KR200303031Y1 - By-product Condenser of Deposition Equipment - Google Patents
By-product Condenser of Deposition Equipment Download PDFInfo
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- KR200303031Y1 KR200303031Y1 KR2019970039373U KR19970039373U KR200303031Y1 KR 200303031 Y1 KR200303031 Y1 KR 200303031Y1 KR 2019970039373 U KR2019970039373 U KR 2019970039373U KR 19970039373 U KR19970039373 U KR 19970039373U KR 200303031 Y1 KR200303031 Y1 KR 200303031Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
본 고안은 증착장비의 부산물 응축장치에 관한 것으로서, 종래의 증착장비에서 공정균일도를 향상시키기 위해 인너튜브의 내부를 진공으로 만드는 펌프가 부식성이 있는 등의 유해한 공정부산물에 의해 손상되어 수명이 감소하고 동작불량을 일으키는 등의 문제점이 있던 것을 인식하여, 냉매를 소정의 저온으로 만들어 순환하도록 구동시키는 냉각기와, 가스배출관과 양단이 연결되어 내부로 가스가 통과하는 가스응축관과, 상기 냉각기에서 형성된 냉매가 순환하는 경로 중 냉각기의 외부에 위치하는 부분으로서 상기 가스응축관의 외부와 접하여 가스응축관으로부터 열을 빼앗는 순환라인으로 구성되는 가스응축수단을 구비하도록 하여 상기의 문제점을 해소할 수 있도록 한 것이다.The present invention relates to a by-product condensation apparatus of the deposition equipment, in order to improve the process uniformity in the conventional deposition equipment is damaged by harmful process by-products such as corrosive pump that makes the inside of the inner tube to reduce the lifespan Recognizing that there is a problem such as a malfunction, the cooler for driving the refrigerant to circulate to a predetermined low temperature, the gas condensation tube is connected to both ends of the gas discharge pipe and the gas passes inside, the refrigerant formed in the cooler In order to solve the above problems by providing a gas condensing means consisting of a circulation line which is located outside the cooler of the circulation path to the outside of the gas condensation tube to take heat from the gas condensation tube. .
Description
본 고안은 증착장비에 관한 것으로서, 상세하게는 웨이퍼에 증착막을 형성하는 증착장비에서 증착균일도를 향상시키기 위해 진공을 만드는데 사용되는 펌프가 공정부산물에 의해 오염되는 것을 방지하기 위하여 가스응축수단을 설치한 증착장비의 부산물 응축장치에 관한 것이다.The present invention relates to a deposition apparatus. Specifically, in the deposition apparatus for forming a deposition film on a wafer, a gas condensation means is installed to prevent a pump used to create a vacuum to improve the deposition uniformity to be contaminated by process byproducts. It relates to a by-product condenser of the deposition equipment.
종래의 일반적인 증착장비는, 도 1 에 도시한 바와 같이, 아웃터튜브(1)의 내측에 인너튜브(2)가 설치되고, 상기 인너튜브(2)의 내측으로는 웨이퍼(W)를 100매 내지 150매 수납하고 있는 보트(3)가 보트받침대(4)에 얹혀 삽입되며, 상기 아웃터튜브(1)와 인너튜브(2)의 일측을 관통하는 가스공급관(5)이 설치되고, 그 반대쪽으로는 반응에 사용된 가스등의 공정부산물이 빠져나가는 가스배출관(6)이 아웃터튜브(1)와 연결되어 있다. 상기 가스배출관(6)은 펌프(7)를 지나 가스정화장치(8)로 연결되어 있으며 펌프(7)와 아웃터뷰브(1) 사이의 가스배출관(6)에는 배출되는 가스의 양을 조절하는 조절밸브(9)가 설치되어 있다.In the conventional general deposition apparatus, as illustrated in FIG. 1, an inner tube 2 is installed inside the outer tube 1, and 100 wafers W are formed inside the inner tube 2. The boat (3), which houses 150 sheets, is inserted and inserted into the boat support (4), and a gas supply pipe (5) penetrating one side of the outer tube (1) and the inner tube (2) is provided, and on the opposite side thereof. The gas discharge pipe 6 through which process by-products such as gas used in the reaction flows out is connected to the outer tube 1. The gas discharge pipe (6) is connected to the gas purification device (8) through the pump (7), the control to adjust the amount of gas discharged in the gas discharge pipe (6) between the pump (7) and the outer view (1) The valve 9 is provided.
