KR20060083871A - Chip-type electronic component characteristic inspection classification device - Google Patents

Abstract

The present invention provides a chip-type electronic component characteristic inspection and sorting apparatus for conveying a chip-shaped electronic component to a rotating disk or the like and inspecting and classifying the electrical characteristics thereof. The part which contacts the cross-sectional electrode 31 of the said chip type electronic component of the test contact of the apparatus which test | inspects the electrical characteristic of the chip type electronic component 30 which concerns on this invention, and classifies the chip type electronic component 30 according to the test result. The alloy is based on palladium, silver, platinum and gold. The shape of the portion in contact with the end face electrode of the chip-shaped electronic component is, for example, a brush shape in which a plurality of thin wires are bundled.

Chip Electronic Component, Sorting Device, Wire, Brush

Description

Apparatus for inspecting and sorting the characteristics of chip-type electronic part}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a disc-shaped rotor for conveying a chip-type electronic component used in an apparatus of a chip-type electronic component characteristic inspection classification apparatus according to the present invention.

FIG. 2 is a cross-sectional view of the device taken along the line A-A in FIG.

Fig. 3 is a contactor for inspection in which a brush-shaped wire brush in which a plurality of thin wires with a diameter of 0.2 mm are bonded to the tip of a brush mounting plate that is a conductive plate member used in the apparatus according to the present invention (Example 1 before bending) Top view of the.

It is a front view of Example 1 before the said bending process.

5 is a plan view of Embodiment 1 according to the present invention in which each wire is bent in the same direction and the same radius of curvature.

6 is a front view of Example 1 after the bending process.

7 is an explanatory diagram showing an operating state in the first embodiment of the inspection contact.

Fig. 8 is a front view showing the second embodiment of the inspection contact according to the present invention and its holding mechanism.

FIG. 9 is a cross-sectional view taken along the line B-B in FIG. 8 showing the second embodiment of the inspection contact and its holding mechanism. FIG.

10 is an explanatory diagram showing an operating state in Example 2 of the inspection contact.

Fig. 11 is a front view showing a third embodiment of the inspection contact according to the present invention and its holding mechanism.

FIG. 12 is a cross-sectional view taken from the arrow direction, taken along the line C-C in FIG. 11, showing Example 3 of the inspection contact and its retention mechanism. FIG.

It is an enlarged view which shows the roller which comprises the said inspection contact which is Example 3 in detail.

14 is an explanatory diagram showing an operating state of the third embodiment of the inspection contact;

Fig. 15 is a front view showing a fourth embodiment of an inspection contact according to the present invention and its holding mechanism;

Fig. 16 is an explanatory diagram showing an operating state in the fourth embodiment according to the present invention;

** Description of Major Reference Codes **

1,3: brush mounting plate 2,4: wire brush

10: rotor 11: through hole

12: boss 13: motor

14: base plate 20: reference base for the parts transport

21: Insulation bush 22: Lower electrode

30: chip type electronic component 31: single-sided electrode

40: main body case 41: connection pin

42: roller 43: shaft for rotation

44: rocking block 45: point pin

46: compression spring 47: connecting line

50: body case 51: spring probe

52: fixing nut 53: roller

54: roller holder 55: point pin

56: shaft 57: through hole for shaft

58: wire 60: spring probe holder

61: spring probe 62: compression spring

63: spring probe tip 64: bending plate spring

The present invention relates to an apparatus for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic components according to the inspection result. The present invention relates to a chip-type electronic component characteristic inspection and classification device having improved materials and shapes for inspection contacts.

Background Art Conventionally, various inspection contacts have been proposed in the apparatus for inspecting the electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component in accordance with the inspection result in order to contact the end face electrodes of the chip-shaped electronic component and inspect the electrical characteristics.

As the invention described in Japanese Patent Laid-Open No. 2000-501174, a cantilever plate spring contactor using a spring material such as beryllium copper is generally used. In addition, the inventions described in Japanese Patent Laid-Open No. 5-275202, Japanese Patent Laid-Open No. 6-20756, and Japanese Patent Laid-Open No. Hei 7-146332 propose the shape and material of the sliding motion contact point, and include silver, palladium, copper, and the like. An embodiment using an alloy containing is disclosed.

