KR20010008282A - The parts assembling method for a printed circuit board use the conductible glue - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining components of a printed circuit board by using a conductive bond when the IC or other electronic components are coupled to a single-sided printed circuit board (printed circuit board). A printed circuit board 10 having a solder resister 30 coated on portions other than the land portion 20 on which the printed circuits are formed and the holes 15 on which the parts are coupled are formed; The same circuit pattern as the circuit printed on the printed circuit board 10 is printed, and a land hole 45 having a size corresponding to the land portion 20 of the printed circuit board 10 is formed therethrough. An upper surface of the solder register portion 30 of the printed circuit board 10 is formed of a thin plate 40 of a non-conductive material having a predetermined thickness, on which one side 35 is printed, and an adhesive layer 42 is formed on one side thereof. After adhering the thin plate 40 to each other, the component elements 35 printed on the upper surface of the thin plate 40 are watched, and each component element is formed into the land hole 45 of the thin plate and the hole 15 of the printed circuit board 10. After the lead wires 27 of 25 are positioned, a conductive bond 50 is injected around the lead wires 27 of the land holes 45 to couple the components of the printed circuit board.

Description

The parts assembling method for a printed circuit board use the conductible glue}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining a single-sided printed circuit board using a conductive bond when bonding an IC or other electronic component to a printed circuit board (PCB), and particularly, a copper foil is formed on a front surface thereof. The printed circuit board printed with the circuit and the symbol of the parts to be assembled with the same circuit pattern as the printed circuit board are printed on the upper surface, and the land hole of the size corresponding to the land portion of the copper foil formed on the printed circuit board penetrates. The present invention relates to a component joining method of a printed circuit board, in which a conductive sheet is injected by assembling a conductive bond after a predetermined thickness of a thin plate is adhered to an upper surface of the printed circuit board and various components such as IC are attached to a hole formed in the thin plate.

In the present invention, a copper foil is formed on one side, and a circuit is printed on a solder-resister portion, and on the other side, a component symbol and a part name are printed, and electronic components such as an IC are assembled so that only one side is used. As is applicable to a printed circuit board of the prior art, a conventionally used printed circuit board, as shown in Figs. 1 to 2, the copper foil is formed on one surface thereof, the circuit is printed, and the hole in the position where 15) is formed, and in the vicinity of the hole 15, a formed land portion 20, in which copper foil is exposed, is formed to solder the lead wire of the component, and the other side on which the land portion 20 is formed is soldered. The solder-resister portion 30 is coated to prevent the lead from melting due to high heat.

In addition, on the other side of the solder resister 30, a component symbol 35 to be assembled to facilitate assembly of each component is printed at each position.

In the conventional method of combining components using a printed circuit board, as shown in the operation flowchart of FIG. 3, an assembling device for assembling a printed circuit board is required to look at the component symbol 35 formed on the back of the printed circuit board. The solder wire is soldered to the solder register by rotating the printed circuit board in a state where the lead wire is inserted into each hole 15 and temporarily fixed, and after each component is fixed by soldering, each protruding part A method of completing assembly of a printed circuit board by cutting a lead wire of was used.

However, when used as a teaching aid to students in a general school, or when individuals assemble parts using printed circuit boards, these assemblers are non-specialists in this field, who are poor at assembling printed circuit boards and have a lack of know-how about work. Due to the structure of the circuit board, the parts must be inserted on one side and soldered on the other side, so the assembly of the printed circuit board is very difficult and the work speed is low. When soldering, burns are often caused by a high temperature soldering machine. .

In particular, since harmful gases are generated during soldering, there are risks when working in an enclosed space, and in order to assemble printed circuit boards, separate work tools or workshops such as soldering machines, lead, and a ventilator for releasing harmful gases are required. In the case of a joint learning facility, a separate training room has to be prepared, so it is economically expensive. In particular, it is difficult to have multiple work tools for assembling printed circuit boards personally. It acted as a factor to lower motivation.

