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KR20010024370A - 마이크로전자 소자를 제조하는 동안 처리 유체에 작업편표면의 노출을 제어하기 위한 장치 및 방법 - Google Patents

마이크로전자 소자를 제조하는 동안 처리 유체에 작업편표면의 노출을 제어하기 위한 장치 및 방법 Download PDF

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Publication number
KR20010024370A
KR20010024370A KR1020007003485A KR20007003485A KR20010024370A KR 20010024370 A KR20010024370 A KR 20010024370A KR 1020007003485 A KR1020007003485 A KR 1020007003485A KR 20007003485 A KR20007003485 A KR 20007003485A KR 20010024370 A KR20010024370 A KR 20010024370A
Authority
KR
South Korea
Prior art keywords
workpiece
processing fluid
processing
contact
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007003485A
Other languages
English (en)
Korean (ko)
Inventor
로버트 더블유. 주니어. 배츠
리드 에이. 블랙번
스티븐 이. 켈리
제임스 더블유. 두리틀
Original Assignee
세미툴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/940,517 external-priority patent/US6090711A/en
Priority claimed from US08/940,523 external-priority patent/US6015462A/en
Application filed by 세미툴 인코포레이티드 filed Critical 세미툴 인코포레이티드
Publication of KR20010024370A publication Critical patent/KR20010024370A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020007003485A 1997-09-30 1998-09-30 마이크로전자 소자를 제조하는 동안 처리 유체에 작업편표면의 노출을 제어하기 위한 장치 및 방법 Withdrawn KR20010024370A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/940,517 US6090711A (en) 1997-09-30 1997-09-30 Methods for controlling semiconductor workpiece surface exposure to processing liquids
US08/940,523 1997-09-30
US08/940,523 US6015462A (en) 1997-09-30 1997-09-30 Semiconductor processing workpiece position sensing
US08/940,517 1997-09-30
PCT/US1998/020743 WO1999017344A1 (fr) 1997-09-30 1998-09-30 Appareil et procedes pour controler l'exposition de la surface d'une piece a traiter a des liquides de traitement lors de la fabrication de composants micro-electroniques

Publications (1)

Publication Number Publication Date
KR20010024370A true KR20010024370A (ko) 2001-03-26

Family

ID=27130138

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007003485A Withdrawn KR20010024370A (ko) 1997-09-30 1998-09-30 마이크로전자 소자를 제조하는 동안 처리 유체에 작업편표면의 노출을 제어하기 위한 장치 및 방법

Country Status (6)

Country Link
EP (1) EP1029342A1 (fr)
JP (1) JP2001518567A (fr)
KR (1) KR20010024370A (fr)
CN (1) CN1272956A (fr)
AU (1) AU9679598A (fr)
WO (1) WO1999017344A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005093788A1 (fr) * 2004-03-22 2005-10-06 Rena Sondermaschinen Gmbh Procede de traitement de surfaces de substrats
US7566390B2 (en) * 2004-12-15 2009-07-28 Lam Research Corporation Wafer support apparatus for electroplating process and method for using the same
ES2401845T3 (es) 2005-11-23 2013-04-25 Materials And Technologies Corporation Dispositivo y procedimiento para sujetar un sustrato

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB710235A (en) * 1952-08-08 1954-06-09 Eisler Paul Printed electric circuits and electric circuit components

Also Published As

Publication number Publication date
JP2001518567A (ja) 2001-10-16
AU9679598A (en) 1999-04-23
WO1999017344A1 (fr) 1999-04-08
EP1029342A1 (fr) 2000-08-23
CN1272956A (zh) 2000-11-08

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20000330

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid