KR20020095070A - Manufacture method for packing hot melt adhesive - Google Patents
Manufacture method for packing hot melt adhesive Download PDFInfo
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- KR20020095070A KR20020095070A KR1020020027898A KR20020027898A KR20020095070A KR 20020095070 A KR20020095070 A KR 20020095070A KR 1020020027898 A KR1020020027898 A KR 1020020027898A KR 20020027898 A KR20020027898 A KR 20020027898A KR 20020095070 A KR20020095070 A KR 20020095070A
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- South Korea
- Prior art keywords
- soluble adhesive
- ethane
- styrene
- heat
- polymer
- Prior art date
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000004831 Hot glue Substances 0.000 title 1
- 238000012856 packing Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 claims abstract description 58
- 230000001070 adhesive effect Effects 0.000 claims abstract description 58
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 26
- -1 polyethylene Polymers 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 239000004698 Polyethylene Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 15
- 238000001125 extrusion Methods 0.000 claims description 15
- 229920000573 polyethylene Polymers 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 13
- 229920002554 vinyl polymer Polymers 0.000 claims description 12
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 6
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000002174 Styrene-butadiene Substances 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims description 3
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 3
- 239000013256 coordination polymer Substances 0.000 claims description 3
- 150000001993 dienes Chemical class 0.000 claims description 3
- WKTXWVAHIAJTTL-UHFFFAOYSA-N ethane styrene Chemical compound C=CC1=CC=CC=C1.CC.C=CC1=CC=CC=C1 WKTXWVAHIAJTTL-UHFFFAOYSA-N 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- 239000011115 styrene butadiene Substances 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000005054 agglomeration Methods 0.000 abstract 1
- 230000002776 aggregation Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000002518 glial effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
- B29C48/911—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
본 발명은 포장용 열용해성 접착제의 제조방법에 관한 것으로, 특히 일종의 덩어리 형태의 열용해성 접착제를 형성해 연속적인 포장이 가능한 제조방법에 관한 것이다.The present invention relates to a method for producing a thermally soluble adhesive for packaging, and more particularly, to a method for manufacturing a continuous thermal packaging by forming a thermally soluble adhesive in the form of a lump.
열용해성 접착제(속칭 열용해성 아교)는 일종의 용도가 상당히 광범한 접착제이다. 이러한 열용해성 접착제의 특징으로는 일반적으로 용해 또는 액체상태에서 사용되는데, 평소에는 고체상태로 존재한다. 때문에 이러한 접착제는 일반적으로 고체상태로 시장에 공급되는데 그 점성 때문에 운반 도중에 서로 접착되거나, 변형되거나 또는 먼지 같은 불순물이 달라붙게 되고, 심지어는 점성과 점도 면에서 외부요인(공기, 온도, 습도 등)의 영향으로 인해 그 효과가 떨어지게 된다. 때문에 이러한 접착제는 아교막으로 피복된 덩어리 형태로 공급되는 것이 비교적 이상적인데, 이 경우 형성된 표면이 점성이 없고 덩어리가 형성되지 않는 구조여서 매우 이상적이다.Thermally soluble adhesives (commonly known as thermally soluble glues) are a type of adhesive with a wide range of uses. Characteristic of such heat-soluble adhesives are generally used in the dissolved or liquid state, usually in the solid state. Because of this, these adhesives are generally supplied to the market in solid form, and due to their viscosity, they adhere to each other during transportation, deform or adhere to dust-like impurities, and even external factors in terms of viscosity and viscosity (air, temperature, humidity, etc.) The effect is to reduce the effect. Therefore, it is relatively ideal that such adhesives are supplied in the form of agglomerates coated with a gluing film, in which case the surface formed is viscous and is not ideal for agglomeration.