상기한 바와 같은 구조로 되는 증착장비는 가스공급관(5)을 통해 반응가스가 공급된 후 인너튜브(2)의 내측에 보트(3)에 수납된 상태로 장입된 웨이퍼(W)의 표면에 반응가스가 반응되어 형성된 물질의 막이 형성되도록 작용하게 되는데, 이때 상기 펌프(7)는 반응이 일어나는 인너튜브(2)의 내부를 진공으로 만들어 주기 위하여 반응한 가스 및 미반응된 가스를 뽑아내게 된다. 이는 상압 또는 대기압에서 반응을 일으키는 것보다는 분자밀도가 희박한 진공에서 반응이 일어나도록 하는 것이 반응가스 분자들간의 충돌을 줄이고 고른 확산현상을 이루어 증착되는 막이 보다 균일하게 되어 우수한 공정균일도를 얻을 수 있기 때문이며, 특히 분자량이 큰 가스를 반응시켜 증착하는 공정에서 이러한 시스템은 필수적인 것이고 일반적인 증착장비에도 보편화되고 있다.The deposition apparatus having the structure as described above reacts to the surface of the wafer W loaded in the state in which the reaction gas is supplied through the gas supply pipe 5 and stored in the boat 3 inside the inner tube 2. When the gas is reacted to form a film of the formed material, the pump 7 extracts the reacted gas and the unreacted gas to make the inside of the inner tube 2 where the reaction takes place in a vacuum. This is because the reaction occurs in a vacuum where the molecular density is thinner than the reaction at atmospheric pressure or atmospheric pressure, thereby reducing collisions between the reaction gas molecules and achieving even diffusion, resulting in a more uniform film to obtain a uniform process uniformity. In particular, such a system is essential in the process of reacting and depositing a gas having a high molecular weight, and is widely used in general deposition equipment.
그런데 상기한 바와 같은 구조로 되는 종래 증착장비에서는 반응이 일어나는 공간을 진공으로 하기 위하여 동작하는 상기 펌프(7)의 내부로 반응가스 내지 미반응된 가스가 통과하다가 일부 바람직하지 못한 공정부산물이 펌프(7)의 내부에 고착되거나 펌프(7)의 내부를 부식시키게 되어 펌프(7)의 기능저하 내지 동작불량 및 수명감소를 가져오게 되는 문제점이 있었다.However, in the conventional deposition apparatus having the structure as described above, the reaction gas or the unreacted gas passes through the inside of the pump 7 operated to vacuum the space where the reaction takes place, and some undesirable process by-products are pumped ( 7) There is a problem in that the inside of the pump 7 is fixed or corroded to the inside of the pump 7 to bring about the functional degradation of the pump (7), poor operation and reduced life.
따라서, 상기한 바와 같은 문제점을 인식하여 안출된 본 고안의 목적은 펌프의 내부에 유해한 공정부산물이 고착되는 등으로 펌프를 손상시키는 것을 방지함에 의해 펌프의 기능저하 내지 동작불량을 방지하고 펌프를 장기간 사용할 수 있도록 하기 위한 장치가 구비된 증착장비의 부산물 응축장치를 제공하고자 하는 것이다.Therefore, the object of the present invention devised by recognizing the problems as described above is to prevent the pump from damaging or malfunctioning by preventing damage to the pump by the fixing of harmful process by-products inside the pump, and the pump for a long time It is to provide a by-product condensation device of the deposition equipment equipped with a device for use.
