KR20030002946A - Organic Electroluminescence Device - Google Patents
Organic Electroluminescence Device Download PDFInfo
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- KR20030002946A KR20030002946A KR1020010039541A KR20010039541A KR20030002946A KR 20030002946 A KR20030002946 A KR 20030002946A KR 1020010039541 A KR1020010039541 A KR 1020010039541A KR 20010039541 A KR20010039541 A KR 20010039541A KR 20030002946 A KR20030002946 A KR 20030002946A
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- organic electroluminescent
- plastic
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- 238000005401 electroluminescence Methods 0.000 title abstract 8
- 229920003023 plastic Polymers 0.000 claims abstract description 46
- 239000004033 plastic Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000002250 absorbent Substances 0.000 claims description 8
- 230000002745 absorbent Effects 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 8
- 238000002347 injection Methods 0.000 abstract description 6
- 239000007924 injection Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 3
- 230000005525 hole transport Effects 0.000 abstract description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- -1 metal halide compound Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
본 발명은 유기 전계발광 소자에 관한 것으로, 특히 유기 전계발광 소자의 실링에 관한 것이다.The present invention relates to organic electroluminescent devices, and more particularly to sealing of organic electroluminescent devices.
유기 전계발광 소자는 전자 주입 전극과 정공 주입 전극 사이에 형성된 유기 전계발광층에 상기 전극을 통해 전하를 주입하여 주입된 전자와 정공이 쌍을 이룬 후 소멸하면서 빛을 내는 소자이다.The organic electroluminescent device is a device that emits light by injecting charge into the organic electroluminescent layer formed between the electron injection electrode and the hole injection electrode through the electrode and then disappears after pairing the injected electrons and holes.
유기 전계발광 소자는 플라스틱 같이 휠 수 있는(flexible) 투명 기판 위에도 소자를 형성할 수 있을 뿐 아니라, 플라즈마 디스플레이 패널(plasma display panel : PDP)이나 무기 EL 패널 디스플레이에 비해 10V 이하의 낮은 전압에서 구동이 가능하고, 또한 전력 소모가 비교적 적으며, 색감이 뛰어나다.The organic electroluminescent device can be formed on a flexible transparent substrate such as plastic, and can be driven at a voltage lower than 10V compared to plasma display panel (PDP) or inorganic EL panel display. It is possible, and also the power consumption is relatively low, the color is excellent.
그러나 유기 전계발광 소자의 안정성의 요인으로 그 응용이 제한되었다.However, its application has been limited due to the stability of the organic electroluminescent device.
즉, 유기 전계발광 소자 제작에 쓰이는 유기물들은 대부분 무기 재료들에 비해 안정성이 떨어지고, 수명이 짧다.In other words, organic materials used to fabricate organic electroluminescent devices are less stable and have a shorter lifetime than most inorganic materials.
소자의 수명을 결정짓는 원인은 여러 가지가 있겠으나, 중요한 원인으로는 유기물 내부의 불순물, 유기물과 전극간의 계면, 유기물의 낮은 결정화 온도(Tg), 산소와 수분에 의한 소자의 산화를 들 수가 있다.There are many reasons for determining the lifetime of the device, but the main causes include impurities in the organic material, an interface between the organic material and the electrode, low crystallization temperature (Tg) of the organic material, and oxidation of the device by oxygen and moisture. .
일반적으로 알려져 있는 보호막 형성 과정은 첫째, 금속성 실커버에 금속 산화물, 알카리 금속산화물, 알카리 토금속 산화물, 황산염 또는 금속 할로겐 화합물 등의 흡착제를 도입하고, 둘째 지지막을 이용하여 흡습제가 소자로 떨어지는 것을 막고, 셋째, UV 경화성 접착제나 열결화성 접착제를 바른 후 소자가 형성된 기판과 합착하는 방법이다.Generally known protective film formation process is, firstly, an adsorbent such as a metal oxide, an alkali metal oxide, an alkaline earth metal oxide, a sulfate or a metal halide compound is introduced into the metallic seal cover, and a second support film is used to prevent the absorbent from falling into the device. Third, after applying a UV curable adhesive or thermosetting adhesive, the method is bonded to the substrate on which the device is formed.
