KR19990028767A - 반도체 웨이퍼 일괄 적재 시스템 및 반도체 웨이퍼 조작 시스템 - Google Patents
반도체 웨이퍼 일괄 적재 시스템 및 반도체 웨이퍼 조작 시스템 Download PDFInfo
- Publication number
- KR19990028767A KR19990028767A KR1019980700066A KR19980700066A KR19990028767A KR 19990028767 A KR19990028767 A KR 19990028767A KR 1019980700066 A KR1019980700066 A KR 1019980700066A KR 19980700066 A KR19980700066 A KR 19980700066A KR 19990028767 A KR19990028767 A KR 19990028767A
- Authority
- KR
- South Korea
- Prior art keywords
- door
- conveyer
- carrier
- chamber
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 235000012431 wafers Nutrition 0.000 claims abstract description 148
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 239000000428 dust Substances 0.000 claims abstract description 42
- 239000002245 particle Substances 0.000 claims abstract description 42
- 238000003860 storage Methods 0.000 claims abstract description 34
- 238000012546 transfer Methods 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 30
- 238000002955 isolation Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 60
- 230000008878 coupling Effects 0.000 claims description 26
- 238000010168 coupling process Methods 0.000 claims description 26
- 238000005859 coupling reaction Methods 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 5
- 238000011084 recovery Methods 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000011109 contamination Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012636 effector Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49898795A | 1995-07-06 | 1995-07-06 | |
| US8/498597 | 1995-07-06 | ||
| US8/498859 | 1995-07-06 | ||
| US08/498,597 US5609459A (en) | 1995-07-06 | 1995-07-06 | Door drive mechanisms for substrate carrier and load lock |
| US08/499,069 US5613821A (en) | 1995-07-06 | 1995-07-06 | Cluster tool batchloader of substrate carrier |
| US8/498987 | 1995-07-06 | ||
| US08/498,859 US5607276A (en) | 1995-07-06 | 1995-07-06 | Batchloader for substrate carrier on load lock |
| US8/499069 | 1995-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990028767A true KR19990028767A (ko) | 1999-04-15 |
Family
ID=27504398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980700066A Abandoned KR19990028767A (ko) | 1995-07-06 | 1996-07-02 | 반도체 웨이퍼 일괄 적재 시스템 및 반도체 웨이퍼 조작 시스템 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0886617A1 (fr) |
| JP (1) | JP4306798B2 (fr) |
| KR (1) | KR19990028767A (fr) |
| CN (1) | CN1195332A (fr) |
| AU (1) | AU6408996A (fr) |
| TW (1) | TW278200B (fr) |
| WO (1) | WO1997002199A1 (fr) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG47226A1 (en) * | 1996-07-12 | 1998-03-20 | Motorola Inc | Method and apparatus for transporting and using a semiconductor substrate carrier |
| US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
| DE19805624A1 (de) * | 1998-02-12 | 1999-09-23 | Acr Automation In Cleanroom | Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen |
| US6610150B1 (en) * | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
| JP4628530B2 (ja) * | 2000-08-25 | 2011-02-09 | 株式会社ライト製作所 | 搬送容器の蓋着脱装置 |
| SG115630A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock |
| KR101131417B1 (ko) * | 2003-11-12 | 2012-04-03 | 주성엔지니어링(주) | 로드락 장치 및 이를 설치한 로드락 챔버 |
| JP4748816B2 (ja) | 2008-11-28 | 2011-08-17 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム |
| JP5279576B2 (ja) * | 2009-03-27 | 2013-09-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4919123B2 (ja) | 2010-03-08 | 2012-04-18 | Ｔｄｋ株式会社 | 処理基板収納ポッド及び処理基板収納ポッドの蓋開閉システム |
| US10741432B2 (en) * | 2017-02-06 | 2020-08-11 | Applied Materials, Inc. | Systems, apparatus, and methods for a load port door opener |
| US10510573B2 (en) * | 2017-11-14 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Loading apparatus and operating method thereof |
| KR102247183B1 (ko) * | 2020-05-29 | 2021-05-04 | 주식회사 싸이맥스 | 효율적인 설치면적을 갖는 웨이퍼 공정 장치 |
| KR102200250B1 (ko) * | 2020-05-29 | 2021-01-11 | 주식회사 싸이맥스 | 풉 로드락 도어가 구비된 로드포트모듈 및 로드포트모듈 도어와 풉 로드락 도어의 개폐방법 |
| US11302553B1 (en) * | 2021-01-07 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transport carrier docking device |
| CN114777490B (zh) * | 2022-06-21 | 2022-09-09 | 上海陛通半导体能源科技股份有限公司 | 可实现自动全向开合的半导体设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4550242A (en) * | 1981-10-05 | 1985-10-29 | Tokyo Denshi Kagaku Kabushiki Kaisha | Automatic plasma processing device and heat treatment device for batch treatment of workpieces |
| JPH0461146A (ja) * | 1990-06-22 | 1992-02-27 | Mitsubishi Electric Corp | 半導体ウエハ移替装置 |
| JPH04206547A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 装置間搬送方法 |
| JP3275390B2 (ja) * | 1992-10-06 | 2002-04-15 | 神鋼電機株式会社 | 可搬式密閉コンテナ流通式の自動搬送システム |
-
1995
- 1995-09-07 TW TW084109347A patent/TW278200B/zh active
-
1996
- 1996-07-02 KR KR1019980700066A patent/KR19990028767A/ko not_active Abandoned
- 1996-07-02 AU AU64089/96A patent/AU6408996A/en not_active Abandoned
- 1996-07-02 WO PCT/US1996/011244 patent/WO1997002199A1/fr not_active Ceased
- 1996-07-02 CN CN96196791A patent/CN1195332A/zh active Pending
- 1996-07-02 EP EP96923623A patent/EP0886617A1/fr not_active Withdrawn
- 1996-07-02 JP JP50529197A patent/JP4306798B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW278200B (en) | 1996-06-11 |
| WO1997002199A1 (fr) | 1997-01-23 |
| EP0886617A1 (fr) | 1998-12-30 |
| JP4306798B2 (ja) | 2009-08-05 |
| JPH11513006A (ja) | 1999-11-09 |
| AU6408996A (en) | 1997-02-05 |
| CN1195332A (zh) | 1998-10-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 19980106 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20010702 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20031128 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20040803 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |