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KR20060021740A - O-ring - Google Patents

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Publication number
KR20060021740A
KR20060021740A KR1020040070610A KR20040070610A KR20060021740A KR 20060021740 A KR20060021740 A KR 20060021740A KR 1020040070610 A KR1020040070610 A KR 1020040070610A KR 20040070610 A KR20040070610 A KR 20040070610A KR 20060021740 A KR20060021740 A KR 20060021740A
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KR
South Korea
Prior art keywords
ring
process chamber
entrance
exit
door plate
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Withdrawn
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KR1020040070610A
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Korean (ko)
Inventor
정연철
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삼성전자주식회사
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Priority to KR1020040070610A priority Critical patent/KR20060021740A/en
Publication of KR20060021740A publication Critical patent/KR20060021740A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gasket Seals (AREA)
  • Sealing Devices (AREA)

Abstract

본 발명은 반도체용 프로세스 챔버의 입출구와 인너도어 사이에 개재되는 오 링에 관한 것으로, 프로세스 챔버의 입출구 주위에 형성된 기존의 오 링 설치홈에 삽입 설치되면서 도어판이 약간 기울어지게 입출구에 밀착되더라도 진공이 세는 불량을 억제하기 위해서, 프로세스 챔버의 입출구의 둘레 설치홈에 삽입되는 외경보다는 도어판에 밀착되는 부분의 외경이 상대적으로 크게 형성된 오 링을 제공한다.The present invention relates to an O-ring interposed between the entrance and exit of the process chamber for semiconductors and the inner door, even if the door plate is inclined in close contact with the entrance and exit while being inserted into the existing O-ring installation groove formed around the entrance and exit of the process chamber In order to suppress the counting failure, the O-ring is provided in which the outer diameter of the portion closely contacting the door plate is relatively larger than the outer diameter inserted into the circumferential installation groove of the inlet and outlet of the process chamber.

챔버(chamber), 실링(sealing), 진공, 오 링(O-ring), 리크(leak)Chamber, Sealing, Vacuum, O-Ring, Leak

Description

오 링{O-ring}O-ring

도 1은 프로세스 챔버의 입출구와 인너도어 사이에 종래기술에 따른 오 링이 개재되어 밀폐된 상태를 보여주는 도면이다.1 is a view showing a state in which the O-ring is sealed between the inlet and outlet of the process chamber and the inner door according to the prior art.

도 2는 도 1에서 프로세스 챔버의 입출구에 인너도어가 경사지게 밀착되어 진공이 누설되는 상태를 확대하여 보여주는 도면이다.FIG. 2 is an enlarged view of a state in which an inner door is inclined to be inclined to the inlet and outlet of the process chamber in FIG. 1 to leak a vacuum.

도 3은 본 발명의 실시예에 따른 오 링의 단면도이다.3 is a cross-sectional view of an o-ring according to an embodiment of the present invention.

도 4는 프로세스 챔버의 입출구와 인너도어 사이에 본 발명의 실시예에 따른 오 링이 개재되어 밀폐된 상태를 보여주는 도면이다.4 is a view showing a state in which the O-ring is interposed between the inlet and outlet of the process chamber and the inner door is interposed.

도 5는 프로세스 챔버의 입출구에 인너도어가 경사지게 밀착된 상태를 보여주는 도면이다.5 is a view showing a state in which the inner door is inclined in close contact with the inlet and outlet of the process chamber.

* 도면의 주요 부분에 대한 설명 *Description of the main parts of the drawing

40 : 프로세스 챔버 42 : 프로세스 공간40: process chamber 42: process space

44 : 입출구 45 : 설치홈44: entrance and exit 45: installation groove

46 : 척 50 : 인너 도어46: Chuck 50: Inner Door

52 : 구동축 54: 도어판52: drive shaft 54: door plate

60 : 오 링 62 : 제 1 밀착부60: o-ring 62: first contact portion

64 : 제 2 밀착부64: second close contact

본 발명은 오 링에 관한 것으로, 반도체용 프로세스 챔버의 입출구와 인너도어 사이에 개재되는 오 링에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an o-ring, and relates to an o-ring interposed between an inlet and an outlet of a semiconductor process chamber.

반도체 제조용 프로세스 챔버(process chamber)의 입출구와, 입출구를 개폐하는 인너 도어(inner door) 사이에 진공이 세는 것을 방지하기 위해서 일반적으로 오 링(O-ring)이 개재된다.O-rings are generally interposed in order to prevent the vacuum from counting between the inlet and outlet of the process chamber for semiconductor manufacturing and the inner door for opening and closing the inlet and outlet.