Description
미국 특허 제5373682호 및 대만 특허 공보 공고 제298582호에는 일종의 열용해성 접착제의 연속적인 봉인, 포장방법이 공개되어 있다. 도 7에 도시된 바와같이, 수용성막(8)이 연속적으로 리딩롤러(81)를 통과하는데, 이때 리딩롤러(81)를 이용해 상기 수용성막(8)이 평탄하고 매끄럽게 변하며 동시에 필요한 장력이 통제된다. 이어 상기 수용성막(8)이 막형성장치(82)에 진입하면, 원통형체(801)에 의해 원통형태로 되며, 또한 열공기 밀봉 또는 초음파 납땜을 거치고, 이어 냉각공기에 의해 냉각된 후 밀봉성형된다. 밀봉성형된 후에 원통형태의 수용성막(8)이 제 1 실린더(83), 아래쪽이 뾰족한 제 2 실린터(84) 및 한쌍의 구동롤러(85)의 작용에 의해 원통형태의 수용성막이 아래쪽으로 이동되어 상기 원통형체(801)의 하단부로 이동된다. 그 후 액체펌프에 의해 운반되어진 열용해성 접착제가 U 자형관(87)에 의해 압출롤러(86)에 끼워지게 되고 외부 냉각장치(88)에 의해 냉각성형 되는데, 상기 압출롤러(86)가 느슨해지고 U 자형관(87)이 일정한 거리로 하강한 후 압출롤러(86)는 다시 U 자형관(87) 양단을 끼워 고정시켜 균일하게 밀봉한다. 그 후 절단장치(89)로 절단하여 수조에 떨어지게 하여 냉각하고 실온으로 옮긴다. 그중 상기 절단장치(89)는 절단하기 전의 U 자형관의 외부에는 냉각분무기(80)가 설치되어 지속적으로 냉각 성형된다.U.S. Patent No. 5373682 and Taiwan Patent Publication No. 298582 disclose a continuous sealing and packaging method of a kind of heat soluble adhesive. As shown in FIG. 7, the water-soluble film 8 continuously passes through the reading roller 81, wherein the water-soluble film 8 changes flat and smooth using the reading roller 81, and at the same time, the necessary tension is controlled. . Subsequently, when the water-soluble film 8 enters the film forming apparatus 82, the water-soluble film 8 becomes cylindrical by the cylindrical body 801, and is subjected to hot air sealing or ultrasonic soldering, and then cooled by cooling air and then sealed. do. After sealing, the cylindrical water-soluble film 8 is moved downward by the action of the first cylinder 83, the second cylinder 84 having a sharp bottom, and the pair of driving rollers 85. And move to the lower end of the cylindrical body 801. Then, the heat soluble adhesive carried by the liquid pump is inserted into the extrusion roller 86 by the U-shaped tube 87 and cooled by the external cooling device 88, and the extrusion roller 86 is loosened. After the U-shaped tube 87 is lowered by a certain distance, the extrusion roller 86 is again fitted by fixing the U-shaped tube 87 both ends to seal uniformly. Thereafter, the cutting device 89 is cut, dropped into a water bath, cooled, and transferred to room temperature. Among them, the cutting device 89 is provided with a cooling atomizer 80 on the outside of the U-shaped tube before cutting, and is continuously cooled and formed.
이러한 제조방법은 실제적 운용에 있어 다음과 같은 문제점이 있다.This manufacturing method has the following problems in practical operation.
1. 수용성막은 반드시 사전에 제조, 준비가 완료되어야하는데 그 제조 및 준비과정, 운반과정에 폐기물의 증가와 원가상승이 뒤따르게 된다.1. Water-soluble membranes must be manufactured and prepared in advance, which will be accompanied by an increase in waste and cost increase in the manufacturing, preparation, and transportation process.
2. 액체펌프를 이용해 이송된 열용해성 접착제가 수용성막에 진입할 때 그 온도에 의해 수용성막의 두께가 제한되므로 배합에 문제가 생길 경우 수용성막의 파열되거나, 접착제가 외부로 흘러 나오거나 외관이 돌출하는 등의 변형이 생기기 쉽다.2. When the heat-soluble adhesive transferred by the liquid pump enters the water-soluble membrane, the thickness of the water-soluble membrane is limited by its temperature, so if a problem occurs in mixing, the water-soluble membrane ruptures, the adhesive flows out, or the external appearance Deformation such as protruding easily occurs.
3. 전술의 문제점을 회피하기 위해 대다수의 종래의 제조방법에 있어서, 적당한 두께의 수용성막을 예비하는데, 이 경우 상기 막의 두께가 이후 가열조의 용해속도에 직접적인 영향을 미치게 되므로 실제사용에 상당히 불리한 영향을 미치게 된다.3. In order to avoid the above-mentioned problems, in many conventional manufacturing methods, a water-soluble film having a suitable thickness is prepared, in which case the thickness of the film has a direct adverse effect on the dissolution rate of the heating bath. Go crazy.
