KR20040058417A - Printed circuit board for memory module and mounting soket thereof - Google Patents

Abstract

A printed circuit board for a memory module and a socket for mounting the same are disclosed. The substrate includes a connector formed longitudinally along both edges of the substrate body, and the socket includes a socket pin for horizontally mounting both edges of the connector. The connector occupies a minimum space by forming connectors at both edges of the substrate main body, and the socket for mounting the same may mount the maximum memory module in the minimum space by horizontally mounting the connector.

Description

Printed circuit board for memory module and mounting soket et al.

The present invention relates to a printed circuit board for a memory module and a socket for mounting the same, and more particularly, to a printed circuit board for a memory module having a connector formed at both corners of the printed circuit board and a socket for mounting the same.

The memory installed in a personal computer, a system server, a communication switch, or the like is mostly a memory module formed by mounting a memory integrated circuit on an off-chip printed circuit board. The memory module includes a connector between the external device and the memory device, and sends and receives an electrical signal with the external device to read and write data of the memory chip through the DQ signal (Data Query). signal). This DQ signal is prevented because signal reflections such as overshoot / undershoot are prone to occur when there is no damping resistor between the memory chip SDRAM and the edge tab. The damping chip is included separately.

1 is a perspective view showing a conventional printed circuit board for a memory module and a socket for mounting the same.

As shown in FIG. 1, a memory module includes a printed circuit board main body 12 on a rectangular plate and a plurality of memories having a plurality of lead lines arranged and mounted in the longitudinal direction on the printed circuit board main body 12. Damping to eliminate the phenomenon of the electrical signal due to external noise that may occur between the chip 14, the connector 18 formed in the longitudinal direction along one edge of the substrate body 12 and the memory chip 14 And a chip 16. The memory module is mounted in a socket 20 that connects to the external device 10. This method of mounting is called vertical mounting.

Recently, since the size of electronic products is gradually becoming smaller, memory modules must also be smaller in size. However, the vertical mounting of the memory module takes a lot of space and there is a limit on the number of sockets.

Accordingly, an object of the present invention is to provide a printed circuit board for a memory module that occupies a minimum space.

Another object of the present invention is to provide a socket in which a printed circuit board for a memory module that occupies a minimum space can be mounted in a minimum space.

1 is a perspective view showing a conventional printed circuit board for a memory module and a socket for mounting the same.

2 is a plan view showing the arrangement of a memory module according to the present invention.

3A and 3B are a perspective view and a side view schematically showing a socket for mounting a printed circuit board for a memory module according to the present invention.

* Description of the symbols for the main parts of the drawings *

100; Memory module 110; Board Body

112; Memory chip 114; Damping chip

116; Connector 118; Connection pad

200; Socket pin

The memory module printed circuit board according to the present invention for achieving the above technical problem is a plurality of pads formed of a group of pads arranged on the board body and a plurality of semiconductor memory chips having a plurality of lead wires arranged on the plate surface of the substrate body A memory chip pad group and a connector formed in a longitudinal direction along both edges of the substrate main body.

In the printed circuit board for a memory module according to the present invention, the connector may be made of a tab (TAB) or may be in the shape of a needle.

In the printed circuit board for a memory module according to the present invention, an electrical signal can be formed on a connector formed on both sides of the substrate main body.

A plurality of sockets for mounting a printed circuit board for a memory module may be formed of a group of pads arranged in correspondence with a substrate body and a plurality of semiconductor memory chips having a plurality of lead wires arranged on a plate surface of the substrate body. A printed circuit board for a memory module, the connector comprising: a memory chip pad group and a connector formed in a longitudinal direction along both edges of the substrate main body, the socket pins horizontally mounting both edges of the connector; .

In the socket for mounting a printed circuit board for a memory module, the socket pin may be a plurality of socket pins.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, only this embodiment to make the disclosure of the present invention complete, and complete the scope of the invention to those skilled in the art It is provided to inform you. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements.