이 방법은 실커버를 금속으로 사용할 경우 소자의 무게 증가 뿐 아니라 반드시 접착제 사용을 피할 수 없는 문제점이 있다.This method has a problem in that the use of the adhesive as well as the increase in the weight of the device when the seal cover is used as a metal.
따라서 본 발명은 상기와 같은 문제점을 해결하기 위해 안출한 것으로서, 비교적 가벼운 플라스틱을 실커버로 이용하여 가열 및 압착하여 소자를 실링함으로 소자의 무게 감소 및 공정의 용이한 유기 전계발광 소자를 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, by using a relatively light plastic as a seal cover to seal the device by heating and pressing to reduce the weight of the device and to provide an easy organic electroluminescent device of the process There is a purpose.
도1a는 유기 전계발광 소자의 바람직한 제1 실시예.1A is a first preferred embodiment of an organic electroluminescent device.
도1b는 상기 도1a의 유기 전계발광 소자의 실링 방법의 개념 도식도.1B is a conceptual diagram of a sealing method of the organic electroluminescent device of FIG. 1A.
도2a는 본 발명에 따른 유기 전계발광 소자의 바람직한 제2 실시예.Figure 2a is a second preferred embodiment of an organic electroluminescent device according to the present invention.
이고, 도2b는 상기 도2a의 유기 전계발광 소자의 실링 방법의 개념 도식도.2B is a conceptual diagram of a sealing method of the organic electroluminescent device of FIG. 2A.
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 플라스틱 기판 10 : 유리 기판1: plastic substrate 10: glass substrate
2, 20 : 제1전극 2a, 20a : 제1전극 연결라인2, 20: first electrode 2a, 20a: first electrode connection line
3, 30 : 유기 전계발광층 4, 40 : 제2전극3, 30: organic electroluminescent layer 4, 40: second electrode
4a, 40a : 제2전극 연결라인4a, 40a: second electrode connection line
5, 50, 60 : 플라스틱 실커버5, 50, 60: plastic seal cover
100, 200 : 유기 전계발광 소자100, 200: organic electroluminescent device
상기와 같은 목적을 달성하기 위한 본 발명에 따른 유기 전계발광 소자의 특징은 기판 위에 제1전극 및 제2전극의 교차하는 영역에 유기 전계발광층을 갖는 유기 전계발광 소자에 있어서, 상기 유기 전계발광층을 실링(sealing)함에 있어 실커버를 플라스틱 물질로 형성되는데 있다.A feature of the organic electroluminescent device according to the present invention for achieving the above object is that in the organic electroluminescent device having an organic electroluminescent layer on the intersection of the first electrode and the second electrode on the substrate, the organic electroluminescent layer In sealing, the seal cover is formed of a plastic material.
상기 기판이 투명한 플라스틱 물질로 형성되는 경우, 상기 기판은 상기 실커버와 함께 가열압착하여 실링하여 실커버가 형성되며, 상기 실커버는 흡습제를 함유할 수 있다.When the substrate is formed of a transparent plastic material, the substrate is heated and pressed together with the seal cover to seal the seal cover, and the seal cover may contain a moisture absorbent.
그리고 상기 기판이 투명한 글레스로 형성되는 경우, 상기 유기 전계발광층이 형성된 상기 기판의 하부 및 상부에 플라스틱을 위치하여 상기 플라스틱 모서리 부분을 용융 접합하여 상기 실커버가 형성되며, 상기 하부 및 상부에 위치한 플라스틱 중 하나는 흡습제를 함유할 수 있다.When the substrate is formed of transparent glass, the seal is formed by melting and bonding the plastic edge portions by placing plastics on the lower and upper portions of the substrate on which the organic electroluminescent layer is formed, and forming the lower and upper plastics. One of them may contain a hygroscopic agent.
상기 플라스틱은 PET, PBT, PES, PC 등의 고분자 물질로 이루어진다.The plastic is made of a polymer material such as PET, PBT, PES, PC.
본 발명의 다른 목적, 특성 및 잇점들은 첨부한 도면을 참조한 실시예들의 상세한 설명을 통해 명백해질 것이다.Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.
