KR19990048676A - Inspection probe and inspection method of electronic circuit board - Google Patents

Abstract

The present invention provides a novel and improved method that enables an electrical inspection of a circuit board at high speed with reliability, at a low cost.

The inspection probe of the electronic circuit board according to the present invention

a) a base plate having an opening of electrically insulating plastic resin,

b1) a first group electrode fixedly arranged around the opening of the base plate,

b2) a second group electrode fixedly arranged around an edge of the base plate, wherein the first group electrode and the second group electrode are electrically connected to form an electric circuit;

c) connecting leads, one end of which is connected to one of the first group connections, and the other end of which extends down through the opening of the substrate,

d) capsules molded entirely of flexible elastomer for the insertion of connecting leads, the ends extending below each of the connecting leads being exposed out of the capsule and in contact with one of the electrodes of the electronic circuit board under test; Face down, so that the capsule, and

e) an assembly with a reinforcement molded from a rigid material covering the capsule.

Description

Inspection probe and inspection method of electronic circuit board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to probes and inspection methods for inspecting electronic circuit boards such as IC package substrates used for mounting semiconductor devices and semiconductor silicon wafers on which chips are formed.

Some modern technologies are still in the development stage of the production process, but according to the trend of manufacturing electronic equipment, which is increasingly demanding more compact design density integration or device mounting density, high precision, high performance, etc., various innovative technologies are widely used.

As semiconductor devices with increasingly dense integration, sophistication, and improved performance are mounted on electronic circuit boards, the circuit board is made of electrodes for electrical connection with the terminals of the semiconductor device such that the intermediate assembly of the product is carried out in various processing steps. The number of terminals should increase with decreasing array pitch.

In order to meet the strong demand for small electronic equipment, the mounting type using a conventional semiconductor package is a flip chip mounting type in which a semiconductor device is mounted on a circuit board in the form of a chip, and multiple devices in which a plurality of devices are simultaneously mounted on a circuit board. Work is currently underway to replace the chip module. This mounting technology is expected to contribute to the miniaturization of electronic equipment and the performance of electronic equipment.

Moreover, the circuit wiring of the circuit board on which the semiconductor chip is mounted is made by using finer wiring or filament as the wiring density increases so that the inspection technique follows this wiring. One type of inspection probe for inspecting such an electronic circuit board is provided with a plurality of pins made of steel such as tungsten and arranged to correspond to the number and arrangement pitch of the electrodes on the circuit board under test. Such probe probe fabrication is performed by elaborate manual work, the tip of each tungsten pin is sharpened by etching, and a sharp tungsten pin is fixed to the probe base under the microscope to correspond to the number and pitch of electrodes on the circuit board under test. Highly sophisticated microscopy to fabricate inspection probes containing multiple pins can be very labor intensive and time consuming and inevitably increase the cost of production. Such test probes can only be used on one type of circuit board and require a test probe specifically designed for each type of circuit board to be tested.

In addition to the high cost mentioned above, inspection probes with such tungsten pins are not always suitable for high speed inspection of semiconductor devices. This is because each tungsten pin has a relatively large length of, for example, about 50 mm from the end of the pin to the end reaching the connection of the circuit board. Moreover, inspection by such inspection probes is carried out by measuring continuously on a pin-by-pin basis and many measurements over a long period of time complete a single inspection test. There is still an undeveloped connection technology suitable for fine electrodes arranged at high density or fine pitch.

As will be understood from the above description, development of high performance inspection probes and inspection technologies is urgently required in order to keep up with the development technology of modern semiconductor devices and the manufacturing technology of circuit boards. The necessity from this point of view includes not only an inspection technique for responding to flip chip mounting or a multiple chip module mounting technique, but also an inspection technique for a chip or wafer type semiconductor device. Despite numerous efforts to develop inspection probes and inspection methods for inspecting electronic circuit boards, the inspection probes proposed so far have some problems in high speed signal transmission and sophisticated connection of the arrangement pitch of electrodes. There is an urgent need for the emergence of more advanced inspection probes and inspection methods for inspecting electronic circuit boards.

Accordingly, an object of the present invention is not only in view of the problems and disadvantages of the prior art described above, but also inexpensive inspection method as well as an inspection method capable of high-speed inspection even in an electronic circuit board provided with a plurality of electrodes arranged at extremely fine pitches. To provide a new and improved inspection probe for electronic circuit board inspection that can be manufactured at a price.

