[go: up one dir, main page]

KR20060021178A - Electrode Tantalum Capacitor - Google Patents

Electrode Tantalum Capacitor Download PDF

Info

Publication number
KR20060021178A
KR20060021178A KR1020040070042A KR20040070042A KR20060021178A KR 20060021178 A KR20060021178 A KR 20060021178A KR 1020040070042 A KR1020040070042 A KR 1020040070042A KR 20040070042 A KR20040070042 A KR 20040070042A KR 20060021178 A KR20060021178 A KR 20060021178A
Authority
KR
South Korea
Prior art keywords
tantalum capacitor
lead wire
pellet
tantalum
mold layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020040070042A
Other languages
Korean (ko)
Inventor
조영수
Original Assignee
파츠닉(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파츠닉(주) filed Critical 파츠닉(주)
Priority to KR1020040070042A priority Critical patent/KR20060021178A/en
Publication of KR20060021178A publication Critical patent/KR20060021178A/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/042Electrodes or formation of dielectric layers thereon characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/048Electrodes or formation of dielectric layers thereon characterised by their structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

본 발명은 전극이동형 탄탈콘덴서에 관한 것이다.The present invention relates to an electrode movable tantalum capacitor.

본 발명은 각형 펠릿을 에폭시 몰드층에 매설하여 양측 리드선중 양극리드선은 펠릿의 탄탈소자에 용접하고, 음극리드선은 도전성 접착제로 펠릿의 주면상에 접촉하여 노출된 부위를 각기 에폭시 몰드층의 주면상에 접촉시킨 탄탈콘덴서에 있어서, 상기 양극리드선(30a)을 "ㄴ"형으로 절곡하여 수직으로 절곡된 상단부를 탄탈소자(21)의 직하방과 용접함과 아울러 수평부위를 펠릿(20)의 저면에 도전성 접착제로 고정하고 음극리드선(30b)은 "-"형으로 형성하여 펠릿(20)의 저면에 도전성 접착제로 고정하여 상기 노출된 양측 리드선 부위를 에폭시몰드층(10)의 저면상에 각각 접촉하여 된 구조이다.According to the present invention, a rectangular pellet is embedded in an epoxy mold layer, and the anode lead wire of both lead wires is welded to the tantalum element of the pellet, and the cathode lead wire is contacted on the main surface of the pellet with a conductive adhesive, and the exposed portions are respectively formed on the main surface of the epoxy mold layer. In the tantalum capacitor brought into contact with the tantalum capacitor, the positive lead wire 30a is bent into a "b" shape to weld the upper end bent vertically with the tantalum element 21 directly below, and the horizontal part is placed on the bottom surface of the pellet 20. Fixed with a conductive adhesive and the cathode lead wire (30b) is formed in a "-" shape to be fixed to the bottom surface of the pellet 20 with a conductive adhesive to contact the exposed both ends of the lead wire on the bottom surface of the epoxy mold layer 10, respectively Structure.

본 발명은 탄탈콘덴서의 전극을 저부로 이동 구성하여 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance) 특성을 효과적으로 낮추도록 함은 물론 내부 소자의 볼륨 확대가 가능하여 탄탈콘덴서의 용량을 배가시킬 수 있게 되는 매우 유용한 발명이다.The present invention can effectively reduce the ESR (Equivalent Series Resistance) characteristics of the tantalum capacitor by moving the electrode of the tantalum capacitor to the bottom, and can increase the volume of the internal element to double the capacity of the tantalum capacitor. It is a very useful invention.

Description

전극이동형 탄탈콘덴서{Electrode movement type tantal condenser}Electrode movement type tantalum condenser

도 1은 본 발명 탄탈콘덴서의 측면도1 is a side view of the tantalum capacitor of the present invention

도 2는 종래 탄탈콘덴서의 측면도2 is a side view of a conventional tantalum capacitor

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10 : 에폭시몰드층 20 : 펠릿10: epoxy mold layer 20: pellet

21 : 탄탈소자 30a : 양극리드선21 tantalum element 30a positive lead wire

30b : 음극리드선30b: cathode lead wire

본 발명은 전극이동형 탄탈콘덴서에 관한 것이다.The present invention relates to an electrode movable tantalum capacitor.