Conventionally, the plate spring type contactor of the cantilever which is generally used is a cross-sectional electrode of a chip-type electronic component which is continuously conveyed by an apparatus for inspecting the electrical characteristics of the chip-shaped electronic component and classifying the chip-type electronic component according to the inspection result. Touches with leaf spring contact.

If the contact pressure is unstable, there is a problem that the surface of the end face of the chip-shaped electronic component is scraped, and the traces remain, resulting in poor appearance.

In addition, spring materials such as beryllium copper, which are generally used as a cantilever plate spring contactor, have a chemical change such as plating of the end face electrode of a chip-shaped electronic component on the contactor surface or oxidation on the contactor surface. By this, the contact resistance between the end face of the chip-shaped electronic component and the surface of the contactor changes, which causes a problem that the measured value of the electrical characteristic inspection of the chip-shaped electronic component is unstable. In particular, in the chip-type electronic component characteristic inspection and sorting apparatus which conveys and inspects a chip-shaped electronic component using a rotating disk, the above-mentioned problem that a contact state of a component and a contactor changes easily tends to arise.

The object of the present invention is to solve the inherent problems of the apparatus for inspecting and classifying a plurality of chip-type electronic components, in particular by using a rotating disk and the like, so as not to leave a wound that is defective on the surface of the cross-sectional electrode of the chip-type electronic component. An object of the present invention is to provide a chip-type electronic component characteristic inspection and classification device having an inspection contact capable of inspecting electrical characteristics of a stable chip-type electronic component.

In order to solve the above problems, the invention as set forth in claim 1 according to the present invention is a device for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component according to the inspection result. The contactor is an alloy based on palladium, silver, platinum, and gold of a portion of the chip-shaped electronic component that contacts the cross-section electrode, and bundles a plurality of wires having a shape of the portion of the chip-shaped electronic component that contacts the cross-sectional electrode. It is made into a brush shape.

In the invention according to claim 2, in the chip-type electronic component characteristic inspection classification device according to claim 1, a plurality of the thin wires are bundled in parallel, and each wire is bent in the same direction and with the same curvature radius, so that the overall curved surface shape is generally bow-shaped. It is.

In the invention according to claim 3, an apparatus for inspecting the electrical characteristics of a chip-shaped electronic component and classifying the chip-shaped electronic components according to the inspection results, wherein the inspection contact for inspecting the electrical characteristics is a cross-sectional electrode of the chip-shaped electronic component. The roller is made of palladium, silver, platinum, and gold based alloys in contact with each other, and is capable of contact rotation with a rotating load having a small shape in contact with the end face electrode of the chip-shaped electronic component.

The invention according to claim 4 is an apparatus for inspecting the electrical characteristics of a chip-shaped electronic component and classifying the chip-shaped electronic components according to the inspection result, wherein the inspection contact for inspecting the electrical characteristics is a cross-sectional electrode of the chip-shaped electronic component. Palladium, silver, platinum, and gold-based alloys are used for the material in contact with each other, and the shape of the part in contact with the cross-sectional electrode of the chip-shaped electronic component is a thin wire. It is rolled up.

The invention according to claim 5 is an apparatus for inspecting the electrical characteristics of a chip-shaped electronic component and classifying the chip-shaped electronic components according to the inspection result, wherein the inspection contact for inspecting the electrical characteristics is a cross-sectional electrode of the chip-shaped electronic component. Palladium, silver, platinum, and gold-based alloys are used for the material in contact with each other, and the shape of the part in contact with the cross-sectional electrode of the chip-shaped electronic component is a shape in which the leaf spring is bent. And a spring pressure having a shape in which the leaf spring is bent than the spring pressure of the spring for the side pressure of the spring probe.

