KR20000047288A - Production process of core shell rubber modified phenol hardening agent with high molecular weight - Google Patents
Production process of core shell rubber modified phenol hardening agent with high molecular weight Download PDFInfo
- Publication number
- KR20000047288A KR20000047288A KR1019980064081A KR19980064081A KR20000047288A KR 20000047288 A KR20000047288 A KR 20000047288A KR 1019980064081 A KR1019980064081 A KR 1019980064081A KR 19980064081 A KR19980064081 A KR 19980064081A KR 20000047288 A KR20000047288 A KR 20000047288A
- Authority
- KR
- South Korea
- Prior art keywords
- rubber
- molecular weight
- bis
- epoxy resin
- corel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 28
- 229920001971 elastomer Polymers 0.000 title claims abstract description 22
- 239000005060 rubber Substances 0.000 title claims abstract description 22
- 150000002989 phenols Chemical class 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011258 core-shell material Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 39
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000004593 Epoxy Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 26
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- -1 (4-hydroxy-2,6-dimethyl-3-methoxy) phenyl Chemical group 0.000 claims description 10
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 238000007259 addition reaction Methods 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 claims description 2
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 claims description 2
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 2
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims description 2
- AVNFUVHTTAGFJM-UHFFFAOYSA-N 2-bromo-4-(3-bromo-4-hydroxyphenoxy)phenol Chemical compound C1=C(Br)C(O)=CC=C1OC1=CC=C(O)C(Br)=C1 AVNFUVHTTAGFJM-UHFFFAOYSA-N 0.000 claims description 2
- DYTIQBZNYCPBKT-UHFFFAOYSA-N 2-chloro-4-(3-chloro-4-hydroxynaphthalen-1-yl)oxynaphthalen-1-ol Chemical compound C12=CC=CC=C2C(O)=C(Cl)C=C1OC1=CC(Cl)=C(O)C2=CC=CC=C12 DYTIQBZNYCPBKT-UHFFFAOYSA-N 0.000 claims description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 2
- KCAPNGLKHXOABM-UHFFFAOYSA-N 4-[2-(4-hydroxy-2-propan-2-ylphenyl)propan-2-yl]-3-propan-2-ylphenol Chemical compound CC(C)C1=CC(O)=CC=C1C(C)(C)C1=CC=C(O)C=C1C(C)C KCAPNGLKHXOABM-UHFFFAOYSA-N 0.000 claims description 2
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 claims description 2
- TYSAZKXCCTWCFI-UHFFFAOYSA-N 4-[3-(4-hydroxy-3-methylphenyl)propyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(CCCC=2C=C(C)C(O)=CC=2)=C1 TYSAZKXCCTWCFI-UHFFFAOYSA-N 0.000 claims description 2
- FNYDIAAMUCQQDE-UHFFFAOYSA-N 4-methylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C=C1O FNYDIAAMUCQQDE-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 229920000800 acrylic rubber Polymers 0.000 claims description 2
- HJPOABXPCUWEHE-UHFFFAOYSA-N benzene-1,4-diol;ethylbenzene Chemical compound CCC1=CC=CC=C1.OC1=CC=C(O)C=C1 HJPOABXPCUWEHE-UHFFFAOYSA-N 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 229920003244 diene elastomer Polymers 0.000 claims description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 150000002460 imidazoles Chemical group 0.000 claims description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 2
- 150000003003 phosphines Chemical class 0.000 claims description 2
- 150000004714 phosphonium salts Chemical group 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920000223 polyglycerol Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 239000000600 sorbitol Substances 0.000 claims description 2
- 150000003512 tertiary amines Chemical class 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims 2
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 claims 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 150000005846 sugar alcohols Polymers 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000000843 powder Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 239000003973 paint Substances 0.000 description 8
- 229940106691 bisphenol a Drugs 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- JHYNXXDQQHTCHJ-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 JHYNXXDQQHTCHJ-UHFFFAOYSA-M 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- MFIUDWFSVDFDDY-UHFFFAOYSA-M butyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 MFIUDWFSVDFDDY-UHFFFAOYSA-M 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- AXOHMUBZOPFRHU-UHFFFAOYSA-N C.OC1=C(C=CC(=C1)O)O Chemical compound C.OC1=C(C=CC(=C1)O)O AXOHMUBZOPFRHU-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical group C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
본 발명은 고분자량 코아셀 고무 변성 페놀경화제의 제조방법에 관한 것으로서, 더욱 상세하게는 다가페놀과 에피클로로히드린을 반응시켜 얻어지는 저분자량 에폭시 화합물에 코아셀 고무수지를 분산 반응시켜 저분자량 코아셀 고무 변성 에폭시수지를 제조하고, 상기 저분자량 코아셀 고무 변성 에폭시수지에 다가알콜을 과량으로 반응시킨 후 촉진제를 투입하여 제조할 수 있는 저온에서도 우수한 내충격성을 갖고 저장중 물성 변화가 없으며 물이나 용제를 추출하는 복잡한 공정을 거치지 않고서도 간단하게 제조할 수 있는 고분자량 코아셀 고무 변성 페놀경화제의 제조방법에 관한 것이다.The present invention relates to a method for producing a high molecular weight coarse rubber-modified phenol curing agent, and more particularly, low molecular weight coasel by dispersing and reacting a corel rubber resin with a low molecular weight epoxy compound obtained by reacting a polyhydric phenol with epichlorohydrin. A rubber-modified epoxy resin is prepared, and the low-molecular-weight coasel rubber-modified epoxy resin is reacted with an excess of polyhydric alcohol, and then it has excellent impact resistance even at low temperatures that can be prepared by adding an accelerator. The present invention relates to a method for preparing a high molecular weight coasel rubber-modified phenolic hardener that can be easily produced without undergoing a complicated process of extracting a.