본 발명은 탄탈콘덴서의 전극을 저부로 이동 구성하여 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance) 특성을 효과적으로 낮추도록 함은 물론 내부 소자의 볼륨 확대가 가능하여 탄탈콘덴서의 용량을 배가시킬 수 있도록 한 것이다. The present invention can effectively reduce the ESR (Equivalent Series Resistance) characteristics of the tantalum capacitor by moving the electrode of the tantalum capacitor to the bottom, and can increase the volume of the internal element to double the capacity of the tantalum capacitor. It would be.

탄탈콘덴서의 형태 중 본 발명이 적용하고자 하는 칩타입 콘덴서를 도 2에 도시하고 있다.2 illustrates a chip type capacitor to which the present invention is applied in the form of a tantalum capacitor.

상기 탄탈콘덴서는 탄탈분말을 형성하여 1600℃∼2000℃로 소결시킨 다공질 소결체의 탄탈소자중 일측소자로부터 차례로 탄탈금속층, 산화피막층, 이산화망간층, 카본층, 은페이스트도포층으로 각형 펠릿(200)을 형성하며 상기 펠릿(200)을 에폭시몰드층(100)에 매설하여 양측 리드선중 양극리드선(310)은 "⊂"형태로 절곡하여 펠릿(200)의 탄탈소자(210)에 용접하고, "⊃"형태로 절곡된 음극리드선(320)은 도전성 접착제로 펠릿(200)의 주면상에 접촉하여 노출된 양측 리드선 부위를 각기 에폭시몰드층(100)의 주면상에 접촉시킨 구조로 제공되고 있다.The tantalum capacitor is formed of tantalum powder and tantalum pellets 200 are formed of tantalum metal layer, oxide film layer, manganese dioxide layer, carbon layer, and silver paste coating layer from one side of tantalum elements of the porous sintered body sintered at 1600 ° C to 2000 ° C. Forming and embedding the pellet 200 in the epoxy mold layer 100 so that the anode lead wire 310 of both lead wires is bent into a "⊂" shape and welded to the tantalum element 210 of the pellet 200, and "⊃" The negative lead wire 320 bent in a shape is provided in a structure in which both of the lead wire portions exposed by contacting the main surface of the pellet 200 with the conductive adhesive are contacted on the main surface of the epoxy mold layer 100, respectively.

종래에는 상기와 같은 구조의 칩타입 콘덴서가 알려져 있고 제품의 용량 발현은 일반적인 고체전해질(MnO2) 방식의 용량이 동일 사이즈 기준으로 해서 1~2단계식 낮았다. 그러나 하기의 표에서와 같이 등가직렬저항은 우수한 것으로 나타나고 있다.Conventionally, a chip type capacitor having the above structure is known, and the capacity expression of the product has a low capacity of 1 to 2 steps based on the same size of the capacity of a general solid electrolyte (MnO 2 ) system. However, the equivalent series resistance is shown to be excellent as shown in the following table.

[표 1]TABLE 1

전도성고분자Conductive polymer MnO2 MnO 2 A 사이즈A size 22㎌22㎌ 47㎌47㎌ B 사이즈B size 47㎌47 100㎌100㎌

본 발명은 탄탈콘덴서의 전극을 저부로 이동 구성하여 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance) 특성을 효과적으로 낮추도록 함은 물론 내부 소자의 볼륨 확대가 가능하여 탄탈콘덴서의 용량을 배가시킬 수 있도록 함을 목적으로 한다.The present invention can effectively reduce the ESR (Equivalent Series Resistance) characteristics of the tantalum capacitor by moving the electrode of the tantalum capacitor to the bottom, and can increase the volume of the internal element to double the capacity of the tantalum capacitor. The purpose is to make it work.

