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KR200462936Y1 - Water pump with a circuit having heat dissipating apparatus - Google Patents

Water pump with a circuit having heat dissipating apparatus Download PDF

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Publication number
KR200462936Y1
KR200462936Y1 KR2020100000857U KR20100000857U KR200462936Y1 KR 200462936 Y1 KR200462936 Y1 KR 200462936Y1 KR 2020100000857 U KR2020100000857 U KR 2020100000857U KR 20100000857 U KR20100000857 U KR 20100000857U KR 200462936 Y1 KR200462936 Y1 KR 200462936Y1
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South Korea
Prior art keywords
cover
motor
housing
transistor
water pump
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Expired - Fee Related
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KR2020100000857U
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Korean (ko)
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KR20110007629U (en
Inventor
서우-시웅 황
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왈러스 펌프 코퍼레이션 리미티드
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0606—Canned motor pumps
    • F04D13/064—Details of the magnetic circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/007—Details, component parts, or accessories especially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/02—Selection of particular materials
    • F04D29/026—Selection of particular materials especially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/406—Casings; Connections of working fluid especially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/605—Mounting; Assembling; Disassembling specially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2210/00—Working fluids
    • F05D2210/10—Kind or type
    • F05D2210/11—Kind or type liquid, i.e. incompressible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2260/00—Function
    • F05D2260/60—Fluid transfer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S415/00—Rotary kinetic fluid motors or pumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S417/00—Pumps

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

본 고안은 회로 방열 구조를 구비한 물 펌프에 관한 것으로, 이는 모터, 펌프 하우징 및 본체 커버를 구비하고, 펌프 하우징의 일단과 모터 하우징은 서로 연결되고 본체 커버는 펌프 하우징의 타단에 설치된다. 그 중, 모터 하우징과 펌프 하우징의 연결위치에 금속으로 제작된 커버가 설치되고, 모터 하우징을 향하고 있는 커버의 일 측면에 고정 시트가 고정설치되고, 고정 시트 내에 커버와 접촉하는 트랜지스터가 설치되고 물 펌프가 작동될 때 물이 커버의 다른 일 측면에서 유동하게 된다. 또한 트랜지스터와 커버가 접촉되어 있으므로 트랜지스터에 생성된 열량이 커버에 전달하게 된다. 커버의 다른 일측면이 물과 접촉하고 있어 커버에 전달된 열량이 물에 의해 빼앗기게 되므로 상기 트랜지스터의 온도를 낮추는 목적에 도달하게 된다. The present invention relates to a water pump having a circuit heat dissipation structure, which includes a motor, a pump housing and a body cover, wherein one end of the pump housing and the motor housing are connected to each other and the body cover is installed at the other end of the pump housing. Among them, a cover made of metal is installed at a connection position between the motor housing and the pump housing, a fixing sheet is fixedly installed on one side of the cover facing the motor housing, and a transistor in contact with the cover is installed in the fixing sheet and water When the pump is running water will flow on the other side of the cover. In addition, since the transistor is in contact with the cover, the heat generated in the transistor is transferred to the cover. Since the other side of the cover is in contact with water, the heat transferred to the cover is taken away by the water, thereby reaching the purpose of lowering the temperature of the transistor.

Description

회로 방열 구조를 구비한 물 펌프{WATER PUMP WITH A CIRCUIT HAVING HEAT DISSIPATING APPARATUS}WATER PUMP WITH A CIRCUIT HAVING HEAT DISSIPATING APPARATUS}

본 고안은 회로 방열 구조를 구비한 물 펌프에 관한 것으로, 물의 유동과 금속의 열전도성에 의해 방열 효과에 도달하는 회로 방열 구조를 구비한 물 펌프를 제공한다. The present invention relates to a water pump having a circuit heat dissipation structure, and provides a water pump having a circuit heat dissipation structure that reaches a heat dissipation effect by the flow of water and the thermal conductivity of the metal.

인간의 일상 생활에서 수돗물이 없어서는 안 되며 또한 수돗물의 공급은 반드시 물 펌프에 의해서 이루어진다. 낮은 곳의 물에 대해 가압하여 높은 곳의 급수탑에 수송하고 사람들이 나중에 사용하도록 한다. 그러므로 물 펌프는 사람들의 일상 생활을 떠날 수 없다. In human daily life, tap water is indispensable, and tap water must be supplied by a water pump. Pressurize against low water and transport it to high water towers for later use. Therefore, the water pump can not leave people's daily life.

