KR19980072415A - Lead frame, its manufacturing apparatus and manufacturing method - Google Patents
Lead frame, its manufacturing apparatus and manufacturing method Download PDFInfo
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- KR19980072415A KR19980072415A KR1019970007249A KR19970007249A KR19980072415A KR 19980072415 A KR19980072415 A KR 19980072415A KR 1019970007249 A KR1019970007249 A KR 1019970007249A KR 19970007249 A KR19970007249 A KR 19970007249A KR 19980072415 A KR19980072415 A KR 19980072415A
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- lead frame
- die pad
- die
- reinforcing plate
- manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
반도체칩에 사용되는 리드프레임과 그 제조장치 및 그 제조방법에 관한 내용이 개시되어 있다. 리드프레임은 다이패드의 적어도 일측면에 다이패드를 보강하는 보강판이 설치된 점에 특징이 있으며, 리드프레임 제조장치는 보강판이 삽입되는 삽입홈이 다이에 형성된 점에 특징이 있으며, 리드프레임 제조방법은 다이패드를 다운ㅅ할 때 보강판을 다이패드에 부착하는 단계에 특징이 있다. 이와 같은 특징으로 갖는 본 발명은 제조장치를 경제적으로 제공할 수 있으며, 제조방법이 경제이며, 이러한 제조방법 및 제조장치에 의하여 생성된 다이패드는 평탄하다. 따라서, 반도체칩의 미스본딩과 패키지 크랙 등의 문제점을 줄일 수 있다.Disclosed are a lead frame used in a semiconductor chip, a manufacturing apparatus thereof, and a method of manufacturing the same. The lead frame is characterized in that a reinforcement plate is installed on the at least one side of the die pad to reinforce the die pad, the lead frame manufacturing apparatus is characterized in that the insertion groove into which the reinforcement plate is inserted is formed in the die, the lead frame manufacturing method It is characterized by the step of attaching the reinforcement plate to the die pad when the die pad is downloaded. The present invention having such a feature can economically provide a manufacturing apparatus, the manufacturing method is economical, and the die pad produced by the manufacturing method and the manufacturing apparatus is flat. Therefore, problems such as misbonding and package cracking of semiconductor chips can be reduced.
Description
본 발명은 리드프레임과 그 제조장치 및 그 제조 방법에 관한 것으로, 더 상세하게는 반도체칩에 사용되는 리드프레임과 그 제조장치 및 그 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame, a manufacturing apparatus thereof, and a manufacturing method thereof, and more particularly, to a lead frame used in a semiconductor chip, a manufacturing apparatus thereof, and a manufacturing method thereof.
1985년경에는 100핀이 넘는 리드프레임은 제조되지 않았으나, 1989년경에는 160핀 또는 208핀의 내부리드를 갖는 리드프레임이 제조되었다. 최근에는 반도체칩의 고집적화, 박형화 그리고 소형화 추세에 따라 304핀 이상의 내부리드를 갖는 리드프레임이 개발되고 있다. 이와 같이 내부리드의 수가 많아진다는 것은 내부리드의 선단밀도가 높아지는 것을 의미하며, 내부리드의 선단밀도가 높아지면 IC칩에 형성된 각 단자와 각 내부리드를 와이어본딩하기가 어렵게 된다. 따라서, 평탄도가 좋은 안정된 품질의 리드프레임의 생산이 요구된다.By 1985, leadframes of more than 100 pins were not manufactured. By 1989, leadframes with internal leads of 160 or 208 pins were manufactured. Recently, according to the trend of high integration, thinning, and miniaturization of semiconductor chips, lead frames having internal leads of more than 304 pins have been developed. As the number of internal leads increases, the tip density of the internal leads increases, and when the tip density of the internal leads increases, it becomes difficult to wire-bond each terminal formed on the IC chip and each internal lead. Therefore, production of a lead frame of stable quality with good flatness is required.
