KR20060048322A - Small Lot Size Lithography Bay - Google Patents

Abstract

In a first aspect, a small lot size lithography bay is provided. Small lot size lithography bays include (1) multiple lithography bays; And (2) a small lot size transfer system for transferring the small lot size substrate carrier to the lithography tool. Each small lot size substrate carrier holds less than 13 substrates. Various other aspects are provided.

Description

SMALL LOT SIZE LITHOGRAPHY BAYS}

1 is an exemplary graph of semiconductor device manufacturing facility (FAB) cycle time or WIP vs. facility output for large and small lot size substrate carriers.

2 is a schematic representation of an exemplary small lot size (SLS) semiconductor device manufacturing facility provided in accordance with the present invention.

3 is a top plan view of an exemplary small lot sized lithographic bay provided in accordance with the present invention.

4 is a flow chart of an example method of operating the small lot size lithographic bay of FIG.

Brief description of the main symbols in the drawings

300: lithography bay 302: wet cleaning processing tool

304: dry strip processing tool 306-312: measurement and inspection tool

314-328: Patterning Tool

This application claims the priority of US Provisional Patent Application No. 60 / 578,792, filed June 10, 2004. This application is also a CIP claiming priority of US patent application Ser. No. 10 / 764,620, filed January 26, 2004, which claims priority of US provisional application No. 60 / 443,001, filed January 27, 2003. The contents of each of the above applications are referenced herein.

This application is related to the following co-transferred, co-pending US patent applications referred to herein:

US Patent Application No. 10 / 650,310, filed August 28, 2003, entitled "System For Transporting Substrate Carriers" (Attorney Docket No. 6900);

US Patent Application No. 10 / 650,312 filed August 28, 2003, entitled "Method and Apparatus for Using Substrate Carrier Movement to Actuate Substrate Carrier Door opening / Closing" (Attorney Docket No. 6976);

US Patent Application No. 10 / 650,481 filed August 28, 2003, entitled "Method and Apparatus for Unloading Substrate Carriers from Substrate Carrier Transport Systems" (Attorney Docket No. 7024);

US Patent Application No. 10 / 650,479 filed August 28, 2003, entitled "Method and Apparatus for Supplying Substrates to a Processing Tool" (Attorney Docket No. 7096);

US Patent Application No. 60 / 407,452, filed August 31, 2002, entitled "End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations" (Attorney Docket No. 7097 / L);

US Patent Application No. 60 / 407,337, filed August 31, 2002, entitled "Wafer Loading Station with Docking Grippers at Docking Stations" (Attorney Docket No. 7099 / L);

US Patent Application No. 10 / 650,311, filed August 28, 2003, entitled "Substrate Carrier Door Having Door Latching and Substrate Clamping Mechanism" (Attorney Docket No.7156);

US Patent Application No. 10 / 650,480, filed August 28, 2003, entitled "Substrate Carrier Handler That Unloads Substrate Carriers Directly From a Moving Conveyor" (Attorney Docket No.7676);

US Patent Application No. 10 / 764,982, filed Jan. 26, 2004, entitled "Methods and Apparatus for Transporting Substrate Carriers" (Attorney Docket No.7163);

US Patent Application No. 10 / 764,820, filed Jan. 26, 2004, entitled "Overhead Transfer Flange and Support for Suspending Substrate Carrier" (Attorney Docket No.8092);

US Provisional Patent Application No. 60 / 443,115, filed Jan. 27, 2003, entitled "Apparatus and Method for Storing and Loading Wafer Carriers" (Attorney Docket No.8202);

US Patent Application No. 10 / 987,956, filed November 12, 2004, entitled "Calibration of High Speed Loader to Substrate Transport System" (Attorney Docket No.8158); And

US Provisional Patent Application No. 60 / 520,035, filed November 13, 2003, entitled "Apparatus and Method for Transporting Substrate Carriers Between Conveyors" (Attorney Docket No.8195 / L).

FIELD OF THE INVENTION The present invention relates to semiconductor device manufacturing systems, and more particularly to small lot size lithographic bays.

Semiconductor device fabrication typically involves performing sequential steps on substrates such as silicon substrates, glass plates, and the like. These steps include polishing, deposition, etching, photolithography, heat treatment, and the like. Typically, multiple different processing steps may be performed in a single processing system or in a "tool" that includes multiple processing chambers. However, it is common for other processes to need to be performed at different processing locations in a manufacturing facility such that the substrate needs to be transferred from one processing location to another processing location within the manufacturing facility. Depending on the type of semiconductor device being manufactured, a relatively large number of processing steps may be required to be performed at many different processing locations within the manufacturing facility.

It is common to transfer substrates from one processing location to another within a substrate carrier, such as a sealed pod, cassette, container, or the like. In addition, automated substrates, such as automated guided vehicles, overhead delivery systems, substrate carrier holding robots, or the like, for transferring substrate carriers relative to substrate carrier delivery devices or for moving substrate carriers from one location to another within a manufacturing facility. It is common to use carrier transfer robots.

For individual substrates, the entire manufacturing process from forming or receiving pure substrates to cutting semiconductor devices from finished substrates requires elapsed time, measured weekly or monthly. In a typical manufacturing facility, multiple substrates may be provided at any given time as "Work in Progress" (WIP). Substrate provision in a manufacturing facility as a WIP represents a significant investment of operating capital, which increases with the cost of manufacturing the substrate.

When the manufacturing facility is fully operational, reduced WIP reduces capital and manufacturing costs. For example, WIP reduction can be achieved by reducing the average total elapsed time for processing each substrate in the manufacturing facility.

The US patent application Ser. No. 10 / 650,310, filed Aug. 28, 2003, entitled "System for Transporting Semiconductor Substrate Carriers", delivers a substrate carrier comprising a conveyor for a continuously moving substrate carrier while the manufacturing facility is in operation. Start the system. Continuously moving conveyors facilitate the transfer of substrates within a manufacturing facility to reduce the overall "dwell" or "cycle" time of each substrate in the manufacturing facility. WIP reduction can be achieved as less WIP is required to produce the same factory output.

