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KR19990047806A - Battery Embedded PCB - Google Patents

Battery Embedded PCB Download PDF

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Publication number
KR19990047806A
KR19990047806A KR1019970066335A KR19970066335A KR19990047806A KR 19990047806 A KR19990047806 A KR 19990047806A KR 1019970066335 A KR1019970066335 A KR 1019970066335A KR 19970066335 A KR19970066335 A KR 19970066335A KR 19990047806 A KR19990047806 A KR 19990047806A
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KR
South Korea
Prior art keywords
plate
battery
layer
pcb
metal plate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019970066335A
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Korean (ko)
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KR100294240B1 (en
Inventor
박재근
Original Assignee
박재근
서광옥
주식회사 미래전지
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Application filed by 박재근, 서광옥, 주식회사 미래전지 filed Critical 박재근
Priority to KR1019970066335A priority Critical patent/KR100294240B1/en
Priority to PCT/KR1998/000389 priority patent/WO1999030376A2/en
Publication of KR19990047806A publication Critical patent/KR19990047806A/en
Application granted granted Critical
Publication of KR100294240B1 publication Critical patent/KR100294240B1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/14—Cells with non-aqueous electrolyte
    • H01M6/16—Cells with non-aqueous electrolyte with organic electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/536—Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Primary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

본 발명은 밧데리를 내장한 PCB 에 관한 것으로, 하기판 상의 금속판(5) 상에 양극제층(6)을 형성한 애노드부와, 상기판 상의 니켈층(8) 상에 리튬 및 폴리머층(3,4)을 형성한 캐소드부를 이루고, 상기의 금속판(5)은 격자상으로 이루어지고 그의 외주로 외주판(51)을 형성하여 상호 연결하며, 상기 폴리머층(4)을 도포한 증착 리튬층(3)은 상기 금속판(5)의 면적에 대향하여 대향면을 이루도록 면상으로 형성시키고, 그 외주로 외주판(32)을 형성한 것을 특징으로 한다. 본 발명에 의하면 PCB 자체에 밧데리가 내장되어 있어 얇은 판상으로 제작이 가능하여 통상의 일정 두께를 갖는 PCB 상 표면상에 실장이 가능하게 된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PCB with a built-in battery, comprising: an anode portion in which an anode layer 6 is formed on a metal plate 5 on a base plate, and a lithium and polymer layer 3, on a nickel layer 8 on the plate. 4) forming a cathode portion, wherein the metal plate 5 is formed in a lattice form and is formed by interconnection by forming an outer circumferential plate 51 on the outer circumference thereof, and the deposited lithium layer 3 coated with the polymer layer 4. ) Is formed in a planar shape to face the area of the metal plate 5 to form an opposing surface, and the outer circumferential plate 32 is formed on the outer circumference thereof. According to the present invention, the battery is built in the PCB itself, so that it can be manufactured in a thin plate shape, and thus it is possible to mount on the surface of the PCB having a predetermined thickness.

Description

밧데리 내장형 ＰＣＢBuilt-in battery PC

본 발명은 밧데리를 내장하고 있는 PCB 에 관한 것이다.The present invention relates to a PCB containing a battery.

예를들어, 종래 카드를 열면 멜로디가 나오는 크리스마스 카드의 경우, 카드의 내부에 밧데리를 내장하는 바, 이 밧데리는 통상 알카리,수은 밧데리로써 PCB 판 상면에 설치되고 또한 그 밧데리의 내장을 위하여는 많은 부품수가 소요되고 두께를 차지하는 단점이 있어 일정 두께 이하로 박형으로 제작함에는 한계가 있었다.For example, in the case of a Christmas card where a melody comes out when a conventional card is opened, a battery is built in the inside of the card, which is usually installed on the upper side of the PCB board as an alkali or mercury battery. There is a disadvantage in that the number of parts is required and the thickness is occupied to be thinner than a certain thickness.

그외 대부분의 밧데리는 그의 구조상 일정한 두께를 형성하고 있어 밧데리의 성능 저하 없이 그 자체 두께를 줄이는 것은 한계가 있었다.Most of the battery has a certain thickness in its structure, so it was limited to reduce the thickness itself without degrading the performance of the battery.