도 1에 도시된 바와 같이, 반도체칩은 리드프레임(10:lead frame), IC칩(20), 본딩와이어(30:bonding wire) 그리고 패키지(40:package)를 포함하여 구성된다. 리드프레임(10)은 IC칩(20)과 외부회로(미도시)를 연결하는 전선(lead) 역할과 반도체칩을 회로기판(미도시)에 고정시키는 버팀대(frame) 역할을 한다. 그리고, 패키지(40)는 외부의 충격 및 자기장 등으로부터 IC칩(20)의 회로를 보호하고, 반도체칩이 최적의 상태에서 본래의 기능을 할 수 있도록 내부적 환경을 보호하기 위하여 리드프레임(10)의 일부와 본딩와이어(30) 그리고 IC칩(20) 등을 감싸는 역할을 한다.As shown in FIG. 1, the semiconductor chip includes a lead frame 10, an IC chip 20, a bonding wire 30, and a package 40. The lead frame 10 serves as a lead for connecting the IC chip 20 and an external circuit (not shown) and a frame for fixing the semiconductor chip to a circuit board (not shown). In addition, the package 40 protects the circuit of the IC chip 20 from external shocks and magnetic fields, and the lead frame 10 to protect the internal environment so that the semiconductor chip can function in an optimal state. A portion of the bonding wire 30 and the IC chip 20 and the like serves to wrap.
리드프레임(10)의 제조방식에는 금형으로 제조하는 스템핑(stamping)방식과, 패턴(pattern)노광으로 제조하는 에칭(etching)방식이 있다. 이러한 제조방식에 의한 리드프레임(10) 제조공정에는 리드프레임(10)의 일부를 디프레스(depress)하는 다운ㅅ(down set)공정이 있다.The manufacturing method of the lead frame 10 includes a stamping method manufactured by a mold and an etching method manufactured by pattern exposure. The manufacturing method of the lead frame 10 according to the manufacturing method includes a down set process of depressing a part of the lead frame 10.
다운ㅅ공정은 소성변형장치에 의하여 이루어진다. 도 1a도를 참조하면, 상기 소성변형장치는 미리 정해진 모양이 파여진 다이(51)와, 리드프레임(10)을 다이(51) 위에 눌러 고정시키는 스트리퍼(52:stripper)와, 스트리퍼(52) 사이에 설치되며 리드프레임(10)을 소성변형시키는 다이(51)와 상보형인 펀치(52:punch)를 구비하여 리드프레임(10)을 다이(51)의 모양으로 소성변형시킨다.The down process is performed by plastic deformation device. Referring to FIG. 1A, the plastic deformation apparatus includes a die 51 having a predetermined shape, a stripper 52 for pressing and fixing the lead frame 10 onto the die 51, and a stripper 52. The lead frame 10 is plastically deformed in the shape of the die 51 by being provided between the die 51 and the complementary punch 52 (punch) for plastic deformation of the lead frame 10.
이와 같은 구비되는 종래의 리드프레임 제조장치 중 하나인 소성변형장치는 다음과 같이 리드프레임(10)을 소성변형시킨다. 도 1b를 참조하면, 스트리퍼(52)는 다이(51) 위에 위치된 리드프레임(10)을 다이(51) 위에 눌러 고정시킨다. 그리고 도 1c도를 참조하면, 펀치(53)가 리드프레임(10)의 리드프레임(10)을 눌러 다이(51)의 모양으로 소성변형시킨다.The plastic deformation apparatus, which is one of the conventional lead frame manufacturing apparatuses provided as described above, plastically deforms the lead frame 10 as follows. Referring to FIG. 1B, the stripper 52 presses and fixes the leadframe 10 positioned on the die 51 over the die 51. 1C, the punch 53 presses the lead frame 10 of the lead frame 10 to plastically deform into the shape of the die 51.