Description
본 발명은 고분자량 코아셀 고무 변성 페놀경화제의 제조방법에 관한 것으로서, 더욱 상세하게는 다가페놀과 에피클로로히드린을 반응시켜 얻어지는 저분자량 에폭시 화합물에 코아셀 고무수지를 분산 반응시켜 저분자량 코아셀 고무 변성 에폭시수지를 제조하고, 상기 저분자량 코아셀 고무 변성 에폭시수지에 다가알콜을 과량으로 반응시킨 후 촉진제를 투입하여 제조할 수 있는 저온에서도 우수한 내충격성을 갖고 저장중 물성 변화가 없으며 물이나 용제를 추출하는 복잡한 공정을 거치지 않고서도 간단하게 제조할 수 있는 고분자량 코아셀 고무 변성 페놀경화제의 제조방법에 관한 것이다.The present invention relates to a method for producing a high molecular weight coarse rubber-modified phenol curing agent, and more particularly, low molecular weight coasel by dispersing and reacting a corel rubber resin with a low molecular weight epoxy compound obtained by reacting a polyhydric phenol with epichlorohydrin. A rubber-modified epoxy resin is prepared, and the low-molecular-weight coasel rubber-modified epoxy resin is reacted with an excess of polyhydric alcohol, and then it has excellent impact resistance even at low temperatures that can be prepared by adding an accelerator. The present invention relates to a method for preparing a high molecular weight coasel rubber-modified phenolic hardener that can be easily produced without undergoing a complicated process of extracting a.
에폭시 분체 도료의 조성물로서 사용되는 종래의 경화제로서 비스페놀-A 말단 페놀경화제의 경우에는 후도막이나 속경화시 내충격성이 저하되는 단점이 있다.In the case of the bisphenol-A terminal phenol curing agent, which is a conventional curing agent used as a composition of epoxy powder coating, there is a disadvantage in that impact resistance during thickening or rapid curing is lowered.
종래의 페놀경화제의 제조 방법으로는 당량이 170 ∼ 210인 선형 에폭시수지에 과량의 2가 페놀을 반응시켜 말단 수산기의 당량이 200 ∼ 1,000인 수지를 제조한 후, 상기 수지의 경화성을 조절하기 위하여 선택적으로 이미다졸 화합물을 멜트블랜딩하는 방법[미국특허 제4,767,832호]과 다관능 에폭시수지를 실온에서 2급 아미노기를 가진 이미다졸 화합물을 용제에 희석하여 부가 반응시킨 후, 상기 용액에 다관능 페놀을 투입하고 감압하에서 용제를 회수하여 경화제를 제조하는 방법[미국특허 제5,077,355호]이 있다.In the conventional method for preparing a phenol curing agent, an excess of divalent phenol is reacted with a linear epoxy resin having an equivalent weight of 170 to 210 to prepare a resin having an equivalent weight of terminal hydroxyl group of 200 to 1,000, and then to adjust the curability of the resin. The method of melt-blending the imidazole compound selectively [US Pat. No. 4,767,832] and the polyfunctional epoxy resin were added and reacted by diluting the imidazole compound having a secondary amino group in a solvent at room temperature, and then adding the polyfunctional phenol to the solution. There is a method (US Pat. No. 5,077,355) for preparing a curing agent by adding the solvent and recovering the solvent under reduced pressure.
상기의 방법으로 제조된 경화제의 경우 후막형 분체도료(예를 들면 중방식용 분체) 또는 속경화형 분체도료로 적용시 도막의 내충격성이 저하되거나 도료가 저장중에 경화 반응이 일어나는 경시 변화의 문제점이 있다.In the case of the curing agent prepared by the above method, when applied as a thick film type powder coating (for example, a medium anticorrosive powder) or a fast curing type powder coating, there is a problem of a change in the time-dependent change in impact resistance of the coating film or a curing reaction occurs while the paint is stored. .
이에 본 발명에서는 이러한 종래기술의 문제점들을 해결하기 위하여 다가페놀과 에피클로로히드린을 반응시켜 얻어지는 저분자량 에폭시 화합물에 코아셀 고무수지를 분산 반응시키고, 여기에 다가페놀 화합물을 과량으로 사용하여 부가 반응 시킨 후, 반응 속도를 조절하기 위한 촉진제를 선택적으로 혼합함으로써 내충격성이 우수하고 저장중 물성 변화가 없으며 물이나 용제를 추출하는 복잡한 공정을 거치지 않고서도 간단하게 제조할 수 있는 고분자량 코아셀 고무 변성 페놀경화제를 제조하는 것을 그 목적으로 한다.Accordingly, in the present invention, in order to solve the problems of the prior art, the core cell rubber resin is dispersed and reacted with a low molecular weight epoxy compound obtained by reacting a polyhydric phenol and epichlorohydrin, and an addition reaction is performed using the polyhydric phenol compound in excess. By selectively mixing the accelerator for controlling the reaction rate, the impact resistance is excellent, there is no change in physical properties during storage, and the high molecular weight core cell rubber modification can be easily produced without the complicated process of extracting water or solvent. It aims at manufacturing the phenol hardening agent.