2 is a plan view illustrating an arrangement of a memory module in accordance with an embodiment of the present invention. As shown, the memory module 100 of the present invention includes a plurality of memory chips having a printed circuit board main body 110 on a rectangular plate and a plurality of lead wires arranged in the printed circuit board main body 110 in a longitudinal direction. The connector 116 formed in a predetermined direction at both corners of the substrate main body 110 so as to be physically coupled to the memory 112 and these memory chips 112 and an external device (10 of FIG. 1) to transmit and receive signals. And a damping chip 114 installed in the periphery of the memory chip 112 and removing a shooting phenomenon of an electrical signal due to external noise that may occur between the connector 116 and the memory chip 112. do.

The memory chip 112 is a synchronized dynamic RAM (SDRAM), which is a volatile memory device, and is formed in a rectangular plate having a long side, and a plurality of memory chips 112 are mounted on one or both sides of the substrate along the longitudinal direction of the substrate main body 110. have. In each of the memory chips 112, a plurality of lead wires protruding from both sides of the long axis of the memory chip are spaced apart at predetermined intervals along the longitudinal direction of the substrate main body 110. The memory chip 112 is mounted such that the side on which the lead wires are formed is disposed in parallel along the long axis side of the substrate body.

The connector 116 may be formed of a tab TAB and may be in the shape of a needle in some cases. The connector 116 is provided with metal wires connected to the printed circuit wiring of the board main body 110 and a connection pad 118 electrically connected to the inside of the board main body 110. The connection pad 118 is formed of a highly conductive metal so as to smoothly transmit electrical signals between the external device 10 of FIG. 1 and the memory chip 112.

According to the embodiment of the present invention, the contact point of the socket can be divided by forming the connector 116 formed at both corners of the conventional one side edged connector (18 in FIG. 1). That is, the space occupied by the memory module 100 can be reduced.

Electrical signals are formed on both of the connectors 116 formed on both sides of the substrate main body 110. In addition, the memory module 100 having the same structure as the embodiment of the present invention has almost no change in the memory chip 112 as compared with the conventional case. Therefore, blind vias and buried vias may be used to form high density and high frequency circuits. In some cases, the arrangement of the memory chips 112 may be different.

3A and 3B are a perspective view and a side view schematically showing a socket for mounting a printed circuit board for a memory module according to an embodiment of the present invention.

Referring to FIGS. 3A and 3B, connectors 116 at both corners of the memory module 100 are mounted to cover a portion of the socket pin 200. The other socket pin 200 is stacked thereon. In this way, the plurality of memory modules 100 may be mounted between the plurality of socket pins 200. The stack of the plurality of socket pins 200 is called a stack socket, and a method of mounting the memory module 100 by the stack socket is called a horizontal mounting.

According to the exemplary embodiment of the present invention, the plurality of memory modules 100 may be mounted in a minimum space.

Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and many modifications and improvements can be made by those skilled in the art within the scope of the technical idea of the present invention. Do.

According to the above-described printed circuit board for a memory module according to the present invention, the connector occupies a minimum space by forming connectors at both corners of the substrate main body, and the socket for mounting the same may mount the maximum memory module in the minimum space by horizontally mounting the socket. Can be.

Claims (6)

A substrate body; A plurality of memory chip pad groups arranged on a plate surface of the substrate main body and formed of a group of pads provided in correspondence with a plurality of semiconductor memory chips having a plurality of lead wires; And Printed circuit board for a memory module comprising a connector formed in the longitudinal direction along both edges of the substrate body. The printed circuit board of claim 1, wherein the connector comprises a tab. The printed circuit board of claim 1, wherein the connector has a needle shape. The printed circuit board of claim 1, wherein an electrical signal is formed at a connector formed at both sides of the substrate main body. A substrate body; A plurality of memory chip pad groups arranged on a plate surface of the substrate main body and formed of a group of pads provided in correspondence with a plurality of semiconductor memory chips having a plurality of lead wires; And In the printed circuit board for a memory module, characterized in that it comprises a connector formed in the longitudinal direction along both edges of the substrate body, Socket for mounting a printed circuit board for a memory module including a socket pin for horizontally mounting both edges of the connector The socket for mounting a printed circuit board of claim 5, wherein the socket pin is a plurality of socket pins.