이와 같이, 스트리퍼(52)가 리드프레임(10)의 양측을 다이(51)의 가장자리에 고정시킨 상태에서 펀치(53)가 스트리퍼(52) 사이의 리드프레임(10)을 다이(51) 위에 누르면 상기 리드프레임(10)이 늘어나면서 다이(51)의 모양과 같은 모양으로 소성변형되며, 리드프레임(10)의 다이패드(11:die pad)는 다운ㅅ된다.As such, when the stripper 52 fixes both sides of the lead frame 10 to the edge of the die 51, the punch 53 presses the lead frame 10 between the strippers 52 onto the die 51. As the lead frame 10 is extended, plastic deformation is performed in the same shape as that of the die 51, and the die pad 11 of the lead frame 10 is down.
상술한 바와 같은 다운ㅅ공정에서는 다이패드(11)의 평탄도가 좋지 않다. 도 1을 참조하면, IC칩(20)이 다이패드(11)에 평탄하게 놓여지지 않아 미스본딩(miss bonding)이 발생되며, 패키지(40)에 크랙이 발생되는 문제점이 있다.In the down process as described above, the flatness of the die pad 11 is not good. Referring to FIG. 1, the IC chip 20 is not placed flat on the die pad 11 so that miss bonding occurs and cracks occur in the package 40.
본 발명의 기술적 과제는 다이패드에 보강판이 부착된 리드프레임을 제조하는 제조장치와, 다이패드에 보강판을 부착하는 제조방법을 경제적으로 제공하며, 다이패드의 평탄도가 향상된 리드프레임을 제공하는데 있다.The technical problem of the present invention is to provide a manufacturing apparatus for manufacturing a lead frame with a reinforcing plate attached to the die pad, and a manufacturing method for attaching the reinforcing plate to the die pad economically, to provide a lead frame with improved flatness of the die pad have.
도 1은 종래의 리드프레임이 설치된 반도체칩 단면도이다.1 is a cross-sectional view of a semiconductor chip in which a conventional lead frame is installed.
도 2a는 종래의 소정변형장치의 단면도이다.2A is a cross-sectional view of a conventional predetermined deformation apparatus.
도 2b는 도 2a의 스트리퍼가 리드프레임을 다이 위에 고정한 상태를 도시한 단면도이다.FIG. 2B is a cross-sectional view illustrating a state in which the stripper of FIG. 2A fixes the lead frame on the die. FIG.
도 2c는 도 2b의 펀치가 리드프레임을 소성변형시키는 상태를 도시한 단면도이다.2C is a cross-sectional view illustrating a state in which the punch of FIG. 2B plastically deforms the lead frame.
도 3은 본 발명의 리드프레임이 설치된 반도체칩 단면도이다.3 is a cross-sectional view of a semiconductor chip provided with a lead frame of the present invention.
도 4는 본 발명의 다이패드와 보강판을 분리하여 도시한 분리 사시도이다.4 is an exploded perspective view illustrating the die pad and the reinforcing plate of the present invention separately.
도 5a는 본 발명의 보강판에 돌기를 형성하는 상태를 도시한 단면도이다.Figure 5a is a cross-sectional view showing a state of forming a projection on the reinforcing plate of the present invention.
도 5b는 본 발명의 보강판을 절단하는 상태를 도시한 단면도이다.5B is a cross-sectional view showing a state of cutting the reinforcing plate of the present invention.
도 6a는 본 발명의 리드프레임 제조장치의 단면도이다.Figure 6a is a cross-sectional view of the lead frame manufacturing apparatus of the present invention.
도 6b는 도 6a의 스트리퍼가 리드프레임을 다이 위에 고정한 상태를 도시한 단면도이다.6B is a cross-sectional view illustrating a state in which the stripper of FIG. 6A fixes the lead frame on the die.