통상적으로 사용되는 오 링은 단면이 원의 형태를 갖는다.Commonly used o-rings have a circular cross section.

도 1은 프로세스 챔버(10)의 입출구(14)와 인너 도어(20) 사이에 종래기술에 따른 오 링(30)이 개재되어 밀폐된 상태를 보여주는 도면이다. 도 1을 참조하면, 프로세스 챔버(10)는 프로세스 공간(12)을 갖는 본체의 일측벽에 웨이퍼를 입출할 수 있는 입출구(14)가 형성되어 있고, 프로세스 공간(12)에 웨이퍼가 탑재되어 흡착되는 척(16)이 설치되어 있다.1 is a view showing a state in which the O-ring 30 according to the prior art is sealed between the entrance and exit 14 and the inner door 20 of the process chamber 10. Referring to FIG. 1, in the process chamber 10, an inlet and outlet 14 through which a wafer is inserted into and out of a main wall having a process space 12 is formed, and the wafer is mounted in the process space 12 to be adsorbed. The chuck 16 is provided.

프로세스 챔버의 입출구(14)는 인너 도어(20)에 의해 개폐된다. 그리고 입출구(14) 주위와 인너 도어(20)가 접촉하는 부분에 오 링(30)이 설치되어 인너 도어(20)에 의해 입출구(14)가 밀폐될 때 진공이 세는 것을 억제한다. 이때 오 링(30)은 입출구(14) 주위에 형성된 설치홈(15)에 반정도가 삽입되어 설치된다.The entrance and exit 14 of the process chamber is opened and closed by the inner door 20. And the O-ring 30 is provided in the part where the inlet / outlet 14 and the inner door 20 contact, and the vacuum is prevented from counting when the inlet / outlet 14 is closed by the inner door 20. At this time, the O-ring 30 is inserted into the installation groove 15 formed around the entrance and exit 14 is inserted half.

인너 도어(20)는 입출구(14)를 개폐하는 도어판(24)과, 도어판(24)을 이동시키는 구동축(22)을 포함한다. The inner door 20 includes a door plate 24 for opening and closing the entrance and exit 14, and a drive shaft 22 for moving the door plate 24.                         

따라서 인너 도어(20)는 구동축(22)의 이동에 따라서 도어판(24)이 입출구(14)에 밀착되어 프로세스 챔버(10)를 밀폐하게 된다.Accordingly, the inner door 20 is in close contact with the entrance and exit 14 of the door plate 24 in accordance with the movement of the drive shaft 22 to seal the process chamber 10.

그런데 인너 도어(20)로 입출구(14) 개폐를 반복하는 과정에서 구동축(22)의 축이 약간 틀어질 경우, 도 2에 도시된 바와 같이, 진공이 세는 공정 불량이 발생될 수 있다. 이와 같은 진공이 세는 불량은 구동축(22)의 축 틀어짐에 의해 입출구(14)의 둘레에 설치된 오 링(14)에 도어판(24)이 완전히 밀착되지 못하기 때문에 발생된다.However, when the shaft of the drive shaft 22 is slightly twisted in the process of repeatedly opening and closing the entrance and exit 14 to the inner door 20, as shown in FIG. 2, a process of counting vacuum may be generated. This vacuum counting failure occurs because the door plate 24 is not completely in close contact with the O-ring 14 provided around the inlet and outlet 14 due to the shaft twist of the drive shaft 22.

종래기술에 따른 오 링(30)은 단면이 원형 형태로 입출구(14)의 둘레에 접촉되는 면적과 밀착되는 도어판(24)에 면촉되는 면적이 거의 유사하기 때문에, 도어판(24)이 약간 기울어지게 입출구(14)에 밀착될 경우, 도어판(24)에서 상대적으로 높이가 높은 부분이 오 링(30)에 밀착되지 않는 경우가 발생될 수 있다. 그리고 이 부분을 통하여 진공이 세는 불량이 발생된다.Since the o-ring 30 according to the prior art has a similar cross-sectional area in contact with the door plate 24 in close contact with the area in contact with the circumference of the entrance and exit 14, the door plate 24 is slightly When inclined closely to the entrance and exit 14, a case where the relatively high portion of the door plate 24 is not in close contact with the O-ring 30 may occur. Through this part, a vacuum counting failure occurs.