도 1 은 종래의 일반적인 증착장비의 구조를 도시한 장치도.1 is a device diagram showing the structure of a conventional general deposition equipment.
도 2 는 본 고안의 일 실시례에 의한 증착장비의 구조를 도시한 장치도.2 is a device diagram showing a structure of a deposition apparatus according to an embodiment of the present invention.
(도면의 주요부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)
1;아웃터튜브 2;인너튜브1; outer tube 2; inner tube
3;보트 4;보트받침대3; boat 4; boat stand
5;가스공급관 6;가스배출관5; gas supply pipe 6; gas discharge pipe
7;펌프 8;가스정화장치7 pump 8 gas purifier
9;조절밸브 10;가스응축수단9; control valve 10; gas condensing means
10a;냉각기 10b:가스응축관10a; Cooler 10b: Gas condensation tube
10b';핀 10c;순환라인10b '; pin 10c; circulation line
상기한 바와 같은 본 고안의 목적을 달성하기 위하여, 아웃터튜브와 가스배출관을 통해 연결되어 인너튜브의 내부를 진공으로 만드는 펌프를 구비한 증착장비에 있어서; 상기 아웃터튜브와 펌프의 사이에 있는 가스배출관의 일부 구간에는 펌프에 유해한 공정부산물을 응축시킬 수 있도록 가스응축수단이 설치된 증착장비에 있어서, 상기 가스응축수단은 냉매를 소정의 저온으로 만들어 순환하도록 구성시키는 냉각기와, 가스배출관과 양단이 연결되어 내부로 가스가 통과하는 가스응축관과, 상기 냉각기에서 형성된 냉매가 순환하는 경로 중 냉각기의 외부에 위치하는 부분으로서 상기 가스응축관의 외부와 접하여 가스응축관으로부터 열을 빼앗는 순환라인으로 구성된 것을 특징으로 하는 증착장비의 부산물 응축장치가 제공된다.In order to achieve the object of the present invention as described above, in the deposition equipment having a pump connected to the outer tube and the gas discharge pipe to make the inside of the inner tube into a vacuum; In a deposition apparatus provided with a gas condensation means to condense harmful process by-products to the pump in some sections of the gas discharge pipe between the outer tube and the pump, the gas condensing means is configured to circulate the refrigerant to a predetermined low temperature. A condenser connected to the gas discharge pipe, and a gas condensation pipe through which gas passes through, and a part located outside the cooler in a path through which the refrigerant formed in the cooler circulates, in contact with the outside of the gas condensation pipe. By-product condensation apparatus of the deposition equipment is provided, characterized in that consisting of a circulation line to take heat from the tube.
상기 가스응축관의 내벽에는 가스와의 접촉면적을 증가시키기 위한 다수개의핀이 형성된 것을 특징으로 하는 증착장비의 부산물 응축장치가 제공된다.By-product condensation apparatus of the deposition equipment is provided on the inner wall of the gas condensation tube is formed with a plurality of pins for increasing the contact area with the gas.
이하, 첨부도면에 도시한 본 고안의 일 실시례에 의거하여 본 고안을 상세히 설명한다.Hereinafter, the present invention will be described in detail based on an embodiment of the present invention shown in the accompanying drawings.