1 is a vertical side view of an advanced inspection probe as a basic embodiment.

2A-2D are each a vertical side view of one of the successive steps of making an advanced test probe.

3 is a vertical cross-sectional view of another embodiment of an advanced inspection probe in which the substrate is layered with a step on the surface around the opening and the first group of electrodes is located on the step surface.

4 is a vertical side view of another embodiment of an advanced inspection probe applicable to an electronic circuit board for inspection having a stepped surface.

FIG. 5 is a vertical side view of an advanced test probe of another embodiment in which the stiffener has an observation hole to accurately mount the probe on the electronic circuit board under investigation.

6 is a vertical side view of an inventive test probe of yet another embodiment with a finned heat sink.

7A and 7D are vertical cross-sectional views of the connection between the electronic circuit board and the inspection equipment of each embodiment.

8 is a vertical cross-sectional view showing a connection between an electronic circuit board and an inspection device of another embodiment.

9 is a vertical cross-sectional view of a connection between an electronic circuit board and inspection equipment in yet another embodiment.

※ Explanation of code for main part of drawing

1: base plate

2: connection lead

3: first group electrode

3´: second group electrode

4: opening

5: capsule

6: reinforcing agent

7: end

8: Hemispherical Connection

The inspection probe of the electronic circuit board according to the present invention

a) a base plate having an opening of electrically insulating plastic resin,

b1) a first group electrode fixedly arranged around the opening of the base plate,

b2) a second group electrode fixedly arranged around an edge of the base plate, wherein the first group electrode and the second group electrode are electrically connected to form an electric circuit;

c) connecting leads, one end of which is connected to one of the first group connections, and the other end of which extends down through the opening of the substrate,

d) capsules molded entirely of flexible elastomer for the insertion of connecting leads, the ends extending below each of the connecting leads being exposed out of the capsule and in contact with one of the electrodes of the electronic circuit board under test; Face down, so that the capsule, and

e) an assembly with a reinforcement molded from a rigid material covering the capsule.

The invention also provides a novel method for inspecting an electronic circuit board using an inspection probe as defined above.

1) connecting the exposed end of the connecting lead to one electrode of the first group of electronic circuit boards under test;

2) electrically connecting each electrode of the second group of electronic circuit boards under test to the first base board of the test equipment directly or via an elastic connector;

3) electrically connecting an electrode on the second base substrate of the inspection equipment connected by wiring with the first base substrate of the inspection equipment to one electrode of the second group of the inspection probes via the elastic connector.

In the inspection probe according to the present invention, an electrode terminal group is provided on a base plate of the probe at a position corresponding to one of the electrode terminals on the electronic circuit board under test (hereinafter referred to as an inspection substrate). The base plate of the test probe has at least one opening, wherein the first group of electrodes is located near or around the opening and the first group of electrodes is located along the edge or rim of the base plate. Each electrode of a 1st group is wired and electrically connected to one of the electrode terminals of a 2nd group, for example in a radial direction. It is advantageous for the arrangement pitch of the electrode terminals of the inspection substrate to be fine in order to use a pitch shifting base plate in which the second electrode of the base plate can have a pitch that converges to match the electrode pitch on the inspection substrate. A plurality of connecting leads are provided, each of which is connected to one end of the first group electrode terminal, and the other end has a contact terminal. The arrangement pitch of the electrode groups of the second group may be the same as the arrangement pitch of the electrode terminals of the first group. Although the electrode terminals of the inspection substrate do not exceed 0.5 mm or are arranged at fine pitches in the range of 0.2 to 0.5 mm, it is effective even if appropriate correction is applied to the arrangement pitch of the second group electrode terminals. When the inspection probe of the invention is used to inspect an area-array type inspection substrate, it is preferable that the base plate of the inspection probe is made of a multilayer laminated substrate.

Each connecting lead is made of micrometallic filament, one end of which is joined to one electrode terminal of the first group on the base plate by wire bonding and the other end extends downward through the opening of the base plate. The metal materials forming the metal filaments for the connecting leads are made from metals and alloys which are easy to bond wires such as gold, gold alloys, copper, aluminum, aluminum-silicon alloys, beryllium copper, brass, nickel, molybdenum, tungsten and stainless steel. It may be selected and is not particularly limited. Gold filaments are most preferred unless they are expensive, but it is also advantageous to plate metal filaments that do not contain gold with gold or a gold base alloy to provide corrosion resistance. The diameter of the metal filament is selectively used depending on the arrangement pitch of the electrode terminals on the inspection substrate and the metal material. When the filament is gold, the diameter of the metal filament is generally in the range of 18 to 50 µm, and preferably in the range of about 25 to 30 µm.

