KR20000051000A - Super-slim telephone - Google Patents

Abstract

The present invention relates to an ultra slim phone. The present invention consists of a telephone body miniaturized by mounting a telephone circuit component in a multilayer on a small double-sided PCB, and an earpiece handset which is connected / separated with a phone jack to the telephone body, and an earphone and a microphone are integrated. The telephone circuit components embedded in the telephone body are arranged on the double-sided PCB while forming a plurality of layers in consideration of the size and leg length of the components. The arrangement structure includes a first part consisting of small parts and a thin film type chip resistor on one side of a double-sided PCB, and a second part consisting of an IC chip, an audio jack, a switch, etc. on the other side while the first parts are mounted. The components are secondly stacked and mounted, and in the state where the first component and / or the second component are mounted, the third components, such as capacitors and crystals, are laminated on the one side and / or the other side in the third side. Short-legged parts are mounted first and large or long-legged parts placed on top of them.

Description

Super-slim telephone

The present invention relates to a hand-free ultra-slim telephone that is compact and portable by miniaturizing the telephone body.

A conventional type of telephone used in the related art is a hook switch and handset for turning on / off a telephone circuit, key input means having a plurality of keys for telephone number input and function selection, and a frequency of a key selected from the key input means. DTMF generating means for generating a dial signal corresponding to the ring, ring detecting means for detecting a ring signal or DTMF tone coming through the telephone line and outputting a ring detection signal, and converting an electrical signal from the telephone line into voice and transmitting it to the receiver. Or a call control means for converting the voice received from the caller side into an electric signal and transmitting it to a telephone line, and a handset for transmitting the voice output from the call control means to the handset or for transmitting the voice input through an external handset to the call control means. The connection means and the communication with the public network And a line connection means for connecting a telephone line such that a ring signal transmitted from an active state or a public communication network can be detected.

However, in the ordinary telephone as described above, the body of the telephone has a proper volume, and in the case of a landline telephone, a handset is mounted on the telephone body to control a hook switch, which requires a certain amount of space, and also makes a call. When you receive or receive a call, you must always hold the handset with you, so you can't perform other tasks at the same time as the phone call.

Therefore, the present invention has been created to solve the above problems, the present invention is a slim body and reduced volume by mounting a multi-layer phone circuit components on a small double-sided PCB, and the earpiece-type handset connected to / separated by a phone jack on the body It is an object of the present invention to provide an ultra-slim telephone, which is compact in size to accommodate only the key matrix of the case body of the telephone body, to be portable and mobile, and to be conveniently used by an operator using both hands.

In order to achieve the above object, the present invention comprises: a first double-sided PCB in which telephone circuit components are arranged in multiple layers; A second double-sided PCB stacked on an upper side of the first double-sided PCB and casing integrally with the first double-sided PCB to accommodate a plurality of keys of the phone on an upper surface of the case; It includes a slim body having a handset connecting means and a telephone line connection means respectively in the front and side predetermined position of the case, the first parts consisting of small components and thin film type chip resistor, etc. are mounted on one surface of the first double-sided PCB In the state in which the first components are mounted, the second components including the IC chip, the audio jack, the switch, and the like are secondarily stacked and mounted on the other surface, and in the state where the first components and / or the second components are mounted. And / or the components are arranged in a plurality of layers in consideration of the size and leg length of the components such as the third components such as capacitors and crystals are stacked and mounted on the other surface, and the slim body is a flat cable. And connecting the first and second double-sided PCBs using connectors connected thereto.

In addition, the present invention has a connection means corresponding to the handset connecting means to be connected to / disconnected from the slim body, the speaker by integrally casing the microphone and speaker and the input / output amplification means for the input / output of the voice signal It is composed of an earring handset that can be handheld by hanging the side of the ear, miniaturized the volume of the phone body is free to carry and move, and employs both hands by using an earring handset.

1 is a perspective view showing an embodiment of an ultra-slim phone according to the present invention

2 is a cross-sectional view showing an embodiment of a multilayer component arrangement structure of the slim body of FIG.

Figure 3 is a cross-sectional view showing the upper and lower PCB connection state of the multilayer component arrangement

4A and 4B are examples of the state where the slim body is mounted at a predetermined position of a hard drive or a monitor of a PC.

5 is an internal block diagram for voice connection from the slim body to the earring handset;

6A and 6B are a speaker output stage amplification circuit diagram and a microphone input stage amplification circuit diagram respectively built in the earring handset.

** Explanation of symbols for the main parts of the drawings **

10: slim body 11: audio jack

12: telephone line connection jack 13: chip resistance

14: IC 15: Capacitor

16: Crystal 17a, 17b: Connector

17c: flat cables 18a, 18b; Small Duplex Printed Circuit Board (PCB)

19: rubbery 20: earring handset

21: microphone 22: speaker

23: phone jack

Hereinafter, the configuration of the ultra-slim phone according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an embodiment of an ultra-slim telephone according to the present invention, in which a telephone line connection jack 12 is provided at a predetermined position in a state in which a telephone circuit component is embedded, and the entire upper surface of the case is for inputting a telephone number and selecting a function. A slim body 10 which has been miniaturized to accommodate a plurality of key matrices, and a microphone 21 and a speaker 22 for input / output of a voice signal while being able to be connected / disconnected to the slim body through a phone jack 23. And the ear / handset handset 20 in which the input / output amplification means are integrally cased so that the speaker side can be hooked to the ear.