도 6c는 도 6b의 리드프레임이 펀치에 의하여 소성변형되면서 보강판이 부착되는 상태를 도시한 단면도이다.6C is a cross-sectional view illustrating a state in which the reinforcing plate is attached while the lead frame of FIG. 6B is plastically deformed by a punch.
도 7은 다이패드에 보강판이 설치된 상태를 도시한 일부 절제 단면도이다.7 is a partial cross-sectional view illustrating a state in which a reinforcement plate is installed on a die pad.
도면의 주요부분에 대한 부호 설명Explanation of symbols for the main parts of the drawings
20...IC칩21...접착제20 IC chip 21 Adhesive
30...본딩와이어 40...패키지30 ... bonding wire 40 ... package
51'...다이 52...스트리퍼51 '... Die 52 ... Stripper
53...펀치60...리드프레임53 ... punch 60 ... lead frame
61...다이패드62...압입구멍61.Diap 62.Indentation hole
65...보강판 66...압입돌기65.Reinforcement plate 66 ... Indentation protrusion
67....보강판삽입홈67 .... Reinforcement plate insert groove
본 발명에 따른 리드프레임은 : IC칩과 본딩와이어에 의하여 연결되는 리드와, 상기 리드로부터 다운ㅅ되어 IC칩이 설치되는 다이패드를 구비하는 리드프레임에 있어서, 상기 다이패드의 적어도 일측면에 고정되어 상기 다이패드를 보강하는 보강판을 구비하는 것을 특징으로 한다.According to the present invention, a lead frame includes: a lead frame including an IC chip and a lead connected by a bonding wire, and a die pad downloaded from the lead and installed with the IC chip, the lead frame being fixed to at least one side of the die pad And a reinforcing plate for reinforcing the die pad.
그리고, 본 발명에서, 압입구멍이 형성된 상기 다이패드와, 상기 압입구멍에 압입되는 압입돌기가 형성된 상기 보강판을 구비하여, 상기 압입구멍에 상기 압입돌기가 압입됨에 따라 상기 보강판이 상기 다이패드에 고정되는 것이 바람직하다.In the present invention, the die pad having a press-in hole is formed, and the reinforcement plate is formed with a press-in protrusion formed in the press-in hole. It is preferable to be fixed.
그리고, 본 발명에서, 상기 압입돌기의 높이는 상기 압입구멍의 깊이보다 작은 것이 바람직하다.In the present invention, the height of the indentation protrusion is preferably smaller than the depth of the indentation hole.
본 발명에 따른 리드프레임 제조장치는 : 소정 모양으로 패턴이 형성된 리드프레임의 다이패드를 다운ㅅ시키기 위한 모양의 다이와, 상기 리드프레임을 상기 다이 위에 눌러 고정시키는 스트리퍼와, 상기 스트리퍼에 의하여 고정된 나머지 부분의 리드프레임을 상기 다이 위에 눌러 소성변형시키는 펀치를 구비하는 리드프레임 제조장치에 있어서, 상기 다이에 보강판이 삽입되는 보강판홈이 형성되어 상기 펀치가 상기 리드프레임을 눌러 소성변형시킬 때 상기 보강판홈에 삽입된 보강판이 상기 다이패드에 고정되는 것을 특징으로 한다.Lead frame manufacturing apparatus according to the present invention comprises: a die of the shape to download the die pad of the lead frame is a pattern formed in a predetermined shape, a stripper for pressing and fixing the lead frame on the die, and the rest fixed by the stripper A lead frame manufacturing apparatus comprising a punch for pressing a portion of the lead frame onto the die to plastically deform, wherein the reinforcing plate groove is formed in the die to insert a reinforcing plate so that the punch is pressed against the lead frame to deform the plastic. A reinforcement plate inserted in the die pad is fixed.