물 펌프는 모터 및 펌프 하우징 두 부분을 포함한다. 하지만 단순히 모터와 펌프 하우징을 가지고서는 물 펌프를 구동할 수 없다. 물 펌프에 있어서, 모터는 회로에 의해 제어되며 이렇게 해야 만이 모터를 구동하고 온/오프할 수 있다. 그러나 회로가 작동하는 과정에 많은 열을 생성하므로 히트 싱크(heat sink)에 의해서만이 방열하는 효과에 도달할 수 있다.The water pump includes two parts, the motor and the pump housing. However, simply using a motor and pump housing cannot drive the water pump. In a water pump, the motor is controlled by a circuit so it can only drive and turn the motor on and off. However, as the circuit generates a lot of heat in the process of operation, the heat dissipation effect can only be reached by a heat sink.

도 5 내지 도 7에 도시한 바와 같이, 종래 물 펌프의 회로 방열 구조에 있어서, 펌프 하우징(40)의 일단에 챔버(41)가 형성되고, 챔버(41) 내에 모터(60)를 제어할 수 있는 회로판(50)이 설치되고, 상기 회로판(50)에 트랜지스터(51)가 설치되고, 트랜지스터(51) 위에 히트 싱크(52)가 고정 설치된다. 5 to 7, in the circuit heat dissipation structure of the conventional water pump, the chamber 41 is formed at one end of the pump housing 40, the motor 60 can be controlled in the chamber 41. A circuit board 50 is provided, a transistor 51 is provided on the circuit board 50, and a heat sink 52 is fixedly installed on the transistor 51.

도 5를 다시 참조하면, 모터(60)와 펌프 하우징(40)을 결합한 후, 회로판(50)은 펌프 하우징(40)의 챔버(41) 내에 완전히 밀폐된다. 트랜지스터(51)는 작동 과정에 많은 열을 생성하므로 반드시 히트 싱크(52)를 통해서 온도를 낮춰야 한다. Referring again to FIG. 5, after coupling the motor 60 and the pump housing 40, the circuit board 50 is completely enclosed in the chamber 41 of the pump housing 40. Since the transistor 51 generates a lot of heat during operation, the temperature must be lowered through the heat sink 52.

하지만, 앞서 설명한 회로판(50)은 밀폐된 공간 내에 설치되므로 히트 싱크(52)가 방출한 열 에너지가 챔버(41)내에 모이게 된다. 일정한 시간이 지나면 상기 열 에너지에 의해 트랜지스터(51)가 과열손상되는 동시에 물 펌프가 작동할 수 없게 되어 사람들의 생활에 불편을 끼친다.However, since the circuit board 50 described above is installed in a closed space, the heat energy emitted by the heat sink 52 is collected in the chamber 41. After a certain time, the thermal energy causes the transistor 51 to overheat, and at the same time, the water pump becomes inoperable, causing inconvenience to people's lives.

본 고안의 발명인은 상기 종래 기술이 실제 사용상에 여전히 결함이 존재하는 것을 고려하여, 이를 다시 설계하여 물이 흐르는 위치에 커패시터를 설치하고 흐르는 물을 통해 온도를 낮추는 효과에 도달하는 것을 목적으로 한다. The inventors of the present invention aim to attain the effect of lowering the temperature through the flowing water by installing a capacitor in a position where water flows, considering that the prior art still has defects in actual use.

상기 발명의 목적에 도달하기 위하여, 본 고안은 회로 방열 구조를 구비한 물 펌프를 제공한다. 그 중 모터 하우징과 펌프 하우징의 결합부에 금속으로 제작된 커버가 설치되고, 모터 하우징을 향하고 있는 커버의 일측면에 고정 시트가 고정설치되며, 고정 시트 내에 커버와 접촉하는 트랜지스터가 설치된다.In order to reach the object of the present invention, the present invention provides a water pump having a circuit heat dissipation structure. Among them, a cover made of metal is installed in the coupling portion of the motor housing and the pump housing, a fixing sheet is fixedly installed on one side of the cover facing the motor housing, and a transistor in contact with the cover is installed in the fixing sheet.

