KR19980076753A - Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound and preparation method thereof - Google Patents
Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound and preparation method thereof Download PDFInfo
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- KR19980076753A KR19980076753A KR1019970013599A KR19970013599A KR19980076753A KR 19980076753 A KR19980076753 A KR 19980076753A KR 1019970013599 A KR1019970013599 A KR 1019970013599A KR 19970013599 A KR19970013599 A KR 19970013599A KR 19980076753 A KR19980076753 A KR 19980076753A
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- -1 aryl diphosphate compound Chemical class 0.000 title claims abstract description 26
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 title claims abstract description 17
- 239000001177 diphosphate Substances 0.000 title claims abstract description 16
- 235000011180 diphosphates Nutrition 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims description 5
- 239000003063 flame retardant Substances 0.000 claims abstract description 23
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 20
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000007806 chemical reaction intermediate Substances 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 7
- ITVPBBDAZKBMRP-UHFFFAOYSA-N chloro-dioxido-oxo-$l^{5}-phosphane;hydron Chemical compound OP(O)(Cl)=O ITVPBBDAZKBMRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000543 intermediate Substances 0.000 claims description 4
- WVPKAWVFTPWPDB-UHFFFAOYSA-M dichlorophosphinate Chemical compound [O-]P(Cl)(Cl)=O WVPKAWVFTPWPDB-UHFFFAOYSA-M 0.000 claims description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 229920003023 plastic Polymers 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 4
- ICKWICRCANNIBI-UHFFFAOYSA-N 2,4-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(C(C)(C)C)=C1 ICKWICRCANNIBI-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001629 magnesium chloride Inorganic materials 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- IKEBXDQECRVZEU-UHFFFAOYSA-N [H+].[H+].[H+].[PH4+].[O-]P([O-])(=O)OP([O-])([O-])=O Chemical compound [H+].[H+].[H+].[PH4+].[O-]P([O-])(=O)OP([O-])([O-])=O IKEBXDQECRVZEU-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- BGGGMYCMZTXZBY-UHFFFAOYSA-N (3-hydroxyphenyl) phosphono hydrogen phosphate Chemical compound OC1=CC=CC(OP(O)(=O)OP(O)(O)=O)=C1 BGGGMYCMZTXZBY-UHFFFAOYSA-N 0.000 description 1
- UXAFEFWYRQXVKX-UHFFFAOYSA-N 2,3-bis[3-(2,4-ditert-butylphenyl)-2,6-dimethylphenyl]benzene-1,4-diol phosphono dihydrogen phosphate Chemical compound OP(O)(=O)OP(=O)(O)O.CC(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C=1C(=C(C(=CC1)C)C=1C(=C(O)C=CC1O)C1=C(C(=CC=C1C)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C)C)C UXAFEFWYRQXVKX-UHFFFAOYSA-N 0.000 description 1
- HWRWJDHHPAPHKP-UHFFFAOYSA-N 2,4-ditert-butyl-1-dichlorophosphoryloxybenzene Chemical compound CC(C)(C)C1=CC=C(OP(Cl)(Cl)=O)C(C(C)(C)C)=C1 HWRWJDHHPAPHKP-UHFFFAOYSA-N 0.000 description 1
- YMBUSXBGGUAEFN-UHFFFAOYSA-N CC1=C(C(=C(C=C1)C2=C(C=C(C=C2)C(C)(C)C)C(C)(C)C)C)OP(=O)(O)Cl Chemical compound CC1=C(C(=C(C=C1)C2=C(C=C(C=C2)C(C)(C)C)C(C)(C)C)C)OP(=O)(O)Cl YMBUSXBGGUAEFN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZQCYSDVRUPTVLF-UHFFFAOYSA-N P(O)(=O)(OP(=O)(O)O)OC1=CC(O)=CC=C1.CC(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C=1C(=C(C(=CC1)C)O)C.CC(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C=1C(=C(C(=CC1)C)O)C Chemical compound