도 2 는 본 고안의 일 실시례에 의한 증착장비의 구조를 개략적으로 도시한 장치도로서, 이에 도시한 바와 같이, 본 고안에 의한 증착장비는 종래와 마찬가지로 아웃터튜브(1)의 내측에 인너튜브(2)가 설치되고, 상기 인너튜브(2)의 내측으로는 웨이퍼(W)를 100매 내지 150매 수납하고 있는 보트(3)가 보트받침대(4)에 얹혀 삽입되며, 상기 아웃터튜브(1)와 인너튜브(2)의 일측을 관통하는 가스공급관(5)이 설치되고, 그 반대쪽으로는 반응에 사용된 가스등이 빠져나가는 가스배출관(6)이 아웃터튜브(1)와 연결된다. 그러나 종래의 가스배출관(6)은 펌프(7)로 직접 연결되었던 것에 반해 본 고안의 경우에는 가스응축수단(10)을 경유하여 펌프(7)와 연결되게 된다.2 is a device diagram schematically showing a structure of a deposition apparatus according to an embodiment of the present invention, as shown in this, the deposition apparatus according to the present invention is the inner tube inside the outer tube (1) as in the prior art (2) is installed, a boat (3) containing 100 to 150 sheets of wafer (W) inside the inner tube (2) is inserted and inserted into the boat support (4), the outer tube (1) ) And a gas supply pipe 5 penetrating one side of the inner tube 2, and a gas discharge pipe 6 through which the gas, etc. used in the reaction, exits is connected to the outer tube 1. However, the conventional gas discharge pipe 6 is directly connected to the pump 7, whereas in the present invention, the gas discharge pipe 6 is connected to the pump 7 via the gas condensing means 10.
상기 가스응축수단(10)은 냉매를 소정의 저온으로 만들어 순환하도록 구동시키는 냉각기(10a)와, 가스배출관(6)과 양단이 연결되어 내부로 가스가 통과하는 가스응축관(10b)과, 상기 냉각기(10a)에서 형성된 냉매가 순환하는 경로 중 냉각기(10a)의 외부에 위치하는 부분으로서 상기 가스응축관(10b)의 외부와 접하여 가스응축관(10b)으로부터 열을 빼앗는 순환라인(10c)으로 구성되게 되는데, 상기 가스응축관(10b)의 내벽에는 가스와의 접촉면적을 증가시키기 위하여 다수개의 핀(10b')이 형성되는 것이 바람직하다.The gas condensing means 10 is a cooler (10a) for driving the refrigerant to circulate by making a predetermined low temperature, the gas condensing pipe (10b) is connected to both ends of the gas discharge pipe (6) and the gas passes through, and A portion located outside the cooler 10a among the paths through which the coolant formed in the cooler 10a circulates, and is in contact with the outside of the gas condensation tube 10b to a circulation line 10c that takes heat from the gas condensation tube 10b. It is preferable that a plurality of fins 10b 'are formed on the inner wall of the gas condensation tube 10b to increase the contact area with the gas.
그리고 상기 가스응축관(10b)은 양단이 가스배출관(6)과 분리 가능하게 결합되는 것이 바람직하다.And the gas condensation tube (10b) is preferably both ends detachably coupled to the gas discharge pipe (6).
도면상 미설명 부호는 도 1 에 도시된 종래 증착장비의 것과 같은 것을 나타낸다.Reference numerals in the drawings indicate the same as those of the conventional deposition apparatus shown in FIG. 1.
상기한 바와 같은 구조로 되는 가스응축수단(10)은 펌프(7)에 의해 가스배출관(6)을 통해 빠져나오는 반응가스 등이 펌프(7)에 이르기 전에 가스응축관(10b)을 통과하도록 설치되어 있는바, 상기 가스응축관(10b)은 냉각기(10a)에서 만들어진 냉매가 순환하는 순환라인(10c)과 접촉되어 낮은 온도로 유지되므로 그 내벽에 부딪히는 가스의 일부가 응축되게 된다. 이때 가스응축관(10b)의 내벽에 설치된 핀(10b')은 가스와의 접촉면적을 넓혀 이러한 가스의 응축을 보다 용이하게 하는 작용을 행하게 된다. 그리고 가스응축관(10b) 내부의 온도는 가장부식성이 강하거나 하여 펌프(7)에 좋지 않은 영향을 주는 공정부산물이 응축될 수 있는 온도가 되도록 냉각기(10a)를 제어하는 것이 바람직하다. 