At the end of the connection lead extending downward along the opening of the base plate, a hemispherical contact point plated with gold is provided to reduce the contact resistance when the contact point contacts the electrode on the inspection substrate. An assembly of connecting leads extending downwardly through an opening from one of the first group of electrodes on the base plate is a capsule of flexible electrically insulating elastic material with the exception of the above-mentioned contact points of each end as a whole opposing the electrode terminals. Is inserted into The above-mentioned elastic material may be selected from various kinds of rubber materials including silicone rubber, epoxy rubber, urethane rubber and other synthetic rubbers. The elastic capsule provides elasticity to the connection lead to elastically match the deformation of the connection lead to ensure proper contact pressure on the connection lead contact point and the inspection substrate. The elastic capsule is coated with a rigid reinforcement molded from rigid metals such as general-purpose industrial plastic resins, ceramics and metals in consideration of heat resistance, dimensional stability, moldability, and the like of the material.

Compared with the conventional inspection probe, the inspection probe of the present invention having the above structure is not only applicable to an inspection substrate having electrode terminals whose electrodes are arranged at very fine pitches, but also results in a short connection distance not exceeding 5 mm. It has the advantage of enabling a high speed inspection of the inspection substrate. In particular, advanced inspection probes formed using a multilayer substrate as a base plate are suitable for inspection of inspection substrates having a large number of electrode terminals arranged in a matrix arrangement, for example, in order to increase the number of electrode terminals. In addition, since the contact portion is installed at a lower level than the lower surface of the base plate of the probe and the connecting lead is encapsulated with the elastic rubber material as a whole, the elastic force applied to the contact point is not affected by warpage and vibration of the test substrate. High reliability can be ensured in the contact state between the electrode terminal of the substrate and the contact point of the connecting lead.

According to one aspect of the invention, a novel method for inspecting an electronic circuit board using the above-described inspection probe is provided. Therefore, the method of the present invention,

1) connecting the exposed end of the connecting lead to one electrode of the first group of electronic circuit boards under test;

2) electrically connecting each electrode of the second group of electronic circuit boards under test to the first base board of the test equipment directly or via an elastic connector;

3) electrically connecting an electrode on the second base substrate of the inspection equipment connected by wiring with the first base substrate of the inspection equipment to one electrode of the second group of inspection probes via the elastic connector.

In step 2) of the above-described method, another method may be used to electrically connect the electrodes on the first base substrate of the inspection equipment provided with several pogo pins and the second group electrodes of the electronic circuit board under investigation. have.

In the inspection method of the present invention using the above-described inspection probe inserted into the elastic capsule and having a connecting wire extending from the first group of electrodes around or around the base substrate through the opening of the base plate of the inspection probe, The contact point of the connecting lead and the inspection substrate according to the connection between the second group electrode and the electrode on the second base substrate of the inspection equipment and the direct connection of the electrode on the first base substrate of the inspection equipment in which the plurality of pogo pins are formed. An elastic connector is used in which electrical connection is performed between the first group of electrodes and between the second group of electrodes of the inspection substrate and the electrode on the first base substrate of the inspection equipment. Since such a connection works with an elastic force under pressure, the reliability of the electrical connection is secured by applying a slight pressure. In addition, since the connection length is greatly reduced, the electrical connection is made at a high speed, and even if the electrodes on the inspection substrate are arranged at a high density, high reliability can be guaranteed.

In the case of inspecting an inspection substrate having extremely fine electrodes arranged at a high density, for example, the inspection substrate consists of a multilayer plate having recesses and is provided on each step area of each layer around the recesses. Or in the case of inspecting the IC package substrate, the inspection may be performed by using an inspection probe provided with a first group electrode around the opening of the base plate so as to be crosswise or zigzag in order to match the arrangement of the electrodes on the stepped region of the inspection substrate. Can be.

Alternatively, the inspection probe may be provided with a multilayer base plate having a stepped area around an opening having a connection lead coupled to each stepped area.

