KR200163645Y1 - Wafer boat - Google Patents
Wafer boat Download PDFInfo
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- KR200163645Y1 KR200163645Y1 KR2019970008649U KR19970008649U KR200163645Y1 KR 200163645 Y1 KR200163645 Y1 KR 200163645Y1 KR 2019970008649 U KR2019970008649 U KR 2019970008649U KR 19970008649 U KR19970008649 U KR 19970008649U KR 200163645 Y1 KR200163645 Y1 KR 200163645Y1
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- pillar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 상부 및 하부가 개방되고 측면에 각각의 기둥을 갖는 몸체와, 각각의 기둥의 측면에 서로 대응되도록 형성된 다수의 웨이퍼안착부를 구비하여 각각의 대응되는 웨이퍼안착부에 웨이퍼가 적재되는 웨이퍼보오트에 관한 것으로, 웨이퍼안착부의 웨이퍼와 접촉되지 않는 부분에 홈이 형성된 것을 특징으로 한다.The present invention has a wafer beam having a top and a bottom open and a body having respective pillars on the side, and a plurality of wafer seating portions formed to correspond to each other on the side of each pillar, wherein wafers are loaded on each corresponding wafer seating portion It relates to an oat, characterized in that the groove is formed in the portion that is not in contact with the wafer of the wafer seating portion.
따라서, 본 고안의 웨이퍼보오트에서는 웨이퍼에 노출되는 웨이퍼안착부에 홈을 형성함으로써, 증착물질이 홈 내부에 매립됨에 따라, 웨이퍼안착부에 이물증착됨에 따른 웨이퍼 손상을 줄일 수 있다.Therefore, in the wafer boat of the present invention, by forming a groove in the wafer mounting portion exposed to the wafer, as the deposition material is embedded in the groove, it is possible to reduce wafer damage due to foreign matter deposition on the wafer mounting portion.
Description
본 고안은 반도체 제조 장치에 관한 것으로서, 특히, 반도체 제조 공정시에 웨이퍼를 적재시키기에 용이하도록 한 웨이퍼보오트에 관한 것이다.The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a wafer boat made easy to load a wafer in a semiconductor manufacturing process.
일반적으로 웨이퍼보오트는 반응로 내에 공정이 진행될 다수의 웨이퍼가 적재되는 것으로 웨이퍼와의 접촉면적을 최소화하면서 안정적으로 고정시키는 것이 중요하다.In general, the wafer boat is loaded with a plurality of wafers to be processed in a reactor, and it is important to stably fix the wafer board while minimizing a contact area with the wafer.
제1a도 내지 제1e도는 종래기술에 따른 웨이퍼보오트를 도시한 도면으로, 제1a도는 종래의 일반적인 웨이퍼보오트의 사시도이고, 제1b도는 제1a도의 S부분을 부분확대한 도면이고, 제1c도는 종래의 웨이퍼보오트의 정면도이고, 제1d도는 종래의 웨이퍼보오트에 확산가스가 증착됨을 보인 도면이고, 제1e도는 종래의 웨이퍼보오트의 문제점을 도출시키기 위한 도면이다.1A to 1E show a wafer boat according to the prior art, FIG. 1A is a perspective view of a conventional wafer boat, and FIG. 1B is a partially enlarged view of part S of FIG. 1A, and FIG. 1C FIG. 1 is a front view of a conventional wafer boat, and FIG. 1d is a view showing diffusion gas is deposited on a conventional wafer boat, and FIG. 1e is a diagram for deriving a problem of a conventional wafer boat.
이하, 첨부된 도면을 참조하여 설명하겠다.Hereinafter, with reference to the accompanying drawings will be described.
종래의 웨이퍼보오트는 제1a도와 같이, 상부 및 하부가 개방되고 측면에 다수 개의 기둥(11)을 갖는 몸체(10)와, 각각의 기둥(11)의 내측면에 웨이퍼가 안착되도록 서로 대응되도록 다수개 형성된 웨이퍼안착부(15)로 구성된다.Conventional wafer boats, as shown in FIG. It is composed of a wafer seating portion 15 formed.
상기에서, 기둥(11)을 포함하는 몸체(10)는 석영 또는 탄화규소 등으로 형성된다. 그리고, 기둥(11)에 형성된 웨이퍼안착부(15)는 제1b도와 같이, 각각의 기둥(11) 내측면에 홈의 형태로 형성되며, 표면이 평평하고 가장자리가 곡선처리된 형태를 갖는다.In the above, the body 10 including the pillar 11 is formed of quartz or silicon carbide. And, the wafer seating portion 15 formed in the pillar 11 is formed in the form of a groove on the inner surface of each pillar 11, as shown in Figure 1b, the surface is flat and has a curved shape of the edge.