P(O)(=O)(OP(=O)(O)O)OC1=CC(O)=CC=C1.CC(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C=1C(=C(C(=CC1)C)O)C.CC(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C=1C(=C(C(=CC1)C)O)C ZQCYSDVRUPTVLF-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- OZJDKMBIEWVOEH-UHFFFAOYSA-N benzene-1,4-diol;phosphono dihydrogen phosphate Chemical compound OC1=CC=C(O)C=C1.OP(O)(=O)OP(O)(O)=O OZJDKMBIEWVOEH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GLUYADGKGBGXRV-UHFFFAOYSA-N chloro dihydrogen phosphate Chemical compound OP(O)(=O)OCl GLUYADGKGBGXRV-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
- TXFOLHZMICYNRM-UHFFFAOYSA-N dichlorophosphoryloxybenzene Chemical compound ClP(Cl)(=O)OC1=CC=CC=C1 TXFOLHZMICYNRM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical compound P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- ZOOOXFQDMBDASO-UHFFFAOYSA-N phosphono [2,3,4,6-tetrakis(2,6-dimethylphenyl)-5-hydroxyphenyl] hydrogen phosphate Chemical compound CC1=CC=CC(C)=C1C(C(=C1C=2C(=CC=CC=2C)C)OP(O)(=O)OP(O)(O)=O)=C(O)C(C=2C(=CC=CC=2C)C)=C1C1=C(C)C=CC=C1C ZOOOXFQDMBDASO-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Abstract
하기의 화학식 1로 표시되는 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]아릴 디포스페이트 화합물은 플라스틱 수지에 난연성 및 내열성을 부가하는데 이용될 수 있는 신규한 난연제이며 이를 제조하는 신규의 방법을 제공함으로써 난연제를 제조하는 종래의 공정 중에 포스포러스 옥시클로라이드를 제거해야하는 문제점 및 바람직하지 못한 올리고머의 생성 문제점을 해결한다.Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound represented by the following Chemical Formula 1 may be used to add flame retardancy and heat resistance to plastic resins. By providing a novel flame retardant and a novel method of making it, the problem of removing phosphorus oxychloride and the production of undesirable oligomers during the conventional process of making the flame retardant are solved.
Description
[산업상 이용분야][Industrial use]
본 발명은 난연제 및 그 제조방법에 관한 것으로서, 더욱 상세하게는 플라스틱 수지에 난연성 및 내열성을 부가하는데 이용될 수 있는 신규한 유기인 화합물로 하기의 화학식 1로 표시되는 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]아릴 디포스페이트 화합물 및 그 제조방법에 관한 것이다.The present invention relates to a flame retardant and a method for preparing the same, and more particularly to a novel organophosphorus compound which can be used to add flame retardancy and heat resistance to a plastic resin. A 1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound and a method for producing the same.
[화학식 1][Formula 1]
[종래 기술][Prior art]
근래에 플라스틱을 시작으로 고무, 섬유, 종이 등의 제품에 대한 연소성의 규제가 강화되고 있다. 특히, 각종 고분자 재료는 많은 우수한 특성을 소유하고 있기 때문에, 전기, 전자부품, 차량부품, 항공기, 선박 등의 넓은 분야에 사용되고 있다. 이 때문에 국내외를 불문하고 이들의 난연화에 관한 필요성이 증대되어 왔다.Recently, regulations on combustibility of rubber, fiber, paper, and other products have been tightened, starting with plastics. In particular, since various polymer materials possess many excellent properties, they are used in a wide range of fields such as electric, electronic parts, vehicle parts, aircraft, and ships. For this reason, the necessity for flame retardation of these has been increased at home and abroad.
일반적으로 유기인 화합물은 비교적 좋은 난연 효과를 나타내는 난연제로 알려져 왔으나 다소 높은 휘발성과 낮은 내열성이 문제점으로 지적되었다. 특히 엔지니어링 플라스틱 또는 수퍼-엔지니어링 플라스틱과 같이 새로이 개발된 고기능성 플라스틱의 경우 가공 온도가 300℃ 근처이므로 난연제의 내열성에 대한 요구가 증대되고 있다.In general, organophosphorus compounds have been known as flame retardants having a relatively good flame retardant effect, but has been pointed out as a problem of somewhat high volatility and low heat resistance. In particular, newly developed high-performance plastics, such as engineering plastics or super-engineering plastics, have a demand for heat resistance of flame retardants because the processing temperature is around 300 ° C.