In the invention according to claim 6, the chip type electronic component characteristic inspection classification apparatus according to claim 1, 3, 4 or 5, wherein the inspection contact material is made of palladium in contact with the end face electrode of the chip electronic component. , Silver, platinum and gold-based alloys, further comprising copper and zinc, and their composition ratios are approximately palladium: silver: platinum: gold: copper and zinc = 35: 30: 10: 10: 15.

In addition, the present invention is the chip type electronic component characteristic inspection classification apparatus of claim 1, wherein the chip type electronic component can be configured to be detachably inserted into the hole provided in the rotor to be introduced into the contact position.

DESCRIPTION OF THE EMBODIMENTS An embodiment of an apparatus according to the present invention will now be described with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a disc-shaped rotor for conveying a chip-type electronic component used in an apparatus of a chip-type electronic component characteristic inspection classification apparatus according to the present invention. to be.

There is a disk-shaped rotor 10 for transferring chip electronic components. In the rotor 10, twenty-four through holes 11 are formed at positions in which the circle is divided into 24 on the same circle.

In the drawings, reference numerals a to x are attached to the positions of the through holes 11 to explain the functions.

At the position a in the through hole 11, the chip-shaped electronic components are supplied to the through holes 11 one by one by a supply means (not shown). The inspection contact of this invention is provided in each position of code | symbol h-n of the through-hole 11, and inspects the electrical characteristic of a chip-type electronic component. In addition, functional parts (not shown in the drawing) are provided at the positions o through w of the through holes 11 to classify the chip-shaped electronic components into designated storage boxes according to the inspection results of the electrical characteristics. The rotor 10 is fixed to the motor 13 via the boss 12. The motor 13 intermittently conveys the rotor 10 by one portion of the through hole 11 in accordance with a control command. The lower side of the rotor 10 is provided with a reference plate 20 for conveying parts fixed to the base plate (14). The chip-shaped electronic components that enter the through hole 11 of the rotor 10 are conveyed by the rotor 10 while sliding the surface of the component transport reference table 20. At the position h-n of the through-hole 11 of the component conveyance reference base 20, the lower electrode 22 (refer FIG. 7) for inspecting the electrical characteristics of a chip-type electronic component is used for insulation. It is installed through the bush 21.

(Example 1)

Embodiment 1 of the inspection contact corresponding to claims 1 and 2 of the present invention will be described with reference to FIGS. 3, 4, 5, 6, and 7. 3 is a plan view showing a state before bending of the inspection contact used in the apparatus according to the present invention, and FIG. 4 is a front view of the above.

5 is a plan view showing a state in which each wire is bent in the same radius of curvature, Figure 6 is a front view of the above. 7 is an explanatory diagram showing an operating state in the first embodiment of the inspection contact 1.

As shown in FIG. 3 and FIG. 4, the shape of the test | inspection contact part which contacts the cross-sectional electrode of a chip-shaped electronic component is a brush shape which bundled several thin wires, and is 0.2 diameter in the tip of the brush mounting plate 1 which is a conductive plate member. The brush-shaped wire brush 2 which bonded several thin wire of mm is joined. The end face electrode of the chip-shaped electronic component is brought into contact with the wire brush 2. 5 and 6 show a contactor for inspection in which the shape of the wire brush 2 of FIG. 3 is again made of a wire brush 4 having each wire bent in the same direction and the same radius of curvature and having a generally curved curved surface shape. The wire brush 4 is brought into contact with the end face electrode of the chip electronic component.

FIG. 7 shows a state in which the wire brush 4 is brought into contact with the end face electrode of the chip-shaped electronic component. The brush mounting plate 3 is installed at an inclined angle with respect to the surface of the rotor 10 to bring the R-shaped portion of the wire brush 4 into contact with the end face electrode 31 of the chip-shaped electronic component 30. The chip electronic component 30 is provided in the through-hole 11 of the rotor 10 in the vertical direction, and is conveyed from the right side to the left side by the rotor 10. The cross-sectional electrode of the chip-shaped electronic component 30 on the side of the component conveyance reference table 20 comes into contact with the lower electrode 22 provided on the component conveyance reference table 20 through the insulating bush 21. have. In this state, the brush mounting plate 3 and the lower electrode 22 are connected to a measuring instrument (not shown) to test the electrical characteristics of the chip-shaped electronic component 30.