본 발명은 고분자량 코아셀 고무 변성 페놀경화제를 제조함에 있어서,The present invention in the preparation of high molecular weight corel rubber modified phenol hardener,
저분자량 에폭시 화합물 또는 저분자량 에폭시 화합물, 노블락 에폭시수지 및 지방족 에폭시수지로 이루어지는 혼합물에 코아셀 고무수지를 분산 반응시켜 저분자량 코아셀 고무 변성 에폭시수지를 제조하고;Preparing a low molecular weight corel rubber-modified epoxy resin by dispersing the corel rubber resin in a mixture of a low molecular weight epoxy compound or a low molecular weight epoxy compound, a noblock epoxy resin and an aliphatic epoxy resin;
상기 저분자량 코아셀 고무 변성 에폭시수지에 다가페놀을 과량으로 반응시킨 후, 촉진제를 첨가하는 것을 그 특징으로 한다.After the polyhydric phenol is reacted in excess with the low molecular weight corel rubber-modified epoxy resin, an accelerator is added.
이와 같은 본 발명을 제조방법에 의거하여 상세히 설명하면 다음과 같다.The present invention will be described in detail based on the manufacturing method as follows.
우선, 저분자량 에폭시 화합물 또는 저분자량 에폭시 화합물, 노블락 에폭시수지 및 지방족 에폭시수지로 이루어지는 혼합물에 코아셀 고무수지를 분산 반응시켜 저분자량의 코아셀 고무 변성 에폭시수지를 제조한다.First, a low molecular weight core cell rubber-modified epoxy resin is prepared by dispersing a corel rubber resin into a mixture of a low molecular weight epoxy compound or a low molecular weight epoxy compound, a noblock epoxy resin and an aliphatic epoxy resin.
본 발명에서는 저분자량의 에폭시 화합물로 비스페놀 A형 또는 비스페놀 F형 에폭시 수지를 사용할 수 있으며, 본 발명에서는 분자량이 300 ∼ 2,000이며 에폭시 당량(EEW)이 170 ∼ 300인 비스페놀 A형 에폭시 수지를 사용하는 것이 바람직하고, 본 발명이 사용하는 시판중인 비스페놀형 에폭시수지의 예로는 R-8815, R-8816, R-8827, R-8828, R-8829(KCC사) 등이 있다.In the present invention, a bisphenol A type or bisphenol F type epoxy resin can be used as the low molecular weight epoxy compound. In the present invention, a bisphenol A type epoxy resin having a molecular weight of 300 to 2,000 and an epoxy equivalent weight (EEW) of 170 to 300 is used. Preferably, commercially available bisphenol-type epoxy resins used in the present invention include R-8815, R-8816, R-8827, R-8828, R-8829 (KCC), and the like.
또한, 본 발명의 노블락 에폭시수지로는 평균 관능기 수가 3 ∼ 7이고 에폭시 당량이 170 ∼ 300인 크레졸 노블락 에폭시수지 또는 페놀 노블락 에폭시수지를 사용할 수 있으며, 본 발명이 사용하는 시판중인 노블락 에폭시수지의 예로는 N-8460, N-8470(KCC사), DEN-431, DEN-438, DEN-439, DEN-485(다우수지)등이 있다.As the noblock epoxy resin of the present invention, cresol noblock epoxy resin or phenol noblock epoxy resin having an average number of functional groups of 3 to 7 and an epoxy equivalent of 170 to 300 may be used, and examples of commercially available noblock epoxy resins used in the present invention may be used. There are N-8460, N-8470 (KCC Co., Ltd.), DEN-431, DEN-438, DEN-439, DEN-485 (Dow Resin).
지방족 에폭시수지로는 에폭시 당량이 120 ∼ 400인 솔비톨폴리그리시딜에테르, 폴리글리세롤폴리그리시딜에테르, 펜타에리스리톨폴리그리시딜에테르, 디글리세롤폴리그리시딜에테르, 트리글리시딜트리스(2-히드록시에틸)이소시아뉴레이트, 글리세롤폴리그리시딜에테르, 트리메틸올프로판폴리그리시딜에테르, 네오펜틸글리콜디그리시딜에테르, 1,6-헥산디올디그리시딜에테르, 하이드로게네이티드비스페놀에이디그리시딜에테르, 에틸렌, 폴리에틸렌글리콜디그리시딜에테르, 프로필렌, 폴리프로필렌글리콜디그리시딜에테르 및 이들의 유도체 중에서 선택되어지는 것을 사용할 수 있다. 본 발명이 사용하는 시판중인 지방족 에폭시수지의 예로는 EX-611, 612, 512, 521, 411, 421, 301, 313, 314, 321, 211, 212, 252, 821, 830, 831, 841, 920, 921(나가세케미칼) 등이 있다.Examples of the aliphatic epoxy resins include sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether and triglycidyl tris (2-hydroxyethyl) having an epoxy equivalent of 120 to 400. Isocyanate, glycerol polyglycidyl ether, trimethylolpropanepolyglycidyl ether, neopentylglycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, hydrogenated bisphenol edicidyl ether, ethylene, polyethylene Those selected from glycol diglycidyl ether, propylene, polypropylene glycol diglycidyl ether and derivatives thereof can be used. Examples of commercially available aliphatic epoxy resins used in the present invention include EX-611, 612, 512, 521, 411, 421, 301, 313, 314, 321, 211, 212, 252, 821, 830, 831, 841, 920 And 921 (Nagase Chemical).