본 발명에 따른 유기 전계발광 소자의 바람직한 실시예에 대하여 첨부한 도면을 참조하여 설명하면 다음과 같다.Preferred embodiments of the organic electroluminescent device according to the present invention will be described with reference to the accompanying drawings.
도1a는 본 발명에 따른 유기 전계발광 소자의 바람직한 제1 실시예이고, 도1b는 상기 도1a의 유기 전계발광 소자의 실링 방법의 개념 도식도이다.Figure 1a is a first preferred embodiment of the organic electroluminescent device according to the present invention, Figure 1b is a schematic diagram of a sealing method of the organic electroluminescent device of Figure 1a.
도1a와 같이 투명한 플라스틱 기판(1) 위에 제1전극(2)을 형성하고, 상기 제1전극(2)을 포함한 상기 플라스틱 기판(1) 위에 유기 전계발광층(3)을 형성한 후, 상기 유기 전계발광층(3) 위에 메탈 물질로 제2전극(4)을 형성한다.As shown in FIG. 1A, a first electrode 2 is formed on a transparent plastic substrate 1, and an organic electroluminescent layer 3 is formed on the plastic substrate 1 including the first electrode 2. The second electrode 4 is formed of a metal material on the electroluminescent layer 3.
상기 제1전극(2)은 ITO 등으로 형성되고, 상기 유기 전계발광층(3)은 정공주입층(CuPc:15nm), 정공수송층(TPD:30nm), 녹색 발광층(Alq3), 전자주입층이 적층된 구조를 예로 들 수 있다.The first electrode 2 is formed of ITO, and the organic electroluminescent layer 3 includes a hole injection layer (CuPc: 15 nm), a hole transport layer (TPD: 30 nm), a green light emitting layer (Alq 3 ), and an electron injection layer. A stacked structure is exemplified.
이어 도1b와 같은 방법으로, 상기 플라스틱 기판(1), 제1전극(2), 유기 전계발광층(3), 제2전극(4)을 포함하여 구성되는 유기 전계발광 소자의 하판(100) 상부에 플라스틱 실커버(5)를 위치시키고, 모서리 부분에 플라스틱 기판(1)과 플라스틱 실커버(5)를 동시에 가열 및 압착하여 용융 접합시켜 상기 유기 전계발광층(3)을 실링(sealing)하면 도1a와 같이 유기 전계발광 소자가 실링된다.Subsequently, in the same manner as in FIG. 1B, the lower plate 100 of the organic electroluminescent device including the plastic substrate 1, the first electrode 2, the organic electroluminescent layer 3, and the second electrode 4 is formed. When the plastic seal cover 5 is placed on the plastic substrate, the plastic substrate 1 and the plastic seal cover 5 are simultaneously melted and melt-bonded at the corners to seal the organic electroluminescent layer 3, and FIG. As such, the organic electroluminescent device is sealed.
필요에 따라 플라스틱 실커버(5)에만 열을 가하여 용융압착시킴으로 접착시킬 수도 있다.If necessary, heat may be applied only to the plastic seal cover 5 to be melt bonded.
상기 플라스틱 실커버(5)는 상기 플라스틱 기판(1) 전체를 커버하고, 상기 제2전극(4) 및 제1전극(2)의 연결라인(4a, 2a)은 구동IC의 연결라인들과 탭(TAB :Tape Automated Bonding) 등의 방식으로 전기적으로 콘택되어 유기 전계발광 소자를 구동하기 위한 구동IC와 연결된다.The plastic seal cover 5 covers the entire plastic substrate 1, and the connection lines 4a and 2a of the second electrode 4 and the first electrode 2 are connected to the connection lines and tabs of the driving IC. It is electrically contacted by a method such as (TAB: Tape Automated Bonding) and connected to a driving IC for driving an organic electroluminescent device.