In one aspect of the invention, (1) storing substrates in a plurality of small lot-sized substrate carriers, each having less than 13 substrates; And (2) delivering at least one small lot sized substrate carrier into the lithographic bay of the semiconductor device manufacturing facility.

In a second aspect of the invention, a small lot sized lithographic bay is provided. Small lot size lithography bays include (1) a number of lithography tools; And (2) a small lot size transfer system for delivering a small lot size substrate carrier to the lithography tool. Each small lot size substrate carrier holds less than 13 substrates. Various other aspects are provided.

Other features and aspects of the present invention will become more apparent from the following detailed description, the appended claims, and the accompanying drawings.

The present invention relates to reducing cycle time in semiconductor device manufacturing facilities, such as lithographic portions (bays) of semiconductor device manufacturing facilities. Cycle time is reduced by using a lot size reduction and / or high speed delivery system to transfer small lot size substrate carriers between the processing, metrology and / or inspection tools of the lithographic bay.

As used herein, a "small lot" size substrate carrier is typically considered to be a substrate carrier having a significantly smaller number of substrates than a conventional "big lot" size substrate carrier having 13 or 25 substrates. do. In one embodiment, for example, the small lot size substrate carrier holds less than five substrates. Other small lot size substrate carriers may be used (eg, one, two, three, four, five, six, seven or more substrates but substrate carriers having fewer substrates than large lot size substrate carriers may be used. Can be). For example, in one embodiment, each small lot size substrate carrier may hold a very small substrate for human delivery of the substrate carrier for use within a semiconductor device manufacturing facility.

Cycle time reduction

In a conventional semiconductor device manufacturing facility, a substrate is typically delivered to a substrate carrier having 25 substrates per carrier. In this case, the manufacturing facility uses lot sizes of 25 substrates.

The cycle time CT for processing the substrate lot can be detected using the following equation:

CT = lot processing time + delivery time + tool wait time

Lot processing time (LPT) is the time required to process each substrate in a lot (eg, 25 substrates for a standard lot size). Lot processing time, eg, the time required to transfer each substrate from the substrate carrier to the processing chamber of the processing tool, includes the time to process the substrate and return the substrate to the substrate carrier. The transfer time TT is regarded as the time required to transfer the lot from one processing tool to another processing tool (e.g., the time between when the substrate carrier is closed in the first tool and opened in the second tool). do.

Tool wait time (TWT) is considered as the time the lot should wait in the processing tool before the substrate in the lot is processed in the tool. Assuming each lot is processed immediately after reaching each processing tool, the tool wait time is zero and the minimum cycle time (CTMIN) is

CTMIN = lot processing time + delivery time.

It can be seen from the above equation that during a fixed transfer time, the cycle time increases with the lot size (because in general each substrate in the lot has to be replaced by all other substrates in the lot before the lot is transferred to the new processing tool). Because you have to wait for it to be processed). Thus, by using a small lot size (eg, a substrate carrier with a few substrates), the cycle time can be reduced unless the transfer time is greatly increased. By using a lot size of one substrate (eg, a substrate carrier with only one substrate carrier) without increasing the transfer time, the cycle time can be minimized and transferred to a new processing tool for the next processing step. This is because the instrument board does not wait for another substrate to be processed before.

For example, assuming 130 nanometer logic, the processing time is 2 days and the transfer time is 2 days. Also, assuming for this example, for a 25 substrate lot size, the time for each substrate to wait for another substrate in the lot to process is 10 days. The minimum cycle time for 25 substrate lots (CTMIN25) is

CTMIN25 = Processing Time + Lot Wait Time + Delivery Time

= 2 days + 10 days + 2 days

       = 14 days.

However, assuming a single substrate lot size is used and the transfer time is fixed, the minimum cycle time (CTMIN1) for one substrate is

CTMIN25 = Processing Time + Lot Wait Time + Delivery Time

= 2 days + 0 days + 2 days

       = 4 days.

Thus, by using a single substrate lot size, the minimum cycle time is reduced by 73%.

From the cycle time relationship, the use of a single substrate carrier has been shown to be desirable. However, the use of more than one substrate lot size may be desirable for other issues such as providing sufficient storage in each processing tool, scheduling lot, processing control strategy, and the like. For example, it may be desirable to use small lot sizes with two, three, four, five, six, or more substrates. Note that the use of such small lot sizes provides a significant reduction in cycle time compared to conventional large lot sizes.

Cycle time and its influence on manufacturing facilities are described below with reference to FIGS. 1 and 2. In particular, FIGS. 1 and 2 illustrate work management of WIP and cycle time through the use of hot lots. Cycle time adjustment in a small lot size lithography bay is described below with reference to FIGS. 3 and 4.

Cycle time vs. WIP at manufacturing facility

As described, reducing WIP for a fully operational manufacturing facility reduces capital and manufacturing costs. However, reduced WIP may endanger semiconductor device manufacturing facilities. For example, if a processing tool on a manufacturing line becomes inactive (for example, "suspended" due to periods of equipment defects, maintenance or cleaning, etc.), WIP will indicate that the tool in the inactive state is inactive (e.g. For example, it is possible to provide sufficient substrate buffering to allow continuous plant output until "restart"). On the other hand, insufficient WIP can idle the manufacturing line.

In general, when the average cycle time per substrate is reduced in a semiconductor device manufacturing facility, the corresponding decrease in WIP (eg, similarly, proportionally or otherwise) generally results in more substrates. It can be implemented as it moves through the facility. In accordance with at least one embodiment of the present invention, the average cycle time per substrate can be maintained approximately constant by decreasing the cycle time of the higher priority substrate while increasing the cycle time of the lower priority substrate. (Note that low priority substrates and high substrates may be distributed over a range of priority values, such as priority 1 through priority 100, or some other suitable priority range). In this way, the relationship between the cycle time of the high priority substrate and the WIP can be separated (e.g., reduced or erased) so that the reduction of cycle time on a high priority substrate is a semiconductor device manufacturing facility using the present invention. It does not provide a corresponding reduction in WIP in the eye.