본 발명의 출발물질로서 저분자량 폴리에폭사이드 화합물 단독으로 사용하거나, 또는 노블락 에폭시수지 및 지방족 에폭시수지를 20 중량% 이하 혼합 사용하는 것이 바람직한데, 만일 함량비가 상기 범위를 벗어나면 분산성이 떨어져 최종수지의 물성에서 내충격성이 저하되는 문제가 있다. 본 발명에 있어서 상기 분산 반응은 50 ∼ 150℃의 온도에서 2 ∼ 4시간 동안 수행되는데, 만일 반응 온도 및 반응 시간이 상기 범위를 벗어나게 되면 최종수지 제품에 분산이 제대로 되지않아 수지 제품에 입자가 잔존하게되어 문제가 있어 바람직하지 않다.As a starting material of the present invention, it is preferable to use a low molecular weight polyepoxide compound alone or to mix 20% by weight or less of a noblock epoxy resin and an aliphatic epoxy resin. There is a problem that the impact resistance is lowered in the physical properties of the final resin. In the present invention, the dispersion reaction is carried out for 2 to 4 hours at a temperature of 50 ~ 150 ℃, if the reaction temperature and the reaction time is out of the above range is not dispersed properly in the final resin product particles remain in the resin product It is not desirable because of problems.
본 발명에서 사용되는 코아셀 고무로는 코아셀 입자의 평균직경이 300 ∼ 20,000 Å인 것을 사용하는 것이 바람직하며, 본 발명에서는 상기 코아셀 입자가 그라프트 고무 입자 구조를 갖으며 코아셀 입자의 평균 직경이 900 ∼ 2000 Å인 것을 사용하는 것이 더욱 바람직하다. 상기 코아는 고무와 유사한 탄력적 성질을 지니고 있으며 컨쥬게이티드디엔계 고무, 아크릴계 고무, 실리콘계 고무 또는 이들의 공중합체로 이루어져 있다. 또한, 상기 셀의 구성 성분중 일부는 에폭시 수지내의 입자가 코아에 그라프트 되어 있는 비극성 성분이며, 일부는 에폭시기 또는 페놀기와 반응할 수 있는 극성 성분으로 이루어져 있다. 본 발명에 사용되는 셀의 평균 분자량은 일반적으로 10,000 ~ 250,000 이며, 에폭시 수지에 잘 용융될 수 있는 폴리머로 구성되어 있고, 주요 구성 성분은 에칠렌 불포화 화합물 즉 스타이렌, 아크릴레이트, 메타크릴레이트, 아크릴로니트릴, 아크릴산, 메타크릴산, 히드록시프로필아크릴레이트, 히드록시에틸아크릴레이트, 글리시딜아크릴레이트, 글리시딜메타크릴레이트 등의 비닐모노머이다. 특히, 반응성기를 가지고 있는 셀 폴리머는 에폭시 수지와의 분산 반응이 매우 용이하며, 본 발명에서는 스타이렌/아크릴로니트릴/그리시딜메타아크릴에이트, 스타이렌/아크릴로니트릴/아크릴산, 에틸아크릴레이트/메타크릴산, 스타이렌/메틸메타아크릴레이트/메타크릴산, 스타이렌/메틸메타크릴레이트/그리시딜메타아크릴레이트, 스타이렌/아크릴로니트릴/메틸메타크릴레이트그리시딜메타아크릴레이트 등의 셀폴리머를 사용할 수 있다.As the coacell rubber used in the present invention, it is preferable to use a coarse particle having an average diameter of 300 to 20,000 mm 3, and in the present invention, the coacel particles have a graft rubber particle structure and have an average of coasel particles. It is more preferable to use the thing of 900-2000 mm in diameter. The core has elastic properties similar to rubber and is made of conjugated diene rubber, acrylic rubber, silicone rubber or copolymers thereof. In addition, some of the constituents of the cell are non-polar components in which particles in the epoxy resin are grafted to the core, and some are composed of polar components capable of reacting with epoxy groups or phenol groups. The average molecular weight of the cell used in the present invention is generally 10,000 to 250,000, and is composed of a polymer that can be melted well in an epoxy resin, and the main constituents are ethylene unsaturated compounds such as styrene, acrylate, methacrylate, and acryl. Vinyl monomers such as ronitrile, acrylic acid, methacrylic acid, hydroxypropyl acrylate, hydroxyethyl acrylate, glycidyl acrylate and glycidyl methacrylate. In particular, a cell polymer having a reactive group is very easy to disperse with an epoxy resin, and in the present invention, styrene / acrylonitrile / glycidyl methacrylate, styrene / acrylonitrile / acrylic acid, ethyl acrylate / meta Cell polymers such as crylic acid, styrene / methyl methacrylate / methacrylic acid, styrene / methyl methacrylate / glycidyl methacrylate, styrene / acrylonitrile / methyl methacrylate and glycidyl methacrylate Can be used.
본 발명이 사용하는 시판중인 코아셀의 예로는 KM-334, KM-355P(롬엔하스사) 등과 같은 폴리부틸아크릴레이트 코아/폴리메틸메타크릴레이트셀, 큐레하사의 EXL 타입 및 미시비시레이욘사의 C-타입 제품 등과 같은 M.B.S(스타이렌 부타디엔 메틸메타아크릴레이트) 코아셀, 실리콘 아크릴 코아셀으로는 미시비시레이욘사의 S-타입 제품, 카르복시 극성기를 갖고 있는 EXL-8866, EXL-2611(롬엔하스사) 및 그리시딜기를 갖고 있는 EXL-2314(큐레하사) 등의 실리콘아크릴 코아셀이 있다.Examples of commercially available core cells used in the present invention include polybutyl acrylate core / polymethyl methacrylate cells such as KM-334 and KM-355P (Rom & Has Co., Ltd.), EXL type of Curreha Co., Ltd. MBS (styrene butadiene methyl methacrylate) core cell such as C-type product, and silicone acrylic core cell include S-type product of Misubishi Rayon Co., Ltd., EXL-8866 and EXL-2611 having carboxy polar group And acrylic acryl cores such as EXL-2314 (Cureha Co., Ltd.) having a glycidyl group.