4. 수용성막의 두께는 또한 열용해성 접착제의 비율에 직접 영향을 미치게 되는데, 막 두께가 두꺼울수록 함량비율이 높아져 열용해성 접착제의 배합방법과 품질에 막대한 영향을 미친다.4. The thickness of the water-soluble film also directly affects the ratio of the heat-soluble adhesive. The thicker the film thickness, the higher the content ratio, which has a significant effect on the formulation and quality of the heat-soluble adhesive.
따라서, 본 발명은 종래의 제조방법에 비해, 일종의 신규의 연속적인 포장방법을 제공하므로서, 종래의 제조방법에서의 결점을 완전히 극복하였다.Accordingly, the present invention completely overcomes the drawbacks of the conventional manufacturing method by providing a kind of novel continuous packaging method as compared to the conventional manufacturing method.
본 발명의 목적은 일종의 포장용 열용해성 접착제 제조방법을 제공하는 것으로서, 구체적으론 일종의 주, 부 압출기 세트 또는 펌프와 압출기 세트로 각각의 열용해성 접착제와 아교막을 동기적으로 용해시켜 젤(jell) 상태가 되게 하며, 동시에 압출 주형내에 회합시키고, 압출 주형에 의해 연속적으로 배출된 열용해성 접착제의 외부표면에 직접 한 층의 원통형태의 아교막을 피복시키는 연속자동 포장방법을 제공하는 것이다.SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a thermally soluble adhesive for packaging, and in particular, the thermally soluble adhesive and the glial membrane are synchronously dissolved in a kind of a main or secondary extruder set or a pump and an extruder set to obtain a gel state. It is to provide a continuous automatic packaging method that is simultaneously associated with the extrusion mold, and coating a layer of cylindrical glue film directly on the outer surface of the heat-soluble adhesive continuously discharged by the extrusion mold.
본 발명의 포장용 열용해성 접착제 제조방법은 아래를 포함한다.The method for producing a packaging heat-soluble adhesive of the present invention includes the following.
1) 주, 부 압출기 세트 또는 펌프와 압출기 세트로 각각의 열용해성 접착제와 아교막 원료를 동기적으로 용해시켜, 상기 두 압출기의 출구에 공통으로 연결된 압출 주형내로 이송시킨다.1) Synchronously dissolve each thermally soluble adhesive and glue raw material with a set of primary and secondary extruders or a pump and an extruder and transfer them into an extrusion mold commonly connected to the outlets of the two extruders.
2) 압출 주형은 둥근 기둥형태의 열용해성 접착제를 연속적으로 압출해내는 동시에 그 외부표면에 한 층의 적당한 두께의 아교막을 피복하여 긴밀히 결합시킨다.2) The extrusion mold continuously extrudes the round columnar heat-soluble adhesive and simultaneously bonds the outer surface with a layer of a suitable thickness of a glue film.
3) 아교막이 피복된 열용해성 접착제는 계속해서 압출되어 냉각조로 진입해 예비냉각된다.3) The glue-coated thermally soluble adhesive is subsequently extruded into the cooling bath and precooled.
4) 예비냉각되어 아직 완전히 굳어지지 않은 열용해성 접착제를 절단장치를 이용해 입구를 봉하는 동시에 일정한 크기의 덩어리로 절단한다.4) The heat-soluble adhesive, which is precooled and not yet completely hardened, is cut into chunks of constant size while sealing the inlet by using a cutting device.
5) 덩어리 형태의 열용해성 접착제가 냉각조에 인입되어 계속 냉각되며 이송벨트를 이용해 점차 냉각조를 나오면서 건조가 진행된다.5) Agglomerated heat-soluble adhesive enters the cooling tank and continues to cool, and drying proceeds gradually by exiting the cooling tank using a transfer belt.
상술한 방법을 이용해 일종의 접착제 및 아교막이 주, 부 압출기 세트 또는 펌프와 압출기 세트의 동기적 작용에 의해 원기둥 형태로 형성되며, 동시에 긴밀히 결합된 아교막으로 피복되고, 냉각조의 예비냉각을 거쳐, 완전히 굳어지기 전에 입구가 봉해지고 절단되어 설정된 길이의 베개형태의 덩어리의 열용해성 접착제가 제조된다.Using the above-described method, a kind of adhesive and glue film are formed in a cylindrical shape by the synchronous action of the main or secondary extruder set or the pump and the extruder set, and are simultaneously covered with a tightly bonded glue film, and after precooling of the cooling tank, Before hardening, the inlet is sealed and cut to produce a pillow-shaped thermally soluble adhesive of a set length.