Conventionally, in the cantilever plate spring type contactor which is generally used, the cross-sectional electrode of the chip-type electronic component which is continuously conveyed by the device which inspects the electrical characteristics of the chip-type electronic component and classifies the chip-type electronic component according to the inspection result is said. A trace of rubbing remained on the entire cross-section of the cross-sectional electrode of the chip-shaped electronic component by touching while touching the leaf spring contactor. In the wire brush 2 and the wire brush 4 of this embodiment, each one of the wire brushes moves independently. Therefore, it is possible to obtain the effect that only traces of several wires remain in the high portion of the cross section of the cross-sectional electrode of the chip type electronic component. Further, by making the material of the wire brush 2 and the wire brush 4 an alloy based on palladium, silver, platinum and gold, it is more preferable not to leave traces of appearance defects on the surface of the cross-sectional electrode of the chip type electronic component. The effect can be obtained. Furthermore, by using the alloy, plating of the cross-section electrode of the chip-shaped electronic component hardly adheres to the contact surfaces of the wire brush 2 and the wire brush 4, and hardly causes chemical changes such as oxidation on the contact surface. Therefore, the effect that the electrical characteristics of the stable chip type electronic component can be inspected can be obtained. The palladium, silver, platinum and gold based alloys of the wire brush 2 and the wire brush 4 are composed of 35% palladium, 30% silver, 10% platinum, 10% gold, and other copper and zinc. It is preferable to make it into 15%.

As shown in FIG. 7, the chip-shaped electronic component 30 is fitted into the through hole 11 of the rotor 10 for the convenience of detachment, and the position at the inspection position is also slightly inconsistent.

By making the width of the wire brush correspond to the width of the chip-shaped electronic component 30 in the traveling direction (right to left in FIG. 7), reliable contact can be maintained even if one is shifted.

In addition, this shape does not damage the surface of the chip-shaped electronic component 30. Although the shape of the contact electrode is slightly different in the following examples, the same contact can be expected.

(Example 2)

Embodiment 2 defined by Claim 3 of the present invention will be described with reference to FIGS. 8, 9 and 10. Fig. 8 is a front view showing Embodiment 2 of an inspection contact according to the present invention and its retaining mechanism, and Fig. 9 is a sectional view taken along the line BB of Fig. 8 showing Embodiment 2 of the inspection contact and its retaining mechanism from the direction of the arrow. 10 is an explanatory diagram showing an operating state of the inspection contact.

As shown in FIG. 9, the shape of the inspection contact which contacts the cross-sectional electrode of a chip-shaped electronic component is the cylindrical roller 42. As shown in FIG.

The rotating shaft 43 is inserted in the center part of the roller 42, and the roller 42 is made to rotate by light rotational force by making the rotating shaft 43 into a rotating shaft. Moreover, the roller 42 is provided in the rocking block 44 through the rotating shaft 43, and the rocking block 44 is the main body case 40 of insulating material through the point pin 45 used as a rocking point. Assembled in The swing block 44 has a structure capable of swinging motion with a return force by the compression spring 46 with the point pin 45 as the point. In addition, both ends of the contact line 47 made of a soft material which does not inhibit the rocking motion are soldered to the rocking block 44 and the connecting pin 41 and electrically connected to each other. It is a structure which makes an electrode contact.

10 shows a state in which the end face electrode of the chip-shaped electronic component 30 is brought into contact with the roller 42. The main body case 40 is provided so that the roller 42 may contact the end face electrode 31 of the chip type electronic component 30 by a holder (not shown). The chip electronic component 30 is provided in the through-hole 11 of the rotor 10 in the longitudinal direction, and is conveyed from the left to the right side of the drawing by the rotor 10. The cross-sectional electrode of the chip-shaped electronic component 30 on the side of the component conveyance base 20 is in contact with the lower electrode 22 provided on the component conveyance base 20 through the insulating bush 21. . In this state, the connecting pin 41 and the lower electrode 22 are connected to a measuring instrument (not shown) to test the electrical characteristics of the chip type electronic component 30.

