KR19990031225U - Heat dissipation adhesive surface structure of printed circuit board - Google Patents
Heat dissipation adhesive surface structure of printed circuit board Download PDFInfo
- Publication number
- KR19990031225U KR19990031225U KR2019970043934U KR19970043934U KR19990031225U KR 19990031225 U KR19990031225 U KR 19990031225U KR 2019970043934 U KR2019970043934 U KR 2019970043934U KR 19970043934 U KR19970043934 U KR 19970043934U KR 19990031225 U KR19990031225 U KR 19990031225U
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- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- adhesive surface
- heat dissipation
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 고안은 인쇄회로기판에서 발생되는 열을 효과적으로 방출시키기 위해 인쇄회로기판을 방열판에 납으로 밀착하는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 있도록 방열접착면에 마이크로 스트립 라인이 매트릭스 형상으로 적용된 인쇄회로기판의 방열접착면 구조에 관한 것으로, 인쇄회로기판의 방열접착면에 도금된 전도성이 양호한 금속을 사진식각하여 마이크로 스트립 라인을 매트릭스형상으로 형성시켜 이루어진 것을 특징으로 한다.In order to effectively release heat generated from the printed circuit board, the present invention has a micro strip line in a matrix shape on the heat dissipation adhesive surface to effectively discharge residual lead and flux generated during the process of closely contacting the printed circuit board with the heat sink. The present invention relates to a heat dissipation adhesive surface structure of an applied printed circuit board, and is formed by forming a microstrip line into a matrix by photolithography a metal having good conductivity plated on the heat dissipation adhesive surface of a printed circuit board.
Description
본 고안은 인쇄회로기판의 방열접착면 구조에 관한 것으로, 보다 상세하게는 인쇄회로기판에서 발생되는 열을 효과적으로 방출시키기 위해 인쇄회로기판을 방열판에 납으로 밀착하는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 있도록 방열접착면에 마이크로 스트립 라인이 매트릭스 형상으로 적용된 인쇄회로기판의 구조에 관한 것이다.The present invention relates to a heat dissipation bonding surface structure of a printed circuit board, and more particularly, to remove residual lead and flux generated during the process of closely contacting a printed circuit board with a heat sink to lead to effectively dissipate heat generated from the printed circuit board. The present invention relates to a structure of a printed circuit board in which a micro strip line is applied in a matrix shape to a heat dissipation adhesive surface so as to effectively discharge it.
일반적으로, 초고주파 전력증폭기를 비롯하여 다수의 소자들을 탑재한 인쇄회로기판과 인쇄회로기판의 전력증폭기에서 방열되는 열의 열전도를 원활히 하기 위하여 인쇄회로기판을 방열판(금속후판)에 융접시키게 되는데, 이때, 잔여분의 납과 플럭스가 잔존하여 회로소자의 전기적인 특성을 저해하는 요소로 작용하고 있다.In general, a printed circuit board is welded to a heat sink (metal thick plate) to smooth heat conduction of heat radiated from a printed circuit board including a plurality of devices including a high frequency power amplifier and a power amplifier of the printed circuit board. Lead and flux remain to act as a factor to inhibit the electrical characteristics of the circuit element.
상기한 바의 종래 인쇄회로기판과 방열판의 분리사시도인 도 1을 보면, 회로소자(11)가 실장되어 있는 인쇄회로기판(11)과 방열판(13)은 납과 플럭스에 의해 융접되는데, 상기 인쇄회로기판(11)과 방열판(11)에는 잔여분의 납이나 플럭스를 배출시킬 수 있는 통로를 갖추고 있지 않다.Referring to FIG. 1, which is a separate perspective view of the conventional printed circuit board and the heat sink, the printed circuit board 11 and the heat sink 13 on which the circuit element 11 is mounted are fused by lead and flux. The circuit board 11 and the heat sink 11 do not have a passage for discharging residual lead or flux.
따라서, 종래의 인쇄회로기판이나 방열판의 구조로는 인쇄회로기판 위에 탑재된 회로소자, 예컨대 초고주파 전력증폭기로 인해 인쇄회로기판에서 발생되는 열을 효과적으로 방출시키기 위하여 인쇄회로기판을 방열판에 납으로 밀착하는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 가 없게 되므로 잔류하는 잔여납과 플럭스에 의해 인쇄회로기판 위에 탑재된 회로소자의 전기적인 특성을 저해하는 문제가 있다.Therefore, a conventional printed circuit board or heat sink has a structure in which the printed circuit board is closely adhered to the heat sink to effectively release heat generated from the printed circuit board due to a circuit element mounted on the printed circuit board, for example, a high frequency power amplifier. Since residual lead and flux generated during the process cannot be effectively discharged, there is a problem of inhibiting the electrical characteristics of the circuit elements mounted on the printed circuit board by the residual lead and flux remaining.
