KR19980027861A - Lead bend forming device - Google Patents

Abstract

An upper mold having recesses of a predetermined shape so that the semiconductor chip package into which the leads are bent may be inserted; A lower mold on which the semiconductor chip package is seated; In the lead bending molding apparatus of a semiconductor chip package having a plurality of bends, a plurality of bending means which is operated by a rotational force to a position that can be inserted into the groove of the upper mold to guide the bending of the lead is mechanically coupled to the lower mold By providing a lead bending forming apparatus, it is possible to prevent a defect generated in a lead, such as scratching or plating plating, generated in the lead bending forming process, thereby improving the reliability of the semiconductor chip package.

Description

Lead bend forming device

The present invention relates to a lead bending molding apparatus, and more particularly, to a lead bending molding apparatus capable of bending molding a lead using a rolling friction by a roller.

The lead of the semiconductor chip package is tin soldered and palladium plated on the surface of the package to improve protection and bonding from the external environment in response to changes in the external environment. In addition, the lead is subjected to a lead forming process in various forms depending on the module mounting form. Next, the lead forming process will be described.

The lead forming process is a process proceeding to the next step of the mold process and the lead cutting process, which is one of the final processes of semiconductor assembly in the manufacturing process of the semiconductor chip package. In general, the lead shape varies according to the package type, and the process is complicated because the lead lead molded into a J shape in the PLCC (PLASTIC LEADED CHIP CARRIER) and SOJ (Small Outline J-bend Package). It is vulnerable to external stress.

1 to 3 are package state diagrams for explaining the lead bending forming process.

Referring to FIGS. 1 to 3, in order to have a J-shape, unlike a general lead bending forming process, there are usually five bending forming steps although there are some differences. 1 is a state in which the lead 12 is cut to an appropriate length and ready to bend. First, the front end of the lead 12 is bent in the first bending step, and the second end is bent to about 45 degrees while the tip of the lead 12 is restrained by pressing the lead. In the third bending step, the lead 12 is bent to 90 degrees while removing the restraint. In the fourth and fifth bending steps, when a load is applied to the end of the lead 12 and the tip of the lead 12 is pressed into the mold to bend in a J shape, the lead molding is completed as shown in FIG. 3 in the shape of FIG. 2. do.

In the fourth and fifth steps of the bending process, the lead bending forming apparatus including the upper mold and the lower mold is used.

4 is a cross-sectional view showing a state in which the outer lead of the package is bent using the lead bend forming apparatus according to the prior art. Referring to FIG. 4, the lead bending apparatus 100 according to the related art includes an upper mold 60 for pressing the lead 12 of the semiconductor chip package 10 and a lower mold 80 on which the semiconductor chip package 10 is mounted. Has

The upper mold 60 consists of a cover 62 and a body 64. The body 64 is formed with a first groove 66 and a second groove 68 in a predetermined shape, the spring 70 is embedded in the first groove 66, the spring 70 is One side is supported by the cover 62. The other side of the spring 70 is in contact with one side of the push pin 72 is inserted into the first groove 66 of the body 64 to enable flow along the first groove 66. The other side of the push pin 72 is fastened to the eject pin 74 by screwing. The lower mold 80 is a portion on which the semiconductor chip package 10 to be bent is seated, and a portion on which the lead 12 is seated has a shape of a recess 82.

Looking at the operation of the bending molding apparatus, the ejection pin (in the state in which the upper die 60 is vertically lowered in the direction of the lower die 80, the semiconductor chip package is inserted into the second groove 68 of the upper die 60) 74 presses the upper surface of the semiconductor chip package 10. At this time, the lead 12 is supported by the lower die 80, the end portion is supported, and the progression in the state that the upper die 60 is supported so that the lead 12 does not escape to the outside. As shown in the enlarged portion of the portion where the lead 12 and the lower mold 80 are in contact with each other, the lead 12 is forced vertically downward by the force F1 applied to the semiconductor chip package 10. The end of the lead 12 is bent along the surface of the groove 82 of the lower mold. The force F1 acts as a basis of the force acting vertically to have a lead shape, and the force F2 is a force bending along the recess 82 of the lower mold 80 to the shape of the lead.