또한, 본 발명에서는 관능기가 있는 코아셀을 선택하거나 저분자량 에폭시수지에 완전하게 분산될 수 있는 구조의 코아셀을 선택하였는데, 이때 셀의 두께가 너무 두꺼운 경우에는 코아셀의 분산이 불완전하게 이루어져 내충격성의 저하가 일어날 우려가 있고, 셀이 두께가 너무 얇으면 상대적으로 코아가 두꺼워져 분산시 코아셀의 구조가 파괴되는 문제가 발생하게 된다.In addition, in the present invention, a core cell having a functional group or a core cell having a structure that can be completely dispersed in a low molecular weight epoxy resin was selected. In this case, when the thickness of the cell is too thick, the core cell is incompletely dispersed and the impact resistance is made. There is a risk of deterioration of the properties, and if the cell is too thin, the core becomes relatively thick, causing a problem that the structure of the core cell is destroyed during dispersion.
본 발명에서는 상기 코아셀의 함량은 저분자량 에폭시 화합물 100 중량부에 대하여 10 ∼ 70 중량부로 사용하는데, 만일 상기 코아셀의 함량이 10 중량부 미만이면 내충격성의 향상이 미비하여 변성의 의미가 없고, 함량이 70 중량부를 초과하면 저분자량 수지에 비해 코아셀의 함량이 너무 높아 분산이 불가능한 문제가 있다. 상기 분산 반응 결과 얻어지는 저분자량의 코아셀 고무 변성 에폭시수지의 에폭시 당량은 150 ∼ 450 g/eq이다.In the present invention, the content of the corel is used in an amount of 10 to 70 parts by weight based on 100 parts by weight of the low molecular weight epoxy compound. If the content of the corel is less than 10 parts by weight, the improvement of impact resistance is insignificant and there is no meaning of denaturation. If the content exceeds 70 parts by weight, the content of corel is too high compared to the low molecular weight resin, there is a problem that can not be dispersed. The epoxy equivalent of the low molecular weight corel rubber modified epoxy resin obtained as a result of the said dispersion reaction is 150-450 g / eq.
이와 같은 방법으로 저분자량의 코아셀 고무 변성 에폭시수지를 제조하고, 상기 저분자량의 코아셀 고무 변성 에폭시수지에 다가페놀을 과량으로 사용하여 부가 반응시킨 후, 촉진제를 첨가함으로서 고분자량의 코아셀 고무 변성 페놀경화제를 제조한다.In this manner, a low molecular weight corel rubber-modified epoxy resin is prepared, and the low molecular weight corel rubber-modified epoxy resin is reacted with an excess amount of polyhydric phenol in an excess amount, and then a promoter is added to the high molecular weight corel rubber. A modified phenol hardener is prepared.
이때, 상기 저분자량의 코아셀 고무 변성 에폭시수지, 노블락에폭시수지 및 지방족 에폭시수지는 상기한 바와 같다.In this case, the low molecular weight corel rubber-modified epoxy resin, noblock epoxy resin and aliphatic epoxy resin are as described above.
본 발명에서 사용되는 다가페놀은 저분자량 에폭시 수지와 부가반응하여 분자량을 증대시켜 분체도료용으로 사용하기에 적절한 특성을 갖는 것으로서, 본 발명에서는 상기 다가페놀 화합물로서 2,2-비스(P-히드록시페닐) 프로판, (2,4-디히드록시페닐)메탄, 비스(2-히드록시페닐)메탄, 2,2-비스(3-이소프로필-4-히드록시페닐)프로판, 2,2-비스(2-이소프로필-4-히드록시페닐)프로판, 1,1-비스(4-히드록시페닐)에탄, 1,3-비스(3-메틸-4-히드록시페닐)프로판, 비스(4-히드록시-2,6-디메틸-3-메톡시)페닐, 2,2-비스(4-히드록시페닐)프로판, 4,4-디히드록시페닐, 비스(4-히드록시-3-클로로나프틸)에테르, 비스(4-히드록시-3-브로모페닐)에테르, 1,1-비스(4-히드록시페놀)-2-페닐에탄 및 2,4-비스(P-히드록시페닐)-4-메틸펜 등을 사용할 수 있으며, 본 발명에서는 2,2-비스(P-히드록시페놀)프로판, (2,4-디히드록시페놀)메탄을 사용하는 것이 바람직하다. 상기 다가페놀은 저분자량의 코아셀 고무 변성 에폭시수지에 대하여 1.0 ∼ 4.0의 몰비로 사용하는 것이 바람직한데, 만일 함량이 1.0 몰비 미만이면 저분자 페놀경화제가 되어 도료화시 저장성이 떨어지거나 경화속도가 너무 빨라 경시변화에 영향이 있고, 4.0 몰비를 초과하면 분자량이 너무 높거나 수산기 당량이 너무 높아 반응성이 떨어지는 문제가 있다.The polyhydric phenol used in the present invention has properties suitable for use in powder coating by increasing the molecular weight by addition reaction with a low molecular weight epoxy resin, and in the present invention, 2,2-bis (P-hydride) as the polyhydric phenol compound. Hydroxyphenyl) propane, (2,4-dihydroxyphenyl) methane, bis (2-hydroxyphenyl) methane, 2,2-bis (3-isopropyl-4-hydroxyphenyl) propane, 2,2- Bis (2-isopropyl-4-hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) ethane, 1,3-bis (3-methyl-4-hydroxyphenyl) propane, bis (4 -Hydroxy-2,6-dimethyl-3-methoxy) phenyl, 2,2-bis (4-hydroxyphenyl) propane, 4,4-dihydroxyphenyl, bis (4-hydroxy-3-chloro Naphthyl) ether, bis (4-hydroxy-3-bromophenyl) ether, 1,1-bis (4-hydroxyphenol) -2-phenylethane and 2,4-bis (P-hydroxyphenyl) 4-methylphene and the like can be used, and in the present invention, 2,2-bis (P-hydroxyphenol) Preference is given to using propane, (2,4-dihydroxyphenol) methane. The polyhydric phenol is preferably used in a molar ratio of 1.0 to 4.0 with respect to a low molecular weight corel rubber-modified epoxy resin. If the content is less than 1.0 molar ratio, the polyhydric phenol becomes a low molecular phenol curing agent, resulting in poor storage properties or too low a curing rate. Fast change is affected over time, and exceeds 4.0 molar ratio, there is a problem that the molecular weight is too high or the hydroxyl equivalent is too high, the reactivity is lowered.