본 고안은 상기한 종래기술의 문제점을 감안하여 창안한 것으로서, 인쇄회로기판에서 발생되는 열을 효과적으로 방출시키기 위해 인쇄회로기판을 방열판에 납으로 밀착하는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 있도록 방열접착면에 마이크로 스트립 라인이 매트릭스 형상으로 적용된 인쇄회로기판의 방열접착면 구조를 제공하는데 그 목적이 있다.The present invention was devised in view of the above-described problems of the prior art, and effectively discharges the remaining lead and flux generated during the process of closely bonding the printed circuit board with lead to the heat sink in order to effectively release the heat generated from the printed circuit board. The purpose of the present invention is to provide a heat dissipation adhesive surface structure of a printed circuit board in which a micro strip line is applied in a matrix shape to the heat dissipation adhesive surface.
도 1은 종래의 인쇄회로기판과 방열판을 개략적으로 분리하여 도시한 분리사시도,1 is an exploded perspective view schematically illustrating a conventional printed circuit board and a heat sink;
도 2는 본 고안에 따른 방열접착면 구조를 갖는 인쇄회로기판과 방열판을 도시한 상세 분리사시도이다.Figure 2 is a detailed exploded perspective view showing a printed circuit board and a heat sink having a heat dissipation adhesive surface structure according to the present invention.
*** 도면의 주요부분에 대한 부호의 설명****** Explanation of symbols for main parts of drawing ***
11,21 : 인쇄회로기판 12 : 트랜지스터11,21: printed circuit board 12: transistor
13,23 : 방열판 24 : 크림납13,23: heat sink 24: cream lead
상기한 목적을 달성하기 위한 본 고안에 따른 인쇄회로기판의 방열접착면 구조는, 인쇄회로기판의 방열접착면과 방열판을 납으로 밀착하여 부착시키는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 있도록 인쇄회로기판의 방열접착면에 도금된 전도성이 양호한 금속을 사진식각하여 마이크로 스트립 라인을 매트릭스형상으로 형성시켜 이루어진 것을 특징으로 한다.The heat dissipation adhesive surface structure of the printed circuit board according to the present invention for achieving the above object, can effectively discharge the residual lead and flux generated in the process of adhering the heat dissipation adhesive surface and the heat sink of the printed circuit board with lead. In order to form a micro strip line in a matrix form by photo-etching a metal having good conductivity plated on the heat-dissipating adhesive surface of the printed circuit board.
이하, 첨부도면을 참조하여 본 고안에 따른 실시예를 보다 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment according to the present invention in more detail.
본 고안에 따른 방열접착면 구조를 갖는 인쇄회로기판과 방열판의 상세 분리사시도인 도 2를 참조하여 본 고안의 인쇄회로기판 방열접착면 구조를 보면, 인쇄회로기판(21)의 방열접착면과 방열판(23)을 납으로 밀착하여 부착시키는 과정에서 발생되는 잔여납과 플럭스를 효과적으로 배출시킬 수 있도록 인쇄회로기판의 방열접착면에 도금된 전도성이 양호한 금속을 사진식각하여 마이크로 스트립 라인(22)을 매트릭스형상으로 형성시켜 이루어져 있다.Referring to FIG. 2, which is a detailed separation perspective view of a printed circuit board and a heat sink having a heat dissipation adhesive surface structure according to the present invention, a heat dissipation adhesive surface and a heat sink of the printed circuit board 21 of the present invention will be described. The microstrip line 22 is matrixed by photolithography of a highly conductive metal plated on a heat-dissipating adhesive surface of a printed circuit board to effectively discharge the residual lead and flux generated in the process of closely attaching (23) with lead. It is formed in the shape.