그중 아래 재료의 중합체와 복합물로 열용해성 접착제가 구성되는데;Among them, a heat-soluble adhesive is composed of a polymer and a composite of the following materials;
합성수지, 고무, 폴리에틸렌, 폴리비닐 아세테이트, 에탄-폴리비닐 에탄이며,Synthetic resins, rubber, polyethylene, polyvinyl acetate, ethane-polyvinyl ethane,
비교적 특별한 예는 아래 나열하는 재료로 제조한 열용해성 접착제를 포함한다.Relatively special examples include heat-soluble adhesives made from the materials listed below.
① 고무중합체로 예를들어, 비닐기 방향족 탄화수소와 복합 다이네 상감중합체, 또는 스티렌-부티다엔, 스티렌-부티다엔-스티렌, 스티렌-이소프렌- 스티렌, 스티렌-에탄-코로토-스티렌, 스티렌-에탄-스티렌 등.① As the rubber polymer, for example, a vinyl aromatic hydrocarbon and a composite diene inlay polymer, or styrene-butadiene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-ethane-corro-styrene, styrene Ethane-styrene, etc.
②에탄-폴리비닐 에탄 중합체, 기타 아세테이트와 아세테이트 중합체.Ethane-polyvinyl ethane polymer, other acetate and acetate polymer.
③폴리에탄 폴리프로필렌과 같은 올레핀.③ Olefin such as polyethane polypropylene.
④폴리비닐 에탄 복합물 등등.④ polyvinyl ethane composite etc.
열용해성 접착제가 압출되어 나오는 온도는 90-120℃이고 그 점도는 2000-300000 CP이며, 열용해성 접착제와 표면 피복 재료의 상호 용합도는 저온(40-70℃)일 때 비교적 낮고, 고온(110-150℃)일 때 비교적 양호하다.The temperature at which the heat-soluble adhesive is extruded is 90-120 ° C., the viscosity is 2000-300000 CP, and the mutual solubility of the heat-soluble adhesive and the surface coating material is relatively low at low temperature (40-70 ° C.) and high temperature (110 ° C.). -150 ° C), which is relatively good.
그리고 본 발명에서 사용되는 표면 피복 재료 즉, 아교막의 재료로는 에탄-폴리비닐에탄 중합체, 폴리에틸렌, 에탄-폴리비닐에탄 중합체와 폴리에틸렌의 혼합물이 사용되고, 아교막의 가공온도는 각각 에탄-폴리비닐에탄 중합체(90-130℃), 폴리에틸렌(110-130℃), 에탄-폴리비닐에탄 중합체와 폴리에틸렌의 혼합물(100-130℃)이며, 열용해성 접착제의 표면에 피복되는 막의 두께는 약 0.015㎜-0.03㎜(비율은 0.1％-0.3％)이다.As the surface coating material used in the present invention, that is, the material of the glue film, a mixture of ethane-polyvinylethane polymer, polyethylene, ethane-polyvinylethane polymer and polyethylene is used, and the processing temperature of the glue film is ethane-polyvinylethane polymer, respectively. (90-130 ° C), polyethylene (110-130 ° C), a mixture of ethane-polyvinylethane polymer and polyethylene (100-130 ° C), and the thickness of the film coated on the surface of the heat-soluble adhesive is about 0.015 mm-0.03 mm (The ratio is 0.1%-0.3%).
이하, 도면을 참조하여 본 발명을 보다 상세히 설명하기로 한다.Hereinafter, the present invention will be described in more detail with reference to the drawings.
도 1은 본 발명의 과정도.1 is a process diagram of the present invention.
도 2는 본 발명설비의 전체실시도.Figure 2 is an overall embodiment of the present invention equipment.
도 3은 본 발명설비의 전체구조도.Figure 3 is an overall structural diagram of the present invention equipment.
도 4는 본 발명설비의 단면구조 및 실시도.Figure 4 is a cross-sectional structure and implementation of the present invention equipment.
도 5는 본 발명의 완성품 외관도.5 is an external appearance of the finished product of the present invention.