At this time, the slim body 10 has a phone number input key on the upper surface of the case, a hook key (H) for controlling the hook on / off by a toggle switching operation, and a lamp for displaying the hook on / off state to the outside ( F), and a redial key (R) for selecting a redial function, etc., and an audio jack 11 for enabling audio input / output of the handset on the front and side of the case, respectively, and a telephone line. It is shown that a telephone line connecting jack 12 for connecting can be provided.

And the earring handset 20 is provided with a phone jack 23 to be connected to the audio jack of the slim body, the microphone 21 for receiving and amplifying an external voice signal, and the voice signal transmitted from the slim body or A speaker 22 for receiving and amplifying and outputting an external voice signal received through a microphone, and casing the speaker and the microphone integrally, the speaker side has an earphone shape that can be inserted into the ear and gripped, the other side into a microphone shape It can be seen that it has a body.

FIG. 2 is a cross-sectional view showing an embodiment of a multilayer component arrangement structure of the slim body of FIG. 1, wherein a chip resistor 13 designed as a small component or a thin film among a plurality of components constituting a telephone circuit is small in size. A component that is primarily mounted on the PCB 18a and has an intermediate size leg such as the ice 14 or the connector 17a and the audio jack 11 has the small component or the chip resistor 13 interposed between the legs. In the state of the second double-sided PCB (18a) is laminated on the back of the secondary secondary, in the state in which the secondary component is mounted, the long legs such as the capacitor 15 and the crystal 16 is the same as the secondary component It can be seen that it has a multi-layer component arrangement structure that is laminated and mounted on the surface in a third order, and such a multilayer component arrangement structure may be configured of three or more layers.

In addition, the telephone line connection jack 12 is mounted separately from the multilayer component arrangement in consideration of its volume, and a plurality of keys for inputting a telephone number and selecting a function are mounted on another small double-sided PCB 18b and mounted on the small double-sided PCB. Stacked on (18a), the two-sided PCB (18a, 18b) is integrally casing, the upper side of the other small double-sided PCB (18b) rubber that can switch control the key matrix by pressing the respective keys ( rubber) key 19 is installed so that the rubber key protrudes from the casing upper surface, and the audio jack 11 which is a handset connecting means and the telephone line connecting jack 12 which is a telephone line connecting means respectively at predetermined positions on the front and side surfaces of the case. ) Shows a slim body 10 that forms a compact multilayer component arrangement structure.

3 is a cross-sectional view showing the upper and lower PCB connection state of the multilayer component arrangement structure, in which the upper and lower small double-sided PCBs 18a and 18b are connected to the flat cable 17c and the flat cable 17c in the multilayer component arrangement of the slim body. It is shown to be connected by the connector 17b and the female connector 17a. At this time, the female connector 17a is mounted on the small double-sided PCB 18a on the lower side, and the flat cable 17c integrated with the male connector 17b is directly connected by soldering on the small double-sided PCB 18b on the upper side. The male connector 17b has a structure that can be assembled to the female connector 17a of the lower small double-sided PCB 18a.

4A and 4B show that the slim body is mounted at a predetermined position of a hard drive or a monitor of a PC, and it is understood that the slim body may be easily mounted on a bed or other items. Can be.

5 is an internal block diagram for a voice connection from the slim body to the earpiece handset, by sending a signal coming from a telephone line to an audio jack or sending a signal coming from an audio jack to a telephone line and feeding back the signal to the audio jack again. A telephone line network (net) having a feedback function to be sent to the speaker side of the speaker, an input / output amplifier (AMP21) (AMP22) of an audio receiver for amplifying a signal input through an audio jack, and an amplifying signal to an audio jack. An input / output amplifier (AMP12) (AMP13) of an audio transmitter and a transmitter / receiver gain controller (G1) (G2) (G3) for controlling the gain of the amplifiers are provided so that the sound input from the microphone is transmitted to the amplifier of the transmitter. After being fed back to the receiver amplifier, you can hear the sound yourself. It can be seen that there is to be delivered.

6A and 6B illustrate a speaker 22 output stage amplification circuit and a microphone 21 input stage amplification circuit diagram built in the earring handset, respectively, and include a plurality of amplifiers AMP23, AMP24, and AMP11, and an amplification control device around them. R1-R4, R11-R13, C1-C3, C11-C14). In this case, the speaker has a shape of an earphone and is in close contact with the ear, so that the amplification degree of the speaker output terminal is slightly lower than that of the general one (amplification resistance R3 is 33 [Hz] and sensitivity resistance R4 is 330 [Hz]). It is preferable to set the amplification resistance (R3) to have a value of 22 [Hz] and the sensitivity resistance (R4) to have a value of 300 [Hz], and since the microphone does not receive much volume, the microphone input terminal is used to increase the input sensitivity. The amplification degree of R13 has a range of 180-250 [kW] compared to the general one (amplification resistance R13 is 100 [kW] and sensitivity resistance R11 is 100 [kW)). It is preferable that the sensitivity resistance R11 is set to have a value of 330 [Hz] so as to reduce noise of the microphone input terminal.