In the inspection of the electronic circuit board according to this advanced method, first, the inspection substrate is placed on the electrode on the first base substrate of the inspection equipment such that the second group electrode of the inspection substrate is connected to the electrode on the inspection equipment first base plate. Mount it. In this case, the elastic connector can be sandwiched between two groups of electrodes of two groups. If the arrangement pitch of the second electrode on the inspection substrate is relatively large, for example, 0.5 mm or more, a large number of pogo pins may be used, even if it has a small pitch of the second group electrode in the range of 0.18 to 0.20 mm. It is provided in the electrode on a 1st base substrate, and is directly connected with the 2nd group electrode of a test | inspection board | substrate.

The first group electrode of the inspection substrate is connected to the first group electrode on the base plate of the inspection probe by a connecting lead, and the second group electrode of the lower surface of the base plate of the inspection probe is the elastic connector, the anisotropic electrically conductive sheet, or An electronic circuit for inspection is formed by being connected to an electrode on the second base substrate of the inspection equipment. Among the above-mentioned elastic connectors, anisotropic electrically conductive sheets and plastic sheets having metal contact bumps, the elastic connectors are preferable. The reason for this is that other conductive sheets or plastics of metal connecting parts are not reliable at small pitches of 0.5 mm or less in the electrode terminal arrangement. As the elastic splicer, a product including an MT type splicer (produced by Shin-Etsu Polymer Co.) having a micrometallic filament inserted in parallel with a specific slope in an insulating matrix sheet of rubber elastomer is used. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes in detail various embodiments of the test probes and test methods of the present invention with reference to the drawings in which the test probes are shown in a vertical sectional view.

First embodiment

As shown in FIG. 1, which is a vertical cross-sectional view, the inspection probe manufactured in Embodiment 1 is a basic embodiment of the present invention, which is made of an insulating material such as plastic resin and has a base plate 1 having an opening 4 at its center. Has One end of each of the plurality of connecting leads 2 is attached to one of the first group electrodes 3 of the base plate 1 around or around the central opening 4. The second group electrode 3 'is provided on the base plate 1 at the edge or edge of the base plate 1, and each of the second group electrode 3' is electrically connected to one of the first group electrodes 3; Is connected. Each of the lead wires 2 extends down through the center opening 4 and the lead wires 2 are generally made of rubber or the like except for the other end 7 facing downward from the elastic capsule 5 toward the exposed door. It is inserted into a capsule 5 made of insulating material. The other end 7 is provided with a hemispherical connection 8 and plated with gold to ensure electrical connection. The elastic capsule 5 is covered with the rigidity reinforcement 6 as a whole to serve as a protective barrier.

2A to 2D show manufacturing steps for fabricating the above-described test probe, respectively.

As a first step, as shown in Fig. 2A, about 0.5 mm thick copper space 10 is mounted on the alignment jig substrate 9 by means of the positioning pin 11. The copper spacer 10 is provided as a region of the first and second group electrodes 3 and 3 'of the inspection probe with a pitch of 0.3 mm depth at a position corresponding to the electrode arrangement of the inspection substrate. The surface of the pitch is plated with gold. The base plate 1 is precisely positioned by the positioning pin 11 and mounted on the copper spacer 10. Furthermore, the fixing plate 12 is placed on the base plate 1 to fix the entire assembly.

The base plate 1 having a central opening includes a first group electrode 3 around the center opening and a second group electrode 3 'along the periphery of the base plate 1 patterned in the same arrangement and pitch as the electrode terminals for the substrate. ) Is installed.

A gold filament having a diameter of 25 μm is connected to the gold plated surface of each pit of the copper spacer 10 by a wire bonding method, so that each of the connecting wires 2 is positioned at a position corresponding to one of the electrode terminals on the inspection substrate. The other end is bonded to one of the first group electrodes 3 on the base plate 1. The bonding operation at each end of each of the connecting wires 2 is repeatedly performed by the number of electrode terminals of the inspection substrate. When this bonding operation is completed, the fixing plate 12 is removed.

In the next step, as shown in FIG. 2B, the mold strengthening agent 6 is mounted on the base plate 1 and another fixing plate 13 is mounted to fix the entire assembly. The reinforcement 6 is equipped with a port (not shown in the figure) for injecting an uncured fluidic elastic material for the capsule and the uncured urethane resin is a cavity between the reinforcement 6 and the base plate 1. Is injected through the port of the reinforcement 6. The uncured urethane resin is cured by storage at room temperature for 24 hours and aged at 60 ° C. for a long time for 2 hours to complete the capsule 5 of cured urethane rubber. The base plate 1 and the reinforcing agent 6 are integrally bonded by adhering to the cured urethane rubber capsule 5. The reinforcement 6 is made from polyphenylene sulfide resin, a rigid plastic resin with good electrical properties.