Conventionally, in the cantilever plate spring type contactor which is generally used, the cross-sectional electrode of the chip-shaped electronic component which is continuously conveyed by the device which inspects the electrical characteristics of the chip-shaped electronic component and classifies the chip-shaped electronic component according to the inspection result is the plate. It touches while touching the spring-type contact, leaving traces of the cross-section of the cross-sectional electrode of the chip-shaped electronic component. In this embodiment, since the roller 42 can rotate with very little rotational force, the cross-section of the chip-shaped electronic component Rolling contact with the end face of the electrode. Therefore, the surface of the cross-sectional electrode of the chip-shaped electronic component is made by leaving the traces on the cross-section of the cross-sectional electrode of the chip-shaped electronic component and making the material of the roller 42 an alloy based on palladium, silver, platinum and gold. It is possible to obtain a better effect of not leaving a trace of becoming defective. Further, by using the alloy, since the plating of the cross-sectional electrode of the chip-shaped electronic component hardly adheres to the contact surface of the roller 42, and the chemical change such as oxidation hardly occurs on the contact surface, the stable chip-shaped electronic component There is an effect that the electrical characteristics can be inspected.

Palladium, silver, platinum and gold-based alloys of the material of the roller 42 are preferably palladium 35%, silver 30%, platinum 10%, gold 10%, and other copper and zinc 15%. Do.

(Example 3)

A third embodiment corresponding to claim 4 of the present invention will be described with reference to FIGS. 11, 12, 13, and 14. 11 is a front view showing a third embodiment of the inspection contact according to the present invention and its retaining mechanism, FIG. 12 is a sectional view taken along line CC of FIG. 11 showing a third embodiment of the inspection contact and its retaining mechanism; It is an enlarged view which shows the detail of the roller which comprises the said inspection contact which is Example 3. As shown in Fig. 13, the surface of the inspection contact in contact with the end face electrode of the chip-shaped electronic component is a thin wire, and the thin wire 58 is wound in close contact with the outer circumference of the roller 53 of insulating material. The roller 53 has a cylindrical shape, and a thin wire 58 having a diameter of 0.2 mm is wound around the outer circumference of the roller 53 so that the end face electrode of the chip-shaped electronic component contacts the surface of the wire 58. It is. As shown in FIG. 12, the shaft 56 is inserted in the center part of the roller 53, and the roller 53 is being fixed to the shaft 56 half, and is rotatable by giving strong rotational force. . In addition, the roller 53 is provided in the roller holder 54 through the shaft 56, the roller holder 54 is capable of oscillating movement by the point pin 55 as a point, the roller holder 54 Is assembled to the main body case 50 made of an insulating material through a point pin 55 serving as a swinging point. In addition, a commercially available spring probe 51 is attached to the main body case 50 by a fixing nut 52, and a tip of the spring probe 51 is wound around the outer circumference of the roller 53. The spring probe 51 is in contact with the compressed state of about 1-2mm. Therefore, the spring pressure compressed by the spring probe 51 acts as a return force of the rocking motion described above.

FIG. 14 shows a state where the end face electrode of the chip-shaped electronic component is in contact with the surface of the wire 58 wound around the outer circumference of the roller 53. The main body case 50 not shown in the drawing is provided so that the surface of the wire 58 wound around the outer circumference of the roller 53 is brought into contact with the end face electrode 31 of the chip-shaped electronic component 30 by a holder (not shown). have. The chip electronic component 30 is provided in the through-hole 11 of the rotor 10 in the longitudinal direction, and is conveyed from the inside of the drawing to the front by the rotor 10. When the chip-shaped electronic component 30 is conveyed by the rotor 10, the roller 53 is semi-fixed to the shaft 56, so that the chip-shaped electronic component 30 is rotatable by receiving a strong rotational force. The roller 53 pushes the roller 53 in contact with each other while rubbing the surface of the wire 58 without rotating.