예를 들면 산화염화인(POCl3)과 산소(O2)가 반응가스인 경우에는 그 반응에 의해 오산화인(P2O5)과 염소(Cl2)가 만들어지게 되는데 이때의 염소는 펌프(7)의 내부를 부식시키게 되어 이러한 반응이 일어나는 증착시에는 펌프(7)를 사용하지 못하였는데, 염소를 응축시키는 온도로 가스응축관(10b)의 내부온도가 내려가게 냉각기(10a)를 제어하면 염소가 응축되어 펌프(7)로 가지 못하므로 펌프(7)를 사용하여 인너튜브(2)의 내부를 진공으로 하는 상태에서 이러한 공정을 진행하는 것이 가능하여 공정균일도를 향상시키게 된다.The gas condensing means 10 having the structure as described above is installed such that the reaction gas, etc., which escapes through the gas discharge pipe 6 by the pump 7 passes through the gas condensation pipe 10b before reaching the pump 7. As the gas condensation tube 10b is in contact with the circulation line 10c through which the refrigerant made in the cooler 10a circulates, the gas condensation tube 10b is condensed. At this time, the fin (10b ') provided on the inner wall of the gas condensation tube (10b) is to increase the contact area with the gas to facilitate the condensation of such gas. In addition, it is preferable to control the cooler 10a such that the temperature inside the gas condensation tube 10b is the temperature at which the process by-product, which has the strongest corrosion resistance or adversely affects the pump 7, can be condensed. For example, when phosphorus oxychloride (POCl 3 ) and oxygen (O 2 ) are reaction gases, phosphorus pentoxide (P 2 O 5 ) and chlorine (Cl 2 ) are produced by the reaction. At the time of deposition where this reaction occurs due to corrosion of the inside of the pump), the pump 7 was not used. When the cooler 10a is controlled to lower the internal temperature of the gas condensation tube 10b to a temperature that condenses chlorine, Since condensation does not go to the pump 7, it is possible to proceed with this process in a state in which the inside of the inner tube 2 is vacuumed using the pump 7 to improve the process uniformity.
가스응축수단(10)을 장기간 사용하게 되면 가스응축관(10b)의 내부에 공정부산물이 많이 응축되어 가스의 흐름을 방해하게 될 것이므로 일정기간 사용한 뒤에는 가스배출관(6)으로부터 가스응축관(10b)을 분리하여 세척한 후 재결합하여 사용하게 된다.If the gas condensing means 10 is used for a long time, a lot of process by-products will be condensed inside the gas condensation tube 10b, thereby preventing the flow of gas. After separation, washing and recombination is used.
상기한 바와 같은 구조로 되는 본 고안에 의한 증착장비의 부산물 응축장치는 펌프의 내부와 접촉하여 펌프의 수명을 감소시키고 동작불량 등을 야기하는 공정부산물이 펌프와 접촉되기 전에 가스응축수단의 가스응축관 내부에 응축되도록 함으로써 펌프의 기능저하 내지 동작불량을 방지하고 펌프를 장기간 사용할 수 있도록 하는 효과가 있다.The by-product condensation apparatus of the vapor deposition apparatus according to the present invention having the structure as described above condenses the gas condensing means before contacting the pump with the process by-products, which are in contact with the inside of the pump, reducing the service life of the pump and causing malfunction. By condensing inside the pipe, there is an effect of preventing the pump from malfunctioning or malfunctioning and allowing the pump to be used for a long time.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970039373U KR200303031Y1 (en) | 1997-12-20 | 1997-12-20 | By-product Condenser of Deposition Equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970039373U KR200303031Y1 (en) | 1997-12-20 | 1997-12-20 | By-product Condenser of Deposition Equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990026828U KR19990026828U (en) | 1999-07-15 |
| KR200303031Y1 true KR200303031Y1 (en) | 2003-03-28 |
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|---|---|---|---|
| KR2019970039373U Expired - Fee Related KR200303031Y1 (en) | 1997-12-20 | 1997-12-20 | By-product Condenser of Deposition Equipment |
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| Country | Link |
|---|---|
| KR (1) | KR200303031Y1 (en) |
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- 1997-12-20 KR KR2019970039373U patent/KR200303031Y1/en not_active Expired - Fee Related
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