미국특허 제 2,520,090호 및 제 4,134,876호에는 포스포러스 옥시클로라이드와 화학식 4와 같은 디히드릭 페놀 화합물 및 화학식 5와 같은 모노히드릭 페놀 화합물을 반응시켜 방향족 디포스페이트 올리고머 인계 난연제에 대한 제조 방법이 개시되어 있다. 상기 특허는 미반응된 포스포러스 옥시클로라이드를 제거해야 하는 단점이 있고 또한 바람직하지 못한 올리고머 제품이 다량 생산되는 단점이 있다.US Patent Nos. 2,520,090 and 4,134,876 disclose methods for preparing aromatic diphosphate oligomer phosphorus flame retardants by reacting phosphorus oxychloride with dihydric phenol compounds such as Formula 4 and monohydric phenol compounds such as Formula 5 have. The patent has the disadvantage of removing unreacted phosphorus oxychloride and also the disadvantage of producing large quantities of undesirable oligomeric products.
[화학식4][Formula 4]
화학식 4의 화합물의 종류에는 레조시놀, 히드로퀴논 등이 있다.Examples of the compound of formula 4 include resorcinol, hydroquinone and the like.
[화학식5][Formula 5]
여기서 R1및 R2는 탄소수 1 내지 8의 알킬기, 또는 R1은 수소일 경우, R2는 탄소수 1 내지 8 사이의 알킬기이다.Wherein R 1 and R 2 are an alkyl group having 1 to 8 carbon atoms, or when R 1 is hydrogen, R 2 is an alkyl group having 1 to 8 carbon atoms.
유럽특허 제 613,902호에는 포스포러스 옥시클로라이드와 화학식 5와 같은 모노히드릭 페놀화합물 및 화학식 4와 같은 디히드릭 페놀 화합물을 반응시켜 방향족 디포스페이트 올리고머 인계 난연제에 대한 제조방법이 개시되어 있다. 상기 특허는 바람직하지 못한 올리고머의 생성을 억제하기 위하여 옥시클로라이드와 모노히드릭 페놀 화합물을 반응시킨 후 반응중간체를 정제해야 하는 단점이 있다.EP 613,902 discloses a process for preparing aromatic diphosphate oligomeric phosphorus flame retardants by reacting phosphorus oxychloride with monohydric phenol compounds such as Formula 5 and dihydric phenol compounds such as Formula 4. The patent has a disadvantage in that the reaction intermediate must be purified after reacting the oxychloride and the monohydric phenol compound in order to suppress the formation of undesirable oligomers.
미국특허 제 5,420,327호, 유럽특허 제 509,506호 및 일본 공고특허 제 2,552,780호에는 포스포러스 옥시클로라이드와 모노히드릭 페놀화합물을 반응시킨 후 다시 디히드릭페놀 화합물을 반응시켜 순도 90% 이상의 분말형 방향족 디포스페이트 인계 난연제에 대한 제조하는 방법이 개시되어 있다. 여기에서는 기공지된 논할로겐(non-halogen) 인계 난연제, 예를 들면 트리페닐포스페이트(TPP), 레조시놀디포스페이트(RDP)보다 난연성 및 내열성이 우수하다는 내용이 공지되어 있다. 그러나 열이 많이 발생하는 가전제품 등의 수지조성물은 난연성이 우수해야 할 뿐만 아니라 특히 내열성이 매우 우수해야 하는데 그 수준에는 미치지 못하는 단점이 있다.U.S. Patent No. 5,420,327, European Patent No. 509,506, and Japanese Patent Publication No. 2,552,780 react the phosphorus oxychloride with the monohydric phenol compound and then react with the dihydric phenol compound to obtain a powdered aromatic di A process for the preparation of phosphate phosphorus flame retardants is disclosed. It is known here that flame retardancy and heat resistance are superior to known non-halogen phosphorus flame retardants such as triphenylphosphate (TPP) and resorcinol diphosphate (RDP). However, resin compositions such as home appliances that generate a lot of heat not only have to be excellent in flame retardancy, but also have particularly high heat resistance, which has disadvantages that fall short of the level.