이를 위해 본 발명은 각형 펠릿을 에폭시 몰드층에 매설하여 양측 리드선중 양극리드선은 펠릿의 탄탈소자에 용접하고, 음극리드선은 도전성 접착제로 펠릿의 주면상에 접촉하여 노출된 부위를 각기 에폭시 몰드층의 주면상에 접촉시킨 탄탈콘덴서에 있어서, 상기 양극리드선(30a)을 "ㄴ"형으로 절곡하여 수직으로 절곡된 상단부를 탄탈소자(21)의 직하방과 용접함과 아울러 수평부위를 펠릿(20)의 저면에 도전성 접착제로 고정하고 음극리드선(30b)은 "-"형으로 형성하여 펠릿(20)의 저면에 도전성 접착제로 고정하여 상기 노출된 양측 리드선 부위를 에폭시몰드층(10)의 저면상에 각각 접촉하여 된 일련의 전극이동형 탄탈콘덴서를 제공함으로서 상기 목적을 달성하고자 한다.To this end, the present invention embeds rectangular pellets in an epoxy mold layer, and the anode lead wires of both lead wires are welded to the tantalum element of the pellets, and the cathode lead wires are contacted on the main surface of the pellets with a conductive adhesive to expose the exposed portions of the epoxy mold layer. In the tantalum capacitor contacted on the main surface, the anode lead wire 30a is bent into a "b" shape to weld the upper end bent vertically with the tantalum element 21 and the horizontal portion of the pellet 20 The bottom surface of the epoxy mold layer 10 is fixed on the bottom surface of the epoxy mold layer 10 by fixing with a conductive adhesive on the bottom surface and the cathode lead wire 30b having a "-" shape. It is an object of the present invention to provide a series of electrode-movable tantalum capacitors in contact.

본 발명은 각형 펠릿을 에폭시 몰드층에 매설하여 양측 리드선중 양극리드선은 펠릿의 탄탈소자에 용접하고, 음극리드선은 도전성 접착제로 펠릿의 주면상에 접촉하여 노출된 부위를 각기 에폭시 몰드층의 주면상에 접촉시킨 탄탈콘덴서에 있어서, 상기 양극리드선(30a)을 "ㄴ"형으로 절곡하여 수직으로 절곡된 상단부를 탄탈소자(21)의 직하방과 용접함과 아울러 수평부위를 펠릿(20)의 저면에 도전성 접착제로 고정하고 음극리드선(30b)은 "-"형으로 형성하여 펠릿(20)의 저면에 도전성 접착제로 고정하여 상기 노출된 양측 리드선 부위를 에폭시몰드층(10)의 저면상에 각각 접촉하여 된 구조이다.According to the present invention, a rectangular pellet is embedded in an epoxy mold layer, and the anode lead wire of both lead wires is welded to the tantalum element of the pellet, and the cathode lead wire is contacted on the main surface of the pellet with a conductive adhesive, and the exposed portions are respectively formed on the main surface of the epoxy mold layer. In the tantalum capacitor brought into contact with the tantalum capacitor, the positive lead wire 30a is bent into a "b" shape to weld the upper end bent vertically with the tantalum element 21 directly below, and the horizontal part is placed on the bottom surface of the pellet 20. Fixed with a conductive adhesive and the cathode lead wire (30b) is formed in a "-" shape to be fixed to the bottom surface of the pellet 20 with a conductive adhesive to contact the exposed both ends of the lead wire on the bottom surface of the epoxy mold layer 10, respectively Structure.

첨부도면 도 1은 본 발명 탄탈콘덴서의 측면도이고, 도 2는 종래 탄탈콘덴서의 측면도를 나타낸다.1 is a side view of a tantalum capacitor of the present invention, and FIG. 2 is a side view of a conventional tantalum capacitor.

이하 본 발명의 작용을 상세히 설명하면 다음과 같다.Hereinafter, the operation of the present invention will be described in detail.

본 발명은 탄탈콘덴서가 갖추어야할 기본적인 구성요소들은 종래와 같이 한다. According to the present invention, the basic components that a tantalum capacitor should have are as in the prior art.

다만 본 발명은 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance)을 최소화시키는 전도성 고분자 적용기술과 용량을 최대화 시킬 수 있도록 전극을 탄탈콘덴서의 저부로 이동 구성하고 있는 것이다.However, the present invention is configured to move the electrode to the bottom of the tantalum capacitor to maximize the application technology and capacity of the conductive polymer to minimize the equivalent series resistance (ESR: Equivalent Series Resistance) of the tantalum capacitor.