또한 상기 플라스틱 실커버(5)는 상기 플라스틱 기판(1)의 상부면 일부가 노출되도록 커버할 수도 있으며, 이때 노출된 전극 부분은 구동을 위해 (TAB : Tape Automated Bonding) 등의 방식으로 전기적으로 콘택되어 유기 전계발광 소자를 구동하기 위한 구동IC와 연결된다.In addition, the plastic seal cover 5 may cover a portion of the upper surface of the plastic substrate 1 so that the exposed electrode portion may be electrically contacted by a method such as tape automated bonding (TAB) for driving. And a driving IC for driving the organic electroluminescent device.
또한 플라스틱 실커버(5) 내부에 형성된 분말 형태의 흡습제와, 흡습제를 덮는 지지막을 더 포함하여 구성될 수 있으며, 플라스틱은 PET, PBT, PES, PC 등의 고분자 물질로 이루어진다.In addition, the plastic seal cover 5 may be configured to further include a moisture absorbent in the form of a powder and a support film covering the moisture absorbent, the plastic is made of a polymer material such as PET, PBT, PES, PC.
도2a는 본 발명에 따른 유기 전계발광 소자의 바람직한 제2 실시예이고, 도2b는 상기 도2a의 유기 전계발광 소자의 실링 방법의 개념 도식도이다.Figure 2a is a second preferred embodiment of the organic electroluminescent device according to the present invention, Figure 2b is a schematic diagram of a sealing method of the organic electroluminescent device of Figure 2a.
도2a와 같이 유리 기판(10) 위에 제1전극(20)을 형성하고, 상기 제1전극(20)을 포함한 상기 유리 기판(10) 위에 유기 전계발광층(30)을 형성한 후, 상기 유기 전계발광층(30) 위에 메탈 물질로 제2전극(40)을 형성한다.As shown in FIG. 2A, the first electrode 20 is formed on the glass substrate 10, and the organic electroluminescent layer 30 is formed on the glass substrate 10 including the first electrode 20. The second electrode 40 is formed of a metal material on the light emitting layer 30.
상기 제1전극(20) 물질 및 유기 전계발광층(30)의 물질은 상기 제1 실시예에 설명되어 있으므로 생략한다.The material of the first electrode 20 and the material of the organic electroluminescent layer 30 are omitted since they are described in the first embodiment.
이어 도2b와 같은 방법으로, 상기 유리 기판(10), 제1전극(20), 유기 전계발광층(30), 제2전극(40)을 포함하여 구성되는 유기 전계발광 소자의 하판(200)을 플라스틱 실커버(50)에 고정시키고, 하판(200)의 상부에 플라스틱 실 커버(60)를 위치시켜, 상기 하판(200)의 상하부에 형성된 플라스틱 실커버(50, 60)의 모서리 부분을 동시에 가열 및 압착하여 용융 접합시켜 상기 유기 전계발광층(30)을 실링(sealing)하면 도2a와 같이 유기 전계발광 소자가 실링된다.Subsequently, as shown in FIG. 2B, the lower plate 200 of the organic electroluminescent device including the glass substrate 10, the first electrode 20, the organic electroluminescent layer 30, and the second electrode 40 is removed. The plastic seal cover 50 is fixed to the plastic seal cover 50, and the plastic seal cover 60 is positioned on the upper plate 200, thereby simultaneously heating edge portions of the plastic seal covers 50 and 60 formed at the upper and lower portions of the lower plate 200. When the organic electroluminescent layer 30 is sealed by pressing and melting, the organic electroluminescent device is sealed as shown in FIG. 2A.
상기 플라스틱 실커버(60)는 상기 플라스틱 실커버(50) 전체를 커버하여 플라스틱 실커버(50, 60)를 용융접착 시에 구동IC와 연결하기 위한 상기 연결라인(40a, 20a)들도 함께 용융 압착되고 연결라인의 일부가 소자 밖으로 노출됨으로 파워와 연결될 수 있다.The plastic seal cover 60 covers the entire plastic seal cover 50 to melt the connection lines 40a and 20a for connecting the plastic seal covers 50 and 60 to the driving IC during melt bonding. It can be compressed and connected to power by exposing part of the connection line out of the device.