The cross-sectional electrode of the chip-shaped electronic component 30 on the side of the component conveyance reference table 20 comes into contact with the lower electrode 22 provided on the component conveyance reference table 20 through the insulating bush 21. have. In this state, the spring probe 51 and the lower electrode 22 are connected to a measuring instrument (not shown) to test the electrical characteristics of the chip-shaped electronic component 30.

Conventionally, in the cantilever plate spring type contactor which is generally used, the cross-sectional electrode of the chip-type electronic component which is continuously conveyed by the device which inspects the electrical characteristics of the chip-type electronic component and classifies the chip-type electronic component according to the inspection result is said. In the present embodiment, a thin wire 58 having a diameter of 0.2 mm wound around the outer periphery of the roller 53 is formed in the chip-shaped electronic component. It is possible to obtain the effect of leaving only traces of a few wires in the high portion of the cross-section of the cross-section electrode of the component. Further, when the material of the wire 58 is an alloy based on palladium, silver, platinum and gold, a better effect can be obtained without leaving traces of appearance defects on the surface of the cross-sectional electrodes of the chip-type electronic component. . Further, by using the alloy, since the plating of the cross-sectional electrodes of the chip electronic component hardly adheres to the contact surface of the wire 58, and chemical changes such as oxidation hardly occur on the contact surface, the stable chip electronic component The effect of being able to inspect the electrical characteristics can be obtained. The palladium, silver, platinum and gold based alloys of the wire 58 are composed of palladium 35%, silver 30%, platinum 10%, gold 10%, and other copper and zinc 15%. desirable.

In addition, in the present embodiment, since the roller 53 is semi-fixed to the shaft 56 so as to be able to rotate by applying a strong rotational force, the roller 53 is not rotated by the chip-shaped electronic component 30 but the wire is rotated. The roller 53 is pushed in contact with each other while rubbing the surface of the 58. Therefore, when the conductive failure occurs at the position where the wire 58 is in contact with the chip-shaped electronic component 30, a strong rotational force is applied to the roller 53 by hand, and the chip-shaped electronic component 30 is contacted at the new position. You can do that. By doing this in several places, there is an effect that long life can be realized.

(Example 4)

A fourth embodiment corresponding to claim 5 of the present invention will be described with reference to FIGS. 15 and 16. Fig. 15 is a front view showing the fourth embodiment of the inspection contact according to the present invention and its holding mechanism, and Fig. 16 is an explanatory view showing the operating state of the fourth embodiment.

As shown in Fig. 15, the shape of the inspection contact in contact with the end face electrode of the chip-shaped electronic component has a shape in which a leaf spring is bent. The commercially available spring probe 61 is pushed into the spring probe holder 60 and pushed in. In addition, a bending plate spring 64 having a shape in which a leaf spring is bent is soldered to the tip of the spring probe 61, and the spring pressure of the bending plate spring 64 is a compression spring for side pressure that is used for the spring probe 61. It is set weaker than the spring pressure of (62). As the material of the bending plate spring 64, an alloy based on palladium, silver, platinum and gold is used.

FIG. 16 shows a state where the end face electrode of the chip-shaped electronic component is in contact with the bending plate spring 64. The bending plate spring 64 is provided in contact with the end face electrode 31 of the chip-shaped electronic component 30 by the spring probe holder 60 which is not shown in the figure. The chip type electronic component 30 is provided in the through-hole 11 of the rotor 10 in the longitudinal direction, and is conveyed from the left to the right direction by the rotor 10. When the chip-shaped electronic component 30 is conveyed by the rotor 10, the chip-shaped electronic component 30 pushes the bending plate spring 64 while touching the surface of the bending plate spring 64. The cross-sectional electrode of the chip-shaped electronic component 30 on the side of the component conveyance base 20 is in contact with the lower electrode 22 provided on the component conveyance base 20 through the insulating bush 21. . In this state, the spring probe 61 and the lower electrode 22 are connected to a measuring instrument (not shown) to test the electrical characteristics of the chip type electronic component 30.