In order to reduce the average cycle time in accordance with the present invention, a "small lot" size substrate carrier uses a high speed substrate carrier delivery system. The high speed substrate carrier delivery system can deliver substrate carriers within a semiconductor device manufacturing facility at a considerably faster rate than conventional delivery systems (described below). Thus, any given substrate carrier can be routed through faster installations.

Use of small lot sizes during the manufacture of semiconductor devices

1 is an exemplary graph of semiconductor device manufacturing facility (FAB) cycle time or WIP versus facility output for large and small lot size substrate carriers. Referring to FIG. 1, curve 100 represents the cycle time or WIP versus facility output for a typical semiconductor device manufacturing facility configured to deliver large lot sized substrate carriers. Curve 102 represents the cycle time or WIP versus facility output for a semiconductor device manufacturing facility configured to deliver small lot size substrate carriers in accordance with the present invention.

Curve 100 shows how facility output increases with WIP. As WIP continues to increase, plant output also increases. As a result, large WIP increases are required for relatively small output gains. Thus, to provide facility output estimates, large lot sized equipments typically operate near the knee of curve 100. At this location, the plant output is near the maximum and a small increase or decrease in cycle time or WIP has some effect on the plant output.

Curve 102 shows how the use of a small lot size substrate carrier with a high speed substrate carrier delivery system (described below) affects the WIP and / or facility output. For example, as shown in FIG. 1, curve 102 moves downward to the right relative to curve 100. This shift indicates that the same level of facility output can be maintained with less WIP (see 106). Optionally, if the same level of WIP is desired in a small lot size facility as provided to a large lot size facility controlled by curve 100, the output in the small lot size facility will increase (see 108). In at least an embodiment of the invention, the factory output is increased through a slight decrease in WIP as shown for example 110. Other operating points along curve 102 may also be used.

Selection of the "optimal" operating point on curve 102 depends on various factors. For example, some products have long product life cycles and relatively stable values (eg embedded device applications such as devices used in industrial equipment or other long product life products). The devices used in these products can be manufactured and stored as inventory in the near future with less financial risk. Substrates for such devices are classified as low priority and used to fill the capacity of manufacturing facilities. As inventory is depleted, the priority of these substrates will increase to meet the associated business arrangements (eg, lead time, stocking levels, etc.).

 Substrates for devices used in general purpose products, such as DRAM, which have been on the market for three to four years, are adopted as low priority substrates. Yields for these devices are generally high and the versatility of the product used in these devices is ensured in the market. Thus, inventory aging is unlikely, but potential profitability is relatively low. However, these boards provide the capacity that equipment can continue to use to make profitable products.

The new product offers a high margin. Substrates for devices used in these products are given high priority. In this way, manufacturing facilities can increase profit per substrate by manufacturing biasing for higher profit products. Often, new products can achieve rapid selling erosion due to competition and market strategies that lower market penetration prices. Higher priority placement and selective reduction of manufacturing cycle times for these products can increase the amount of products that can be sold at higher profitability. In addition, high priority can be given to substrates for devices used in articles with short cycles. Short life cycle products include custom devices for consumer electronics such as, for example, specialized memory devices for digital cameras, video game controllers, cell phone components, and the like. As they become outdated and prices fall rapidly, there is a risk of inventory of this type of device.

Certain order devices or devices that are under development that have not undergone changes or have been subjected to specific quality tests are specifically processed at the manufacturing facility; Substrates used for the manufacture of such devices are considered "hot lots" or "super hot lots." Hot lots are prioritized to be moved in front of the queue for each processing step. Super hot lots can be assigned the highest priority and equipment can be serviced or maintained or idle waiting for the super hot lot substrate to arrive. In conventional manufacturing facilities using 13 or 25 substrates per lot, the use of hot lots and super lots can cause serious confusion in the process flow. However, as will be described further below, in the small lot size manufacturing facility provided in accordance with the present invention, a particular order or other similar device can be integrated into a production flow provided with less loss of tool utilization. Substrates used for the manufacture of such devices are given the highest priority in manufacturing facilities.

Example of small lot size semiconductor device manufacturing facility

2 is a schematic diagram of an exemplary small lot size (SLS) semiconductor device manufacturing facility 200 provided in accordance with the present invention. Referring to FIG. 2, the SLS facility 200 includes a high speed substrate carrier delivery system 202 that delivers small lot size substrate carriers to a number of processing tools 204. Local storage or buffering 206 is provided at or near each processing tool 204 for local storage of the WIP. In addition, volume storage or buffering 208 may be provided (eg, volume stocking to accommodate peaks in the WIP that develop during the manufacturing process or during long storage periods of the WIP).

A carrier opening device 210 may be provided to each processing tool 204 to open a small lot size substrate carrier such that the substrate contained therein can be extracted, processed and / or returned. A mechanism (not shown separately) is provided for transferring a small lot size substrate carrier from the high speed delivery system 202 to the carrier opening device 210 of each processing tool 204 as described in more detail below.

Automatic communication and / or software system 212 is provided to control the operation of manufacturing facility 200 and may include, for example, a manufacturing execution system (MES), a substance control system (MCS), a scheduler, and the like. . A separate delivery system controller for controlling the delivery of small lot size substrate carriers to the manufacturing tool 204 is shown in FIG. 2. Delivery system controller 214 may be an automated communication and / or software system 212 component; And / or a separate MES, MCS or scheduler may be used.

Most processing tools, even large lot size manufacturing facilities, process small batches of substrates (eg, by processing one or two substrates per processing chamber at the same time). However, certain processing tools, such as furnaces or wet processing tools, process substrates of large batch size (eg, about 25 to 200 substrates per batch). Thus, the small lot size manufacturing facility 200 can accommodate the delivery, storage and operating conditions of a large batch size processing tool. One of such exemplary large batch size processing tools is shown at 216 in FIG. 2.