본 발명에서 사용되는 촉진제는 분체도료의 반응속도를 조절하기 위하여 사용하는 원료로서, 본 발명에서는 상기 촉진제로서 이미다졸류, 포스핀류, 3급아민류, 4급 암모늄염 및 4급 포스포늄염류 등을 사용할 수 있으며, 본 발명에서는 상기 촉진제가 전체 페놀 경화제 조성물 중에 1 ~ 15 중량% 함유되는 것이 바람직한데, 만일 함량이 1 중량% 미만이면 경화성이 떨어져 물성에 악영향을 미치고, 함량이 15 중량%를 초과하면 경화속도가 너무 빨라 도막외관이 떨어지는 문제가 있다.The promoter used in the present invention is a raw material used to control the reaction rate of the powder coating, and in the present invention, imidazoles, phosphines, tertiary amines, quaternary ammonium salts and quaternary phosphonium salts may be used as the promoters. In the present invention, it is preferable that the accelerator is contained in an amount of 1 to 15% by weight in the total phenolic curing agent composition. If the content is less than 1% by weight, the curing property is adversely affected and the content is more than 15% by weight. There is a problem in that the appearance of the coating film drops because the curing speed is too fast.
상기 반응은 150 ∼ 200℃의 온도에서 수행하는 것이 바람직한데, 만일 반응 온도가 200℃를 초과하면 고온에서 촉매활성이 떨어지는 문제가 있고, 150℃ 미만의 온도에서는 반응속도가 느려 미반응물의 잔존으로 인하여 최종 고분자 페놀경화제 제품의 물성이 저하되는 문제가 있다. 상기 반응 결과 얻어지는 고분자 코아셀 고무 변성 페놀경화제의 에폭시 당량은 200 ∼ 1,000 g/eq이며, 연화점은 70 ∼ 140℃이다.The reaction is preferably carried out at a temperature of 150 ~ 200 ℃, if the reaction temperature exceeds 200 ℃ there is a problem that the catalytic activity falls at a high temperature, the reaction rate is slow at a temperature below 150 ℃ to remain unreacted material Due to this there is a problem that the physical properties of the final polymer phenol hardener product is lowered. The epoxy equivalent of the polymeric coasel rubber modified phenol hardener obtained as a result of the said reaction is 200-1,000 g / eq, and a softening point is 70-140 degreeC.
상술한 바와 같이 본 발명에서는 저분자량 에폭시수지와 코아셀의 분산이 완전하게 이루어지며, 이에 따라 내충격성 및 내열성이 매우 우수한 고분자량 코아셀 고무변성 페놀경화제를 제조할 수 있다. 특히, 본 발명의 고분자량 코아셀 고무 변성 페놀경화제는 160 ∼ 180℃의 온도에서도 기계적 물성, 저장성이 양호한 에폭시 분체 도료의 원료로 사용될 수 있으며, 이러한 특성을 이용하여 에폭시 분체도료의 코일스프링용 분체도료 및 후막형 분체도료(중방식용 분체도료) 등의 제조에 널리 활용될 수 있다.As described above, in the present invention, the low molecular weight epoxy resin and the core cell are completely dispersed, and thus, a high molecular weight cored rubber-modified phenol curing agent having excellent impact resistance and heat resistance can be prepared. In particular, the high molecular weight coasel rubber-modified phenolic hardener of the present invention can be used as a raw material for epoxy powder coatings having good mechanical properties and storage properties even at a temperature of 160 to 180 ° C. By using these properties, powders for coil springs of epoxy powder coatings can be used. It can be widely used in the production of paints and thick film type powder coatings (medium-type powder coatings).
이하 본 발명을 실시예에 의거 상세하게 설명하면 다음과 같은 바, 본 실시예가 본 발명의 범위를 한정하는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to the following Examples, which are not intended to limit the scope of the present invention.