물론 좀 더 직경이 큰 오 링을 사용함으로써 이와 같은 문제점을 어느 정도 해소할 수 있지만, 이 경우 오 링이 설치된 프로세스 챔버의 입출구 주위에 형성된 설치홈에 직경이 큰 오 링이 설치될 수 있도록 별도로 가공을 해야 하는 문제점이 있다.Of course, this problem can be solved to some extent by using a larger diameter O-ring, but in this case, it is processed separately so that a large diameter O-ring can be installed in the installation groove formed around the inlet and outlet of the process chamber in which the O-ring is installed. There is a problem that needs to be done.

따라서, 본 발명의 목적은 기존의 설치홈에 삽입 설치되면서 도어판이 약간 기울어지게 입출구에 밀착되더라도 진공이 세는 불량이 발생되지 않는 오 링을 제공 하는 데 있다.Accordingly, an object of the present invention is to provide an O-ring that does not occur in the vacuum counting failure even if the door plate is inclined in close contact with the entrance and exit while being installed in the existing installation groove.

상기 목적을 달성하기 위하여, 본 발명은 프로세스 챔버의 입출구의 둘레 설치되는 부분의 외경보다는 도어판에 밀착되는 부분의 외경이 상대적으로 크게 형성된 오 링을 제공한다.In order to achieve the above object, the present invention provides an o-ring formed with a relatively larger outer diameter of the portion that is in close contact with the door plate than the outer diameter of the portion installed around the entrance and exit of the process chamber.

이하, 첨부 도면을 참조하여 본 발명의 실시예를 보다 상세하게 설명하고자 한다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

도 3은 본 발명의 실시예에 따른 오 링(60)의 단면도이다. 도 3을 참조하면, 본 발명의 실시예에 따른 오 링(60)은 단면이 서로 다른 직경을 갖는 두 개의 반원이 서로 연결된 구조를 갖는다.3 is a cross sectional view of an o-ring 60 according to an embodiment of the invention. 3, the o-ring 60 according to the embodiment of the present invention has a structure in which two semicircles having different diameters in cross section are connected to each other.

즉, 종래의 오 링은 단면이 원형이었지만, 본 발명의 실시예에 따른 오 링(60)은 서로 다른 직경을 갖는 두 개의 반원이 서로 연결된 구조를 갖는다. 이때 오 링(60)에서 상대적으로 외경이 작은 부분을 제 1 밀착부(62)라 하고, 제 1 밀착부(62)에 대해서 상대적으로 외경이 큰 부분을 제 2 밀착부(64)라 한다.That is, although the conventional o-ring has a circular cross section, the o-ring 60 according to the embodiment of the present invention has a structure in which two semicircles having different diameters are connected to each other. In this case, a portion having a relatively small outer diameter in the o-ring 60 is called a first contact portion 62, and a portion having a relatively large outer diameter with respect to the first contact portion 62 is called a second contact portion 64.

이와 같은 본 발명의 실시예에 따른 오 링(60)이 개재되어 프로세스 챔버(40)의 입출구(44)가 인너 도어(50)에 의해 밀폐된 상태가 도 4에 도시되어 있다. 도 4를 참조하면, 프로세스 챔버(40)의 입출구(44)의 둘레의 설치홈(45)에 오 링의 제 1 밀착부(62)가 설치되고, 도어판(54)이 밀착되는 부분에 오 링의 제 2 밀착부(64)가 노출된다.4 illustrates a state in which the inlet and outlet 44 of the process chamber 40 is sealed by the inner door 50 through the o-ring 60 according to the exemplary embodiment of the present invention. Referring to FIG. 4, the first contact portion 62 of the O-ring is installed in the installation groove 45 around the entrance and exit 44 of the process chamber 40, and the door plate 54 is in close contact with the installation groove 45. The second contact 64 of the ring is exposed.

이때 제 1 밀착부(62)는 종래의 오 링의 외경과 동일한 외경을 갖도록 형성함으로써, 프로세스 챔버(40)의 입출구(44) 둘레의 설치홈(45)에 별도의 가공 없이 본 발명에 따른 오 링의 제 1 밀착부(62)를 삽입시킬 수 있다. 그리고 설치홈(45) 밖으로 돌출된 제 2 밀착부(64)는 제 1 밀착부(62)의 외경보다는 크기 때문에, 종래 보다는 도어판(54)과의 밀착 면적도 증가하고 도어판(54)과 입출구(44)의 외측면 사이에 공간도 더 많이 존재한다.At this time, the first contact portion 62 is formed to have the same outer diameter as that of the conventional O-ring, so that the installation groove 45 around the inlet and outlet 44 of the process chamber 40 without any additional processing according to the present invention The first contact portion 62 of the ring can be inserted. In addition, since the second contact portion 64 protruding out of the installation groove 45 is larger than the outer diameter of the first contact portion 62, the contact area with the door plate 54 is increased and the door plate 54 and the door plate 54 are increased. There is also more space between the outer surfaces of the inlet and outlet 44.