물 펌프가 작동할 때 물은 커버의 다른 일 측면에서 유동하게 된다. 트랜지스터와 커버가 접촉하고 있으므로 트랜지스터에 생성된 열량이 커버에 전달하게 된다. 또한 커버의 다른 일측면이 물과 접촉하고 있어 커버에 전달된 열량은 물에 의해 빼앗기게 되므로 트랜지스터의 온도를 낮추는 목적에 도달한다.When the water pump is running water will flow on the other side of the cover. Since the transistor is in contact with the cover, the heat generated in the transistor is transferred to the cover. In addition, since the other side of the cover is in contact with water, the heat transferred to the cover is taken away by the water, thereby reaching the purpose of lowering the temperature of the transistor.

물이 쉬지않고 유동하고 있으므로 트랜지스터에 생성된 열량은 계속 물에 의해 빼앗기게 되므로 트랜지스터가 과열손상됨으로써 사람들의 생활에 불편을 끼치는 문제가 발생하지 않는다. Since the water flows without stopping, the heat generated in the transistor is continuously taken away by the water, so that the transistor is not overheated and does not cause inconvenience to people's lives.

도 1은 본 고안에 따른 회로 방열 구조의 분리상태를 나타낸 사시도이다.
도 2는 본 고안에 따른 회로 방열 구조와 펌프 하우징을 결합한 사시도이다.
도 3은 본 고안에 따른 회로 방열 구조의 고정 시트의 단면도이다.
도 4는 본 고안에 따른 회로 방열 구조의 단면도이다.
도 5는 종래의 물 펌프의 단면도이다.
도 6은 종래의 회로 방열 구조의 사시도이다.
도 7은 종래의 회로 방열 구조와 펌프 하우징을 결합한 사시도이다.1 is a perspective view showing a separated state of the circuit heat dissipation structure according to the present invention.
2 is a perspective view illustrating a circuit heat dissipation structure and a pump housing according to the present invention.
3 is a cross-sectional view of the fixing sheet of the circuit heat dissipation structure according to the present invention.
4 is a cross-sectional view of a circuit heat dissipation structure according to the present invention.
5 is a cross-sectional view of a conventional water pump.
6 is a perspective view of a conventional circuit heat dissipation structure.
7 is a perspective view of a combination of the conventional circuit heat dissipation structure and the pump housing.

도 1 내지 도 4에 도시한 바와 같이, 본 고안에 따른 회로 방열 구조의 물 펌프에 있어서, 펌프 하우징(10) 내에 챔버(11)가 형성되고, 챔버(11) 내에 모터(11)를 제어하는 회로판(23)이 설치된다. 1 to 4, in the water pump having a circuit heat dissipation structure according to the present invention, a chamber 11 is formed in the pump housing 10, and the motor 11 is controlled in the chamber 11. The circuit board 23 is provided.

모터(30)는 모터 하우징에 수용되고, 펌프 하우징(10)의 일단과 모터 하우징이 서로 연결되고 연결부위에 금속으로 제작된 커버(20)가 설치되고, 상기 커버(20)의 가장자리(邊緣, edge)는 펌프 하우징(10)과 모터 하우징 사이에 삽입 설치되고, 모터(30)를 향하고 있는 커버(20)의 일측면에 중공된 고정 시트(21)가 고정설치된다.The motor 30 is accommodated in the motor housing, and one end of the pump housing 10 and the motor housing are connected to each other, and a cover 20 made of metal is installed at the connection portion, and the edges of the cover 20 The edge is inserted between the pump housing 10 and the motor housing, and the hollow fixing sheet 21 is fixedly installed on one side of the cover 20 facing the motor 30.

고정 시트(21) 내에 커버(20)와 접촉하고 있는 트랜지스터(25)가 설치되고, 고정 시트(21)의 중공(中空) 부위에 트랜지스터(25)를 보호하고 물기를 차단하는 절연 겔(211)이 충진되어 있다. 상기 트랜지스터(25)에 회로판(23)과 서로 연결되는 전원선(24)이 설치되고 커버(20)의 중앙에 모터(30)의 회전축(31)이 관통하는 천공(22)이 형성되어 있다. The transistor 25 in contact with the cover 20 is provided in the fixed sheet 21, and the insulating gel 211 protects the transistor 25 and blocks moisture in the hollow portion of the fixed sheet 21. Is filled. A power supply line 24 connected to the circuit board 23 and the circuit board 23 is installed in the transistor 25, and a perforation 22 is formed in the center of the cover 20 to penetrate the rotation shaft 31 of the motor 30.