Many large batch size processing tools can move a substrate (eg, one substrate at a time) directly from a large lot size carrier with a robot blade using an Equipment Front End Module (EFEM), not shown separately. Each substrate is then transferred by the processing tool to the processing chamber as required to establish the large substrate arrangement required for processing. By providing local storage of small lot size substrate carriers in such a processing tool, large substrate batches can be mounted using the Equipment Front End Module (EFEM) of the large batch size processing tool in the small lot size manufacturing facility 200.

Other large batch size processing tools take complete large lot size carriers into the internal buffer, or simultaneously remove multiple substrates from large lot size substrate carriers into the internal buffer. For such a tool, a sorter module 218 to move the substrate from the small lot size carrier to the large lot size carrier may be used in the small lot size manufacturing facility 200.

As described, the high speed delivery system 202 delivers a small lot size substrate carrier to a number of processing tools 204. Such a system preferably has a travel speed capacity of at least twice the average speed required for the normal production capacity (eg, in response to peaks of travel speed conditions occurring during the normal manufacturing process). In addition, the system may be configured to redirect substrates in different processing tools in response to factory modifications, excursions, and / or manufacturing processing changes (eg, unplanned maintenance, priority changes, manufacturing yield issues, etc.) Has the ability to re-dircet, re-route, or re-move.

US Patent Application No. 10 / 650,310, filed August 28, 2003, discloses a substrate carrier delivery system (eg, a conveyor) that can be used as a small lot size substrate carrier delivery system 202. The delivery system of the '310 application moves continuously with substrate carrier disassembly and mounting operations. The mounting / dismounting mechanism may be associated with each processing tool or group of processing tools and may operate to mount and / or dismount the substrate carrier from or onto the delivery system as the delivery system moves. Each mounting / dismounting mechanism may include a mounting / dismounting member that moves during the mounting or dismounting operation such that the delivery system closely matches the speed of holding the substrate carrier. The mounting and / or dismounting member is adjusted for gentle substrate / substrate carrier processing. The delivery system of the '310 application can operate at considerably faster speeds than conventional large lot size delivery systems; Easily allow board re-dircet, re-route and / or re-move in different processing tools in response to factory deformation, excursion and / or manufacturing processing changes. Can be. Other substrate carrier delivery systems can similarly be used.

Specific embodiments of suitable high speed delivery systems are disclosed in US patent application Ser. No. 10 / 764,982, filed Jan. 26, 2004. The '982 application discloses a conveyor system that can include a ribbon of stainless steel or similar material that forms a closed loop within at least a portion of a semiconductor device manufacturing facility and delivers a substrate carrier therein. By orienting the ribbon so that the thick portion of the ribbon is in the vertical plane and the thin portion of the ribbon is in the horizontal plane, the ribbon is flexible in the horizontal plane and rigid in the vertical plane. This configuration allows the conveyor of the invention to be constructed and operated at low cost. For example, ribbons that require some material to be rescued are easy to manufacture, and because of the vertical rigidity / strength of the ribbon, secondary support structures (rollers or other similar mechanisms conventionally used, horizontally oriented belt conveyor systems) Support the weight of multiple substrate carriers In addition, the conveyor system is highly customizable because the ribbon can be bent and curved or shaped into various configurations due to its lateral flexibility.

As shown in FIG. 2, the SLS manufacturing facility 200 may include additional high speed delivery systems, indicated at 202 ′, 202 ″. Three or more or fewer delivery systems may be used. For example, an additional high speed delivery system may include a small lot size substrate carrier in different parts of the manufacturing facility, such as equipment for processing substrates stored in a large lot size substrate carrier, different physical areas of the manufacturing facility (such as an extended area of the facility), and the like. Can be used to deliver. One or more delivery mechanisms 220 may be used to store substrate carrier transfer and / or additional substrate carrier storage between the high speed delivery systems 202, 202 ′, 202 ″. In at least embodiments of the present invention, one or more substrate carrier handlers and rotating substrate carrier stages may be used to remove the substrate carrier from the first high speed delivery system (eg, the high speed delivery system 202 of FIG. 2) and the second high speed. The substrate carrier may be delivered to the delivery system (high speed delivery system 202 ′ in FIG. 2) or vice versa. Such systems and methods are disclosed in US Provisional Patent Application No. 60 / 520,035, filed November 13, 2003.

To prevent depletion of the substrate carrier from the high speed delivery system 202, each processing tool 204 may include local storage for WIP buffering or storage (as disclosed). Single operation of the processing tool may be provided without the high speed delivery system 202 for delivering the substrate to the tool. Since various conventional processing tools accommodate at least two large lot size (eg, 25) substrate carriers, at least in one embodiment of the present invention, local storage at or near each processing tool 204 A similar number of substrates are stored by storing various small lot size substrate carriers at or near each processing tool (eg, at least about 50 small lot size carriers in one embodiment). Other or various numbers of substrate carriers may also be stored at or near each processing tool 204 (eg, less than 50, more than 50, and the like).

US Provisional Application No. 60 / 443,115, filed January 27, 2003, shows a high speed bay with a significantly long chassis in the direction of travel of the high speed delivery system when compared to a stocker with a conventional bay distribution. Disclosed a distribution stocker (HSBDS). HSBDS features a high speed substrate carrier handler that mounts the substrate carrier on a high speed delivery system and disengages the substrate carrier from the high speed delivery system. The HSBDS also includes an additional column of substrate carrier storage shelves to provide additional substrate buffering. Other systems for providing local storage may be used (eg, distributed stockers, field stockers, overhead / ceiling mounted tables or shelves, etc.).

Volume storage or buffering 208 provides volume stocking to accommodate peaks in the WIP that develop during the long storage period of the WIP and during the manufacturing process. For example, an order arranged according to a held, non-product substrate, or the like may be placed in volume storage or buffering. This capacity selection of volume storage or buffering is driven by manufacturing facility requirements. For example, volume storage or buffering 208 may include small lot size stockers along a fast delivery loop, large lot size stockers along a fast delivery path or slow delivery paths (not shown), other forms of high density storage, Distribution stockers, field stockers, overhead and / or ceiling mounted tables or shelves, and the like. The substrate stored in the small lot size substrate carrier may be transferred to the large lot size carrier through a sorter and subsequently placed in a high density storage location.