이와같이 구성된 종래의 웨이퍼보오트는, 각각의 기둥(11)의 최하부에 형성된 각각 대응되는 웨이퍼안착부(15)에 첫번째 웨이퍼(#1)를 안착시킨 후, 다음의 대응되는 각각의 웨이퍼안착부에 두번째 웨이퍼(#2)를 안착시키며, 이러한 순서에 의해 최종의 웨이퍼까지 적재시킨다.In the conventional wafer boat configured as described above, the first wafer # 1 is seated on the corresponding wafer seating portion 15 formed at the bottom of each pillar 11, and then the second corresponding wafer seating portion is second. The wafer # 2 is seated and loaded up to the final wafer in this order.
이어서, 웨이퍼(13) 적재가 완료된 웨이퍼보오트는 도면에 도시되지 않았지만, 이송암에 의해 확산로(furnance) 내부로 이송되며, 반응로에서는 일측에 형성된 공정가스주입관으로 부터 공급되는 공정가스가 웨이퍼보오트 내의 웨이퍼와 웨이퍼 사이로 흐르면서 증착 등의 공정이 진행된다.Subsequently, although the wafer boat in which the wafer 13 is loaded is not shown in the drawing, the wafer boat is transferred into the diffusion furnace by the transfer arm, and the process gas supplied from the process gas injection pipe formed at one side in the reactor is wafer. Processes such as deposition proceed between the wafer and the wafer in the boat.
이때, 공정가스는 제1c도와 같이, 웨이퍼(15) 표면 뿐만 아니라, 웨이퍼(15)와 기둥(11) 사이의 웨이퍼안착부(13) 및 기둥(11)에까지도 증착된다.At this time, the process gas is deposited not only on the wafer 15 surface, but also on the wafer seating portion 13 and the pillar 11 between the wafer 15 and the pillar 11 as shown in FIG. 1C.
다음에, 확산공정 진행완료된 웨이퍼보오트를 확산로 밖으로 꺼낸다.Next, the wafer boat having completed the diffusion process is taken out of the diffusion furnace.
그러나, 종래의 웨이퍼보오트에서는 확산로 내에서 공정진행 시, 제1d도와 같이, 웨이퍼 표면 및 웨이퍼와 기둥 사이의 웨이퍼안착부 및 기둥에 증착막이 형성된다.However, in the conventional wafer boat, as the process proceeds in the diffusion path, a deposition film is formed on the wafer surface and on the wafer seat and the pillar between the wafer and the pillar as shown in FIG.
따라서, 증착횟수가 증가됨에 따라 웨이퍼에 의해 가려지지 않고 노출된 웨이퍼안착부 표면 즉, 웨이퍼와 기둥 사이의 웨이퍼안착부에 증착물질이 다량 증착됨으로 인하여 웨이퍼 적재 시, 안착되는 웨이퍼와 웨이퍼안착부와의 접촉면적이 적어지고, 이에 따라 웨이퍼가 웨이퍼보오트에 불안정하게 적재된다.Therefore, as the number of deposition increases, a large amount of deposition material is deposited on the exposed surface of the wafer seat portion, that is, the wafer seat portion between the wafer and the pillar, which is not covered by the wafer. Contact area of the wafer becomes small, and the wafer is unstablely loaded on the wafer boat.
또한, 웨이퍼 적재 시, 증착물질(17)로 인하여 웨이퍼안착부에 안착되는 웨이퍼 가장자리와 증착물질 간에 마찰이 생기거나, 또는 웨이퍼가 웨이퍼 안착부로 부터 슬라이딩(sliding)되어 제품이 손상되는 문제점이 발생된다.In addition, when the wafer is loaded, the deposition material 17 causes friction between the wafer edge and the deposition material seated on the wafer seating portion, or the wafer is slid from the wafer seating portion to damage the product. .
따라서, 이러한 문제점을 해결하고자 본 고안의 목적은 웨이퍼안착부로부터 웨이퍼롤 안정적으로 안착시키어 웨이퍼 적재에 용이하도록 한 웨이퍼보오트를 제공하는 데 있다.Accordingly, an object of the present invention to solve this problem is to provide a wafer boat that is stable to the wafer roll from the wafer mounting portion to facilitate the wafer loading.
상기의 목적을 달성하고자, 본 고안은 상부 및 하부가 개방되고 측면에 각각의 기둥을 갖는 몸체와, 각각의 기둥의 측면에 서로 대응되도록 형성된 다수의 웨이퍼안착부를 구비하여 각각의 대응되는 웨이퍼안착부에 웨이퍼가 적재되는 웨이퍼보오트에 관한 것으로, 웨이퍼안착부의 웨이퍼와 접촉되지 않는 부분에 홈이 형성된 것을 특징으로 한다.In order to achieve the above object, the present invention includes a body having an upper and a lower opening and having respective pillars on the side, and a plurality of wafer seating portions formed to correspond to each other on the sides of each pillar, respectively, corresponding wafer seating portions. The present invention relates to a wafer boat on which a wafer is loaded, wherein a groove is formed in a portion which is not in contact with the wafer.