상기 본체 커버(12)는 외부 커버(121) 및 라이닝(122)을 포함한다. 그 중 외부 커버(121)는 금속 재질로 성형해서 이루어진 내부가 오목한 용기이고 펌프 하우징(10)의 단부에 고정된다. 그리고 라이닝(122)은 공정 플라스틱재질로 성형해서 이루어진 내부가 오목한 용기이며 외부 커버(121)의 내부 오목한 수용 공간 내에 바로 고정될 수 있다. The body cover 12 includes an outer cover 121 and a lining 122. Among them, the outer cover 121 is a concave container made of a metal material and is fixed to an end of the pump housing 10. In addition, the lining 122 is a concave container formed by forming a process plastic material and may be directly fixed in the inner concave accommodation space of the outer cover 121.

그리하여 외부 커버(121)와 라이닝(122)이 결합하여 본체 커버(12)를 형성하고, 본체 커버(12)가 펌프 하우징(10)의 단부를 커버할 때, 라이닝(122)의 재질이 공정 플라스틱이므로 물과 접촉해도 부식되지 않는다. 또한 외부 커버(121)는 금속재질이므로 라이닝(122)의 외측을 커버할 때, 물 펌프의 작동에 의해 발생한 수압 또는 수온이 지나치게 높아 라이닝(122)이 심하게 변형되어 파열되는 것을 방지한다. 게다가 외부 커버(121)의 윗면과 라이닝(122) 윗면의 연결 슬롯(slot)과 외부 커버(121)의 저면과 라이닝(122) 저면의 연결 슬롯 부위에 와셔(123)가 설치되어 있다. 그러므로 물이 연결 슬롯을 통해 라이닝(122)과 외부 커버(121) 사이로 유입되는 것을 방지하고 외부 커버(121)의 부식을 방지하는 동시에 라이닝(122)을 외부 커버(121)내에 보강하여 고정할 수 있어 본체 커버(12)가 손상되는 것을 방지하는 목적에 도달할 수 있다. Thus, when the outer cover 121 and the lining 122 are combined to form the body cover 12, and the body cover 12 covers the end of the pump housing 10, the material of the lining 122 is a process plastic Therefore, it does not corrode even when contacted with water. In addition, since the outer cover 121 is made of a metal material, when the outside of the lining 122 is covered, the water pressure or the water temperature generated by the operation of the water pump is too high to prevent the lining 122 from being severely deformed and broken. In addition, a washer 123 is installed at a connection slot of an upper surface of the outer cover 121 and an upper surface of the lining 122, and a connection slot portion of a lower surface of the outer cover 121 and a lower surface of the lining 122. Therefore, it is possible to prevent the water from flowing between the lining 122 and the outer cover 121 through the connecting slot and to prevent corrosion of the outer cover 121, and at the same time to reinforce and fix the lining 122 in the outer cover 121. Can reach the purpose of preventing the body cover 12 from being damaged.

도 4를 다시 참조하면, 물 펌프가 작동될 때 물이 커버(20)의 다른 일측면을 흘러지나게 되며 또한 커버(20)와 접촉하는 트랜지스터(25)도 생성한 열 에너지를 커버(20)에 전달할 수 있으므로 유동하는 물에 의해 온도를 낮추는 목적에 도달할 수 있어 트랜지스터(25)가 과열로 인하여 손상되지 않는다. 따라서 본 고안은 실용성을 구비한 발명이다. Referring back to FIG. 4, when the water pump is operated, water flows through the other side of the cover 20 and also generates thermal energy generated by the transistor 25 in contact with the cover 20. As it can be delivered, the purpose of lowering the temperature by the flowing water can be reached so that the transistor 25 is not damaged due to overheating. Therefore, the present invention is an invention having practicality.