본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 첫째, 난연성이 우수하고 특히 내열성이 우수한 난연수지 조성물, 예를 들면 폴리카보네이트 수지, ABS 수지, 스틸렌계 공중합체, 폴리올레핀 수지 등에 난연제로 사용되는 방향족 디포스페이트 화합물을 제공하기 위한 것이다.The present invention has been made to solve the above problems of the prior art, an object of the present invention is first, a flame retardant resin composition, such as polycarbonate resin, ABS resin, styrene copolymer having excellent flame resistance and particularly excellent heat resistance And aromatic diphosphate compounds used as flame retardants for polyolefin resins and the like.
둘째, 본 발명은 모노히드릭 페놀화합물에 입체 장애 효과를 부여해 99.5% 이상의 고순도 화합물을 만드는 방법을 제공하여 제조중간에 포스포러스 옥시클로라이드를 제거해야하는 문제점 및 바람직하지 못한 올리고머의 생성 문제점을 해결하기 위한 것이다.Second, the present invention provides a method of making a high purity compound of more than 99.5% by giving a steric hindrance effect to the monohydric phenol compound to solve the problem of removing the phosphorus oxychloride during production and the production of undesirable oligomers will be.
셋째, 본 발명의 또 다른 목적은 화학적 혼합 방법을 통하여 터셔리 부틸기가 함유된 화합물을 도입한 방향족 디포스페이트 화합물을 제공하여 내열성을 부가하기 위한 것이다.Third, another object of the present invention is to provide an aromatic diphosphate compound into which a compound containing a tertiary butyl group is introduced through a chemical mixing method to add heat resistance.
[과제를 해결하기 위한 수단][Means for solving the problem]
본 발명은 상기한 본 발명의 목적을 달성하기 위하여 하기와 같은 구성을 갖는다.The present invention has the following configuration to achieve the above object of the present invention.
본 발명에 있어서, 하기의 화학식 1로 표시되는 난연제용 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 아릴 디포스페이트 화합물을 제공한다.In the present invention, a bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound for a flame retardant represented by the following general formula (1) is provided.
[화학식1][Formula 1]
본 발명에서 아릴 화합물의 종류를 레조시놀로 하여 하기의 화학식 2로 표시되는 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 아릴 디포스페이트 화합물을 제공한다.In the present invention, a bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound represented by the following Chemical Formula 2 is provided using a type of aryl compound as resorcinol. .
[화학식 2][Formula 2]
또한 상기 아릴 화합물의 종류를 히드로퀴논으로 하여 하기의 화학식 3으로 표시되는 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 아릴 디포스페이트 화합물을 제공한다.In addition, a bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound represented by the following Chemical Formula 3 is provided by using a hydroquinone as a kind of the aryl compound.
[화학식 3][Formula 3]
그리고 본 발명에 있어서, 포스포러스 옥시클로라이드를 촉매하에서 화학식 5로 표시되는 서로 상이한 화합물과 반응시켜 화학식 6으로 표시되는 클로로포스페이트 반응중간체를 생성시키고 상기 반응중간체를 촉매하에서 화학식 4로 표시되는 화합물과 반응시켜 화학식 1로 표시되는 화합물을 생성시키는 공정을 포함하는 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 아릴 디포스페이트 화합물의 제조방법을 제공한다.In the present invention, the phosphorus oxychloride is reacted with a different compound represented by the formula (5) under a catalyst to produce a chlorophosphate reaction intermediate represented by the formula (6) and the reaction intermediate is reacted with a compound represented by the formula (4) under a catalyst It provides a method for producing a bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] aryl diphosphate compound comprising the step of producing a compound represented by the formula (1).
[화학식 4][Formula 4]
[화학식 5][Formula 5]
상기 화학식 5에서 R1및 R2는 탄소수 1 내지 8의 알킬기, 또는 R1은 수소일 경우, R2는 탄소수 1 내지 8 사이의 알킬기이다.In Formula 5, R 1 and R 2 are alkyl groups having 1 to 8 carbon atoms, or when R 1 is hydrogen, R 2 is an alkyl group having 1 to 8 carbon atoms.