도 6은 본 발명의 완성품 단면도.6 is a cross-sectional view of the finished product of the present invention.
도 7은 종래기술의 실시도.7 is an embodiment of the prior art.
〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
1 : 주 압출기2 : 부 압출기1: main extruder 2: secondary extruder
3 : 압출 주형4 : 냉각조3: extrusion mold 4: cooling tank
5 : 절단장치6 : 이송벨트5: Cutting device 6: Transfer belt
11 : 배출관32 : 구멍11 discharge pipe 32 hole
33 : 배출구34 : 홀33: outlet 34: hole
41 : 굴절롤러42 : 회전롤러41: refractive roller 42: rotating roller
61 : 수집조311 : 배출조61: collection tank 311: discharge tank
312 : 경사진 가는 틈312: slanted gap
우선 도 1에서 예시한 대로 본 발명의 제조방법은 아래와 같다.First, as illustrated in FIG. 1, the manufacturing method of the present invention is as follows.
1. 주, 부 압출기 세트 또는 펌프와 압출기 세트로 각각 열용해성 접착제와 아교막 원료를 동기적으로 용해시켜 이 두 압출기의 출구로부터 공통으로 연결된 압출 주형 내로 이송된다.1. The primary and secondary extruder sets, or the pump and extruder sets, respectively, dissolve synchronously the heat soluble adhesive and the glue raw material and transfer them from the outlets of these two extruders into the commonly connected extrusion molds.
2. 압출 주형은 둥근 기둥형태의 열용해성 접착제를 연속적으로 압출해내는 동시에 그 외부표면에 한 층의 적당한 두께의 아교막을 피복하여 긴밀히 결합시킨다.2. The extrusion mold continuously extrudes round columnar heat-soluble adhesives and bonds the outer surface with a layer of glue of appropriate thickness.
3. 아교막이 피복된 열용해성 접착제는 계속해서 압출되어 냉각조로 진입되어 예비냉각된다.3. The glue-coated thermally soluble adhesive is subsequently extruded into the cooling bath and precooled.
4. 예비냉각되어 아직 완전히 굳어지지 않은 열용해성 접착제를 절단장치를 이용해 입구를 봉하는 동시에 일정한 크기의 덩어리로 절단한다.4. The pre-cooled, thermally soluble adhesive, which is not yet completely hardened, is cut into lumps of uniform size while sealing the inlet with a cutting device.
5. 덩어리 형태의 열용해성 접착제가 냉각조에 인입되어 지속적으로 냉각되며 벨트를 이용해 점차 냉각조를 나오면서 건조가 진행되고 수집되어 상자에 포장된다.5. Agglomerated thermally soluble adhesive enters the cooling tank and is continuously cooled. The belt is gradually dried, collected and packaged in a box using a belt.
상술한 방법으로 포장된 열용해성 덩어리 형태의 접착제는 그 재료가 나오는 직경, 그리고 봉인, 절단장치의 봉인, 절단형태와 봉인, 절단속도에 의해 두툼하고 짧으며 양쪽 끝이 납작한 베개형태나 길고 가는 직사각형 형태가 된다.Adhesives in the form of thermally soluble agglomerates packaged in the above-mentioned manner are thick, short and flat at both ends by a diameter, the sealing of the material, and the sealing of the cutting device, the cutting shape and sealing, and the cutting speed. Form.
도 2내지 도 4에 도시한 것은 본 발명의 구체적인 실시예이다.2 to 4 are specific embodiments of the present invention.