In at least one embodiment of the present invention, low usage WIPs (e.g., inert WIPs such as substrates placed in engineering hold, test substrates, non-manufacturing substrates, substrates held for long periods of time, etc.) have large storage capacities with greater storage capacity. It can be stored in lot size substrate carriers (the cost of storing substrates in such high density carriers is generally cheaper than using small lot size carrier storage). For example, low-use WIPs are transferred from small lot size carriers to large lot size carriers (eg, via stockers) and stored in volume stockers. If low-use WIPs are not processed within a predetermined time period (e.g., 5 days or some other time period), the WIP can range from small lot size carriers to large lot size carriers (e.g., 13 or 25 substrates). And a carrier for storing the same, and to another location within the manufacturing facility 200. For example, volume storage 208 ′ may include a large lot size volume stocker that stores low-use WIPs at locations remote from the main processing area of manufacturing facility 200.

During the mounting and dismounting of the substrate carrier at the processing tool 204, communication between the processing tool 204 and the manufacturing facility 200 may provide lot identification information, processing parameters, tool operating parameters, processing instructions, and the like. Automatic communication and / or software system 212 is designated to handle these and other communications. Preferably such communication takes place quickly enough so as not to delay substrate processing. For example, a typical requirement for mounting a substrate carrier at the factory interface of a processing tool is less than about 200 seconds, and in some cases less than 30 seconds.

In at least one embodiment of the invention, the automatic communication and / or software system 212 performs substrate-level-tracking (as opposed to carrier level tracking typically used in large lot size environments) and, if desired, refers to lots. Substrates can be grouped. This substrate-based method increases the performance of the manufacturing facility 200 and prevents software lot limitations from negating small lot size manufacturing advantages.

In each processing tool 204, the carrier opening device 210 (to open a small lot size substrate carrier for substrate extraction, processing, and / or return) may be used to minimize the cost of performing large installations (eg, SEMI criteria). ) Use an industry reference interface. An optional carrier opening mechanism can be used. For example, US patent application Ser. No. 10 / 650,311, filed August 28, 2003, latches onto the actuation mechanism at a substrate transfer location (e.g., of a processing tool that can be used during semiconductor device manufacturing). Initiate a door latching mechanism of the substrate carrier that is not automatically latched by the mechanism interaction. In addition, the same actuator mechanism may release the substrate clamping mechanism, which may be part of the substrate carrier (and protects the substrate stored by the substrate carrier during delivery). Likewise, US patent application Ser. No. 10 / 650,312, filed August 28, 2003, discloses the use of the movement of the substrate carrier towards the port of the substrate delivery position to allow the door of the substrate carrier to open. Substrate carrier movement from the port at the substrate transfer position causes the door of the substrate carrier to close. Other carrier opening methods and devices can be used.

Because of the relatively low travel speeds used in large lot size manufacturing facilities, the operator (person) can move the lot between processing tools as needed (eg, when an automated delivery system has failed). For small lot size production, the speed of travel required is so large that the use of the operator is typically impractical. As a result, redundant systems (other than operators) can be used for proper plant operation. Such redundant systems may include, for example, additional control system computers, software databases, automated delivery systems, and the like (not shown separately).

In at least one embodiment of the present invention, while the high speed delivery system 202 is in operation (eg during operation and / or using other tools), the small lot size manufacturing facility 200 may, for example, produce new processing. Includes the ability to install and mount tools. US Patent Application No. 10 / 987,956 (8158), filed November 12, 2004, describes a high speed substrate carrier delivery station (for mounting and removing substrate carriers on a high speed substrate carrier delivery system) while the delivery system is in operation. A method of aligning and calibrating a high speed substrate carrier delivery system is disclosed. The substrate carrier hand-off function of the transfer station is then tested and the fast transfer station is located. Other methods / systems may be used.

The use of a small lot size manufacturing facility as described above with reference to FIG. 2 provides various advantages over conventional large lot size manufacturing facilities. For example, small lot size manufacturing facilities provide significant versatility. As described with reference to FIG. 1, for an equivalent set of processing tools, a small lot size manufacturing facility may include: (1) equivalent output at reduced cycle periods; It can operate at (2) the equivalent cycle time at which the factory output is increased, or (2) at a predetermined point between them. Factory operating conditions (large lot size baseline) may be adjusted according to other conditions for placing priorities according to either business conditions or cycle time reduction or increased capacity. In addition, through the use of a high speed substrate carrier delivery system, certain orders and other similar devices can be integrated into a production flow that provides a loss of tool utilization. Typically hot lots and / or super hot lots can be processed in small lot size manufacturing facilities with a small impact on manufacturing facility output rates. Thus, less excess capacity is required to handle hot lots and / or super hot lots.

The foregoing description merely discloses embodiments of the present invention. Modifications of the above disclosed apparatus and methods will be readily apparent to those skilled in the art within the scope of the present invention. For example, other arrangements for small lot size manufacturing facilities such as different processing tools, storage devices and / or delivery system layouts and / or types, many or fewer processing tools, storage devices and / or delivery systems, etc. may be used. In at least one embodiment, a substrate carrier cleaner 222 may be provided to clean a small lot size substrate carrier. In this way, the substrate carrier can be cleaned to prevent cross-contamination of inappropriate processing. The small lot size semiconductor device manufacturing facility shown in FIG. 2 is larger than the semiconductor device (which may include, for example, one or more other small lot size semiconductor device manufacturing facility and / or one or more large lot size semiconductor device manufacturing facility). It may form part or a subset of the manufacturing equipment. For example, small lot size semiconductor device manufacturing facilities can be used to reduce the cycle time, in whole or in part, of the interconnect formation steps of device fabrication. That is, the small lot size semiconductor device manufacturing facility provided in accordance with the present invention can be used to selectively accelerate the portion of device processing time. As another example, in a lithography bay, small lot size fabrication modules can be used to improve cycle times for metrology, substrate rework, and the like.