이는 종래와 같이 각형 펠릿(200)을 에폭시몰드층(100)에 매설하되, 양측 리드선중 양극리드선(310)은 "⊂"형태로 절곡하여 펠릿(200)의 탄탈소자(210)에 용접하고, "⊃"형태로 절곡된 음극리드선(320)은 도전성 접착제로 펠릿(200)의 주면상에 접촉하여 노출된 양측 리드선 부위를 각기 에폭시몰드층(100)의 주면상에 접촉시킨 구조를 탈피하여 상기 양극리드선(30a)을 "ㄴ"형으로 절곡하여 수직으로 절곡된 상단부를 탄탈소자(21)의 직하방과 용접함과 아울러 수평부위를 펠릿(20)의 저면에 도전성 접착제로 고정하고 음극리드선(30b)은 "-"형으로 형성하여 펠릿(20)의 저면에 도전성 접착제로 고정하여 상기 노출된 양측 리드선 부위를 에폭시몰드층(10)의 저면상에 각각 접촉하여 된 구조를 제공함으로서 탄탈콘덴서의 전극을 저부로 이동 구성하여 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance) 특성을 효과적으로 낮추게 됨은 물론 내부 소자의 볼륨 확대가 가능하여 탄탈콘덴서의 용량을 배가시킬 수 있게 되는 것이다.This embeds the square pellet 200 in the epoxy mold layer 100 as in the prior art, the anode lead wire 310 of both lead wires are bent in the form of "형태" and welded to the tantalum element 210 of the pellet 200, The negative lead wire 320 bent in a “⊃” shape is formed by contacting the lead wire portions exposed by contacting the main surface of the pellet 200 with the conductive adhesive on the main surface of the epoxy mold layer 100. The positive lead wire 30a is bent into a "b" shape to weld the upper end bent vertically with the tantalum element 21 directly below, and the horizontal part is fixed to the bottom of the pellet 20 with a conductive adhesive and the negative lead wire 30b ) Is formed in a "-" shape and is fixed to the bottom of the pellet 20 with a conductive adhesive to provide a structure in which the exposed lead wire portions are in contact with each other on the bottom of the epoxy mold layer 10, thereby providing an electrode of the tantalum capacitor. Move the bottom to the equivalent of tantalum capacitor Column resistance: doemeun lower the (ESR Equivalent Series Resistance) Properties of course possible to effectively enlarge the volume of the inner element and it is possible to double the capacity of the tantalum capacitor.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 설명하였으나 본 발명은 상기한 실시예에 한정되지 아니하며 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누 구든지 다양한 변형 실시가 가능한 것은 물론이고 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the above has been illustrated and described with respect to the preferred embodiment of the present invention, the present invention is not limited to the above-described embodiment without departing from the gist of the present invention claimed in the claims, having ordinary skill in the art to which the present invention pertains. Any modifications and modifications can be made by anyone, as such modifications are within the scope of the appended claims.

본 발명은 탄탈콘덴서의 전극을 저부로 이동 구성하여 탄탈콘덴서의 등가직렬저항 (ESR:Equivalent Series Resistance) 특성을 효과적으로 낮추도록 함은 물론 내부 소자의 볼륨 확대가 가능하여 탄탈콘덴서의 용량을 배가시킬 수 있게 되는 매우 유용한 발명이다.












The present invention can effectively reduce the ESR (Equivalent Series Resistance) characteristics of the tantalum capacitor by moving the electrode of the tantalum capacitor to the bottom, and can increase the volume of the internal element to double the capacity of the tantalum capacitor. It is a very useful invention.












Claims (1)