즉, 열용해성 접착제의 원료를 주 압출기(1)에 넣고, 피복재료인 아교원료를 부 압출기(2)에 넣어 가열, 용해시킨다. 주 압출기(1) 및 부 압출기(2)의 배출단은 압출 주형(3)과 공통으로 연결되어 있으며, 상기 압출 주형(3)은 속이 빈 구멍(32)을 구비하고 있고, 속이 빈 구멍(32)의 위쪽에는 주 압출기(1)의 배출관(11)이 연결되고, 아래쪽에는 배출구(33)가 형성되어 있다. 압출 주형(3)의 배출조(311)의 위쪽은 홀(34)과 연결되고, 아래쪽은 경사진 가는 틈(312)에 의해 배출구(33)와 연결된다. 그리고 상기 홀(34)은 부 압출기(2)의 배출단과 연결된다. 이렇게 주, 부 압출기(1, 2)가 동시에 재료를 압출해 내면, 열용해된 접착제는 젤 상태로 긴 줄기 형태의 속이 빈 구멍(32)을 통하여 아래쪽으로 내려와 배출구(33)에 이르러 경사진 가는 틈(312)으로 압출된 아교막에 의해 피복되기 시작하고 동시에 긴밀히 결합해 함께 배출구(33)를 통해 원기등 형태로 압출되어 배출되며, 냉각조(4)에 인입되어 예비냉각된다. 굴절롤러(41)에 의한 굴절 및 전동 회전롤러(42)에 의한 끌어당김에 의해 점차 냉각된 장대 형태의 반완성품 상태의 접착제가 점차적으로 전진되어 봉인, 절단장치(5)에 이르게 된다. 아직 완전히 굳어지지 않은 상태를 이용해 눌러 절단하여 입구를 봉하고 동시에 일정한 길이로 절단하여, 덩어리 형태(도 5 및 도 6에 도시된 베개형태의 덩어리)의 완성품이 냉각조에 인입되어 완전히 냉각되고 계속해서 전진 이송되어 실온으로 옮겨진다. 그래서 경사지게 설치된 이송벨트(6)가 냉각되어 실온으로 옮겨진 베개모양의 완성품을 점차 이동시켜 수분을 건조시킨 후 수집조(61)에 떨어뜨려 수집, 포장, 상자에 넣는 과정을 거쳐 출하된다.That is, the raw material of a heat-soluble adhesive is put into the main extruder 1, and the glue raw material which is a coating material is put into the sub-extruder 2, and is heated and dissolved. The discharge ends of the main extruder 1 and the sub-extruder 2 are connected in common with the extrusion mold 3, which has an hollow hole 32 and a hollow hole 32. ), The discharge pipe 11 of the main extruder 1 is connected to the upper side, and the discharge port 33 is formed below. The upper part of the discharge tank 311 of the extrusion mold 3 is connected to the hole 34, and the lower part is connected to the outlet 33 by an inclined thin gap 312. And the hole 34 is connected to the discharge end of the secondary extruder (2). Thus, when the primary and secondary extruders 1 and 2 simultaneously extrude the material, the heat-dissolved adhesive descends downward through the hollow hole 32 in the form of a long stem to be inclined toward the outlet 33. It begins to be covered by the glue film extruded into the gap 312 and at the same time is tightly coupled together and extruded and discharged in the form of a cylinder lamp through the outlet 33 together, and is drawn into the cooling tank 4 to be precooled. By the refraction by the refraction roller 41 and the attraction by the electric rotary roller 42, the adhesive of the semi-finished state of the pole shape gradually cooled is advanced, and leads to the sealing and the cutting device 5. As shown in FIG. By pressing and cutting using the state that is not yet completely hardened, sealing the inlet and cutting it to a certain length at the same time, the finished product in the form of lumps (the pillow-shaped lumps shown in Figs. 5 and 6) is introduced into the cooling tank to be completely cooled and continued to advance. Transferred to room temperature. Therefore, the transport belt 6 installed inclined is cooled and gradually moved to a pillow-shaped finished product transferred to room temperature, dried, and then dropped into a collection tank 61 to be collected, packaged, and shipped through a process of being put in a box.
그중 아래 재료의 중합체와 복합물로 열용해성 접착제가 제조된다;Among them, a thermally soluble adhesive is prepared from a polymer and a composite of the following materials;
합성수지, 고무, 폴리에틸렌, 폴리비닐 아세테이트, 에탄-폴리비닐 에탄Synthetic resins, rubber, polyethylene, polyvinyl acetate, ethane-polyvinyl ethane
비교적 특별한 예는 아래 나열하는 재료로 제조한 열용해성 접착제를 포함한다.Relatively special examples include heat-soluble adhesives made from the materials listed below.
1. 고무중합체로 예를들어, 비닐기 방향족 탄화수소와 복합 다이네 상감중합체, 또는 스티렌-부티다엔, 스티렌-부티다엔-스티렌, 스티렌-이소프렌- 스티렌, 스티렌-에탄-코로토-스티렌, 스티렌-에탄-스티렌 등등.1. Rubber polymers, for example, vinyl aromatic hydrocarbons and complex diene inlays, or styrene-butadiene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-ethane-corro-styrene, Styrene-ethane-styrene and so on.