또한 두 플라스틱 실커버(50, 60) 중 어느 하나의 내부에 분말 형태의 흡습제와, 흡습제를 덮는 지지막을 더 포함하여 구성될 수 있으며, 구성될 수 있으며, 플라스틱은 PET, PBT, PES, PC 등의 고분자 물질로 이루어진다..In addition, the inside of any one of the two plastic seal covers 50 and 60 may be configured to further include a moisture absorbent in the form of a powder and a support film covering the absorbent, and may be configured, and the plastic may include PET, PBT, PES, PC, etc. Made of high molecular material.
상기 제1 및 제2 실시예에서 제1전극 및 제2전극은 용융된 플라스틱에 묻혀서 실링이 됨으로 수분 및 산소의 침투가 용이하지 않게 된다.In the first and second embodiments, the first electrode and the second electrode are buried in the molten plastic to be sealed, thereby preventing the penetration of moisture and oxygen.
이상에서 설명한 바와 같은 본 발명에 따른 유기 전계발광 소자는 다음과 같은 효과가 있다.The organic electroluminescent device according to the present invention as described above has the following effects.
소자를 형성할 기판이 플라스틱 물질인 경우 플라스틱을 실커버로 이용하거나, 소자를 형성할 기판이 유리인 경우 기판 하부 및 상부에 플라스틱을 실커버로 이용하여 가열 및 압착하여 소자를 실링함으로 상기 유기 전계발광 소자의 무게 감소의 효과가 있고, 공정이 용이하다.When the substrate to form the element is a plastic material, if the plastic is used as a seal cover, or when the substrate to form the element is glass, the organic electric field by sealing the element by heating and pressing using a plastic as a seal cover on the lower and upper substrates There is an effect of reducing the weight of the light emitting element, and the process is easy.
이상 설명한 내용을 통해 당업자라면 본 발명의 기술 사상을 이탈하지 아니하는 범위에서 다양한 변경 및 수정이 가능함을 알 수 있을 것이다.Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.
따라서, 본 발명의 기술적 범위는 실시 예에 기재된 내용으로 한정되는 것이 아니라 특허 청구의 범위에 의하여 정해져야 한다.Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-2001-0039541A KR100442240B1 (en) | 2001-07-03 | 2001-07-03 | Organic Electroluminescence Device |
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| KR10-2001-0039541A KR100442240B1 (en) | 2001-07-03 | 2001-07-03 | Organic Electroluminescence Device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1662573A2 (en) | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Flat panel display and method of manufacturing the same |
| EP1662572A2 (en) | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Flat panel display and method of manufacturing the same |
| KR100720058B1 (en) * | 2006-07-28 | 2007-05-18 | 주식회사 나모텍 | Sealing film and sealing method of organic light emitting display device |
| KR100982498B1 (en) * | 2008-12-29 | 2010-09-16 | 윤근천 | Encapsulation device for ODL's backplane manufacturing equipment |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100673765B1 (en) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | Organic light emitting display device and manufacturing method |
| KR100671641B1 (en) | 2006-01-25 | 2007-01-19 | 삼성에스디아이 주식회사 | Organic electroluminescent display and manufacturing method thereof |
| JP2010107935A (en) | 2008-10-28 | 2010-05-13 | Samsung Mobile Display Co Ltd | Flat panel display device and method of fabricating the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427193A (en) * | 1988-04-01 | 1989-01-30 | Kansai Nippon Electric | Manufacture of electroluminescent lamp |
| JPH03156888A (en) * | 1989-08-28 | 1991-07-04 | Toshiba Corp | Dispersion type el panel and manufacture thereof |
| JPH03280392A (en) * | 1990-03-28 | 1991-12-11 | Murata Mfg Co Ltd | Electroluminescent element |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1662573A2 (en) | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Flat panel display and method of manufacturing the same |
| EP1662572A2 (en) | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Flat panel display and method of manufacturing the same |
| US7777415B2 (en) | 2004-11-25 | 2010-08-17 | Samsung Mobile Display Co., Ltd. | Sealed, flexible flat panel display |
| KR100720058B1 (en) * | 2006-07-28 | 2007-05-18 | 주식회사 나모텍 | Sealing film and sealing method of organic light emitting display device |
| KR100982498B1 (en) * | 2008-12-29 | 2010-09-16 | 윤근천 | Encapsulation device for ODL's backplane manufacturing equipment |
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