The automatic communication and / or software system 212, the delivery system controller 214, and / or any other controller may be programmed or otherwise configured to perform various WIP management functions. For example, in at least one embodiment of the present invention, the system and / or controller may be configured to (1) increase the average cycle time of a low priority substrate in a small lot size semiconductor device manufacturing facility 200; And (2) reduce the average cycle time of the high priority substrate in the small lot size semiconductor device manufacturing facility 200, thereby maintaining a predetermined WIP within the small lot size semiconductor device manufacturing facility 200. A predetermined WIP level may be maintained in the lot size semiconductor device manufacturing facility 200. In another embodiment of the present invention, the system and / or controller may be configured to (1) a small lot size substrate carrier containing a low priority substrate within a small lot size substrate carrier storage location of one or more processing tools 204. Save; (2) High priority substrates are processed in one or more processing tools 204 prior to the stored low priority substrates, so that the high priority without compromising WIP reduction in small lot size semiconductor device manufacturing facility 200 The cycle time of the substrate can be reduced.

In another embodiment of the present invention, the system and / or controller may comprise (1) a small lot size substrate carrier containing a low priority substrate at a small lot size substrate carrier storage location of one or more processing tools 204 and a priority. Store a small lot size substrate carrier containing a high ranking substrate; (2) prior to processing in the one or more processing tools 204, configured to store the higher priority substrates for a generally shorter period of time than the lower priority substrates, so that the small lot size semiconductor device manufacturing facility 200 It is possible to reduce the cycle time of high priority substrates without following the WIP reduction.

In another embodiment of the present invention, the system and / or controller maintains the small lot size semiconductor device manufacturing facility while maintaining the average cycle time and WIP at approximately the same level as the average lot time and WIP of the large lot size semiconductor device manufacturing facility. It is configured to process the high and low priority substrates at different cycle times within 200.

In another embodiment of the present invention, the system and / or controller manufactures large lot size semiconductor devices in a small lot size semiconductor device manufacturing facility 200 while maintaining nearly all outputs equal to the large lot size semiconductor device manufacturing facility. The equipment is configured to process the substrate.

In another embodiment of the present invention, the system and / or controller increase the output of the small lot size semiconductor device manufacturing facility 200 over a large lot size semiconductor device manufacturing facility, while the small lot size semiconductor device manufacturing facility 200 The substrate is configured to treat the substrate with an average cycle time and WIP that is approximately the same as a large lot size semiconductor device manufacturing facility.

In another aspect of the invention, the system and / or controller may (1) identify a WIP that is not processed within a predetermined time period; (2) transfer the identified WIP from the small lot size substrate carrier to the large lot size substrate carrier; Configured to store a large lot size substrate carrier of volume storage.

Small Lot Size Lithography Bay

Reduced cycle times are particularly desirable for lithographic portions (bays) of semiconductor device manufacturing facilities. 3 is a top view of an exemplary small lot size lithography bay 300 provided in accordance with the present invention. With reference to FIG. 3, lithographic bay 300 includes a wet cleaning processing tool 302, a dry strip processing tool 304, a plurality of metrology and inspection tools 306-312 and a plurality of patterning tools 314-328. Include. Note that other water and / or types of wet cleaning, dry strips, metrology and inspection, and / sonne patterning tools can be used. For example, individual metrology and inspection tools can be used.

The wet clean processing tool 302 and the dry strip processing tool 304 may perform a conventional photoresist or other mask removal process or any other conventional process for reworking undesirably processed substrates during lithography. Re-work "tool. For example, the wet clean processing tool 302 provides a photoresist stripper or other wet chemical bath to the substrate. Similarly, dry strip processing tool 304 utilizes plasma processing (eg, ashing) for substrate rework. Other rework processes and / or tools may be used within the lithographic bay 300, whether aligned or otherwise positioned with other tools 306-328 (shown).

Metrology and inspection tools 306-312 include conventional metrology and inspection tools for detecting critical dimensions, overlay accuracy, defect levels and / or defect shapes of lithographically processed substrates. In at least one embodiment, metrology and inspection tools 306-312 include a single substrate, standalone tool, but batch and / or integrated metrology and inspection tools may be used.

Patterning tools 314-328 may include one or more and / or conventional lithography tools that perform any combination of resist processing, exposure, imprint, and the like. For example, patterning tools may include standalone resist processing tools, standalone exposure tools, standalone imprint tools, integrated resist processing and exposure tools, integrated resist processing and imprint tools, and the like. In at least one embodiment, a resist processing tool includes (1) a substrate or substrates on which a substrate carrier is delivered to a resist processing tool; (2) the substrate or substrates are removed from the substrate carrier and a resist (eg photoresist) is provided to the substrate or substrates using a resist processing tool; (3) the substrate or substrates are transferred to and exposed to the exposure tool; (4) the substrate and / or substrates are returned to a resist processing tool and the provided resist is developed; (5) may be integrated or otherwise connected with the exposure tool such that the substrate or substrates are returned to the substrate carrier.

Patterning tools 314-328 may be single substrate or batch tools. As disclosed, other water and / or types of wet washes, dry strips, metrology and inspection, and patterning tools can be used. In one or more embodiments, any exposure tool that may be used may use visible or ultraviolet light to transfer the circuit pattern from the mask to the resist layer. Likewise, direct transfer, extremely strong ultraviolet, e-beam or x-ray lithography tools can be used.

In the embodiment of FIG. 3, a small lot size transfer system 330 is used to transfer a small lot size substrate carrier between the tools 302-328. The small lot size delivery system 330 may be similar to the fast delivery system 202 described above with reference to FIG. 2, or other suitable delivery system may be used. One or more small lot size delivery systems may be used to transfer carriers between the tools 302-328.