각형 펠릿을 에폭시 몰드층에 매설하여 양측 리드선중 양극리드선은 펠릿의 탄탈소자에 용접하고, 음극리드선은 도전성 접착제로 펠릿의 주면상에 접촉하여 노출된 부위를 각기 에폭시 몰드층의 주면상에 접촉시킨 탄탈콘덴서에 있어서, 상기 양극리드선(30a)을 "ㄴ"형으로 절곡하여 수직으로 절곡된 상단부를 탄탈소자(21)의 직하방과 용접함과 아울러 수평부위를 펠릿(20)의 저면에 도전성 접착제로 고정하고 음극리드선(30b)은 "-"형으로 형성하여 펠릿(20)의 저면에 도전성 접착제로 고정하여 상기 노출된 양측 리드선 부위를 에폭시몰드층(10)의 저면상에 각각 접촉하여 됨을 특징으로 하는 전극이동형 탄탈콘덴서.The square pellets were embedded in an epoxy mold layer, and the anode lead wires of the two lead wires were welded to the tantalum element of the pellets, and the cathode lead wires were contacted on the main surface of the pellets with a conductive adhesive, and the exposed portions were contacted on the main surface of the epoxy mold layer. In the tantalum capacitor, the anode lead wire 30a is bent into a "b" shape to weld the upper end bent vertically with the tantalum element 21 directly below, and the horizontal portion is coated with a conductive adhesive on the bottom of the pellet 20. Fixed and the cathode lead wire (30b) is formed in a "-" shape to be fixed to the bottom surface of the pellet 20 with a conductive adhesive to contact the exposed both sides of the lead wire on the bottom surface of the epoxy mold layer 10, characterized in that Electrode movable tantalum capacitor.
KR1020040070042A 2004-09-02 2004-09-02 Electrode Tantalum Capacitor Ceased KR20060021178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020040070042A KR20060021178A (en) 2004-09-02 2004-09-02 Electrode Tantalum Capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040070042A KR20060021178A (en) 2004-09-02 2004-09-02 Electrode Tantalum Capacitor

Publications (1)

Publication Number Publication Date
KR20060021178A true KR20060021178A (en) 2006-03-07

Family

ID=37128142

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040070042A Ceased KR20060021178A (en) 2004-09-02 2004-09-02 Electrode Tantalum Capacitor

Country Status (1)

Country Link
KR (1) KR20060021178A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132059B1 (en) * 2007-11-20 2012-04-02 산요덴키가부시키가이샤 Solid electrolytic condenser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132059B1 (en) * 2007-11-20 2012-04-02 산요덴키가부시키가이샤 Solid electrolytic condenser
US8149569B2 (en) 2007-11-20 2012-04-03 Sanyo Electric Co., Ltd. Solid electrolytic capacitor with cathode terminal and anode terminal
US8456804B2 (en) 2007-11-20 2013-06-04 Sanyo Electric Co., Ltd. Solid electrolytic capacitor with cathode terminal and anode terminal
KR101283069B1 (en) * 2007-11-20 2013-07-05 산요덴키가부시키가이샤 Solid electrolytic condenser

Similar Documents

Publication Publication Date Title
US7312979B2 (en) Stacked solid electrolytic capacitor
US7400492B2 (en) Multi-layered solid electrolytic capacitor and method of manufacturing same
US6791822B2 (en) Solid electrolytic capacitor
JP5879491B2 (en) Solid electrolytic capacitor
US20090116173A1 (en) Solid electrolytic capacitor
US10256046B2 (en) Solid electrolytic capacitor and method for making the same
US8014129B2 (en) Stacked solid electrolytic capacitor
US7573699B2 (en) Solid state electrolyte capacitor and manufacturing method thereof
KR20110027631A (en) ELECTROLYTE CAPACITOR ASSEMBLY WITH RESET CHANNEL AND MANUFACTURING METHOD
KR102700118B1 (en) Solid electrolytic capacitor
JP2008187091A (en) Solid electrolytic capacitor
KR101792382B1 (en) Composite electronic component and board having the same mounted thereon
US8344735B2 (en) Solid electrolytic capacitor
US20110205689A1 (en) Conductive Adhesive for Use in a Solid Electrolytic Capacitor
JP5484922B2 (en) Solid electrolytic capacitor
KR20060021178A (en) Electrode Tantalum Capacitor
JP2008198639A (en) Solid-state electrolytic capacitor
KR100850844B1 (en) Solid electrolytic capacitor, anode used for solid electrolytic capacitor, and method of manufacturing the anode
JP4688676B2 (en) Multilayer solid electrolytic capacitor and capacitor module
JP2002050545A (en) Chip type multilayer capacitor
CN218730186U (en) Novel paster electronic ceramic element
US8503166B2 (en) Solid electrolytic capacitor
US20230268135A1 (en) Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor
EP0607781A1 (en) Solid electrolytic capacitor
JP2006351609A (en) Solid electrolytic capacitor

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20040902

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20060323

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20060525

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20060323

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I