The present invention has been made to solve the problems caused in the assembly of the conventional printed circuit board, the method of joining the printed circuit board using the conductive bond according to the present invention due to the lead when attaching the component to the printed circuit board It is an object of the present invention to provide a method of joining a printed circuit board that can assemble a printed circuit board safely even for a beginner by preventing a danger of harmful gas generated and a burner caused by a soldering machine.

In addition, the present invention eliminates the hassle of work caused by the soldering on the other side by rotating the printed circuit board after inserting the parts from one side when assembling the conventional printed circuit board, and prints using only one side of the printed circuit board Another object of the present invention is to provide a method of joining components of a printed circuit board to allow assembly of the circuit board to be completed.

In addition, the present invention, so that anyone can easily assemble the printed circuit board by eliminating the need for a large number of work tools that were required when assembling the conventional printed circuit board, inspires individual creativity and the desire to learn, in the case of a joint learning facility Another aim is to reduce the economic cost of preparing a learning facility by enabling learning and practice without facilities and work tools.

1 is a front view of a conventional printed circuit board,

2 is a rear view of a conventional printed circuit board,

3 is a work flow chart according to the conventional method for combining the components of the printed circuit board

4 is a component configuration diagram according to the component bonding method of the printed circuit board of the present invention;

5 is a front view of a thin plate used in the method for coupling parts of a printed circuit board according to the present invention;

6 is a rear view of a printed circuit board applied to the present invention;

7 is a work flow chart according to the method of coupling parts of the printed circuit board of the present invention;

8 is a partially enlarged view of a state in which a printed circuit board and a thin plate are coupled and a component is coupled by a conductive bond according to the present invention.

※ Brief description of symbols for the main parts of the drawings

10: printed circuit board 15: hole

20 land portion 30 solder resist portion

40: thin plate 42: adhesive layer

45: land hole 50: conductive bond

In order to achieve the above object, a part bonding method of a printed circuit board using a conductive bond according to the present invention includes a copper foil formed on one side thereof, except for a land part in which a circuit is printed and a hole in which a part is coupled is formed. A printed circuit board having a solder resist portion coated and a circuit having the same pattern as that printed on the printed circuit board are printed, and a land hole having a size corresponding to the land portion of the printed circuit board is formed therethrough. The symbol of each part to be assembled is printed on one side, and the back side is composed of a non-conductive material with an adhesive layer formed thereon, and then the adhesive layer of the thin plate is attached to the upper surface of the solder register of the printed circuit board, and then printed on the upper surface of the thin plate. After passing the lead wire of the part through the land hole of the thin plate and the hole of the printed circuit board while looking at the part symbol, the inside of the land hole Injecting a conductive bond around the lead wire is provided a method which component elements are combined.

Hereinafter, with reference to the accompanying drawings in the specification will be described in detail the present invention. The present invention relates to a method of assembling a printed circuit board of a new concept, which deviates from the method of assembling a printed circuit board using lead in the related art. Is shown in FIG. 4.

That is, according to the component configuration diagram of FIG. 4, the copper foil is formed on one surface to form a circuit that forms a predetermined pattern, and the portions other than the land portion 20 to which the lead wires 27 of the component element 25 are coupled are printed. An epoxy printed circuit board 10 having a solder resister 30 formed thereon and an upper surface of the solder resister 30 of the printed circuit board 10. An adhesive layer 42 is formed on the back surface to be bonded, and a circuit diagram identical to the print pattern formed on the solder resister 30 is printed on the top surface, and corresponds to the land portion 20 of the printed circuit board 10. A thin plate 40 through which a land hole 45 of a size is formed, and the thin plate 40 is stacked on an upper surface of the printed circuit board 10, and then the land hole 45 of the thin plate 40 and the printed circuit board ( A component element 25 to which the lead wire 27 passes through and is coupled to the hole 15 of the 10, and the land hole 45 of the thin plate 40. It is composed of a conductive bond 50 for fixing the lead wire 27 of the component element 25 passed through the hole 15 of the printed circuit board 10, the front view of the thin plate 40 in the present invention The back view of the applied printed circuit board is shown in FIGS. 5 and 6.