10, 40: 펌프 하우징
11, 41: 챔버
12: 본체 커버
121: 외부 커버
122: 라이닝
123: 와셔
20: 와셔
21: 고정 시트
211: 절연 겔
22: 천공
23, 50: 회로판
24: 전원선
25, 51: 트랜지스터
30, 60: 모터
31: 회전축
52: 히트 싱크 10, 40: pump housing
11, 41: chamber
12: body cover
121: outer cover
122: lining
123 washers
20: washer
21: fixing sheet
211: insulating gel
22: perforated
23, 50: circuit board
24: power line
25, 51: transistor
30, 60: motor
31: axis of rotation
52: heat sink

Claims (5)

모터, 펌프 하우징 및 본체 커버를 구비하고, 상기 모터는 모터 하우징에 수용되고, 상기 펌프 하우징의 일단과 상기 모터 하우징이 서로 연결되고, 상기 본체 커버는 상기 펌프 하우징의 타단에 설치되고, 상기 펌프 하우징의 내부에 챔버가 형성되어 있으며, 상기 모터를 제어하는 회로판이 챔버 내에 설치되고,
상기 펌프 하우징과 모터 하우징 사이에 커버가 설치되고, 상기 커버의 가장자리(邊緣)는 상기 펌프 하우징과 모터 하우징 사이에 삽입 고정되고, 상기 모터 하우징을 향하고 있는 커버의 일 측면에 중공(中空)된 고정 시트(fixed seat)가 고정설치되고, 상기 고정 시트 내에 커버와 접촉하는 트랜지스터가 설치되고, 상기 트랜지스터에 회로판과 서로 연결된 전원선이 설치된,
회로 방열 구조를 구비한 물 펌프.A motor, a pump housing and a body cover, the motor is housed in a motor housing, one end of the pump housing and the motor housing are connected to each other, the body cover is installed at the other end of the pump housing, and the pump housing The chamber is formed inside the circuit board for controlling the motor is installed in the chamber,
A cover is installed between the pump housing and the motor housing, and an edge of the cover is inserted and fixed between the pump housing and the motor housing, and is fixed to one side of the cover facing the motor housing. A fixed seat is fixed, a transistor in contact with a cover is installed in the fixed seat, and a power line connected to a circuit board is installed in the transistor.
Water pump with circuit heat dissipation structure. 제1항에 있어서,
상기 커버의 중앙에 모터의 회전축이 관통하는 천공(穿孔)이 형성되어 있는, 회로 방열 구조를 구비한 물 펌프.The method of claim 1,
A water pump having a circuit heat dissipation structure in which a perforation is formed in the center of the cover to penetrate the rotating shaft of the motor. 제1항 또는 제2항에 있어서,
상기 고정 시트의 중공된 부분에 트랜지스터를 보호하면서 물기를 차단할 수 있는 절연 겔이 충진된, 회로 방열 구조를 구비한 물 펌프.The method according to claim 1 or 2,
A water pump having a circuit heat dissipation structure filled with an insulating gel capable of blocking moisture while protecting a transistor in a hollow portion of the fixing sheet. 제3항에 있어서,
상기 본체 커버는,
금속재질로 성형해서 이루어진 내부가 오목한 용기인 외부 커버; 및,
상기 외부 커버의 내부 오목한 수용 공간 내에 설치되고, 공정 플라스틱 재질로 성형해서 이루어진 내부가 오목한 용기인 라이닝
을 포함하는, 회로 방열 구조를 구비한 물 펌프.The method of claim 3,
The body cover,
An outer cover which is an inner concave container formed by molding of a metal material; And,
Lining is installed in the inner concave receiving space of the outer cover, the interior is a concave container formed by molding the process plastic material
A water pump having a circuit heat dissipation structure comprising a. 제4항에 있어서,
상기 본체 커버의 외부 커버 윗면과 라이닝 윗면의 연결 슬롯, 및 외부 커버의 저면(底面)과 라이닝 저면(底面)의 연결 슬롯에 모두 와셔가 설치된, 회로 방열 구조를 구비한 물 펌프.The method of claim 4, wherein
A water pump having a circuit heat dissipation structure, in which a washer is provided at both a connection slot of an outer cover top and a lining upper surface of the main body cover, and a connection slot of a bottom face and a lining bottom surface of the outer cover.
KR2020100000857U 2010-01-26 2010-01-26 Water pump with a circuit having heat dissipating apparatus Expired - Fee Related KR200462936Y1 (en)

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CN110671339B (en) * 2019-11-06 2025-04-15 谱罗顿智能泵业(安徽)有限公司 A variable frequency submersible pump for drainage and heat dissipation
CN111749904B (en) * 2020-07-30 2024-12-10 利欧集团浙江泵业有限公司 A mounting structure for a water pump controller

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JP2001193683A (en) 2000-01-14 2001-07-17 Asmo Co Ltd Fluid pump device
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