Referring to the operation and effect according to the present invention as described above are as follows.

First, the earring handset 20 according to the present invention includes a microphone 21 for receiving and amplifying an external voice signal, and receiving an external voice signal or a microphone transmitted from a telephone line while maintaining a constant distance from the microphone. A speaker 22 and a phone jack 23, which receive and amplify an audio signal, are integrated into a casing, and the speaker side has an earphone shape that can be inserted into and gripped by the ear, and the body is formed into a microphone shape. Configure.

In addition, the slim body 10 first mounts a thin film type chip resistor 13 together with small components constituting a telephone circuit on the small double-sided PCB 18a, and again forms an Icy form on the back of the double-sided PCB. Secondary components such as connectors, audio jacks, switches, and the like are stacked in a secondary manner together with the components of the first, but the components already mounted in the primary are placed between the legs. In addition, by stacking components such as capacitors and crystals with long legs on the secondary mounted components in the third order, the required area of the double-sided PCB is reduced. A rubber key 19 for switching and controlling a plurality of keys for phone number input and function selection is mounted on another small double-sided PCB 18b separate from the small double-sided PCB 18a, and the double-sided PCB 18a is mounted. ) And by casing the two double-sided PCB (18a) (18b) integrally, the upper surface of the casing slim body protrudes only a number of rubber keys (19), and the predetermined front and side of the case By providing audio jacks 11 and telephone line connection jacks 12 for handset connection respectively, the earpiece handset and the telephone line can be connected to each other to form a single compact telephone.

By the way, in the general handset, the microphone has a form that the structure can receive a lot of volume, but the ultra-slim phone according to the present invention has to use a headset earring handset, so the volume that the microphone can receive relatively It's smaller, so it's especially focused on sound quality and volume (of course, the microphone's shape can be larger, but it's inconvenient when you wear it). Therefore, the distortion of the sound quality due to over-amplification may occur when the input terminal amplification ratio of the microphone is infinitely increased compared to a conventional general telephone, and therefore, it is a main point of the present invention to maintain an appropriate line amplification to solve this problem.

That is, the amplification degree of the microphone input terminal and speaker output terminal of the general handset currently in use is 50-390 [㏀], 33 [㏀], respectively, and the amplification resistance value is higher than that. Howling may occur, but in the present invention, because the form is in close contact with the ear, the amplification degree (22 [㏀]) slightly lower than that of the general telephone is used, so that the ear can be made less comfortable and the microphone can be used in general. By using a microphone with a higher sensitivity than the shape (by the experimental value, about 58 dB is most suitable and 180-250 [Hz]), side noise of the condenser microphone is not generated.

According to the present invention as described above, by mounting the telephone circuit components in a multi-layered PCB on a multi-layered PCB, the phone body can be miniaturized, and the earpiece-type handset connected to / detached by the phone jack can be lightly hanged on the ear. By doing so, the front of the case of the phone body can be miniaturized to a size that accommodates only the key matrix, which is free to carry and move, and can be conveniently used by an operator who uses both hands.

Claims (6)

A first double-sided PCB on which telephone circuit components are arranged in multiple layers; A second double-sided PCB stacked on an upper side of the first double-sided PCB and casing integrally with the first double-sided PCB to accommodate a plurality of keys of the phone on an upper surface of the case; It includes a slim body having a handset connecting means and a telephone line connecting means respectively in the front and side predetermined position of the case, First parts consisting of small parts and thin film type chip resistors are first mounted on one surface of the first double-sided PCB, and second parts consisting of an IC chip, an audio jack, a switch, etc., on the other surface while the first parts are mounted. Size of the components and the length of the legs such that the second components, such as capacitors and crystals, are sequentially laminated on one side and / or the other side while the first components and / or the second components are mounted Considering that the parts are arranged while forming a plurality of layers, And the slim body is connected to the first and second double-sided PCBs using a flat cable and a connector connected thereto. The ultra-slim phone according to claim 1, wherein the slim body is mounted on a bed or a monitor of a PC or a hard drive. The apparatus of claim 1, further comprising a connecting means corresponding to the handset connecting means to be connected to or separated from the slim body, and integrally casing a microphone, a speaker, and the input / output amplifying means for input / output of a voice signal. An ultra-slim telephone comprising an earpiece handset that can be handset by hanging the speaker side over the ear. 4. The ultra-slim telephone according to claim 3, wherein said earring handset has amplification resistance in the range of 180-250 [Hz] in order to increase the input sensitivity of the microphone. 4. The ultra-slim telephone according to claim 3, wherein said earring handset has a sensitivity resistance value of 330 [Hz] in order to reduce noise of a microphone input stage. 4. The ultra-slim telephone according to claim 3, wherein the earring handset has an amplification resistance of 22 [m [Omega]] in order to reduce the amplification degree of the speaker output stage.