본 발명의 목적은 상기한 단점들을 감안하여 발명한 것으로, 최근 대부분의 모든 소형전자제품은 두께를 줄이는 박형제작이 기술상 과제로 부각되고 있는바, 이를 감안한 본 발명은, 상기에서 한가지 예를 들은 크리스마스 카드 뿐만 아니라 박형을 요하는 어떠한 소형 전자 제품에도 적용이 가능한 박형의 한계를 뛰어 넘은 초박형(약 3마이크론미터)으로 제작가능 토록, 통상의 PCB 기판 상면에 실장이 가능한 형태로 구성한 밧데리를 내장하는 PCB 를 제공함에 그 목적이 있다.The object of the present invention was invented in view of the above-mentioned disadvantages, and in recent years, all of the small electronic products have been developed to reduce the thickness of the thin film as a technical problem. PCB with built-in battery that can be mounted on the upper surface of a normal PCB board so that it can be manufactured as ultra thin (approximately 3 micrometers) beyond the limit of thin film that can be applied to any small electronic products requiring a thin film as well. The purpose is to provide.

도 1은 본 발명에 따라 밧데리를 내장하고 있는 상,하기판을 보여주는 일부 단면도.1 is a partial cross-sectional view showing the upper and lower substrates incorporating a battery according to the present invention.

도 2는 본 발명에 따른 한 실시예를 보여주는 도면2 shows an embodiment according to the invention;

도 3 은 본 발명에 의한 PCB를 통상의 일정 두께를 갖는 PCB 상에 실장한 상태를보여주는 도면3 is a view showing a state in which the PCB according to the present invention mounted on a PCB having a typical constant thickness;

도면의 주요부분에 대한 부호설명Explanation of Signs of Major Parts of Drawings

1,2 ; 상,하기판 3 ; 리튬층1,2; Upper and lower substrates 3; Lithium layer

4 ; 폴리머층 5 ; 금속판4 ; Polymer layer 5; plate

6 ; 양극제층 7 ; PCB기판6; Positive electrode layer 7; PCB board

8. ; 니켈층 31 ; 통공8. ; Nickel layer 31; Through

33 ; 제 2 통공33; 2nd through

32, 51 ; 외주판32, 51; Outboard

상기 목적을 달성하기 위한 본 발명의 구성은, 박형의 PCB 기판을 상하로 구분하여 그 상,하기판 사이에 밧데리를 내장한 것으로, 하기판 상에 형성한 금속판(5) 상에 양극제층(6)을 형성한 애노드부와, 상기판 상의 니켈층(8) 상에 리튬 및 폴리머층(3,4)을 형성한 캐소드부를 이루고, 상기의 금속판(5)은 격자상으로 이루어지고 그의 외주로 외주판(51)을 형성하여 상호 연결하며, 상기 폴리머층(4)을 도포한 증착 리튬층(3)은 상기 금속판(5)의 면적에 대향하여 대향면을 이루도록 면상으로 형성시키고, 그 외주로 외주판(32)을 형성한 것을 특징으로 한다.The structure of the present invention for achieving the above object is to divide the thin PCB substrate into upper and lower parts, and to embed a battery between the upper and lower substrates, and the anode layer 6 on the metal plate 5 formed on the lower substrate. ) And an anode portion on which the lithium and polymer layers 3 and 4 are formed on the nickel layer 8 on the plate. The metal plate 5 is formed in a lattice shape and is circumferentially circumferentially formed. A plate 51 is formed and connected to each other, and the deposited lithium layer 3 coated with the polymer layer 4 is formed in a plane shape so as to face the area of the metal plate 5 so as to face the outer surface. A plate 32 is formed.

이하, 본 발명의 상세한 설명을 첨부 도면과 함께 상술한다.Hereinafter, the detailed description of the present invention will be described in detail with the accompanying drawings.

상기한 본 발명의 목적을 달성하기 위한 본 발명에 의한 PCB 기판의 주요 구성은 도 1 과 같다.The main configuration of the PCB substrate according to the present invention for achieving the above object of the present invention is as shown in FIG.

도 1 은 본 발명에 따른 PCB 기판의 단면 설명도이다.1 is an explanatory cross-sectional view of a PCB substrate according to the present invention.

도시한 바와 같이, 상기판(1)에는 니켈층(8)이 형성되어 마이너스 단자층이 이루어지게 하고, 그 위에 리튬층(3)이 진공증착되고 그 위로 바람직한 한 예로써 매우 얇은 박막의 도전성(이온투과성) 폴리머층(4)이 형성된다. 이 폴리머층은 재질은 단지 예로써 기술한 것으로, 재질에 한정되는 것이 아니라 다른 재질도 사용할수 있다.As shown, the plate 1 is formed with a nickel layer 8 to form a negative terminal layer, on which the lithium layer 3 is vacuum deposited and, as a preferred example, a very thin thin film of conductivity ( Ion-permeable) polymer layer 4 is formed. The polymer layer is described by way of example only, and other materials may be used.