[화학식6][Formula 6]
상기 화학식 6에서 R1및 R2는 탄소수 1 내지 8의 알킬기, 또는 R1은 수소일 경우, R2는 탄소수 1 내지 8 사이의 알킬기이다. 또한 R1' 및 R2'는 탄소수 1 내지 8의 알킬기, 또는 R1'은 수소일 경우, R2'는 탄소수 1 내지 8 사이의 알킬기이다.In Formula 6, R 1 and R 2 are alkyl groups having 1 to 8 carbon atoms, or when R 1 is hydrogen, R 2 is an alkyl group having 1 to 8 carbon atoms. In addition, when R 1 'and R 2 ' is an alkyl group having 1 to 8 carbon atoms, or R 1 'is hydrogen, R 2 ' is an alkyl group having 1 to 8 carbon atoms.
상기 화학식 6으로 표시되는 클로로프로페이트 반응중간체를 제조하는 데 있어서, 서로 다른 모노히드릭 화합물을 적당한 촉매하에서 단계적으로 반응시키는 것이 바람직하다.In preparing the chloropropate reaction intermediate represented by Formula 6, it is preferable to react different monohydric compounds step by step under a suitable catalyst.
여기에서 화학식 4로 표시되는 화합물은 레조시놀 또는 히드로퀴논인 것이 바람직하다.The compound represented by the formula (4) is preferably resorcinol or hydroquinone.
본 발명은 화학적 혼합 방법을 통하여 터셔리 부틸기가 함유된 화합물을 도입하여 내열성을 부가할 수 있다. 또한 서로 다른 모노히드릭 페놀 화합물을 조합하여 인함유량을 조절하는 방법을 제공한다. 첫 번째 반응 단계에서 포스포러스 옥시클로라이드에 입체적 장애 효과를 부여하는 2,4-비스(1,1-디메틸에틸)페닐 한 분자를 반응시켜 99.7% 이상 고순도의 [2.4-비스(1,1-디메틸에틸)]페닐 디클로로포스페이트를 제조한 후 두 번째 단계에서는 이 중간체에 반응성이 뛰어나면서 2,4-비스(1,1-디메틸에틸)페놀보다 분자량이 작은 모노히드릭 화합물인 2,6-디메틸페놀을 반응시킴으로써 기존의 2,4-비스(1,1-디메틸에틸)페놀 2몰을 반응시킨 중간체보다 인함량이 증가된 [2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]클로로 포스페이트를 얻을 수 있다. 한 분자 내에 서로 다른 모노히드릭 페놀을 조합하여 사용함으로써 화합물의 인함량을 조절할 수 있는 방법을 제시한다.The present invention can add heat resistance by introducing a compound containing a tertiary butyl group through a chemical mixing method. It also provides a method of controlling phosphorus content by combining different monohydric phenolic compounds. In the first reaction step, a molecule of 2,4-bis (1,1-dimethylethyl) phenyl, which gives steric hindrance effect to phosphorus oxychloride, is reacted to obtain a high purity of [2.4-bis (1,1-dimethyl) of 99.7% or more. In the second step after the preparation of ethyl)] phenyl dichlorophosphate, 2,6-dimethylphenol is a monohydric compound that is more reactive to this intermediate and has a lower molecular weight than 2,4-bis (1,1-dimethylethyl) phenol. [2,4-bis (1,1-dimethylethyl) phenyl-2,6- with a higher phosphorus content than the intermediate to which 2 moles of 2,4-bis (1,1-dimethylethyl) phenol was reacted by reacting Dimethylphenyl] chloro phosphate can be obtained. By using different monohydric phenols in combination in one molecule, a method of controlling phosphorus content of a compound is provided.
다음은 본 발명의 이해를 돕기 위하여 바람직한 실시예를 제시한다. 그러나 하기의 실시예들은 본 발명을 보다 쉽게 이해하기 위하여 제공되는 것일 뿐 본 발명이 하기의 실시예에 한정되는 것은 아니다.The following presents a preferred embodiment to aid the understanding of the present invention. However, the following examples are merely provided to more easily understand the present invention, and the present invention is not limited to the following examples.