The printed circuit board 10 applied to the present invention includes a copper foil having a circuit pattern of a constant shape, the front part of which is formed in a portion to which a component element is coupled, and a copper foil around the hole. The land portion 20 to which the layer is exposed and the portions other than the land portion 20 have the same configuration in which the solder register portion 30 is formed to prevent the sticking of the solder during soldering. On the back side, the symbols of the parts to be assembled as in the prior art are not printed.

In addition, the thin plate 40 adhered to the front surface of the printed circuit board, that is, the upper surface of the solder register unit 30, has printed circuit patterns printed on the rear surface of the conventional printed circuit board on the upper surface thereof. At this position, a land hole 45 having a size of the copper land portion 20 formed on the upper surface of the printed circuit board is formed therethrough, and an adhesive layer is formed on the rear surface of the PCB to bond the solder resist to the printed circuit board. When it is used, it is configured to detach and adhere the backing paper (not shown), and the thin plate 40 is made of a non-conductive plastic material such as PVC, PC, PE, PS, PI, POM, PPS, AXS, ABS, EVA, etc. The land hole 45 formed in the thin plate 40 has a constant height so that a constant step is formed between the top surface of the land portion 20 of the printed circuit board 10 and the top surface of the thin plate 40. Conductive bond 50 injected inside of 45 Prevented from flowing to the periphery and to prevent the occurrence that the short between the parts after assembly of the printed circuit board.

In addition, the lead wire of each component device to be applied to the present invention is cut to have a length equal to the thickness of the laminated sheet and the printed circuit board to avoid the troublesome work of cutting the lead wire of the component device after assembly of the printed circuit board.

A method of coupling the printed circuit board 10, the thin plate 40, and the component elements 25 configured as described above will be described in detail below with reference to the operation flowchart shown in FIG.

That is, the printed circuit board 10 according to the present invention is a copper foil treatment for printing a circuit pattern on the upper surface, and the solder register portion in the portion other than the land portion 20 to which the lead wire of the component element is coupled to the copper foil treated surface 30 is formed.

In addition, the back side of the non-conductive thin plate 40 formed with the adhesive layer 42 is printed on the upper surface of the component symbol 35 to be assembled with the same circuit pattern as the printed circuit board 10, the adhesive layer of the thin plate 40 The backing paper attached to (42) is removed and the adhesive layer 42 is attached to the upper surface of the solder register portion 30 of the printed circuit board 10. In this case, the land holes 45 of the thin plate 40 and the land portions 20 of the printed circuit board 10 are bonded to each other, and after bonding, the upper surface of the printed circuit board 10 and the thin plate 40 are bonded to each other. The upper surface of the thin plate 40 may be rubbed several times with a palm so that no gap is generated between the adhesive layers 42 of the thin plate 40.

Since each component symbol 35 is printed on the upper surface of the thin plate 40 adhered to the upper surface of the solder register unit 30, the assembler looks at each component symbol 35 and inserts the corresponding component element 25 into each hole. Place it in That is, the lead wire 27 of the component element 25 is inserted into the land hole 45 of the thin plate 40 and the hole 15 of the printed circuit board 10, and then the land hole 45 of the thin plate 40. The conductive bond 50 is injected around the lead wire 27 of the component element 25 passed inward. When the conductive bond 50 is injected, the diameter of the land hole 45 of the thin plate 40 is larger than that of the hole 15 formed in the printed circuit board 10, so that the inside of the land hole 45 is formed. The conductive bond 50 injected into the upper surface of the land portion 20 of the copper foil formed on the outer circumference of the hole 15 of the printed circuit board 10 is fixed to the lead wire 27 of the component element 25 and the land of the copper foil. The coupling of the parts 20 is performed. In FIG. 8, a partially enlarged view of the state in which the component elements 25 are coupled by the conductive bond 50 while the thin plates 40 are stacked on the printed circuit board 10 is illustrated. It is.

On the other hand, the operation of the component bonding method of the printed circuit board using the conductive bond according to the present invention described above will be described.

The component joining method of a printed circuit board using the conductive bond according to the present invention is superior in the assembly thereof compared to the conventional method of joining parts of a printed circuit board.