실시예 1Example 1
R-8828 수지(600g, EEW: 185∼195 g/eq, KCC제품)에 코아셀(178g, EXL-2611제품)을 혼합하여 80 ∼ 90℃의 온도에서 2시간 동안 분산반응시킨 후 승온하여 120 ∼ 130℃의 온도에서 2시간 정도 유지하고, 상기 용액에 2,2-비스페놀에이(1170g), 에칠트리페닐포스포늄브로마이드(2.9g, 50% MeOH로 희석됨)을 100℃의 온도에서 첨가하였다. 상기 용액을 160 ∼ 170℃의 온도에서 5시간 동안 반응시킨 후, 상기 용액의 용융 점도가 3.3 포이즈(150℃)되었을 때 2-메틸이미다졸(44g)을 첨가하고 충분히 교반시킨 결과, 코아셀 고무 변성 페놀경화제를 얻을 수 있었다.R-8828 resin (600g, EEW: 185-195 g / eq, KCC) was mixed with a corel (178g, EXL-2611) and dispersed for 2 hours at a temperature of 80 ~ 90 ℃ and then heated to 120 The solution was kept at a temperature of ˜130 ° C. for about 2 hours, and 2,2-bisphenol-A (1170 g) and ethyltriphenylphosphonium bromide (2.9 g, diluted with 50% MeOH) were added to the solution at a temperature of 100 ° C. . After the solution was allowed to react at a temperature of 160 to 170 ° C. for 5 hours, when the melt viscosity of the solution was 3.3 poise (150 ° C.), 2-methylimidazole (44 g) was added thereto, followed by sufficient stirring. A rubber modified phenol hardener was obtained.
수산기 당량 : 254Hydroxyl equivalent: 254
용융 점도 : 3.4포이즈 (150℃, 콘 & 플레이트 점도계)Melt Viscosity: 3.4 Poise (150 ℃, Cone & Plate Viscometer)
연화점 : 88.0℃ (mettler , 2℃.min / 90℃)Softening Point: 88.0 ℃ (mettler, 2 ℃ .min / 90 ℃)
실시예 2Example 2
R-8828 수지(600g, EEW: 185∼195 g/eq, KCC제품)에 코아셀(140g, KM-334제품)을 혼합하여 80 ∼ 90℃의 온도에서 2시간 동안 분산반응시킨 후 승온하여 120 ∼ 130℃의 온도에서 2시간 정도 유지하고, 상기 용액에 2,2-비스페놀에이(747g)과 에칠트리페닐포스포늄브로마이드(1.9g, 50% MeOH로 희석됨)을 100℃의 온도에서 첨가하여 160 ∼ 170℃의 온도에서 5시간 동안 반응시켜, 상기 용액의 용융 점도가 약 22포이즈(150℃)가 되었을 때, 2-메틸이미다졸(34g)을 첨가하고 충분히 교반시켜 코아셀 고무 변성 페놀경화제를 얻을 수 있었다.R-8828 resin (600g, EEW: 185-195 g / eq, KCC product) was mixed with a corel (140g, KM-334 product), dispersed for 2 hours at a temperature of 80 ~ 90 ℃ and then heated to 120 The solution was kept at a temperature of ˜130 ° C. for about 2 hours, and 2,2-bisphenol-A (747 g) and ethyltriphenylphosphonium bromide (1.9 g, diluted with 50% MeOH) were added to the solution at a temperature of 100 ° C. After reacting for 5 hours at a temperature of 160 to 170 ° C., when the melt viscosity of the solution reaches about 22 poises (150 ° C.), 2-methylimidazole (34 g) is added and sufficiently stirred to coarse rubber-modified phenol. A hardener was obtained.
수산기 당량 : 410 g/eqHydroxyl equivalent: 410 g / eq
용융 점도 : 22.1포이즈 (150℃, 콘 & 플레이트 점도계),Melt Viscosity: 22.1 Poise (150 ° C, Cone & Plate Viscometer),
연화점 : 105.0℃ (mettler , 2℃.min / 90℃)Softening Point: 105.0 ℃ (mettler, 2 ℃ .min / 90 ℃)
실시예 3Example 3
R-8828 수지(600g, EEW: 185∼195 g/eq, KCC제품)과 지방족에폭시수지EX-252(84g, EEW: 215 g/eq, 나가세케미컬)를 혼합한 수지에 코아셀(140g, EXL-2655제품)을 첨가하여 80 ∼ 90℃의 온도에서 분산 반응시킨 후, 상기 용액에 2,2-비스페놀에이(843g)와 2-에칠-4-메틸이미다졸(0.84g, 50% MeOH로 희석됨)을 100℃의 온도에서 첨가하여 160 ∼ 170℃의 온도에서 5시간 동안 반응시켜, 상기 용액의 용융 점도가 약 8.0 포이즈(150℃)가 되었을 때, 2-메틸이미다졸(46g)을 첨가하고 충분히 교반시켜 코아셀 고무 변성 페놀경화제를 얻을 수 있었다.Coacell (140g, EXL) in a resin mixed with R-8828 resin (600g, EEW: 185-195 g / eq, KCC) and aliphatic epoxy resin EX-252 (84g, EEW: 215 g / eq, Nagase Chemical) -2655 product) was added and dispersed and reacted at a temperature of 80 to 90 DEG C. Then, 2,2-bisphenol-A (843 g) and 2-ethyl-4-methylimidazole (0.84 g, 50% MeOH) were added to the solution. Diluted) was added at a temperature of 100 ° C. and reacted for 5 hours at a temperature of 160 to 170 ° C., when the melt viscosity of the solution reached about 8.0 poise (150 ° C.), 2-methylimidazole (46 g) Was added and the mixture was sufficiently stirred to obtain a corel rubber-modified phenol curing agent.