이와 대향하는 하기판(2)에는 그 상면으로 금속판(5)이 형성되고 그 위로 탄소 또는 카본계화합물을 포함하는 양극제층(6)이 형성된다. 플러스 단자층이 되는 금속판(5)은 망상 또는 그물상으로 형성시킨다.On the opposite substrate 2, a metal plate 5 is formed on the upper surface thereof, and a cathode layer 6 containing carbon or a carbon-based compound is formed thereon. The metal plate 5 to be a positive terminal layer is formed in a mesh or net form.

도 2 는 도 1 의 구성으로 이루어진 밧데리를 내장하고 있는 본 발명에 따른 PCB 기판을 멜로디 카드에 적용한 예를 나타낸 것으로, 이에 의거 본원 발명을 더욱 상세히 설명한다.2 illustrates an example in which a PCB substrate according to the present invention having a battery having the configuration of FIG. 1 is applied to a melody card, and thus, the present invention will be described in more detail.

하기판(2) 중앙부엔 넓은 면적으로 예를 들어 망 또는 그물 형상으로 금속판(5)을 형성시켰다. 이 금속판(5)엔 양극제가 형성되어 있어 양극제층(6)이 이미 형성되어 있다. 이 망상의 금속판(5)은 그 주위의 테두리로 형성한 금속판인 외주판(51)과 연결된다. 외주판(51)에는 동박이 증착에 의해 이루어지고 양극제층(6)이 형성되어 있지 않다. 이 외주판(51)엔 납을 도포(코팅)하여 상판과 밀봉 접합된다. 이 하기판(2) 쪽은 하나의 애노드(+)를 이룬다.In the center of the base plate 2, a metal plate 5 was formed in a large area, for example, in the form of a net or a net. A positive electrode agent is formed in this metal plate 5, and a positive electrode layer 6 is already formed. This mesh-shaped metal plate 5 is connected with the outer periphery board 51 which is a metal plate formed by the edge around it. Copper foil is formed by vapor deposition on the outer peripheral plate 51, and the positive electrode layer 6 is not formed. Lead is applied (coated) to the outer circumferential plate 51 to be hermetically bonded to the upper plate. The lower substrate 2 forms one anode (+).

이와 대향하는 캐소드(-)를 구성하고 있는 상기판의 하면은 도 2의 우측에 도시하였다. 도시한 바와 같이 폴리머를 도포하여 폴리머층(4)이 이미 형성되어 있는 리튬층(3)이 중앙에 큰 면적으로 이루고 있고 그 일 측단엔 통공(31)이 형성되어 있고, 외주 테두리엔 동박으로 이루어진 외주판(32)이 형성된다. 외주판(32)에도 역시 안쪽으로 돌출하는 표면적으로 이루어지는 곳에 제 2 통공(33)을 형성하고 있다.The lower surface of the plate constituting the opposite cathode (-) is shown on the right side of FIG. As shown in the drawing, the lithium layer 3, in which the polymer layer 4 is already formed, is coated with a polymer to form a large area in the center, and a hole 31 is formed at one end thereof, and the outer rim is made of copper foil. An outer circumferential plate 32 is formed. In the outer circumferential plate 32, a second through hole 33 is also formed at the surface area projecting inward.

이 외주판(32)과 하기판(2) 쪽의 외주판(51)은 상호 납땜으로 접합된다.The outer circumferential plate 32 and the outer circumferential plate 51 on the lower plate 2 side are joined to each other by soldering.

한편 상기판(1)의 상면엔 예로서 IC를 내장하고 있는 IC부(11)를 형성하고 그에 부수적인 통상의 IC다리부(12), LED칩(13), 스위치부(14)등을 형성시킨다.On the other hand, on the upper surface of the plate 1, for example, an IC portion 11 having an IC therein is formed, and an additional IC leg portion 12, an LED chip 13, a switch portion 14, and the like are formed thereon. Let's do it.

도 3 은 도 2 와 같이 얇은 상,하기판으로 이루어진 것을 납땜으로 접합하여, 일반적인 소정의 두께를 갖는 PCB기판(7)에 접합한 상태를 보여준다FIG. 3 shows a state in which a thin upper substrate and a lower substrate as shown in FIG. 2 are bonded by soldering to a PCB substrate 7 having a general predetermined thickness.

도시한 바와 같이, 얇은 박판으로 이루어진 상,하기판을 접합하여 밧데리를 내장토록 구성한 본 발명에 따른 PCB 판을, 예로서 통상의 두께를 갖는 PCB 기판(7)에 접합하였을 경우 PCB기판(7) 보다 월등히 더 얇은 형태로 이루어지므로 초박형으로 구성시킬수 있다.As illustrated, the PCB board 7 according to the present invention, which is formed by bonding the upper and lower boards made of thin thin plates to embed the battery, for example, is bonded to the PCB board 7 having a normal thickness. It is made much thinner and can be configured as ultra thin.

