KR20060015425A - How to Play Camera Module - Google Patents

Abstract

The present invention relates to a method for reproducing a camera module which is reassembled after removing a defective factor of a camera module determined to be defective during a camera module manufacturing process.

The present invention is a lens installed on one side, the image sensor is installed on the other side of the camera module consisting of a housing fixed to the adhesive to check whether the defect; Separating the housing by removing the adhesive when the kind of the defect of the camera module which is identified as the defect is a defect of the foreign matter on the image sensor; Removing foreign matter adhering to the surface of the image sensor; Reassembling the camera module; And checking whether the camera module is defective.

Camera module, playback, image sensor

Description

Reproduction Method of Camera Module

1 and 2 are cross-sectional views for explaining the structure of the camera module applied to the present invention.

3 and 4 are exemplary views for explaining a method of applying heat to a housing for regenerating a camera module according to the present invention.

5 and 6 are exemplary views for explaining a method for removing foreign matter in the camera module according to the present invention.

Figure 7 is an exemplary view for explaining the configuration of the ultrasonic generator used in the present invention.

Explanation of symbols on the main parts of the drawings

10, 20: housing 11, 21: lens

12, 22: filter 13, 23: image sensor

14, 24: substrate 15, 25: FPCB

16, 26: connector 17, 27: adhesive

28: gold bump

The present invention relates to a method for reproducing a camera module, and more particularly, to a method for reproducing a camera module after reassembly after removing a defective factor of a camera module determined to be defective during a camera module manufacturing process.

In general, a camera module mounted on a mobile communication terminal such as a cellular phone and a camera for an image chat is an apparatus for obtaining an image by converting an optical signal into an electrical signal using an image sensor such as a CCD or a CMOS.

The camera module is mainly composed of a lens, a housing, a filter, an image sensor, and a substrate, and is composed of a COB (Chip On Board) type and a COF type (Chip On Flexible Printed Circuit or Chip On Film) according to the configuration of the image sensor. do.

As shown in FIG. 1, the COB type camera module includes an image sensor 13 for converting an optical signal into an electrical signal, a circuit formed thereon, and a substrate 14 on which the image sensor 13 is mounted. FPCB 15 connected to the input / output circuit of (14), a connector (16) connected to an end of the FPCB (15) for transferring image data, and an edge portion thereof around the substrate (14). 17 is installed between the housing 10 fixed through the lens, the lens 11 installed in the light incident portion of the housing 10, and the lens 11 and the image sensor 13 to emit infrared or ultraviolet rays. The filter 12 etc. which cut off are comprised.

In some cases, the filter 12 may be attached to the lens 11, and the lens 11 may be a camera module having a zoom function or an auto focus function. Although an actuator for driving the actuator is further configured inside the housing 10, the structure of most camera modules does not deviate significantly from the general structure as shown in FIG.

On the other hand, the COF type camera module, as shown in Figure 2, the housing 20, the lens 21 is mounted, the filter 22 mounted on the lower end of the housing 20, the optical path through which light passes Is formed and mounted on the lower surface of the filter 22, the connector 26 connected to one end of the FPCB 25, and the gold bump on the lower surface of the FPCB 25 on the optical path It consists of an image sensor 23 and a substrate 24 mounted via 28.

Accordingly, since the image sensor 23 and the substrate 24 are mounted on the flexible FPCB 25, the substrate 24 may also be made of a flexible material.

The camera module configured as described above is determined whether or not defective in the quality inspection process after being completely assembled. If the foreign matter is deposited on the image sensors 13 and 23, it is determined to be a defective product because it causes a pixel defect. If it is sold or classified as a low water supply, it is disposed of if there is no special use or if the contamination problem is severe.

In particular, the failure processing method of the camera module as described above is not caused by a structural failure or a functional failure of the camera module, so a problem occurs in consideration of a processing method other than the disposal processing.

Accordingly, the present invention has been made in view of the problems of the prior art, and its purpose is not a structural or functional defect, but a reproduction method of a camera module that increases productivity by reproducing and processing a camera module contaminated with foreign matter removable in an image sensor. To provide.

In order to achieve the above object, the present invention (a) a lens is installed on one side, the image sensor is installed on the other side of the substrate is confirmed whether the camera module made of a housing fixed by the adhesive; (b) separating the housing by removing the adhesive when the kind of the defect of the camera module which is identified as the defect is a defect due to the foreign matter on the image sensor; (c) removing foreign matter adhering to the surface of the image sensor; (d) reassembling the camera module; And (e) checking whether the camera module is defective or not.

In the step (b), when the adhesive part is bonded with epoxy, heat is separated and a method of applying heat is by using an indirect heating method using hot air or a direct heating method by contacting a heat source, or by applying the camera module to a liquid. After immersion, ultrasonication is applied to deteriorate the adhesive.