Conventionally, in the cantilever plate spring contactor which is generally used, the cross-sectional electrode of the chip-type electronic component which is continuously conveyed by the device which inspects the electrical characteristics of the chip-type electronic component and classifies the chip-type electronic component according to the inspection result is said. By touching while touching the plate spring type contactor, the trace of rubbing is left over the entire cross-section of the cross-sectional electrode of the chip-shaped electronic component. In this embodiment, the bending plate spring 64 is made of palladium, silver, platinum and gold. By doing so, it is possible to obtain a better effect of not leaving a trace of appearance defect on the surface of the cross-sectional electrode of the chip type electronic component. In addition, since the plating of the cross-section electrode of the chip-shaped electronic component hardly adheres to the contact surface of the bent plate spring 64, and the chemical change such as oxidation hardly occurs on the contact surface by using the alloy, the stable chip type The effect of inspecting the electrical characteristics of the electronic component can be obtained. The composition of the palladium, silver, platinum and gold-based alloys of the bending plate spring 64 is 35% palladium, 30% silver, 10% platinum, 10% gold, and 15% other copper and zinc. It is preferable.

The chip-type electronic component characteristic inspection classification device according to the present invention can be widely used in the field of inspection device manufacturing and electronic component inspection and sorting such as ceramic capacitors.

According to the present invention, the material and the shape of the inspection contact for inspecting the electrical characteristics by contacting the end face electrode of the chip-shaped electronic component are constituted as described above, so that the surface of the end face electrode of the chip-shaped electronic component becomes poor in appearance. There can be provided a chip-type electronic component characteristic inspection and classification device having an inspection contact which has no effect and can inspect the electrical characteristics of a stable chip-shaped electronic component.

Claims (6)

An apparatus for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component according to the inspection result, Inspection contact for inspecting the electrical characteristics, The material of the portion in contact with the cross-sectional electrode of the chip-shaped electronic component is an alloy based on palladium, silver, platinum and gold, The shape of the portion of the chip-shaped electronic component in contact with the cross-sectional electrode is characterized in that the chip-shaped electronic component characteristics inspection classification device characterized in that a plurality of thin wires. The method of claim 1, The thin wires are bundled in parallel, A chip-type electronic component characteristic inspection and sorting device in which each wire is bent in the same curvature radius in the same direction and has a generally curved curved surface shape. An apparatus for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component according to the inspection result, Inspection contact for inspecting the electrical characteristics, The material of the portion in contact with the cross-sectional electrode of the chip-shaped electronic component is an alloy based on palladium, silver, platinum and gold, And a roller capable of contact rotation with a rotating load having a small shape of a portion in contact with the end face electrode of the chip electronic component. An apparatus for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component according to the inspection result, Inspection contact for inspecting the electrical characteristics, The material of the portion in contact with the cross-sectional electrode of the chip-shaped electronic component is an alloy based on palladium, silver, platinum and gold, And a thin wire having a shape in contact with a cross-sectional electrode of the chip-shaped electronic component, wherein the thin wire is wound around the outer circumference of an insulating material roller. An apparatus for inspecting electrical characteristics of a chip-type electronic component and classifying the chip-type electronic component according to the inspection result, Inspection contact for inspecting the electrical characteristics, The material of the portion in contact with the cross-sectional electrode of the chip-shaped electronic component is an alloy based on palladium, silver, platinum and gold, The shape of the portion in contact with the cross-sectional electrode of the chip-shaped electronic component is the shape of the plate spring bent, A chip-shaped electronic component characteristic test comprising joining the leaf spring to the tip of a spring probe and connecting the leaf spring to the tip of the spring probe so that the spring pressure of the leaf spring is bent than the spring pressure of the spring for the side pressure of the spring probe. Sorting device. The method according to claim 1, 3, 4, or 5, The contactor for inspection further includes copper and zinc in an alloy based on palladium, silver, platinum, and gold in a portion of the chip-shaped electronic component in contact with the end face electrode. A chip-type electronic component characteristic inspection sorting apparatus having a composition ratio of approximately palladium: silver: platinum: gold: copper and zinc = 35: 30: 10: 10: 15.

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