따라서 종래의 오 링이 설치된 프로세스 챔버의 입출구에 본 발명에 따른 오 링(60)을 설치하면서, 도어판(54)이 밀착되는 부분의 제 2 밀착부(64)의 외경이 종래의 오 링의 외경보다 커 접촉 면적이 넓어지고 도어판(54)과 입출구(44)가 형성된 면 사이의 거리도 더 많이 존해하기 때문에, 도 4에 도시된 바와 같이, 도어판(54)이 약간 기울어지게 입출구(44)에 밀착되어라도 도어판(54)에 오 링의 제 2 밀착부(64)가 밀착되어 진공이 세는 불량을 억제할 수 있다.Therefore, while installing the o-ring 60 according to the present invention at the inlet and outlet of the process chamber in which the conventional o-ring is installed, the outer diameter of the second contact portion 64 of the portion where the door plate 54 is in close contact with the conventional o-ring is Since the contact area is wider than the outer diameter and the distance between the door plate 54 and the surface on which the inlet / outlet 44 is formed also exists, the door plate 54 is slightly inclined as shown in FIG. 4. Even if it is in close contact with 44, the second close contact portion 64 of the o-ring is in close contact with the door plate 54, so that the vacuum counting failure can be suppressed.

한편, 본 명세서와 도면에 개시된 본 발명의 실시예들은 이해를 돕기 위해 특정 예를 제시한 것에 지나지 않으며, 본 발명의 범위를 한정하고자 하는 것은 아니다. 여기에 개시된 실시예들 이외에도 본 발명의 기술적 사상에 바탕을 둔 다른 변형예들이 실시 가능하다는 것은, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 자명한 것이다. On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented.

따라서, 본 발명의 구조를 따르면 프로세스 챔버의 입출구 주위의 설치 홈에 삽입되는 부분의 직경보다는 설치 홈 밖으로 노출되는 부분의 직경이 상대적으로 큰 오 링을 제공함으로써, 종래의 오 링이 설치된 프로세스 챔버의 입출구에 본 발명에 따른 오 링을 설치하면서, 도어판이 밀착되는 부분의 오 링의 외경이 종래의 외경보다 커 접촉 면적이 넓어지기 때문에, 도 4에 도시된 바와 같이, 도어판이 약가 기울어지게 입출구에 밀착되어라도 도어판에 오 링의 제 2 밀착부가 밀착되어 진공이 세는 불량을 억제할 수 있다.Therefore, according to the structure of the present invention, by providing an o-ring having a relatively larger diameter of the portion exposed out of the installation groove than the diameter of the portion inserted into the installation groove around the entrance and exit of the process chamber, While the O-ring according to the present invention is installed at the inlet and outlet, the outer diameter of the O-ring at the portion where the door plate is in close contact is larger than the conventional outer diameter, so that the contact area is widened, as shown in FIG. Even if it is in close contact with the door plate, the second close contact portion of the O-ring is in close contact with each other to suppress a poor vacuum.

Claims (2)

반도체용 프로세스 챔버의 입출구와 인너도어 사이에 개재되는 오 링으로,O-ring interposed between the entrance and exit of the process chamber for semiconductor and the inner door, 상기 프로세스 챔버의 입출구의 둘레에 형성된 설치홈에 삽입되는 제 1 밀착부와;A first contact portion inserted into an installation groove formed around the entrance and exit of the process chamber; 상기 제 1 밀착부와 일체로 형성되어 상기 도어판에 밀착되는 제 2 밀착부를 포함하며,A second contact part formed integrally with the first contact part and in close contact with the door plate; 상기 제 1 밀착부가 상기 제 2 밀착부보다는 외경이 상대적으로 큰 것을 특징으로 하는 오 링.And the first contact portion has a larger outer diameter than the second contact portion. 제 1항에 있어서, 상기 제 1 및 제 2 밀착부는 단면이 반원인 것을 특징으로 하는 오 링.The o-ring according to claim 1, wherein the first and second contact portions are semicircular in cross section.
KR1020040070610A 2004-09-04 2004-09-04 O-ring Withdrawn KR20060021740A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9903651B2 (en) 2013-12-23 2018-02-27 Samsung Electronics Co., Ltd. Sealing member and substrate processing apparatus including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9903651B2 (en) 2013-12-23 2018-02-27 Samsung Electronics Co., Ltd. Sealing member and substrate processing apparatus including the same

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