[실시예]EXAMPLE
본 발명에 대한 제조방법은 다음과 같다.The manufacturing method for the present invention is as follows.
실시예 1: 비스 [2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페놀]레조시놀 디포스페이트Example 1: Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenol] resorcinol diphosphate
잘 건조된 플라스크에 온도계, 냉각 콘덴서 및 교반기를 부착시키고 2,4-비스(1,1-디메틸에틸)페놀 268.2g, 마그네슘 클로라이드 2.0g, 자일렌 100g을 넣고 가열하였다. 반응액의 온도가 150℃에 도달하였을 때 포스포러스 옥시클로라이드 199.3g을 1시간에 걸쳐 주입하였다. 이 때 발생되는 염산가스는 물로 포집하였다. 포스포러스 옥시클로라이드 주입 후 150℃에서 반응을 계속 진행하였다. 염산가스 발생이 완료된 후 반응액의 온도를 180℃로 승온하여 4시간 동안 숙성한 후 [2,4-비스(1,1-디메틸에틸)페닐] 디클로로포스페이트를 얻었다.A well-dried flask was attached with a thermometer, a cooling condenser and a stirrer, and heated with 268.2 g of 2,4-bis (1,1-dimethylethyl) phenol, 2.0 g of magnesium chloride, and 100 g of xylene. When the temperature of the reaction solution reached 150 ℃ 199.3g of phosphorus oxychloride was injected over 1 hour. Hydrochloric acid gas generated at this time was collected by water. After the injection of phosphorus oxychloride, the reaction was continued at 150 ° C. After the generation of hydrochloric acid gas, the reaction solution was heated to 180 ° C., and aged for 4 hours to obtain [2,4-bis (1,1-dimethylethyl) phenyl] dichlorophosphate.
1단계에서 얻은 디클로로포스페이트 반응 중간체의 온도를 70℃로 냉각시킨 상태에서 크실레놀(xylenol) 158.9g과 마그네슘 클로라이드 2.0g을 투입한 후에 서서히 반응 온도를 높여 150℃에서 염산 가스 발생이 중지될 때까지 반응시켰다. 염산가스 발생이 완료된 후 반응액의 온도를 180℃로 승온하여 4시간 동안 숙성하여 [2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 클로로포스페이트를 얻었다.When the temperature of the dichlorophosphate reaction intermediate obtained in step 1 was cooled to 70 ° C and 158.9 g of xylenol and 2.0 g of magnesium chloride were added thereto, the reaction temperature was gradually increased to stop the generation of hydrochloric acid gas at 150 ° C. The reaction was carried out until. After the generation of hydrochloric acid gas, the reaction solution was heated to 180 ° C. and aged for 4 hours to obtain [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] chlorophosphate.
2단계에서 얻은 클로로포스페이트 반응중간체의 온도를 70℃로 냉각시킨 상태에서 레조시놀 71.6g, 마그네슘 클로라이드 3.0g을 투입한 후 반응액을 가열하여 150℃에서 반응을 진행하였다. 이 때 발생되는 염산가스는 물로 포집하였다. 염산가스의 발생이 완료된 후 반응액의 온도를 180℃로 승온하여 4시간 동안 숙성하였다. 반응이 종료된 후 촉매성분 및 불순물을 제거하기 위하여 5% 염산용액 400g으로 세척한 후 또 다시 물로 세척하였다. 그리고 실온으로 냉각하면서 제품 결정을 석출하였다. 결정을 여과한 후 메탄올 500g으로 세척한 후 감압 건조하여 녹는점이 45℃인 백색의 결정성 분말 534g을 얻었다. GPC 분석 결과 얻어진 화합물의 순도는 99.6%였다. 얻어진 화합물에 대하여 적외선 흡수 스펙트럼(IR) 및 핵자기 공명스펙트럼(NMR)으로 구조를 동정하였다. IR 분석은 퓨리에 트랜스폼 인프랄레드(Fourier transform infrared: FT-IR, BRUKER IFS66)를 사용하여 브롬화칼륨과 혼합판상으로 만들어 측정하였다. 