KR20060066211A - Laser beam processing equipment - Google Patents

Abstract

The present invention can be equipped with a plurality of sheets of work to be processed at the same time, and relates to a compact laser beam processing apparatus even when the number of worksheets is increased. The laser beam processing apparatus may allow a workpiece to be mounted on a bed of the laser beam processing unit and move the X and Y axes in an XY table, and apply the laser light onto the above-described workpiece to perform drilling or cutting. There is provided a laser beam processing apparatus comprising a gate-shaped over-frame having an irradiated laser irradiation optical system, wherein the laser irradiation optical system described above is supported to be movable in the Z-axis direction, The bed is cut at the left and right front parts to make installation parts for the leg portions of the gate-shaped over-frame left rear part, the work supply unit and the work discharge units arranged to be inserted into the left and right front cuts described above. It is characterized by.

Description

Laser Beam Processing Equipment {LASER BEAM MACHINING APPARATUS}

1 is a schematic plan view showing a state where the supply unit B and the discharge unit C are arranged to be inserted into the laser beam processing unit A;

2 is a plan view showing a state where the supply unit B and the discharge unit C are arranged to be inserted into the laser beam processing unit A;

3 is a front view showing a state where the supply unit B and the discharge unit C are arranged to be inserted into the laser beam processing unit A;

4 is a side view showing a state where the supply unit B and the discharge unit C are arranged to be inserted into the laser beam processing unit A;

FIG. 5 is a schematic perspective view showing an arrangement relationship of each component constituting the laser beam processing unit A; FIG.

6 is a schematic plan view showing a state where the supply unit B and the discharge unit C are disposed in the conventional laser beam processing unit A; And

Fig. 7 is a schematic perspective view showing the arrangement relationship of each component constituting the conventional laser beam processing unit A. Figs.

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to laser beam processing apparatus, and more particularly, to laser blind holes using a laser to connect a copper foil layer on the surface of a multilayer printed substrate with an inner copper foil layer. A beam processing apparatus.

6 shows an example of a laser beam processing apparatus for treating blind holes using a laser to connect a copper foil layer on the surface of a multilayer printed substrate with an inner copper foil layer, which is also manufactured and sold by the present application. The plan and outline dimensions of the laser beam processing apparatus are also shown. In Fig. 6, A is a laser beam processing unit, B is a work feed unit, C is a work discharge unit, in the drawing the laser beam processing unit (A), the work supply unit (B) and Each of the work discharge units C is rectangular and is disposed adjacent to each other.

7 shows an example of the internal structure of a conventional laser beam processing apparatus for processing blind holes using a laser to connect a copper foil layer on the surface of a multilayer printed substrate with an inner copper foil layer, in the direction of arrow Y The XY table, which consists of a movable Y table 2 and an X table 3 mounted on the Y table 2 and movable in the direction of the arrow X, has a bed 1 for supporting the work 4. Is supported on. In addition, a laser oscillator 6 is mounted on a column 5 provided vertically on the bed 1 to straddle the moving area of the XY table, and the processing head 7 ) Is also supported by the column 5 in order to be able to move in the direction of arrow Z.

The above-described processing head 7 condenses the laser beam on the upper cylindrical body movable in the direction of arrow Z and the lower cylindrical body supported by the upper cylindrical body, the workpiece 4 supported by the upper cylindrical body. And a window lens for protecting the condenser lens supported by the lower cylindrical body. The workpiece 4 with pre-formed laser irradiation window holes is fixed on the X table 3 and positioned at a predetermined position through the operation of servo motors. . Pulsed laser beams are then emitted from the laser oscillator 6 so as to be condensed by the condenser lens on the window hole of the work 4, so that the processing of the blind holes can be performed. Another similar technique is disclosed in JP-A-2003-136274.

In such a laser beam processing apparatus, as the exemplary embodiment of FIG. 6 of JP-A-07-32183, an XY table is provided that allows two sheets of workpieces to be mounted thereon.

In addition to the laser beam processing apparatus, a processing apparatus capable of processing blind holes using a drill and allowing various workpieces to be mounted is disclosed in JP-A-62-297042.

In such a laser beam processing apparatus, as described above, the configuration of the processing unit body is usually formed into a rectangle in the plane of the XY table, regardless of one or two sheets of work mounted on the processing unit. On the other hand, in this type of laser beam processing apparatus, it is conceivable to preferentially expand the work substrate in order to improve productivity, but simply expanding the size of the work substrate is preferred to increase the size of the entire device. no. Thus, it is contemplated that a plurality of optical systems may be provided in order to allow a plurality of sheets of work to be mounted and to be processed simultaneously. However, any of the modifications described above will increase the size of the processing unit.

Accordingly, it is an object of the present invention to provide a laser beam processing apparatus capable of simultaneously processing a plurality of sheets to be mounted, and also to provide a compact laser that does not simply expand the processing apparatus in response to an increase in the number of sheets of the workpiece. It is to provide a beam processing apparatus.

According to the present invention, an XY table capable of allowing a workpiece to be mounted on a bed of a laser beam processing unit and movable in X and Y axis directions; And a gate-shaped over-frame having a laser irradiation optical system for irradiating laser light onto the above-described workpiece to perform drilling or cutting. The above-mentioned laser irradiation optical system is supported to be movable in the Z-axis direction, and the bed of the laser beam processing unit is cut at the left and right front portions so that the leg part of the left back side of the gate-shaped over-frame To make installation parts for the work piece, wherein the work supply unit and the work discharge unit are arranged to be inserted into the left and right front cutouts described above.