상기한 도면들은 단지 본 발명의 설명을 위한 도면으로, 실제 제작할 경우엔 도면보다 더욱 박형으로 제작이 된다.The above drawings are merely for the purpose of explanation of the present invention, and in the case of actual production, the drawings are made even thinner than the drawings.

참고로, 상기의 도 1에서 도시한 상,하기판을 제외한 순수하게 밧데리를 구성하는 층들은 전체 두께를 합해야 3 마이크론 미터 정도의 두께에 불과한 초박형이다.For reference, the layers constituting the battery purely except for the upper and lower substrates shown in FIG. 1 are ultra-thin only 3 microns in thickness.

상기한 구성에 의한 작용을 개략 설명하면, 니켈층(8)(-)과 금속판(5)(+)은 플러스 마이너스 두 극을 이루며, 그 사이의 폴리머층(4)은, 도전성 폴리머로 구성되어 있어 양성자 교환막의 역할, 또는 전지 세퍼레이터 역할을 한다.When the action by the above structure is outlined, the nickel layer 8 (-) and the metal plate 5 (+) constitute a positive and negative pole, and the polymer layer 4 between them is made of a conductive polymer. It acts as a proton exchange membrane, or as a battery separator.

캐소드와 애노드 사이의 통전을 위한 연결은, 도 2 에 도시한 상기판(1)의 통공(31)과 제 2 통공(33)이, 하기판(2)에서 금속판(5) 및 양극제층(6)을 이루는 면과 연결하고 있는 외주판(51)의 면과 접촉하고 있고 통공들의 통공 내경면이 도전성의 금속물질로 이루어져 있어, 상,하기판 사이의 통전이 이루어지는 것이다.The connection for energization between the cathode and the anode is such that the through hole 31 and the second through hole 33 of the plate 1 shown in FIG. 2 are formed on the metal plate 5 and the anode layer 6 on the base plate 2. In contact with the surface of the outer circumferential plate 51 which is connected to the surface forming a) and the inner diameter surface of the through hole of the through hole is made of a conductive metal material, the current is conducted between the upper and lower substrate.

도 1 에 도시한 구성에 의한 이온의 이동에 의한 방전 및 충전작용에 관한 것은 일반적인 전지의 원리와 유사한 것이므로 이들의 기능 및 작용에 관한 상세한 설명은 생략한다.The discharge and charging action by the movement of ions by the configuration shown in FIG. 1 are similar to those of the general battery, and thus detailed descriptions of their functions and actions are omitted.

상기의 본 발명에 따라 밧데리를 내장하는 PCB는 충전형으로 구성할수도 있음은 물론이다.According to the present invention described above, a PCB with a built-in battery may be configured as a charging type.

상기의 본 발명에 도시한 도면은 단지 초박형으로 제작한 본 발명을 설명하기 위한 단지 예시적인 것으로 설명한 것으로, 이들 도면의 구성에 한정되는 것이 아니라 물품에 따라 여러 다양한 변형으로 실시할수 있음은 물론이다.The drawings of the present invention described above are merely illustrative for describing the present invention manufactured by ultra-thin, and are not limited to the configuration of these drawings, of course, can be carried out in various modifications depending on the article.

예를들어, 본 발명에서는 비록 단지 예로서, 통상의 일정한 두께를 갖는 PCB 기판 상에 실장하는 것에 적용하는 것으로 설명하였지만 박형을 요구하는 다른 어떠한 물품에도 적용할수 있고 응용할수도 있다.For example, although the present invention has been described by way of example only for mounting on a PCB substrate having a common constant thickness, it can be applied and applied to any other article requiring thinness.

상기와 같은 본 발명의 구성에 의하면, 밧데리를 내장하는 박형의 PCB 기판을 통상의 PCB 기판상에 실장하는 것에 의하여, 별도의 밧데리를 구비하는 종래의 리튬 전지등을 대체할수 있고 구조를 간단히 하고 부품수를 줄일수 있어, 각종 전자제품 특히 박형을 요구하는 전자제품에 매우 유용하게 사용될수 있다.According to the configuration of the present invention as described above, by mounting a thin PCB substrate with a built-in battery on a conventional PCB substrate, it is possible to replace the conventional lithium battery having a separate battery, and to simplify the structure and parts Since the number can be reduced, it can be very useful for various electronic products, especially those requiring thinness.