측정결과 도 1에서 나타난 바와 같이 진동수 1496㎝-1, 1084㎝-1에서 페닐기의 C=C 스트레칭 흡수띠, 1363㎝-1, 1399㎝-1에서 터셔리 부틸기에 있는 CH3디포메이션 흡수띠, 1308㎝-1에서 P=O 스트레칭 흡수띠, 1130㎝-1에서 P-O-Ar의 스트레칭 흡수띠를 나타냈다.In the state where the temperature of the chlorophosphate reaction intermediate obtained in step 2 was cooled to 70 ° C., 71.6 g of resorcinol and 3.0 g of magnesium chloride were added thereto, and the reaction solution was heated to proceed at 150 ° C. Hydrochloric acid gas generated at this time was collected by water. After generation of hydrochloric acid gas was completed, the reaction solution was heated to 180 ° C. and aged for 4 hours. After completion of the reaction, to remove the catalyst component and impurities, washed with 400g of 5% hydrochloric acid solution and then again with water. And product crystal | crystallization precipitated while cooling to room temperature. The crystals were filtered, washed with 500 g of methanol, and dried under reduced pressure to obtain 534 g of a white crystalline powder having a melting point of 45 ° C. The purity of the compound obtained as a result of GPC analysis was 99.6%. The structure of the obtained compound was identified by infrared absorption spectrum (IR) and nuclear magnetic resonance spectrum (NMR). IR analysis was carried out using Fourier transform infrared (FT-IR, BRUKER IFS66) in a mixed plate with potassium bromide. Measurement results are C = C stretching of the phenyl group, at a frequency 1496㎝ -1, 1084㎝ -1 as shown in the first absorption band, 1363㎝ -1, CH 3 absorption band deformation, 1308㎝ with tertiary butyl groups in 1399㎝ -1 The P = O stretching band at -1 and the stretching band of PO-Ar at 1130 cm -1 are shown.
1H NMR 분석은 중수소화클로로포름을 용매로 사용하고 BRUKER DRX 400으로 CDCl37.24를 내부기준으로 하여 측정하였다. 측정결과 δ는 1.28(18H,s), 1.34(18H,s), 2.3(12H,s), 7.01(9H,m), 7.15(3H,m), 7.36(2H,dd), 743(2H,d)으로 화학식 2와 같은 구조를 갖는다는 것을 확인하였다. 1 H NMR analysis was performed using deuterated chloroform as solvent and BRUKER DRX 400 using CDCl 3 7.24 as internal standard. The measurement result δ is 1.28 (18H, s), 1.34 (18H, s), 2.3 (12H, s), 7.01 (9H, m), 7.15 (3H, m), 7.36 (2H, dd), 743 (2H, It was confirmed that d) has the structure shown in formula (2).
실시예 2: 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]히드로퀴논 디포스페이트Example 2: Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] hydroquinone diphosphate
상기 실시예 1에서 레조시놀 대신에 히드로퀴논으로 대체한 것 이외에는 실시예 1과 동일한 방법으로 실시하여 녹는점이 49℃인 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐] 히드로퀴논 디포스페이트 530g을 얻었다. GPC 분석결과 얻어진 화합물의 순도는 99.5%이었다. 얻어진 화합물에 대하여IR 분석결과 도 2와 같이 진동수 1496㎝-1, 1085㎝-1에서 페닐기의 C=C 스트레칭 흡수띠, 1363㎝-1, 1399㎝-1에서 터셔리 부틸기에 있는 CH3디포메이션 흡수띠, 1307㎝-1에서 P=O 스트레칭 흡수띠, 1158㎝-1에서 P-O-Ar의 스트레칭 흡수띠를 나타냈다.Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6 having a melting point of 49 ° C. in the same manner as in Example 1, except that hydroquinone was substituted for resorcinol in Example 1; -Dimethylphenyl] 530 g of hydroquinone diphosphate was obtained. The purity of the compound obtained as a result of GPC analysis was 99.5%. As a result of IR analysis on the obtained compound, the C = C stretching band of the phenyl group at the frequency of 1496 cm -1 and 1085cm -1 as shown in Fig. 2, and the CH 3 deformation band of the tertiary butyl group at 1363cm -1 and 1399cm -1 , which showed a P = O stretching absorption band at 1307㎝ -1, stretching absorption band of PO-Ar in 1158㎝ -1.