According to the present invention, there is also provided a laser beam processing unit, wherein the workpiece mounted on the XY table is a work of two sheets, and the laser irradiation optical system is arranged in pairs to correspond to the work of the two sheets described above. It is done.

The bed of the laser beam machining unit according to the invention is cut at the left and right front parts to make installation parts for the leg parts behind the gate-shaped over-frame left back, the work supply unit and the work discharge unit Is arranged to be inserted into the left and right frontal cuts described above, as a result of which the width of the laser beam processing apparatus can be reduced, allowing the entire apparatus to be reduced.

Further, in the above laser beam processing apparatus, according to the present invention, the workpiece mounted on the XY table is a work of two sheets, and the laser irradiation optical system is arranged in pairs so as to correspond to the work of the two sheets described above, The bed of the laser beam processing unit is cut at the left and right front parts to make installation parts for the leg portions of the gate-shaped over-frame left back side, and the work supply unit and the work discharge unit are the left and right front described above. It is arranged to be inserted into the cuts, as a result of which the width of the laser beam processing apparatus can be reduced to achieve a reduction in the overall apparatus while increasing the production efficiency.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments of the invention taken in conjunction with the accompanying drawings.

In the following, an exemplary embodiment as a best mode for carrying out the present invention will be described with reference to the accompanying drawings. Of course, it is obvious that the present invention can be readily applied to numerous other forms than those described through the method of exemplary embodiments, without departing from the spirit and scope of the present invention.

1 to 4 are views showing a state where the supply unit B and the discharge unit C are arranged to be inserted into the laser beam processing unit A, which is an external view of a device substantially developed by the present inventors. .

FIG. 5 is a schematic perspective view showing an arrangement relationship of each component constituting the laser beam processing unit, and a linear guide for guiding the cross-table 11 to move freely in the Y-axis direction. A guide is disposed on the top surface of the bed 10 of the laser beam processing unit A. On the top surface of the cross-table 11, a linear guide for guiding the table 12 to move freely in the X-axis direction is disposed. The table 12 and the cross-table 11 are each driven by servo motors (not shown). The two sheets of work 13, 14 are fixed on the top surface of the table 12 by clamping devices.

The gate-shaped over-frame 15 is installed vertically on the bed 10. On the upper side of the over-frame 15, a pair of laser heads (only Fθ lenses 16, 17 are shown in the drawing) are directed toward the two workpieces 13, 14. 19) is movably supported in the vertical direction. Between the laser oscillator 20 and the laser heads (Fθ lenses 16, 17), an optical system is arranged for converging and irradiating the laser beam emitted from the laser oscillator 20 on the workpieces. The optical system devices are disposed on an optical path plate 21.

The conveying unit of the supply unit B and the discharge unit C includes an object suction device (not shown) for conveying the workpiece to the laser beam processing unit A similarly to the conventional apparatus.

As for the size of the laser beam processing unit A, which is an exemplary embodiment of the present invention, as is apparent from FIG. 1, two sheets of work each having a width of about 600 mm are lined up, respectively. In spite of the fact that it can be made to be processed, an overall device size of 4000 mm has been achieved, including the size of the supply unit B and the discharge unit C.

As is apparent from FIGS. 1 and 2, this means that the bed 10 of the laser beam processing unit A has a left and a right front side to make mounting portions for the leg portions of the left back side of the gate-shaped over-frame 15. This is because the workpiece supply unit B and the workpiece discharge unit C are arranged to be inserted into the left and right front cutouts described above. The gate-shaped over-frame 15 supports the laser optical system required for laser beam machining, and since the laser optical system must be structurally and rigidly configured to ensure high precision machining, the leg portion of the over-frame They cannot be made thin. Therefore, the left and right front portions are cut to make mounting portions for the leg portions behind the left side of the gate-shaped over-frame 15, so that reduction of the overall apparatus can be achieved.

In the case where the work substrates are the same size and productivity is assumed to be 100 when one work substrate is processed by one galvano meter optical system, one work substrate is formed by two galvanometer scanning optical systems. Productivity in the case of processing a board | substrate becomes 140-160, and productivity in the case of processing two work board | substrates each with one galvanometer optical system becomes 200. FIG.

On the other hand, when the present invention is applied, the area occupied by the device of the galvanometer scanning system, even the device for processing two work substrates, is only 2% to the conventional apparatus for processing one work substrate. By only increasing by 5%, it is possible to realize a laser beam processing apparatus having a small size and high productivity.

While those skilled in the art have made the foregoing detailed description only with respect to the embodiments of the present invention, the present invention is not limited thereto, and various modifications and changes without departing from the spirit of the present invention and the appended claims. It should be further understood that examples are possible.

According to the present invention, there is provided a laser beam processing apparatus which can be processed simultaneously while allowing a plurality of sheets to be mounted, and also compact laser beam processing that does not simply expand the processing apparatus in response to an increase in the number of sheets of the workpiece. A device can be provided.

Claims (2)

In the laser beam processing apparatus, An XY table capable of allowing the workpiece to be mounted on a bed of the laser beam processing unit, the XY table being movable in the X and Y axis directions; And A gate-shaped over-frame with a laser irradiation optical system for irradiating laser beams onto said workpiece to perform drilling or cutting, The laser irradiation optical system is supported to be movable in the Z-axis direction, and the bed of the laser beam processing unit is cut at the left and right front portions to make installation portions for the leg portions behind the gate-shaped over-frame left rear. And the work supply unit and the work discharge unit are arranged to be inserted into the left and right front cuts. The method of claim 1, And said work mounted on said XY table is a work of two sheets, and said laser irradiation optical system is arranged in pairs so as to correspond to the work of said two sheets.

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