즉, 본원의 발명은, PCB 기판에 초박형으로 일체로 형성할수 있어 밧데리 실장을 요구하는 모든 PCB기판에 극히 유용하게 이용될수 있는 효과가 있다.That is, the invention of the present application can be formed extremely thinly on the PCB substrate and can be extremely useful for all PCB substrates requiring battery mounting.

또한, 본 발명은 다른 리튬 밧데리 등에 비하여 자연방전이 일어나지 않게 구성되어 있어 사용수명이 지극히 크게 연장되는 장점도 있다.In addition, the present invention is configured so that natural discharge does not occur as compared to other lithium batteries, there is an advantage that the service life is extremely extended.

Claims (5)

하기판 상의 금속판(5) 상에 양극제층(6)을 형성한 애노드부와, 상기판 상의 니켈층(8) 상에 리튬 및 폴리머층(3,4)을 형성한 캐소드부를 이루고, 상기의 금속판(5)은 격자상으로 이루어지고 그의 외주로 외주판(51)을 형성하여 상호 연결하며, 상기 폴리머층(4)을 도포한 증착 리튬층(3)은 상기 금속판(5)의 면적에 대향하여 대향면을 이루도록 면상으로 형성시키고, 그 외주로 외주판(32)을 형성한 것을 특징으로 하는 밧데리 내장형 PCB.The metal plate consists of an anode part in which the positive electrode layer 6 was formed on the metal plate 5 on the lower plate, and a cathode part in which lithium and polymer layers 3 and 4 were formed on the nickel layer 8 on the plate. (5) is formed in a lattice form and is connected to each other by forming an outer circumferential plate 51 on the outer circumference thereof, and the deposited lithium layer 3 coated with the polymer layer 4 faces the area of the metal plate 5. A battery-embedded PCB, which is formed in a plane shape to form an opposite surface, and an outer circumferential plate 32 is formed on the outer circumference thereof. 제 1 항에 있어서, 밧데리 내장형 PCB 는 PCB 기판(7)상에 형성한 것을 특징으로 하는 밧데리 내장형 PCB.The battery-embedded PCB according to claim 1, wherein the battery-embedded PCB is formed on a PCB substrate (7). 제 1 항에 있어서, 폴리머층(4)을 포함하는 리튬층(3) 일측단엔 통공(31)을 형성시키고, 그 외주에 형성한 외주판(32)에는 제 2 통공(33)을 형성한 것을 특징으로 하는 밧데리 내장형 PCB.The method of claim 1, wherein the through hole 31 is formed at one end of the lithium layer 3 including the polymer layer 4, and the second through hole 33 is formed in the outer circumferential plate 32 formed on the outer circumference thereof. Battery embedded PCB, characterized in that. 제 1 항에 있어서, 상기 상기판(1)의 상면에 IC부(11), IC다리부(12), LED칩(13) 등을 포함하는 회로부를 형성한 것을 특징으로 하는 밧데리 내장형 PCB.The battery-embedded PCB according to claim 1, wherein a circuit portion including an IC portion (11), an IC leg portion (12), an LED chip (13), and the like is formed on an upper surface of the plate (1). 제 1 항에 있어서, 상기 하기판(2)의 외주판(51)과 상기판(1)의 외주부(32) 납 코팅에 의하여 상호 밀봉접합하는 것을 특징으로 하는 밧데리 내장형 PCB.The battery-embedded PCB according to claim 1, wherein the outer periphery plate (51) of the base plate (2) and the outer periphery part (32) of the plate (1) are hermetically sealed to each other by lead coating.
KR1019970066335A 1997-12-05 1997-12-05 PCB comprising a battery Expired - Fee Related KR100294240B1 (en)

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KR1019970066335A KR100294240B1 (en) 1997-12-05 1997-12-05 PCB comprising a battery
PCT/KR1998/000389 WO1999030376A2 (en) 1997-12-05 1998-12-01 Battery-included pcb

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KR101251666B1 (en) * 2006-12-04 2013-04-05 엘지이노텍 주식회사 Battery built-in printed circuit board and method for manufacturing the same

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CN1324727C (en) * 2004-11-03 2007-07-04 胜光科技股份有限公司 Double-electrode sheet material with electronic circuit layer interlayer and secondary battery with the material
CN108482149A (en) * 2018-03-22 2018-09-04 普汽新能（北京）科技有限公司 A method of assembling batteries of electric automobile group with high-low pressure integrated circuit board

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KR100754072B1 (en) * 2006-05-16 2007-08-31 삼성전기주식회사 Printed circuit board and manufacturing method thereof
KR101251666B1 (en) * 2006-12-04 2013-04-05 엘지이노텍 주식회사 Battery built-in printed circuit board and method for manufacturing the same

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