That is, in the conventional method of joining parts of a printed circuit board, the lead wires protruded to the other side after inserting one lead wire of each component element into the hole of the printed circuit board while checking the part symbol or the part name printed on one side of the printed circuit board. And temporarily fix each other by inverting the printed circuit board, turn the printed circuit board upside down, and solder one by one to the land portion of the solder resist formed on the back surface, or dip the solder register part into a solder tank to fix the molten lead to the land portion where the copper foil is exposed. Although a method of joining a printed circuit board according to the present invention, the thin plate 40 of a non-conductive material having a circuit printed on the upper surface of the solder register unit 30 of the printed circuit board 10 is formed. The lead wires 27 of each component element 25 on the upper surface of the thin plate 40 while gluing them, and looking at the component symbols printed on the thin plate 40 adhered to the upper surface of the printed circuit board 10. When the conductive bond 50 is injected into the land hole 45 around the lead wire 27, each component element 25 is fixedly attached to the upper surface of the thin plate 40 coupled with the printed circuit board 10. Therefore, the assembly of each part is easy and simple features.

In addition, in the case of using the method of joining the printed circuit board according to the present invention, since the soldering tool, which is necessary for soldering, is not required as in the prior art, regardless of a place and a work tool in a general school, home, office, etc., It has the advantage of being able to combine parts, and there is no cost to secure the facility because it does not have to have a separate work room, and it is possible to assemble a printed circuit board without a separate work tool even when an individual learns and hobbies. It can help you to improve your motivation to learn and improve your creativity.

In addition, when assembling the printed circuit board by using the component bonding method of the printed circuit board according to the present invention, it is possible to prevent burns and various safety accidents that have occurred during soldering.

As described above, the component bonding method of a printed circuit board using a conductive bond according to the present invention is a copper foil is formed on only one surface of the printed circuit board is printed circuit pattern and the solder register portion, and the printed circuit board A circuit pattern identical to a circuit is printed on the upper surface thereof, a land hole having a size of a land portion is formed therethrough, an adhesive layer is formed on the rear surface thereof, and a non-conductive thin plate laminated on the upper surface of the solder register portion, and the printed circuit board is integrally formed. Since the lead wire of the component element is inserted into the land hole to the upper part of the thin plate bonded by the adhesive plate, the bonding bond is injected around the lead wire inside the land hole, and thus the component element is attached and coupled, thereby providing a method of joining the component to the printed circuit board. As there is no need for many work tools as in the assembly of a conventional printed circuit board, It can assemble printed circuit boards, and it can prevent worker's safety accidents such as the generation of harmful gas or burns that have occurred during soldering in the past, and it helps to improve learning motivation and creativity for beginners even when used as learning materials. In addition, it provides useful effects that can be done at a low cost even for an individual's hobby.

Claims (2)

A printed circuit board 10 having a solder resist portion 30 coated on portions except for the land portion 20 on which copper foils are formed on one side and a circuit is printed and holes 15 are formed. ; The same circuit pattern as that of the printed circuit board 10 is printed, and a land hole 45 having a size corresponding to the land portion 20 is formed therethrough, and each component symbol 35 to be assembled is printed on one side thereof. An adhesive layer 42 is formed on the rear surface and is formed of a non-conductive thin plate 40 having a predetermined thickness. The adhesive layer 42 of the thin plate 40 is formed on the upper surface of the solder register portion 30 of the printed circuit board 10. ) Are bonded in the same direction, and each component is turned into the land hole 45 of the thin plate 40 and the hole 15 of the printed circuit board 10 while looking at the component symbol 35 printed on the upper surface of the thin plate 40. After the lead wire 27 of the element 25 is inserted, the conductive bond 50 is injected around the lead wire 27 of the land hole 45 to bond the components of the printed circuit board. Part bonding method of printed circuit board using. The method of claim 1, The land hole 45 formed in the thin plate 40 has a constant height so that a constant step is formed between the upper surface of the land portion 20 of the printed circuit board 10 and the upper surface of the thin plate 40. 45) A method of assembling components of a printed circuit board using a conductive bond, which prevents the conductive bond 50 injected into the inside from flowing down to the periphery to prevent shorting between components after assembling the printed circuit board. .