이하, 첨부된 도면을 참조하여 본 고안을 설명하겠다.Hereinafter, the present invention will be described with reference to the accompanying drawings.
제1a도 내지 제1e도는 종래기술에 따른 웨이퍼보오트를 도시한 도면으로,1a to 1e are views showing a wafer boat according to the prior art,
제1a도는 종래의 일반적인 웨이퍼보오트의 사시도이고,1A is a perspective view of a conventional general wafer boat,
제1b도는 제1a도의 S부분을 부분확대한 도면이고,FIG. 1B is a partially enlarged view of part S of FIG. 1A,
제1c도는 종래의 웨이퍼보오트의 정면도이고,1c is a front view of a conventional wafer boat,
제1d도는 종래의 웨이퍼보오트에 확산가스가 증착됨을 보인 도면이고,1d is a view showing that a diffusion gas is deposited on a conventional wafer boat,
제1e도는 종래의 웨이퍼보오트의 문제점을 도출시키기 위한 도면이다.FIG. 1E is a diagram for drawing a problem of a conventional wafer boat.
제2a도 내지 제2e도는 본 고안에 따른 웨이퍼보오트를 도시한 도면으로,2a to 2e is a view showing a wafer boat according to the present invention,
제2a도는 본 고안의 웨이퍼보오트의 사시도이고,Figure 2a is a perspective view of the wafer boat of the present invention,
제2b도는 제2a도의 T부분을 부분확대한 도면이고,FIG. 2B is a partially enlarged view of part T of FIG. 2A,
제2c도는 본 고안의 웨이퍼보오트의 정면도이고,Figure 2c is a front view of the wafer boat of the present invention,
제2d도와 제2e도는 본 고안의 웨이퍼보오트에 확산가스가 증착됨을 보인 도면이다.2d and 2e is a view showing that the diffusion gas is deposited on the wafer boat of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10, 100 : 몸체 11, 111 : 기둥10, 100: body 11, 111: pillar
13, 113 : 웨이퍼 15, 115 : 웨이퍼안착부13, 113: wafer 15, 115: wafer seat
17, 117 : 증착물질 116 : 홈17, 117: deposition material 116: groove
제2a도 내지 제2e도는 본 고안에 따른 웨이퍼보오트를 도시한 도면으로, 제2a도는 본 고안의 웨이퍼보오트의 사시도이고, 제2b도는 제2a도의 T부분을 부분확대한 도면이고, 제2c도는 본 고안의 웨이퍼보오트의 정면도이고, 제2d도와 제2e도는 본 고안의 웨이퍼보오트에 확산가스가 증착됨을 보인 도면이다.2a to 2e is a view showing a wafer boat according to the present invention, Figure 2a is a perspective view of the wafer boat of the present invention, Figure 2b is a partially enlarged view of the portion T of Figure 2a, 2c FIG. 2 is a front view of the wafer boat of the present invention, and FIGS. 2d and 2e show that the diffusion gas is deposited on the wafer boat of the present invention.
본 고안의 웨이퍼보오트는 제2a도 내지 제2b도와 같이, 상부 및 하부가 개방되고 측면에 다수 개의 기둥(111)을 갖는 몸체(100)와, 각각의 기둥(111)의 내측면에 웨이퍼가 안착되도록 서로 대응되도록 형성되고, 기둥(111)과 연결된 부위에 홈(116)이 형성된 다 수개의 웨이퍼안착부(115)로 구성된다.In the wafer boat of the present invention, as shown in FIGS. 2A to 2B, a body 100 having a plurality of pillars 111 at the top and bottom thereof is opened, and a wafer is seated on an inner side surface of each pillar 111. It is formed so as to correspond to each other, it is composed of a plurality of wafer seating portion 115, the groove 116 is formed in a portion connected to the pillar 111.
상기에서, 기둥(111)을 포함하는 몸체(100)는 석영 또는 탄화규소 등으로 형성된다.In the above, the body 100 including the pillar 111 is formed of quartz or silicon carbide.
이와같이 구성된 본 고안의 웨이퍼보오트는, 각각의 기둥(111)의 최하부에 형성된 각각 대응되는 웨이퍼안착부(115)들에 낱개의 첫번째 웨이퍼(#1)를 안착시킨 후, 다음의 대응되는 각각의 웨이퍼안착부들에 두번째 웨이퍼(#2)를 안착시키는 순서에 의해 최종의 웨이퍼까지 적재시킨다.In the wafer boat of the present invention configured as described above, the first wafer # 1 is seated on the corresponding wafer seating portions 115 formed at the bottom of each pillar 111, and then each corresponding wafer is The second wafer # 2 is placed on the seating portions until the final wafer is loaded.