통상의 인쇄회로기판의 전면에는 회로가 구성되어 회로소자들이 탑재되며, 그 후면에는 동박 또는 전도성이 양호한 금속, 예컨대 동박이 도금되어 방열판에 부착되는 방열접착면이 구성되어 있는데, 이러한 인쇄회로기판(21)의 후면 방열접착면에 가로세로로 직교하는 매트릭스형상의 마이크로 스트립 라인(22)을 형성하기 위해서는 적당한 깊이의 홈이 만들어져야 한다. 적당한 깊이의 홈을 생성시키기 위해서는 인쇄회로기판의 상기 방열접착면에 가로세로의 홈 이외의 부분에 에칭마스크를 형성시킨 후, 홈 이외의 부분이 마스킹된 접착면을 에칭액에 적당시간 동안 노출시키면 에칭마스크에 의해 마스킹되지 않은 금속이 식각되면서 홈이 생성되므로서 마이크로 스트립 라인이 형성되어 진다. 이때, 금속면이 과도하게 부식되어서 마이크로 스트립 라인이 완전히 없어지지 않도록 주의해야 한다.A circuit is constructed on a front surface of a conventional printed circuit board, and circuit elements are mounted thereon, and a rear surface of the printed circuit board includes a heat-dissipating adhesive surface on which a copper foil or a conductive metal such as copper foil is plated and attached to a heat sink. In order to form a matrix-shaped microstrip line 22 perpendicular to the vertical and horizontal direction on the back surface of the heat dissipation adhesive of 21), a groove having an appropriate depth must be made. In order to create a groove having a suitable depth, an etching mask is formed on a portion of the printed circuit board other than the vertical grooves on the heat dissipation bonding surface, and then the adhesive surface on which the portions other than the grooves are masked is exposed to the etching liquid for a suitable time. As the unmasked metal is etched by the mask, grooves are formed to form microstrip lines. At this time, care should be taken to ensure that the metal surface is excessively corroded so that the microstrip line is completely removed.
이와 같이 형성된 인쇄회로기판(21)의 방열접착면은 납과 친화성이 있는 금속으로 도금되어 있거나 자체의 재질이 납과 친화성이 있는 금속판으로 형성되어 방열특성이 양호한 방열판(23)에 납으로 융접되어 지는데, 이러한 방열판의 크기는 상기한 안쇄회로기판의 접착면적과 동일하게 형성할 수도 있다.The heat dissipation bonding surface of the printed circuit board 21 formed as described above is plated with a metal having affinity for lead or formed with a metal plate having affinity with lead, so that the heat dissipation surface of the printed circuit board 21 has a heat dissipation property of lead. The heat sink may be formed to have the same size as the adhesive area of the printed circuit board.
따라서, 상기한 형상의 방열판 위에 미세하게 납이 분쇄되어 납이 녹는 온도에서 접착면의 이물질을 제거하여 납이 부착되기 쉽도록 하는 물질인 플럭스와 혼합되어진 크림납을 얇게 도포하고, 그 위에 본 고안의 인쇄회로기판 방열접착면을 맞닿게 하여 납이 녹을 수 있는 정도의 열을 가할수 있으면서 적당한 압력으로 시료를 누를수 있는 압착융착기에 삽입하여 인쇄회로기판과 방열판을 융착시키게 되는 것이다.Therefore, the lead is crushed finely on the heat sink of the above-described shape to remove the foreign matter on the adhesive surface at the temperature of melting the lead is thinly coated cream lead mixed with the flux, which is a material that is easy to attach lead, the present invention thereon The printed circuit board is brought into contact with the heat dissipation bonding surface, and the heat can be melted to lead, and the sample is inserted into the press fusion splicer that can press the sample at a suitable pressure to fuse the printed circuit board and the heat sink.
본 고안은 상기와 같이 마이크로 스트립 라인이 적용된 인쇄회로기판을 방열판에 납융접하는 경우, 접착면 사이에 과량의 납과 플럭스를 마이크로 스트립 라인을 통해 효과적으로 배출시키고 적량의 납으로서 상호 효과적으로 접착될 수 있도록 인쇄회로기판의 방열접착면에 가로세로로 교차하는 매트릭스형상의 미세한 홈을 다수 만들어 적용하는 구조이다.In the present invention, when soldering a printed circuit board to which a micro strip line is applied to a heat sink as described above, an excess of lead and flux are effectively discharged through the micro strip line between the adhesive surfaces and printed to be effectively bonded to each other as a proper amount of lead. It is a structure that creates and applies a large number of minute grooves having a matrix shape that intersects length and width on a heat dissipation bonding surface of a circuit board.