The next step is the etching of the copper spacer 10. Therefore, after the base plate 1 and the rigidity enhancer 6 are strongly bonded by adhesion, the fixing plate 1 is removed together with the alignment jig substrate, and the copper space 10 is dissolved by etching with an aqueous solution of iron chloride. As shown in 2c, the end 7 of each of the connection leads 2 is exposed on the same plane of the lower surface of the elastic capsule 5, and the connection leads 2 are fixed to the elastic capsule 5 as a whole.

The ends 7 exposed in the same plane of the lower surface of the elastic capsule 5 are each end 7 of the connection lead 2 when the assembly obtained by the above procedure is placed on the electrode terminal of the inspection substrate. As shown in 2d, a hemispherical contact portion 8 having a height of about 40 µm having a rigid gold plating layer having a thickness of about 3 µm is provided to improve durability of the contact portion 8.

What has been described above is merely illustrative of the process of making advanced test probes. That is, various modifications can be made depending on the material of each part and the design of the test probe.

Second embodiment

The inspection probe manufactured in this embodiment is shown in the vertical side view of FIG. In this embodiment, a three-layer base plate 14 is used instead of the single base plate described in the first embodiment. The base plate 14 has a step level difference around the center opening 4 so as to have a stepped area layered downward toward the center opening 4. The connecting leads 2 are divided into three groups, and the connecting leads 2 of each subgroup are formed on one of the stepped regions of the base plate 14 around the center opening 4 of the first group electrode 3. It is joined by wire bonding one.

The first group electrodes 3 on the lower, middle and upper stepped areas of the stairs are patterned in a zigzag arrangement with respect to the adjacent lower groups of the electrodes 3, so that even when each electrode is smaller than 100 탆 required for wiring, The wiring connection is successfully performed and the arrangement pitch of the contact points 8 on the lower surface of the elastic capsule 5 should be as fine as that.

Although not described herein, the inspection probe of the modified embodiment described above is substantially the same as in Example 1 except that the multilayer base plate 14 is used instead of the single layer base plate 1. Proceed.

Third embodiment

This embodiment is shown in the vertical side view of FIG. In this embodiment, the step surface level difference is formed on the lower surface of the elastic capsule 5 to form the step ring region 15 around the center opening 4 of the base plate 14, and the base plate 14 has a center opening 4. It is a two-layer structure having stepped ring regions around it. Thus, the connecting lead 2 is divided into two groups so that one end of each connecting lead 2 of one group is bonded to the electrode 3 on the other step ring region of the base plate 14, and the other end is encapsulated. Another stepped ring region 15 on the bottom surface of 5 is exposed.

Advanced inspection probe models can be easily adapted to the inspection of inspection substrates with electrodes in and around recesses and cavities.

Fourth embodiment

The inspection probe produced in this embodiment is shown in the vertical side view of FIG. 5. This embodiment is a simple modification of Example 1, since the rigidity reinforcement 6 is provided with a viewing hole 16 through which the inspection substrate under the inspection probe can be seen so that the inspection probe can be accurately mounted on the inspection substrate correctly. Can be.

Although the positioning observation hole 16 is preferably formed in the center of the opening 4 of the base plate 1 as shown in FIG. 5, the positioning of the observation hole 16 is provided unless there is a failure in circuit wiring or electrical wiring. Is not limited.

Fifth Embodiment

The test probe produced in this embodiment is shown in the vertical side view of FIG. The inspection probe itself of this embodiment is almost the same as that of the first embodiment, but the difference is that the fin-shaped radiator 17 is mounted by direct connection on the upper part of the stiffener 6, and the heat dissipation ability is significantly improved. By doing so, the inspection using the inspection probe is safely performed even if the inspection substrate generates heat during the inspection. The heat sink 17 has a plurality of fins (17A) on the upper surface to greatly increase the surface area for heat dissipation. In addition, the radiator 17 is provided with a central projection 17B extending downward through the opening 4 formed in the rigid reinforcement 5 to greatly increase the surface area of the radiator 17.

The material forming the radiator 17 need not necessarily be any particular material and may be used if it is easy to make its shape with high thermal conductivity.