본 발명에 따른 리드프레임 제조방법 : 소정의 패턴과 함께 다이패드가 될 리드프레임에 적어도 하나의 구멍이 형성되는 패턴형성단계와, 상기 다이패드에 부착 고정되는 보강판에 상기 구멍에 대응되도록 돌출된 압입돌기가 형성되는 돌기형성단계와, 상기 소정의 패턴이 형성된 리드프레임이 다운ㅅ되면서 상기 보강판이 상기 다이패드에 부착되는 부착단계를 포함하는 것을 특징으로 한다.Lead frame manufacturing method according to the invention: a pattern forming step of forming at least one hole in the lead frame to be a die pad with a predetermined pattern, and protruding to correspond to the hole in the reinforcing plate attached to the die pad And a protrusion forming step of forming an indentation protrusion, and an attaching step of attaching the reinforcement plate to the die pad while the lead frame on which the predetermined pattern is formed is down.
이와 같은 특징으로 갖는 본 발명에 따른 리드프레임과 그 제조장치 및 그 제조방법은 리드프레임의 다이패드를 평탄하게 할 수 있어, 미스본딩과 패키지 크랙 등의 문제점을 줄일 수 있다.The lead frame according to the present invention having such a feature, a manufacturing apparatus thereof, and a method of manufacturing the same can flatten the die pad of the lead frame, thereby reducing problems such as misbonding and package cracking.
이하 첨부된 도면을 참조하면서 본 발명에 따른 리드프레임과 그 제조장치 및 그 제조방법의 바람직한 실시예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of a lead frame, a manufacturing apparatus and a manufacturing method according to the present invention.
도 3을 참조하면, 리드프레임(60)의 다이패드(61) 상측면에는 IC칩(20)이 접착제(21)에 의하여 고정되어 있으며, 다이패드(61)의 하측면에는 보강판(65)이 고정되어 있다. IC칩(20)은 본딩와이어(30)에 의하여 리드프레임(60)에 연결되어 있으며, 리드프레임(60)의 일부와 상기 IC칩(20), 본딩와이어(30), 보강판(65), 접착제(21)는 패키지(40)에 의하여 싸여 있다.Referring to FIG. 3, the IC chip 20 is fixed to the upper side of the die pad 61 of the lead frame 60 by the adhesive 21, and the reinforcement plate 65 is disposed on the lower side of the die pad 61. Is fixed. The IC chip 20 is connected to the lead frame 60 by a bonding wire 30, and a part of the lead frame 60, the IC chip 20, the bonding wire 30, the reinforcing plate 65, The adhesive 21 is wrapped by the package 40.
상술한 바와 같이, 본 발명의 리드프레임(60)은 종래의 리드프레임(10:도1참조)과는 달리 보강판(65)을 갖는 점에 가장 큰 특징이 있다. 상기 보강판(65)은 얇은 다이패드(61)를 보강하여 다이패드(61)가 편편하도록 한다. 잘 알려진 바와 같이, 다이패드(61)가 편편하면 패키지(40)에 발생되는 균열이 줄어들며, IC칩(20)이 다이패드(61) 위에 평탄하게 위치됨으로 미스본딩이 줄어든다.As described above, the lead frame 60 of the present invention has the greatest feature in that it has a reinforcing plate 65, unlike the conventional lead frame 10 (see FIG. 1). The reinforcement plate 65 reinforces the thin die pad 61 so that the die pad 61 is knitted. As is well known, when the die pad 61 is flattened, cracks generated in the package 40 are reduced, and misbonding is reduced because the IC chip 20 is positioned flat on the die pad 61.