2) 에탄-폴리비닐 에탄 중합체, 기타 아세테이트와 아세테이트 중합체.2) ethane-polyvinyl ethane polymer, other acetate and acetate polymers.
3) 폴리에탄 폴리프로필렌과 같은 올레핀.3) olefins such as polyethane polypropylene.
4) 폴리비닐 에탄 복합물 등등.4) polyvinyl ethane complex etc.
열용해성 접착제가 압출되어 나오는 온도는 90-120℃이고, 그 점도는 2000-300000 CP이며, 열용해성 접착제와 표면 피복 재료의 상호 용합도는 저온(40-70℃)일 때 비교적 낮고, 고온(110-150℃)일 때 비교적 양호하다.The temperature at which the heat-soluble adhesive is extruded is 90-120 ° C., its viscosity is 2000-300000 CP, and the degree of mutual melting of the heat-soluble adhesive and the surface coating material is relatively low at low temperature (40-70 ° C.), 110-150 ° C.).
그리고 본 발명에서 사용되는 표면 피복 재료 즉, 아교막의 재료로는 다음과 같다.The surface coating material used in the present invention, that is, the material of the glue film is as follows.
1. 에탄-폴리비닐에탄 중합체.1. Ethane-polyvinylethane polymer.
2. 폴리에틸렌.2. Polyethylene.
3. 에탄-폴리비닐에탄 중합체와 폴리에틸렌의 혼합물3. A mixture of ethane-polyvinylethane polymer and polyethylene
그 가공온도는 각각 에탄-폴리비닐에탄 중합체(90-130℃), 폴리에틸렌(110-130℃), 에탄-폴리비닐에탄 중합체와 폴리에틸렌의 혼합물(100-130℃)이며, 열용해성 접착제의 표면에 피복되는 막의 두께는 약 0.015㎜-0.03㎜(비율은 0.1％-0.3％)이다.The processing temperatures are ethane-polyvinylethane polymer (90-130 ° C), polyethylene (110-130 ° C), a mixture of ethane-polyvinylethane polymer and polyethylene (100-130 ° C), respectively. The thickness of the film to be coated is about 0.015 mm-0.03 mm (ratio 0.1%-0.3%).
경사진 긴 틈(312)의 틈 간격은 접착제의 종류, 배출, 온도 등의 상관조건의 배합과 조정에 따라 달라지는데, 이로써 아교막의 두께의 비율을 최적의 상태로 유지시켜 품질을 관리할 수 있다. 이로서, 종래의 제조방법에서의 문제점인 막 두께가 지나치게 두꺼워지는 결점이 발생되지 않는다. 한편, 봉인, 절단장치(5)의 봉인, 절단속도는 필요에 의해 조절이 가능하며 봉인, 절단의 시간 간격이 길어질수록 길고 가늘어지는 비율이 높고, 봉인, 절단칼날의 형태 역시 각기 다른 형태와 크기로 필요에 따라 변경이 가능하다.The gap spacing of the inclined long gap 312 depends on the formulation and adjustment of the correlation conditions such as the type of adhesive, the discharge, the temperature, and the like, thereby maintaining the optimum ratio of the thickness of the glial membrane to manage the quality. This eliminates the drawback of excessively thick film, which is a problem in the conventional manufacturing method. On the other hand, the sealing, cutting speed of the cutting device (5), the cutting speed can be adjusted as needed, the longer the time interval of sealing, cutting, the longer and thinner the ratio, the shape of the seal, cutting blade also different shape and size Can be changed as needed.
이상을 종합하면, 본 발명은 종래의 제조방법에 비해 다음과 같은 다수의 잇점을 갖는다.In summary, the present invention has a number of advantages as compared to the conventional production method.
1. 본 발명의 접착제 및 그 피복되는 아교막은 주, 부 압출기 세트 또는 펌프와 압출기 세트로 동기적으로 압출해내어 양자가 상당히 긴밀한 결합에 이르게 되어 내부 공기의 잔존이나 기포의 발생을 막을 수 있고, 또한 아교막을 사전에 제작할 필요가 없어 불필요한 재료낭비를 줄여 원가하락을 도모할 수 있다.1. The adhesive of the present invention and its coated glue film can be extruded synchronously into the main, secondary extruder set, or the pump and extruder set, which leads to a very tight coupling, thereby preventing the remaining air or the generation of bubbles. In addition, there is no need to make the glue beforehand, which can reduce unnecessary waste of materials and reduce costs.