우선 인쇄회로기판에는 가로세로의 직교하는 적당한 깊이의 홈이 만들어져야 한다. 적당한 깊이의 홈을 생성시키기 위해서는 기판의 부착면에 가로세로의 홈 이외의 부분에 에칭마스크를 도포한 후, 에칭액에 부착면을 적당한 시간동안 노출시켜 금속면이 깍여 나가 홈이 생성되도록 한다. 이때, 금속면이 과하게 부식되어서 완전히 없어지지 않도록 하여야 한다.First, the printed circuit board should be provided with grooves of a suitable depth perpendicular to each other. In order to create a groove having an appropriate depth, an etching mask is applied to a portion of the substrate other than the vertical groove, and then the adhesive surface is exposed to the etching liquid for a suitable time so that the metal surface is scraped off to generate the groove. At this time, the metal surface is excessively corroded so as not to be completely removed.
다음으로, 방열판의 접착부위에 적당한 양의 크림납(24)을 얇게 도포한다. 그리고, 위와 같이 가공된 인쇄회로기판의 접착면에 서로 맞닿도록 붙여서 압착융접기에 넣는다. 압착융접기로 열을 가하여 접착부위의 납을 녹이면서 압력을 가하여 접착면 사이에 과량으로 존재하는 납과 플럭스를 밀어낸 다음, 상온으로 식을때까지 압착상태를 유지한다.Next, an appropriate amount of cream lead 24 is applied thinly to the bonding portion of the heat sink. Then, the adhesive surface of the printed circuit board processed as described above is put into contact with each other and put into the crimp welding machine. Heat with a crimping fusion machine to melt the lead on the adhesive site and pressurize it to push out the excess lead and flux between the adhesive surfaces, and then keep the crimped state until it cools down to room temperature.
상술한 바의 본 고안에 따르면, 인쇄회로기판의 접착면에 형성된 홈에 과량으로 존재하는 잔류납과 플럭스를 효과적으로 배출할수있고, 인쇄회로기판의 접착면에 형성된 홈에 남아있는 잔류납 인쇄회로기판과 방열판 상이의 양호한 접착성을 유지하게 한다. 또한, 인쇄회로기판의 접착면에 에칭을 통하여 홈을 만드는 방법을 통하여 인쇄회로기판에 기계적인 힘을 가하지 않기 때문에 보다 정밀한 가공을 요구하는 마이크로 스트립 선로를 적용한 회로기판의 제작에 적당한다.According to the present invention as described above, it is possible to effectively discharge the residual lead and flux existing in the groove formed on the adhesive surface of the printed circuit board, the residual lead printed circuit board remaining in the groove formed on the adhesive surface of the printed circuit board And good adhesion between the heat sink and the heat sink. In addition, since a mechanical force is not applied to the printed circuit board by etching grooves on the adhesive surface of the printed circuit board, it is suitable for the manufacture of a circuit board to which a micro strip line which requires more precise processing is applied.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970043934U KR200325539Y1 (en) | 1997-12-30 | 1997-12-30 | Printed Circuit Board Heat Resistant Structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970043934U KR200325539Y1 (en) | 1997-12-30 | 1997-12-30 | Printed Circuit Board Heat Resistant Structure |
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| Publication Number | Publication Date |
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| KR19990031225U true KR19990031225U (en) | 1999-07-26 |
| KR200325539Y1 KR200325539Y1 (en) | 2004-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2019970043934U Expired - Fee Related KR200325539Y1 (en) | 1997-12-30 | 1997-12-30 | Printed Circuit Board Heat Resistant Structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100771291B1 (en) * | 2006-05-24 | 2007-10-29 | 삼성전기주식회사 | Heat radiation board and its manufacturing method |
| WO2009091219A3 (en) * | 2008-01-18 | 2009-10-22 | 주식회사 케이엠더블유 | Printed circuit board installation method |
-
1997
- 1997-12-30 KR KR2019970043934U patent/KR200325539Y1/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100771291B1 (en) * | 2006-05-24 | 2007-10-29 | 삼성전기주식회사 | Heat radiation board and its manufacturing method |
| WO2009091219A3 (en) * | 2008-01-18 | 2009-10-22 | 주식회사 케이엠더블유 | Printed circuit board installation method |
| US9254531B2 (en) | 2008-01-18 | 2016-02-09 | Kmw Inc. | PCB mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200325539Y1 (en) | 2004-02-05 |
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