도 4에 도시된 바와 같이, 리드프레임(60)의 다이패드(61)에는 압입구멍(62)이 형성되어 있으며, 보강판(65)에는 압입구멍(62)에 대응되는 압입돌기(66)가 형성되어 있다. 압입돌기(66)의 돌출 두께는 압입구멍(62)의 두께보다 작다. 따라서, 도 7에 도시된 바와 같이, 보강판(65)의 압입돌기(66)가 압입구멍(62)에 압입됨에 따라 보강판(65)이 다이패드(61)에 고정되고, 압입돌기(66)는 다이패드(61)의 압입구멍(62) 내부에 위치된다.As shown in FIG. 4, the indentation hole 62 is formed in the die pad 61 of the lead frame 60, and the indentation protrusion 66 corresponding to the indentation hole 62 is formed in the reinforcing plate 65. Formed. The protruding thickness of the indentation protrusion 66 is smaller than the thickness of the indentation hole 62. Therefore, as shown in FIG. 7, as the indentation protrusion 66 of the reinforcement plate 65 is press-fitted into the indentation hole 62, the reinforcement plate 65 is fixed to the die pad 61 and the indentation protrusion 66. ) Is located inside the press-in hole 62 of the die pad 61.
도 5a 및 도 5b에 도시된 바와 같이, 보강판(65)에는 돌출부가 형성된 보강판다이(72)와 오목부가 형성된 보강판펀치(71)로 이루어진 프레스에 의하여 압입돌기(66)가 형성된다. 그리고 상기 보강판(65)은 압입돌기(66)가 형성된 다음에 상기 다이패드(61:도 4참조)의 모양과 상보형으로 절단되어 마련되는 것이 바람직하다.5A and 5B, the indentation protrusion 66 is formed on the reinforcing plate 65 by a press including a reinforcing plate die 72 having a protrusion and a reinforcing plate punch 71 having a recess. The reinforcement plate 65 is preferably formed by cutting the die pad 61 (see FIG. 4) into a shape and complementary shape after the indentation protrusion 66 is formed.
잘 알려진 바와 같이, 리드프레임(60)의 제조방식에는 금형으로 제조하는 스템핑방식과, 패턴노광으로 제조하는 에칭방식이 있다. 스템핑방식을 예로 들어 살펴보면, 스템핑방식에는 동판을 미리 정해진 모양으로 스템핑(stamping)하는 단계와, 리드프레임(60)의 다이패드(61)를 디프레스하는 다운ㅅ단계가 있다.As is well known, the manufacturing method of the lead frame 60 includes a stamping method manufactured by a mold and an etching method manufactured by pattern exposure. Taking the stamping method as an example, the stamping method includes stamping a copper plate into a predetermined shape, and a down step of depressing the die pad 61 of the lead frame 60.
도 3 및 도 4를 참조하면, 본 발명에 따른 리드프레임 제조방법의 스탬핑단계는 종래의 리드프레임 제조방법의 스탬핑단계와는 달리 동판을 스탬핑할 때 다이패드(61)가 될 부분에 압입구멍(62)이 함께 형성되는 점에 특징이 있으며, 본 발명의 다운ㅅ단계는 종래의 다운ㅅ단계와는 달리 상기 보강판(65)을 부착하는 단계가 동시에 이루어지는 점에 특징이 있다.3 and 4, the stamping step of the lead frame manufacturing method according to the present invention, unlike the stamping step of the conventional lead frame manufacturing method, when stamping the copper plate in the portion to be a die pad (61) 62) is characterized in that it is formed together, the down step of the present invention is characterized in that the step of attaching the reinforcing plate 65 is made at the same time unlike the conventional down step.
상기 본 발명에 따른 다운ㅅ단계는 본 발명에 따른 리드프레임 제조장치에 의하여 이루어진다. 잘 알려진 바와 같이, 리드프레임 제조장치에는 여러 가지 종류의 제조장치가 많이 있으나, 본 명세서에서는 리드프레임을 다운ㅅ하는 소성변형장치를 말한다.The down step according to the present invention is made by the lead frame manufacturing apparatus according to the present invention. As is well known, there are many types of manufacturing apparatuses in the lead frame manufacturing apparatus, but in the present specification, it refers to a plastic deformation apparatus for downloading the lead frame.