Step (c) is a step of washing by spraying distilled water; Spraying any one selected from nitrogen gas, air, and carbon dioxide, or drying the material, or separating foreign matter using an ultrasonic cleaner, or irradiating a laser to the foreign material to separate the image from the image sensor. It is made by spraying and removing either one.

(Example)

The present invention comprises a process of disassembling the housing and the filter in the camera module, and a process of removing the foreign matter from the image sensor. Hereinafter, the disassembly process and the foreign matter removing process of the camera module will be described separately in each embodiment.

1. First Embodiment (First Dismantling Method of Camera Module)

The first embodiment of the present invention will be described using a COB type or a COF type camera module as shown in Figs.

The image sensor 13 of the camera module of the COB type is mounted on the substrate 14 and has a structure that is coupled to each other by the housing 10 and the adhesive part 17.

The camera module of the COF type is coupled to the gold bump 28 portion on the image sensor 23 through the lead of the FPCB 25, and the FPCB 25, the filter 22, and the housing 20. ) Are bonded to each other by the adhesive portion 27.

The adhesive parts 17 and 27 are usually bonded by epoxy, which is a curable resin, and the epoxy deteriorates when the heat is applied to the adhesive, so that the housings 10 and 20 and the filters 12 and 22 can be separated. .

Therefore, in the present invention, in order to separate the housings 10 and 20 and the filters 12 and 22 coupled as described above, as shown in FIGS. 3 and 4, after fixing the camera module to a jig, a hot air fan ( 30) or the heater 35 is used to deteriorate the epoxy of the bonding portions 17 and 27.

At this time, if a large amount of heat is applied to the adhesive parts 17 and 27 at once, the housings 10 and 20 and the filters 12 and 22 may be deteriorated and damaged. Therefore, when the hot air blower 30 is used, Heat is applied at intervals of 10 to 20 seconds while maintaining the distance between the housings 10 and 20 and the filters 12 and 22 at about 5 to 15 cm, and when using the heater 35, the temperature of the heater 35 is 130 to 170. The heat must be transferred to the housings 10 and 20 and the filters 12 and 22 at intervals of 10 to 20 seconds while maintaining the temperature of the epoxy to deteriorate the damage of the housings 10 and 20 due to thermal stress.

After the epoxy is deteriorated and removed as described above, the housings 10 and 20 and the filters 12 and 22 are separated using a teaser or another tool.

2. Second Embodiment (Second Disassembly Method of Camera Module)

The second embodiment of the present invention is a method of deteriorating the epoxy of the bonding portions 17 and 27 using ultrasonic waves.

First, insert the same solution in an ultrasonic cleaner with alcohol-based cleaning agent is Jess Tron ^R (ZESTRON ^R) and IPA (Iso Propyl Alcohol), while maintaining the temperature of the solution is about 40 ~ 50 ℃ the ultrasound for 3-10 minutes do. At this time, the time for applying the ultrasonic wave is changed according to the type of epoxy used.

After the ultrasonic treatment as described above, when the camera module is taken out and the housings 10 and 20 and the filter 22 are pulled out, the epoxy deteriorates by the ultrasonic waves and easily falls off.

On the other hand, when the epoxy of the adhesive parts 17 and 27 is deteriorated using the ultrasonic cleaner as described above, ultrasonic energy is also transmitted to the parts other than the adhesive parts 17 and 27, and the housings 10 and 20 may be damaged. In the present invention, in order to solve such a problem, the ultrasonic wave may be locally transmitted only to the adhesive parts 17 and 27 of the camera module by using the ultrasonic wave generator as shown in FIG. 7.

That is, the ultrasonic generator according to the present invention, as shown in Figure 7, the ultrasonic bath 70 is accommodated in the solution 78 having a function of efficiently delivering the ultrasonic wave, and the motor in the center of the ultrasonic bath 70 The jig 74 is rotatably installed by the 74 to mount the camera module, and the adhesive parts 17 and 27 of the camera module installed on one side of the ultrasonic bath 70 and mounted to the jig 74. The focal plane 73 is formed of an ultrasonic element 72 for generating ultrasonic waves.

The ultrasonic generator configured as described above is provided only at the focal plane 73 formed on the adhesive parts 17 and 27 formed around the housings 10 and 20 of the camera module mounted on the jig 74. Since the generated ultrasonic waves are delivered locally and intensively, ultrasonic energy is weakly transmitted to other parts to prevent damage to other parts of the camera module.

In addition, although the ultrasonic elements 72 are installed only on one side of the ultrasonic bath 70 in FIG. 7, two or more ultrasonic elements 72 may be installed and operated in some cases.

In addition, since the diameters of the housings 10 and 20 vary according to the type of the camera module, the distance between the ultrasonic element 70 and the camera module mounted on the jig 74 is changed, so that the ultrasonic element 72 may occur. The position of the focal plane 73 to be changed also.