2. 아교막의 막 두께는 압출하는 원료에 따라 필요한 조정이 가능해 두께가 너무 두꺼워 발생하는 여러 결점을 방지할 수 있고 접착제의 점성 및 이후 열용해의 속도 역시 보장되며 이로써 요구하는 품질을 얻을 수 있다.2. The film thickness of the glue can be adjusted according to the raw material to be extruded, so that it is possible to prevent the various defects caused by the thickness too thick, and also to ensure the viscosity of the adhesive and the speed of subsequent heat dissolution, thereby obtaining the required quality.
Claims (6)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011211318A CN1191964C (en) | 2001-06-11 | 2001-06-11 | Method of Packaging Hot Melt Adhesives |
| CN01121131.8 | 2001-06-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020095070A true KR20020095070A (en) | 2002-12-20 |
| KR100459504B1 KR100459504B1 (en) | 2004-12-03 |
Family
ID=4664415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-0027898A Expired - Lifetime KR100459504B1 (en) | 2001-06-11 | 2002-05-20 | Manufacture method for packing hot melt adhesive |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100459504B1 (en) |
| CN (1) | CN1191964C (en) |
| MY (1) | MY128841A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013177382A1 (en) * | 2012-05-24 | 2013-11-28 | Henkel US IP LLC | Process for preparing flowable amorphous poly-alpha olefin adhesive pellets |
| CN112429309A (en) * | 2020-11-10 | 2021-03-02 | 河北耐诺科技有限公司 | Film laminating machine |
| CN114302798A (en) * | 2020-08-06 | 2022-04-08 | 巴顿菲尔-辛辛那提德国有限公司 | Device and method for cutting plastic profiles to length |
| CN114378972A (en) * | 2022-01-12 | 2022-04-22 | 吴寿均 | Preparation method of organic silicon adhesive |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100448748C (en) * | 2006-04-19 | 2009-01-07 | 广州玺明机械有限公司 | Adhesive film sealing machine suction cutting sealing device |
| CN102241948A (en) * | 2010-05-14 | 2011-11-16 | 德渊企业股份有限公司 | Method for producing hot melt adhesive |
| ITUA20161888A1 (en) * | 2016-03-22 | 2017-09-22 | Durante & Vivan S P A | REACTIVE HOT COLLE IN THE FORM OF 'BEARINGS'. |
-
2001
- 2001-06-11 CN CNB011211318A patent/CN1191964C/en not_active Expired - Lifetime
-
2002
- 2002-05-20 MY MYPI20021842A patent/MY128841A/en unknown
- 2002-05-20 KR KR10-2002-0027898A patent/KR100459504B1/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013177382A1 (en) * | 2012-05-24 | 2013-11-28 | Henkel US IP LLC | Process for preparing flowable amorphous poly-alpha olefin adhesive pellets |
| KR20150020544A (en) * | 2012-05-24 | 2015-02-26 | 헨켈 유에스 아이피 엘엘씨 | Process for preparing flowable amorphous poly-alpha olefin adhesive pellets |
| US9364985B2 (en) | 2012-05-24 | 2016-06-14 | Henkel IP & Holding GmbH | Process for preparing flowable amorphous poly-alpha olefin adhesive pellets |
| CN114302798A (en) * | 2020-08-06 | 2022-04-08 | 巴顿菲尔-辛辛那提德国有限公司 | Device and method for cutting plastic profiles to length |
| CN114302798B (en) * | 2020-08-06 | 2024-03-15 | 巴顿菲尔-辛辛那提德国有限公司 | Apparatus and method for cutting plastic profiles to length |
| CN112429309A (en) * | 2020-11-10 | 2021-03-02 | 河北耐诺科技有限公司 | Film laminating machine |
| CN114378972A (en) * | 2022-01-12 | 2022-04-22 | 吴寿均 | Preparation method of organic silicon adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1390906A (en) | 2003-01-15 |
| MY128841A (en) | 2007-02-28 |
| CN1191964C (en) | 2005-03-09 |
| KR100459504B1 (en) | 2004-12-03 |
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