도 6a를 참조하면, 본 발명에 따른 리드프레임 제조장치는 다이(51'), 스트리퍼(52) 그리고 펀치(53)를 포함하여 구성된다. 다이(51')에는 보강판삽입홈(67)이 형성되어 있으며, 이 보강판삽입홈(67)에는 보강판이 삽입된다. 그리고, 다이(51') 위에는 리드프레임(60)을 다이(51') 위에 눌러 고정시키는 스트리퍼(52)와, 스트리퍼(52) 사이에 설치되며 다이(51')와 상보형인 펀치(53)가 설치된다.Referring to FIG. 6A, a lead frame manufacturing apparatus according to the present invention includes a die 51 ′, a stripper 52, and a punch 53. A reinforcement plate insertion groove 67 is formed in the die 51 ', and a reinforcement plate is inserted into the reinforcement plate insertion groove 67. On the die 51 ', a stripper 52 for pressing and fixing the lead frame 60 on the die 51' and a punch 53 provided between the stripper 52 and complementary to the die 51 'are provided. Is installed.
이와 같은 본 발명에 따른 리드프레임 제조장치는 다음과 같이 리드프레임(60)을 소성변형시키면서 보강판(65)을 다이패드(61)에 고정시킨다. 도 6b 및 도 6c를 참조하면, 스트리퍼(52)는 다이(51') 위에 위치된 리드프레임(60)을 다이(51') 위에 눌러 고정시킨다. 그리고 펀치(53)가 리드프레임(60)을 눌러 리드프레임(60)을 다이(51') 모양으로 소성변형시킬 때 상기 보강판(65)의 돌출부(66)가 다이패드(61)에 형성된 압입구멍(62)에 압입되어 보강판(65)이 다이패드(61)에 고정된다.The lead frame manufacturing apparatus according to the present invention as described above secures the reinforcement plate 65 to the die pad 61 while plastically deforming the lead frame 60 as follows. 6B and 6C, the stripper 52 presses and fixes the leadframe 60 positioned on the die 51 ′ over the die 51 ′. When the punch 53 presses the lead frame 60 to plastically deform the lead frame 60 into a die 51 'shape, the protrusion 66 of the reinforcement plate 65 is press-fitted in the die pad 61. The reinforcing plate 65 is fixed to the die pad 61 by being pressed into the hole 62.
첨부된 참조 도면에 의해 설명된 본 발명의 바람직한 실시예는 단지 일 실시예에 불과하다. 당해 기술 분야에 통상의 지식을 가진 자라면 본 발명의 바람직한 실시예를 충분히 이해하여 유사한 형태의 리드프레임과 그 제조장치 및 그 제조방법을 구현할 수 있을 것이다.The preferred embodiment of the present invention described by the accompanying reference drawings is only one embodiment. Those skilled in the art will fully understand the preferred embodiments of the present invention to implement a similar type leadframe, its manufacturing apparatus, and its manufacturing method.
따라서 본 발명의 진정한 기술적 보호 범위는 상술한 기술적 사상에 의한 특허청구범위에 의해 정해져야 할 것이다.Therefore, the true technical protection scope of the present invention will be defined by the claims by the technical spirit described above.
보강판이 부착된 리드프레임을 제조하는 본 발명의 제조방법은 새로운 공정이 추가되지 않아 경제적이며, 본 발명의 제조장치는 종래의 제조장치에 보강판 삽입홈을 형성하여 사용함으로 경제적이다. 그리고, 다이패드의 평탄도가 향상되어 패키지에 발생되는 크랙이 감소되며, 미스본딩이 줄어든다.The manufacturing method of the present invention for producing a lead frame with a reinforcing plate is economical because a new process is not added, and the manufacturing apparatus of the present invention is economical by forming a reinforcing plate insertion groove in a conventional manufacturing apparatus. In addition, since the flatness of the die pad is improved, cracks generated in the package are reduced, and misbonding is reduced.
Claims (6)
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