polyimide substrate is separated from the conductor board again (2-5), so the adhesion between the circuit wiring and the conductor board is smaller than the adhesion between the circuit board and the polyimide. Transcription 2-6 is performed. This can also be confirmed with the usual Scotch tape on the market. The separated mold may be plated again, the polymer film is bonded, and the process of repeating the separation may be performed.
이와 같이 일반적인 패턴 형성공정이 포토레지스트의 도포, 노광, 현상, 에칭, 박리 공정을 하여 제작하는 반면에 도금 및 합착 분리 공정만을 지니므로 생산성이나 생산비용, 설비비용이 극도로 줄어들게 된다.As such, a general pattern forming process is performed by applying, exposing, developing, etching, and peeling a photoresist, whereas only a plating and bonding separation process is performed, thereby reducing productivity, production cost, and facility cost.
그림 1에는 당 기술을 이용하여 시중에서 판매되고 있는 폴리이미드 테이프를 사용해서 배선을 복제해낸 것으로 피치(회로선폭과 간격을 합친 것: 회로선폭이 약 30um, 회로간격이 약 10um)가 40um 정도이다. 이와 같은 배선 형태는 기존의 에칭공법으로는 기술적으로 구현이 매우 어렵다.Figure 1 is a duplicate of the wiring using a commercially available polyimide tape using this technology, and the pitch (combination of circuit line width and spacing: circuit line width about 30um, circuit spacing about 10um) is about 40um. . Such a wiring form is technically very difficult to implement by the conventional etching method.
이와 같은 공법은 다양한 형태의 연성회로기판(FPCB), PET 등에 금속회로가 형성된 전자태그, 박막안테나, 미세한 입자를 동작시켜 유연한 디스플레이를 구현하는 전기영동형 디스플레이와 같은 플렉서블 디스플레이의 전극기판 등의 제작에 활용될 수 있다.Such a method can be used to manufacture flexible tags such as flexible printed circuit boards (FPCBs), PET, electronic tags with metal circuits formed on PET, thin film antennas, and electrophoretic displays that realize flexible displays by operating fine particles. It can be used for.
따라서, 본 발명의 회로기판의 제조방법은 생산설비의 절감, 생산 공정의 단순화, 소모자재의 절감을 얻을 수 있는 효과를 지니고 있음을 알 수 있다.Therefore, it can be seen that the method of manufacturing the circuit board of the present invention has the effect of reducing the production equipment, simplifying the production process, and reducing the consumption materials.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100924151B1 (en) * | 2007-12-07 | 2009-10-28 | 조인셋 주식회사 | Multilayer Elastic Electrical Conductor and Manufacturing Method Thereof |
| KR101104424B1 (en) * | 2009-10-30 | 2012-01-12 | 성균관대학교산학협력단 | Photoresist removal method, manufacturing method of zinc oxide type THC thin film comprising same and zinc oxide type THC thin film |
| KR101116781B1 (en) * | 2009-09-16 | 2012-02-28 | 주식회사 제이미크론 | a Manufacturing Method of a Thin Layer Semiconductor Package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100924151B1 (en) * | 2007-12-07 | 2009-10-28 | 조인셋 주식회사 | Multilayer Elastic Electrical Conductor and Manufacturing Method Thereof |
| KR101116781B1 (en) * | 2009-09-16 | 2012-02-28 | 주식회사 제이미크론 | a Manufacturing Method of a Thin Layer Semiconductor Package |
| KR101104424B1 (en) * | 2009-10-30 | 2012-01-12 | 성균관대학교산학협력단 | Photoresist removal method, manufacturing method of zinc oxide type THC thin film comprising same and zinc oxide type THC thin film |
| KR20170070454A (en) | 2015-12-14 | 2017-06-22 | 주식회사 동진쎄미켐 | Method for fabricating metal interconnects using electroforming process and metal paste composition for use in the same |
| US10121990B2 (en) | 2016-04-28 | 2018-11-06 | Electronics And Telecommunications Research Institute | Organic light emitting devices and methods of fabricating the same |
| WO2020111767A1 (en) * | 2018-11-29 | 2020-06-04 | 삼원액트 주식회사 | Method for manufacturing fccl capable of controlling flexibility and stiffness of conductive pattern |
| KR20200065172A (en) * | 2018-11-29 | 2020-06-09 | 삼원액트 주식회사 | Method for producing FCCL capable of adjusting flexibility and stiffness of conduction pattern |
| US11665828B2 (en) | 2018-11-29 | 2023-05-30 | Samwon Act Co., Ltd. | Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern |
| KR102310015B1 (en) * | 2021-03-10 | 2021-10-08 | 주식회사 코젼트솔루션 | Electrode circuit for mobile antenna using metal mold and method for manufacturing the same |
| KR102490507B1 (en) * | 2022-09-29 | 2023-01-19 | 주식회사 루미디아 | Transparent glass display substrate manufacturiing method and transparent glass display substrate manufactured therefrom |
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