As shown in FIG. 3, the small lot size lithography bay 300 includes one or more substrate carrier stockers or similar devices 332-336. The stockers 332-336 are adapted to receive large lot size substrate carriers from a conventional large lot size substrate carrier delivery system 338 (such as a conventional overhead delivery system that delivers a substrate carrier having 25 substrates). Can be used. In the illustrated embodiment, stockers 332-336 receive large lot size substrate carriers from delivery system 338 and transfer the substrates within each large lot size substrate carrier to the small lot size substrate carriers. For example, a substrate from one 25-substrate substrate carrier may be moved to allow for 25 single-substrate substrate carriers, 13 two-substrate substrate carriers, nine three-substrate substrate carriers, seven four-substrate substrates. Carriers, five five-substrate carriers, four seven-substrate substrate carriers, and the like. Each stocker 332-336 can also be provided in local storage for large and / or small lot size substrate carriers. Less or more stockers 332-336 may be used. In addition, the small lot size lithography bay 300 receives the small lot size carrier directly from another small lot size bay of the manufacturing facility (rather than from a large lot size delivery system).

Behavior of small lot-size lithography bays

4 is a flowchart of an example method 400 of operating a small lot size lithography bay 300. Referring to FIG. 4, at step 401, the substrate is transferred to a small lot size lithography bay 300 via a large lot size delivery system 338. For example, large lot size delivery system 338 may deliver a substrate carrier to stockers 332-334, each holding 25 substrates. Next stockers 332-334 are small lot size carriers from large lot size carriers (e.g. carriers having 1, 2, 3, 4, 5, 6, etc., from carriers having 25 substrates). To transfer the substrate.

Then, at step 402, the first small lot size carrier is delivered to one of the patterning tools 314-328 via the small lot size delivery system 330. Additional small lot size carriers may be delivered (sequentially or in parallel) to the patterning tools 314-328.

In step 403, the substrate or substrates included in the first small lot size carrier is processed. Then, in step 404, after the substrate or substrates of the first carrier have been processed in the patterning tool, the first small lot size carrier is routed through the small lot size delivery system 330 to the metrology and inspection tool 306-312. Is passed on to either.

In step 405, metrology and / or inspection of the substrate or substrates in the first small lot size carrier is performed (eg, to detect critical dimension or overlay accuracy, defect level or shape, etc.).

In step 406, it is determined whether an error condition is detected on the substrate, such as if there are too many defects, if there is inappropriate patterning, or the like. An error condition is detected and in step 407 the first small lot size substrate carrier and its items are directed to the wet cleaning tool 302 and / or the dry strip tool 304 and reworked (eg, one or more). Stripped, washed and prepared for the process in the patterning tool 314-328). If no error condition is found on the substrate or substrates in the first small lot size carrier, then at step 408, the first small lot size transfer system 330 performs better processing within the small lot size lithography bay 300. Return the carrier to patterning tool 314-328 or to stocker 332-338. In stockers 332-338, the substrate is stored and / or transferred from a small lot size carrier to a large lot size carrier and via another large lot size delivery system 338 to another bay of the entire manufacturing facility (not shown). Delivered. The method ends.

Data from the metrology and inspection tool 306-312 is fed back to the patterning tool 314-328 to improve processing performance (as shown virtually by step 409 of FIG. 4). For example, if the critical dimension (CD) of the feature (eg, resist layer) is too small or too large, the exposure time and / or resist processing conditions may be changed to improve the processing result. Another processing parameter may similarly be adjusted. By using a small lot size, feedback data can be provided to the patterning tool with a smaller delay than when a large lot size is used. Faster feedback data enhances processing results more quickly and reduces scrap caused by mis-processing. This is an important advantage for lithographic layers that are largely complex and / or largely important. For these layers, adjustment of processing parameters based on feedback data from the processed substrate is necessary to meet the processing specifications.

Small lot size lithography bay 300 may include, for example, one or more rework tools 302-304, metrology and inspection tools 306-312, patterning tools 314-328, delivery system 330, and / or the like. Or a controller 340 that controls the operation of the lithographic bay 300 as described above by interfacing and / or controlling the stockers 332-338. For example, the controller 340 causes one or more steps of the method 400 described above to be performed and / or at least initiated. For example, controller 300 may be one or more microprocessors and / or microcontrollers, dedicated hardware, and combinations thereof, and may include appropriate computer program code to control the operation of lithography bay 9300.

The controller 340 forms part of an automated communication and / or software system provided to control the operation of the small lot size lithography bay 300, for example, a manufacturing performance system (MES), a substance control system (MCS). , Scheduler, and the like. Individual delivery system controllers (not shown) may be used to control small lot size substrate carrier delivery to processing tools 302-328. The delivery system controller can be the automated communication and / or software system component disclosed above; And / or individual MEC, MCS or scheduler may be used.

Through the use of small lot size carriers in the lithography bay 300, the substrate is processed in the patterning tool 314-328 and directed to the metrology and inspection tool 306-312 considerably faster than in conventional large lot size lithography bays. Can lose. The substrate is delivered for metrology and / or inspection with little or no delay (for example due to processing of another substrate in the carrier) (in this case a single substrate carrier). In one embodiment, for example, that delay is reduced from 200 plus substrates to less than 20 substrates. In addition, through the use of small lot size carriers, the substrates are transferred to different metrology tools in parallel. For example, when a single substrate carrier is used, the first substrate is directed to the critical dimension measurement tool, the second substrate is directed to the overlay metrology tool, and the third substrate is transferred in parallel to the defect measurement tool. Similar parallel operations can be performed with small lot size carriers containing one or more substrates without the large latency-time delay associated with large lot size carriers.

As another example, when a new mask setup is used, the setup may be directed to the mask setup prior to processing a large number of substrates (e.g. to avoid reprocessing too many substrates if the setup is defective). Must be verified To perform setup verification, multiple substrates are processed and delivered for metrology. As disclosed, the use of small lot sizes significantly reduces the time required to receive metrology and / or inspection results for the substrate. Thus, the mask setup verification time is reduced. As another alternative, a new mask setup is assumed to be effective and the substrate is processed using the setup. Any error in the seperation is detected by measurement on the processed substrate. Again, the use of small lot sizes provides information from metrology and / or inspections more quickly to reduce the number of defective substrates that (if any) have to be reworked. Rapid, parallel information feedback from metrology and / or inspection tools that perform different measurements (eg, of critical dimensions, overlays, defects) (eg, confirm setup, monitor manufacturing processes, process In order to detect deviations, a variety of promptly provided near simultaneous indicators of processing conditions are provided.