However, since the position of the focal plane 73 is fixed due to the characteristics of the ultrasonic element 72, it should be possible to change the position of the focal plane 73 by changing the position of the ultrasonic element 72. However, if the ultrasonic device capable of adjusting the focal length, the focal length 73 may be adjusted by adjusting the focal length instead of moving the focal plane 73 according to the positional movement.

In the case of using the ultrasonic generator configured as described above, in order to prevent the ultrasonic energy from being blocked by the FPCBs 15 and 25 which are the components of the camera module, the fixed end 76 is provided on one side of the jig 74. And discontinue the transmission of ultrasonic energy by the FPCB 15. 25 by pulling the fixed ends 76 and the end portions of the FPCBs 15 and 25 toward the jig 74 and fixing them using the fixing line 77. Can be prevented.

Although the ultrasonic generator using FIG. 7 has been described with the jig 74 rotating in a horizontal state as an example, in some cases, the jig 74 is installed on the side of the ultrasonic bath 70 and the ultrasonic element is provided. 72 may be installed and operated at the upper end of the ultrasonic bath 70.

After removing the housings 10 and 20 and the filters 12 and 22 in the same manner as in the first and second embodiments, in order to remove foreign substances on the surfaces of the image sensors 13 and 23. There are several ways to do this, and you can remove it in one of the following ways:

3. Third embodiment

The third embodiment of the present invention is an embodiment consisting of a cleaning process and a drying process. First, the camera module is fixed on a spin dryer or a rotary table by vacuum fixing or tape fixing.

After distilled water is washed by high pressure injection, as shown in FIGS. 5 and 6, nitrogen gas (N ₂ ), air (Air) or carbon dioxide gas (CO ₂ ) is injected and dried. In some cases, it may be removed by spraying nitrogen gas (N ₂ ), air (Air) or carbon dioxide gas (CO ₂ ) without washing with distilled water.

At this time, in order to increase the removal efficiency during the cleaning or drying process as described above, while rotating the spin dryer or the rotary table at 500 ~ 1500rpm should be cleaned for about 60sec or more.

4. Fourth embodiment

The fourth embodiment of the present invention relates to an ultrasonic cleaning method, wherein vertical or image sensors (13, 23) are mounted using a jig of the camera module in an ultrasonic cleaner containing distilled water or an organic solvent such as IPA (Iso Propyl Alcohol). It is a method of washing by generating ultrasonic waves after immersing downward.

3. Fifth Embodiment

In a fifth embodiment of the present invention, a foreign material is removed using a laser. After mounting the camera module in a vacuum chamber, the laser beam is irradiated to about 100 μm in front of the foreign matter to surface the image sensors 13 and 23. After separating the foreign matter from the nitrogen gas (N ₂ ) or air (CO) or by spraying carbon dioxide gas (CO ₂ ) consists of the process of removing the foreign matter.

When the foreign matter on the surface of the image sensor 13, 23 is removed in the above manner, the housing 10, 20 is epoxy attached to the substrate 14 or the FPCB 25, and then the epoxy curing oven Inject to cure the epoxy.

Then, an image inspection is performed on the reproduced camera module to confirm whether there is any defect.

The present invention made as described above provides an effect of increasing the productivity by reproducing what is determined to be defective due to foreign matter on the image sensor of the camera module.

In the above, the present invention has been illustrated and described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments and the general knowledge in the technical field to which the present invention pertains without departing from the spirit of the present invention. Various changes and modifications will be made by those who possess.

Claims (7)

(a) checking whether the lens is installed at one side, and whether the camera module made of a housing in which the substrate on which the image sensor is installed at the other side is fixed by an adhesive; (b) separating the housing by removing the adhesive when the kind of the defect of the camera module which is identified as the defect is a defect due to the foreign matter on the image sensor; (c) removing foreign matter adhering to the surface of the image sensor; (d) reassembling the camera module; And (e) checking whether the camera module is defective; Playback method of the camera module comprising a. The method of claim 1, wherein the step (b) deteriorates the adhesive by applying heat when the adhesive is epoxy. The method of claim 2, wherein the heat is transferred by an indirect heating method using hot air or a direct heating method by heat source contact. The method of claim 1, wherein the step (b) is performed by immersing the camera module in a liquid and applying ultrasonic waves to deteriorate the adhesive. Step (c) is a step of washing by spraying distilled water; A method of regenerating a camera module, characterized in that the step of drying by spraying any one selected from nitrogen gas, air, carbon dioxide. The step (c) is a playback method of the camera module, characterized in that for separating the foreign matter by using an ultrasonic cleaner. The step (c) of the camera module playback method characterized in that by irradiating a laser to the foreign material and separated from the image sensor by spraying any one selected from nitrogen gas, air, carbon dioxide.

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