Sixth embodiment

7A and 7B show the procedure of the inspection test of the electronic circuit board 21 having a generally flat configuration, such as an IC substrate, a semiconductor wafer, etc. as the inspection substrate of the method, respectively. 7A and 7B show an assembly composed of an inspection substrate 21, first and second base substrates 22 and 23 (not shown in the figure) of the inspection equipment, and an inspection probe 24 that is electrically wired, respectively. Vertical section of the. In the embodiment of FIG. 7A, the first group electrode 3 of the inspection probe 24 is provided around the opening 4 of the base plate, and in the embodiment of FIG. 7B, the first group electrode of the inspection probe 24. (3) is installed around the edge of the base plate (1).

First, the elastic connector 25 is mounted on the electrode 22A of the first base substrate 22, and the second group electrode 21B of the test substrate 21 is connected to the first through the elastic connector 25. The test substrate 21 is mounted in such a manner as to be electrically connected to the one base plate 22.

In the next step, the test probe 24 is moved to a position close to the test substrate 21 to electrically connect the ends of the connecting wires 2 connected to the first group electrodes 3 of the test probe 24. . Thus, the elastic connector 28 (MT type of Shin-Etsu Polymer Co.) is mounted on the electrode 23B of the second base substrate 23 of the inspection equipment, so that the inspection probe 24 is provided through the elastic connector 28. The inspection circuit is completed by electrically connecting between the second group electrode 3 'and the electrode 23B of the base plate 23.

Seventh embodiment

FIG. 8 shows another embodiment of the advanced inspection method for inspecting the inspection substrate 21. The first group electrode 21A is sometimes used in the IC package substrate, so that the stepped region of the inspection substrate 21 is not shown. It is formed and the same as in Example 6 in other respects.

By applying pressure in the vertical direction indicated by the arrow P on the inspection probe 24, the electrical inspection of the inspection substrate 21 is made reliably and quickly.

Eighth embodiment

This embodiment is shown in the vertical side view of FIG. Although not shown in the drawing, the electrode 22A of the first base substrate 22 of the inspection equipment and the second group electrode 21B of the inspection substrate 21 are the elastic connectors (used in Examples 6 and 7). Without using 25), a plurality of gold plated pogo pins 32 of 0.5 mm diameter are directly connected by the electrode assembly 22A provided. This method is the same method different from the method used in Example 6 or Example 7. The advantage of using the pogo pin 32 makes it possible to reliably connect with elastic force in the electrical connection.

As described above, according to the present invention, a novel and improved electronic circuit board that can be manufactured at a considerably low price as well as an inspection method capable of high-speed inspection even in an electronic circuit board having a plurality of electrodes arranged at extremely fine pitches. There is an effect that can provide a test probe for the test.

Claims (6)

a) a base plate made of electrically insulating plastic resin and having an opening, b1) a first group electrode fixedly arranged around the opening of the base plate, b2) a second group electrode fixedly arranged around the edge of the base plate, wherein the first group electrode and the second group electrode are electrically connected to form an electric circuit; c) connecting leads, one end of which is coupled to one of the first group electrodes, the other end of which extends down through the opening of the base plate, d) a capsule molded of an insulating elastomer that is flexible to insert the connecting leads as a whole, wherein the extending end of each connecting lead is out of the capsule so as to be in contact with one of the electrodes of the electronic circuit board under test; An exposed and directed downward capsule, and e) an assembly comprising a reinforcing agent molded from a rigid material covering the capsule. The pre-test probe according to claim 1, wherein the base plate has a stepped area around the opening toward the opening, and the first group electrode is formed on the stepped area of the base plate. The inspection probe according to claim 1, wherein the reinforcing agent has an observation hole penetrating the reinforcing agent to open the opening of the base plate. The test probe of claim 1, wherein the reinforcing agent has a plurality of heat dissipation fins. Iii) contacting the exposed side of each connecting lead with one of the first group of electrodes of the electronic circuit board under test, Ii) electrically connecting each electrode of the second electrode on the electronic circuit board under test with one of the electrodes on the first base plate of the inspection equipment, either directly or via an elastic connector; and Iv) electrically connecting each of the electrodes on the second base substrate of the inspection equipment connected with the first base substrate of the inspection equipment to one of the second group electrodes of the inspection probe via the elastic connector. A method of inspecting an electronic circuit board by mounting an inspection probe as defined in claim 1, characterized in that 6. The method of claim 5, wherein the electrodes on the first substrate of the inspection equipment are provided with a plurality of pogo pins in contact with the second group of electrodes on the electronic circuit board to form an electrical connection.