The use of small lot size lithography bay 300 and the reduced cycle time associated therewith allows for interlacing lots and substrates. For example, monitors and / or small lots are interlaced without damaging the pipeline (eg, sequential sequencing of the substrate in the processing tool). If the pipeline of the substrate is interrupted by space or gaps during subsequent sequencing of the substrates in the tool, the tool loses efficiency and net effective utilization is reduced. In addition, monitoring is enhanced and sampling improves without loss of utility. Single (or small lot size) substrate rework may take place in the lithographic bay 300.

In at least an embodiment of the present invention, after the substrate has been exposed and / or patterned in the patterning tools 314-328, the substrate may be formed (eg, a substrate carrier having 25 substrates may have a substrate in the lithographic bay). It is moved to the instrument as quickly as possible (without waiting to process more substrates) as it is used to transfer. In addition, small lot size substrate carriers (eg, single substrate carriers) can be delivered to different metrology tools in parallel.

Note that a standalone instrument can be used. Also, in certain embodiments, dry strips and wet cleaning tools may be included in a line (not shown) to provide rapid cycle time rework when the problem is resolved. Other small lot size substrate carrier delivery systems, apparatus and / or methods other than those disclosed herein can be used.

Thus, while the invention has been disclosed in connection with exemplary embodiments, other embodiments may be practiced without departing from the scope and spirit of the invention as defined by the following claims.

According to the present invention, it is possible to reduce the overall "dwell" or "cycle" time of each substrate in the manufacturing facility, and to facilitate the transfer of the substrate in the manufacturing facility. Can be achieved.

Claims (35)

Storing the substrates in a plurality of small lot size substrate carriers each having less than 13 substrates; And Delivering at least one of said small lot size substrate carriers in a lithographic bay of a semiconductor device manufacturing facility. The method of claim 1, wherein storing the substrate in the plurality of small lot size substrate carriers comprises transferring the substrate from the substrate carrier having 25 substrates to the plurality of small size substrate carriers. Way. The method of claim 1, wherein storing the substrates in a plurality of small lot size substrate carriers each having less than 13 substrates, (a) receiving a large lot sized substrate carrier for storing at least 13 substrates from a large lot sized delivery system; And (b) transferring the substrate from the large lot size substrate carrier to a plurality of small lot size substrate carriers. 4. The method of claim 3, further comprising performing steps (a) and (b) in a stocker. 5. The method of claim 4, further comprising storing the plurality of small lot size substrate carriers in the stocker. 10. The method of claim 1, wherein the plurality of small lot size substrate carriers each has less than six substrates. 2. The method of claim 1 wherein the plurality of small lot size substrate carriers each has less than five substrates. 2. The method of claim 1, wherein the plurality of small lot size substrate carriers each has less than four substrates. 2. The method of claim 1, wherein each of the plurality of small lot size substrate carriers has less than three substrates. 2. The method of claim 1, wherein the plurality of small lot size substrate carriers each has less than two substrates. 2. The method of claim 1, wherein the plurality of small lot size substrate carriers each holds one substrate. The method of claim 1, wherein delivering at least one of the small lot size substrate carriers in the lithographic bay of the semiconductor device manufacturing facility comprises delivering the small lot size substrate carriers to the patterning tool. 13. The method of claim 12, further comprising patterning a substrate from the small lot size substrate carrier using the patterning tool. 13. The method of claim 12, further comprising transferring the small lot size substrate carrier to a tool for performing at least one of metrology and inspection. 15. The method of claim 14, further comprising performing at least one of metrology and inspection on a substrate from the small lot size substrate carrier. 16. The method of claim 15, further comprising transferring the small lot size substrate carrier to one or more rework tools based on at least one metrology and inspection result. 17. The method of claim 16, further comprising reworking the substrate from the small lot size substrate carrier. 18. The method of claim 17, wherein reworking the substrate comprises at least one of wet cleaning and dry stripping of the substrate. 2. The method of claim 1, further comprising transferring the plurality of small lot size substrate carriers to the patterning tool in parallel. 2. The method of claim 1, further comprising transferring the plurality of small lot size substrate carriers to different metrology tools in parallel. The conveyor of claim 1, wherein delivering at least one of the small lot size substrate carriers in a lithographic bay of the semiconductor device manufacturing facility comprises a conveyor continuously moving to deliver at least one of the small lot size substrate carriers in the lithographic bay. The method comprising the step of using. Multiple lithography tools; And A small lot size delivery system for delivering small lot size substrate carriers to the lithography tool, Each small lot size substrate carrier holds less than 13 substrates. The lithographic bay of claim 22, wherein the lithographic tool comprises a patterning tool and at least one metrology and inspection tool. The lithographic bay of claim 22, wherein the lithographic tool comprises at least one rework tool. A lithographic bay as recited in claim 24, wherein said at least one rework tool is in-line with another lithography tool. The lithographic bay of claim 24, wherein the at least one rework tool comprises a wet cleaning tool and a dry stripping tool. The method of claim 22, (a) accepts a large lot size substrate carrier for storing at least 13 substrates from a large lot size delivery system; (b) a lithographic bay further comprising a stocker transferring the substrate from the large lot size substrate carrier to a plurality of small lot size substrate carriers. 28. The lithographic bay of claim 27, wherein the stocker stores at least one of a large lot size and a small lot size substrate carrier. The lithographic bay of claim 27, wherein the small lot size transfer system delivers a small lot size substrate carrier to the stocker. The lithographic bay of claim 22, wherein each of the small lot size substrate carriers stores less than six substrates. The lithographic bay of claim 22, wherein the small lot size substrate carriers store less than five substrates each. The lithographic bay of claim 22, wherein the small lot size substrate carriers store less than four substrates each. The lithographic bay of claim 22, wherein the small lot size substrate carriers store less than three substrates each. The lithographic bay of claim 22, wherein the small lot size substrate carriers each store less than two substrates. The lithographic bay of claim 22, wherein the small lot size substrate carriers each store one substrate.

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