웨이퍼 적재가 완료된 웨이퍼보오트는 도면에 도시되지 않았지만, 이송암에 의해 확산로 내부로 이송되며, 확산로에서는 일측에 형성된 공정가스주입관으로 부터 공급되는 공정가스가 웨이퍼보오트 내의 웨이퍼와 웨이퍼 사이로 흐르면서 증착공정이 진행되도록 한다.Although the wafer boat is not shown in the drawing, the wafer boat is transferred to the inside of the diffusion furnace by a transfer arm. Allow the deposition process to proceed.
이때, 공정가스는 제2d도와 같이, 각각의 웨이퍼(113) 표면 뿐만 아니라, 웨이퍼(113)와 기둥(111) 사이의 웨이퍼안착부(115)의 홈(116) 및 기둥(111)에 까지도 증착된다.At this time, the process gas is deposited not only on the surface of each wafer 113, but also on the grooves 116 and the pillars 111 of the wafer seating portion 115 between the wafer 113 and the pillars 111 as shown in FIG. 2D. do.
이때, 웨이퍼안착부(115)는 웨이퍼안착부위와 홈(116)이 형성된 여분의 공간으로 나뉘며, 웨이퍼안착부위의 소정영역까지 홈을 형성하여 웨이퍼와의 접촉면적을 줄일 수 있다.At this time, the wafer seating portion 115 is divided into an extra space in which the wafer seating portion and the groove 116 are formed, and the contact area with the wafer can be reduced by forming a groove to a predetermined area of the wafer seating portion.
다음에, 확산공정 진행완료된 웨이퍼보오트를 확산로 밖으로 꺼내어 각각의 웨이퍼를 웨이퍼카세트에 옮기고, 제2e도와 같이, 빈 웨이퍼보오트 내의 각각 대응되는 웨이퍼안착부들(115)에 공정이 진행될 다 수의 웨이퍼(113)를 적재시킨다.Next, the wafer boats having undergone the diffusion process are taken out of the diffusion furnace, and each wafer is transferred to the wafer cassette, and as shown in FIG. 2E, the process is performed on the corresponding wafer seating portions 115 in the empty wafer boats. The wafer 113 is loaded.
상기에서 살펴본 바와 같이, 증착공정 시, 증착가스가 증착됨에 따라 웨이퍼안착부에 발생되는 이물에 의해 웨이퍼의 슬라이딩 또는 마찰로 웨이퍼가 손상되는 종래와는 달리, 본 고안의 웨이퍼보오트에서는 표면에 안착된 웨이퍼에 가려지지 않고 노출된 부위 즉, 웨이퍼와 기둥과의 틈새에 홈을 형성함에 따라, 증착공정 시, 홈 내부에 증착물질이 채워지도록 한다.As described above, in the deposition process, unlike the conventional method in which the wafer is damaged by sliding or friction of the wafer by foreign substances generated in the wafer seating portion as the deposition gas is deposited, the wafer boat of the present invention is seated on the surface. As the grooves are formed in the exposed portions, that is, the gaps between the wafer and the pillars, the deposition material is filled in the grooves during the deposition process.
따라서, 본 고안의 웨이퍼보오트에서는 웨이퍼안착부의 표면에 이물이 형성되는 것을 억제하여 웨이퍼 손상을 줄일 수 있다.Therefore, in the wafer boat of the present invention, it is possible to reduce the damage to the wafer by suppressing the formation of foreign matter on the surface of the wafer seat.
또한, 웨이퍼와 웨이퍼안착부의 접촉면적을 줄이어 웨이퍼가 파티클에 의해 오염되는 것을 최소화할 수 있다.In addition, the contact area between the wafer and the wafer seat can be reduced to minimize the contamination of the wafer by the particles.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970008649U KR200163645Y1 (en) | 1997-04-24 | 1997-04-24 | Wafer boat |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970008649U KR200163645Y1 (en) | 1997-04-24 | 1997-04-24 | Wafer boat |
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| Publication Number | Publication Date |
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| KR19980064033U KR19980064033U (en) | 1998-11-25 |
| KR200163645Y1 true KR200163645Y1 (en) | 2000-01-15 |
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| KR100800320B1 (en) * | 2001-05-18 | 2008-02-01 | 엘지.필립스 엘시디 주식회사 | Board storage cassette |
| KR102797418B1 (en) * | 2023-10-05 | 2025-04-21 | 솔믹스 주식회사 | wafer boat |
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