1H NMR 분석결과 δ는 1.29(18H,s), 1.34(18H,s), 2.30(12H,s), 7.01(10,m), 7.14(2H,dd), 7.37(2H,dd), 7.44(2H,d)으로 화학식 3의 구조를 확인하였다. 1 H NMR analysis result δ is 1.29 (18H, s), 1.34 (18H, s), 2.30 (12H, s), 7.01 (10, m), 7.14 (2H, dd), 7.37 (2H, dd), 7.44 (2H, d) confirmed the structure of Chemical Formula 3.
비교예 1Comparative Example 1
트리페닐포스페이트(TPP)(준세이사, 지알급)를 난연제로 사용하였다.Triphenylphosphate (TPP) (Junsei Co., Ltd. grade) was used as a flame retardant.
비교예 2Comparative Example 2
미국특허 제 5,420,327호 제조방법에 의거하여 테트라키스[2,6-디메틸페닐] 레조시놀 디포스페이트를 제조하였다.Tetrakis [2,6-dimethylphenyl] resorcinol diphosphate was prepared according to US Pat. No. 5,420,327.
상기 실시예 1 및 2 그리고 비교예 1 및 2에서 제조한 각각의 난연제 10중량부를 방향족 폴리카보네이트 90중량부 및 ABS 10중량부와 혼합한 후 트윈스크류 압출기를 이용하여 실린더 온도를 230∼260℃로 유지하여 압출한 다음 다이에 걸어 압출된 침상물질을 냉각시킨 후 절단하여 펠렛 상으로 얻었고 240∼260℃에서 사출하여 시편을 제작하였다.10 parts by weight of each of the flame retardants prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were mixed with 90 parts by weight of aromatic polycarbonate and 10 parts by weight of ABS, and then the cylinder temperature was adjusted to 230 to 260 ° C. using a twin screw extruder. After extruding, the pellet was cooled and cut to obtain a pellet. The specimen was prepared by injection at 240 to 260 ° C.
상기와 같이 제작된 시편에 대하여 난연성 시험을 한 결과를 표 1에 나타내었다.Table 1 shows the results of the flame retardancy test on the specimen prepared as described above.
[표 1]TABLE 1
상기의 표 1과 같이 본 발명에 의하여 제조된 난연제인 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]레조시놀 디포스페이트 화합물 및 비스[2,4-비스(1,1-디메틸에틸)페닐-2,6-디메틸페닐]히드로퀴논 디포스페이트 화합물은 비교예로 사용된 트리페닐포스페이트 및 공지의 방향족 디포스페이트 인계 난연제보다 열변형온도가 높으며 충격강도 및 인장강도가 높기 때문에 난연성 및 내열성이 우수한 난연제로 유용하게 사용될 수 있다.Bis [2,4-bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] resorcinol diphosphate compound and bis [2,4, which are flame retardants prepared according to the present invention as shown in Table 1 above The -bis (1,1-dimethylethyl) phenyl-2,6-dimethylphenyl] hydroquinone diphosphate compound has a higher heat deformation temperature than the triphenyl phosphate and the known aromatic diphosphate phosphorus flame retardant used as a comparative example, and the impact strength and tensile Because of its high strength, it can be usefully used as a flame retardant having excellent flame resistance and heat resistance.
본 발명에 의한 방향족 디포스페이트 인계 난연제는 난연성뿐만 아니라 내열성이 특히 우수하여 폴리카보네이트 수지, ABS 수지, 스틸렌계 공중합체, 폴리올레핀 수지 등에 난연제로 사용될 수 있다.The aromatic diphosphate phosphorus-based flame retardant according to the present invention can be used as a flame retardant in polycarbonate resin, ABS resin, styrene copolymer, polyolefin resin and the like because it is particularly excellent in heat resistance as well as flame retardancy.
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