수산기 당량 : 407Hydroxyl equivalent: 407
용융 점도 : 8.1포이즈 (150℃, 콘 & 플레이트 점도계),Melt Viscosity: 8.1 Poise (150 ℃, Cone & Plate Viscometer),
연화점 : 93.0℃ (mettler , 2℃.min / 90℃)Softening Point: 93.0 ℃ (mettler, 2 ℃ .min / 90 ℃)
비교예 1Comparative Example 1
R-8828 수지(600g, EEW: 185∼195 g/eq, KCC제품)에 2,2-비스페놀에이(1170g)와 에칠트리페닐포스포늄브로마이드(2.9g, 50% MeOH로 희석됨)를 100℃의 온도에서 첨가하여 160 ∼ 170℃의 온도에서 3시간 동안 반응시켜, 상기 용액의 용융 점도가 약 2.8 포이즈(150℃)가 되었을 때, 2-메틸이미다졸(44g)을 첨가하고 충분히 교반시켜 경화제를 제조하였다.2,2-bisphenolA (1170g) and ethyltriphenylphosphonium bromide (2.9g, diluted with 50% MeOH) in R-8828 resin (600g, EEW: 185-195g / eq, KCC) At a temperature of 160 to 170 ° C. for 3 hours, and when the melt viscosity of the solution reached about 2.8 poise (150 ° C.), 2-methylimidazole (44 g) was added and stirred sufficiently. A curing agent was prepared.
수산기 당량 : 211Hydroxyl equivalent: 211
용융 점도 : 2.8포이즈 (150℃, 콘 & 플레이트 점도계)Melt Viscosity: 2.8poise (150 ℃, Cone & Plate Viscometer)
연화점 : 82.0℃ (mettler , 2℃.min / 70℃)Softening Point: 82.0 ℃ (mettler, 2 ℃ .min / 70 ℃)
비교예 2Comparative Example 2
R-8828 수지(600g, EEW: 185∼195 g/eq, KCC제품)에 2,2-비스페놀에이(747g)와 에칠트리페닐포스포늄브로마이드(1.9g, 50% MeOH로 희석됨)를 100℃의 온도에서 첨가하여 160 ∼ 170℃의 온도에서 3시간 동안 반응시켜, 상기 용액의 용융 점도가 약 16.5 포이즈(150℃)가 되었을 때, 2-메틸이미다졸(34g)을 첨가하고 충분히 교반시켜 경화제를 제조하였다.2,2-bisphenol-A (747 g) and ethyltriphenylphosphonium bromide (1.9 g, diluted with 50% MeOH) in R-8828 resin (600 g, EEW: 185-195 g / eq, KCC) At a temperature of 160 to 170 ° C. for 3 hours, and when the melt viscosity of the solution reached about 16.5 poise (150 ° C.), 2-methylimidazole (34 g) was added and stirred sufficiently. A curing agent was prepared.
수산기 당량 : 407Hydroxyl equivalent: 407
용융 점도 : 16.7포이즈 (150℃, 콘 & 플레이트 점도계),Melt Viscosity: 16.7 Poises (150 ° C, Cone & Plate Viscometer),
연화점 : 101.0℃ (mettler , 2℃.min / 90℃)Softening Point: 101.0 ℃ (mettler, 2 ℃ .min / 90 ℃)
실험예Experimental Example
상기 실시예 1 ∼ 3 및 비교예 1 ∼ 2에서 얻어진 페놀 경화제를 이용하여 하기 표 1의 조성비로 도료를 제조하고 예열된 시편에(250℃ × 1시간) 도장후 경화시켜 도막두께가 400±50㎛ 인 도막시편을 제조한 후, 각각의 물성을 측정하여 다음 표 2에 나타내였다.Using the phenol curing agent obtained in Examples 1 to 3 and Comparative Examples 1 to 2 to prepare a paint in the composition ratio shown in Table 1 below, after coating (250 ℃ × 1 hour) to preheated specimens and cured coating film thickness of 400 ± 50 After preparing the coating film specimens having a ㎛, the physical properties of each were measured and shown in Table 2 below.
상술한 바와 같이 본 발명의 고분자량 코아셀 고무 변성 페놀경화제는 저온에서도 기계적 물성 및 저장성이 양호한 에폭시 분체 도료의 원료로 사용될 수 있으며, 이러한 특성을 이용하여 코일 스프링용 분체 도료 및 후막형 분체 도료(중방식용 분체 도료)등의 제조에 널리 활용될 수 있다.As described above, the high molecular weight corel rubber-modified phenolic hardener of the present invention can be used as a raw material for epoxy powder coatings having good mechanical properties and storage properties even at low temperatures, and by using such properties, powder coatings for coil springs and thick-film powder coatings ( Heavy powder coatings).
Claims (11)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100689086B1 (en) * | 2005-12-30 | 2007-03-02 | 주식회사 케이씨씨 | Epoxy resin composition for attaching insulation panel to membrane type liquefied natural gas storage tank |
| KR100914821B1 (en) * | 2007-11-28 | 2009-09-02 | 주식회사 케이씨씨 | A epoxy resin composition for semiconductor's packages |
-
1998
- 1998-12-31 KR KR1019980064081A patent/KR20000047288A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100689086B1 (en) * | 2005-12-30 | 2007-03-02 | 주식회사 케이씨씨 | Epoxy resin composition for attaching insulation panel to membrane type liquefied natural gas storage tank |
| KR100914821B1 (en) * | 2007-11-28 | 2009-09-02 | 주식회사 케이씨씨 | A epoxy resin composition for semiconductor's packages |
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