In the lead bending forming by the lead bending forming apparatus as described above, an area friction between the lead and the lower mold is performed, and a phenomenon in which the plating layer plated on the lead is cut or scratched occurs. Such chipping or scratching of the plating layer causes a weakening of the bonding and lead damage from the external environment.

Accordingly, an object of the present invention is to provide a lead bending molding apparatus that can minimize the occurrence of lead plating layer clipping or scratches generated in the lead bending process.

1 to 3 are package state diagrams for explaining the lead bending forming process.

4 is a cross-sectional view showing a state in which the outer lead of the package is bent using the lead bending forming apparatus according to the prior art.

5 is a cross-sectional view showing a state in which the outer lead of the package is bent using the lead bend forming apparatus according to the present invention.

Explanation of symbols for the main parts of the drawings

10 semiconductor chip package 12 lead

20,100: bending molding apparatus 30,60: upper mold

32,62: cover 34,64: body

36,38,52: groove 40,70: spring

42,72: Push pin 44,74: Eject pin

50,80: lower mold 52: shaft

54: roller

Lead bending molding apparatus according to the present invention for achieving the above object is an upper mold having a groove of a predetermined shape so that the semiconductor chip package to be bent lead is inserted; A lower mold on which the semiconductor chip package is seated; In the lead bending molding apparatus of a semiconductor chip package having a plurality of bends, a plurality of bending means for guiding the bending of the lead is operated by a rotational force at a position that can be inserted into the groove of the upper mold is mechanically coupled to the lower mold It is characterized by being.

Hereinafter, a lead bending forming apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

5 is a cross-sectional view showing a state in which the outer lead of the package is bent using the lead bend forming apparatus according to the present invention.

Referring to FIG. 5, a roller 54 coupled to the shaft 52 is coupled to an upper portion of the lower mold 50. The position of the roller 54 is a position at which the distal end of the lid 12 is in contact, and is a position that can be inserted into the groove 38 of the upper mold 30 when the upper mold 30 is lowered. The roller 54 coupled to the lower mold 50 may be operated in the inward direction (arrow direction in FIG. 5) by the rotation of the shaft 52 coupled to penetrate the center of the roller 54. Since the upper mold 30 is the same as the conventional bending molding apparatus described above, the description thereof will be omitted.

The upper mold 30 descends in the vertical downward direction with the semiconductor chip package 10 seated on the roller 54 of the lower mold 50. The semiconductor chip package 10 is positioned in the groove 38 of the vertically lowered upper mold 30. While the eject pin 44 is in contact with the semiconductor chip package 10, the spring 40 is compressed by a force acting in the vertical downward direction to press the semiconductor chip package 10. In a state in which the lid 12 is supported by the groove 38 of the upper mold 30 so as not to be moved outward, the roller 54 rotates in the direction of the arrow to bend the lid 12. If the upper die 30 continuously moves in the vertical downward direction while the roller 54 is rotated, the lid 12 is finally bent. When the bending is completed, the roller 54 stops the operation and the upper mold 30 is raised. When the upper mold 30 is raised, the semiconductor chip package 10 inserted into the recess 38 of the upper mold 30 by the eject pin 44 operated by the restoring force of the spring 40 is the upper mold 30. Is separated from.

As one embodiment of the lead bending forming apparatus described above, the bending forming apparatus having the bending means operated by a rotational force such as a roller applies a frictional friction due to the rotational force, so that the amount of stress applied to the lead can be minimized.

Therefore, according to the structure according to the present invention, there is an advantage that can improve the reliability of the semiconductor chip package by preventing defects such as scratches generated in the lead bend forming process, such as the plating layer is cut.

Claims (2)

An upper mold having recesses of a predetermined shape so that the semiconductor chip package into which the leads are bent may be inserted; A lower mold on which the semiconductor chip package is seated; In the lead bending molding apparatus of a semiconductor chip package having a plurality of bends, a plurality of bending means for guiding the bending of the lead is operated by a rotational force at a position that can be inserted into the groove of the upper mold is mechanically coupled to the lower mold Lead bending molding apparatus, characterized in that there is. The lead bending forming apparatus according to claim 1, wherein the bending means is a roller.