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KR19980087533A - - Google Patents

Info

Publication number
KR19980087533A
KR19980087533A KR19980020041A KR19980020041A KR19980087533A KR 19980087533 A KR19980087533 A KR 19980087533A KR 19980020041 A KR19980020041 A KR 19980020041A KR 19980020041 A KR19980020041 A KR 19980020041A KR 19980087533 A KR19980087533 A KR 19980087533A
Authority
KR
South Korea
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR19980020041A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR19980087533A publication Critical patent/KR19980087533A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR19980020041A 1997-05-30 1998-05-30 Ceased KR19980087533A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9157939A JPH10335035A (ja) 1997-05-30 1997-05-30 Ｂｇａ−ｉｃ用測定機構

Publications (1)

Publication Number Publication Date
KR19980087533A true KR19980087533A (ko) 1998-12-05

Family

ID=15660781

Family Applications (1)

Application Number Title Priority Date Filing Date
KR19980020041A Ceased KR19980087533A (ko) 1997-05-30 1998-05-30

Country Status (3)

Country Link
US (1) US6373267B1 (ko)
JP (1) JPH10335035A (ko)
KR (1) KR19980087533A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100423157B1 (ko) * 2001-06-28 2004-03-16 동부전자 주식회사 웨이퍼 레벨 칩 스케일 패키지 테스트 장치

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11329648A (ja) * 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US7112121B2 (en) 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
US7056131B1 (en) * 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US8584353B2 (en) * 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7597561B2 (en) * 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7758351B2 (en) * 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US6869290B2 (en) * 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7009413B1 (en) * 2003-10-10 2006-03-07 Qlogic Corporation System and method for testing ball grid arrays
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7090503B2 (en) * 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US20050205988A1 (en) * 2004-03-19 2005-09-22 Epic Technology Inc. Die package with higher useable die contact pad area
US7383632B2 (en) * 2004-03-19 2008-06-10 Neoconix, Inc. Method for fabricating a connector
US20060000642A1 (en) * 2004-07-01 2006-01-05 Epic Technology Inc. Interposer with compliant pins
US7354276B2 (en) * 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
US7259581B2 (en) * 2005-02-14 2007-08-21 Micron Technology, Inc. Method for testing semiconductor components
US20070050738A1 (en) * 2005-08-31 2007-03-01 Dittmann Larry E Customer designed interposer
US7357644B2 (en) * 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
DE102006052112A1 (de) * 2006-11-06 2008-05-08 Robert Bosch Gmbh Elektrische Kontaktanordnung
US7872483B2 (en) 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585162A (en) * 1995-06-16 1996-12-17 Minnesota Mining And Manufacturing Company Ground plane routing
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5702255A (en) * 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US5962921A (en) * 1997-03-31 1999-10-05 Micron Technology, Inc. Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps
US5931685A (en) * 1997-06-02 1999-08-03 Micron Technology, Inc. Interconnect for making temporary electrical connections with bumped semiconductor components
JPH1172534A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp テスト端子付き半導体装置およびｉｃソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100423157B1 (ko) * 2001-06-28 2004-03-16 동부전자 주식회사 웨이퍼 레벨 칩 스케일 패키지 테스트 장치

Also Published As

Publication number Publication date
JPH10335035A (ja) 1998-12-18
US6373267B1 (en) 2002-04-16

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19980530

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19980731

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19980530

Comment text: Patent Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20000627

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20010315

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20000627

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20010413

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20010315

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20020530

Appeal identifier: 2001101001029

Request date: 20010413

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20010413

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20010413

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20000825

Patent event code: PB09011R02I

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20010413

Effective date: 20020530

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20020530

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20010413

Decision date: 20020530

Appeal identifier: 2001101001029