KR19980022647U - Wafer Inspection Device - Google Patents
Wafer Inspection Device Download PDFInfo
- Publication number
- KR19980022647U KR19980022647U KR2019960036009U KR19960036009U KR19980022647U KR 19980022647 U KR19980022647 U KR 19980022647U KR 2019960036009 U KR2019960036009 U KR 2019960036009U KR 19960036009 U KR19960036009 U KR 19960036009U KR 19980022647 U KR19980022647 U KR 19980022647U
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- thickness
- robot arm
- sensing
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 고안은 웨이퍼의 외관을 자동으로 검사하는 웨이퍼 검사장치에 관한 것으로, 종래에는 웨이퍼의 외관을 육안 또는 현미경을 통하여 검사함으로써, 정밀도 및 검사속도가 감소하여 생산성이 감소하는 문제점이 있었다. 이러한 문제점을 감안한 본 고안은, 중앙처리부의 제어에 따라 웨이퍼의 위치이동을 위한 로봇팔을 구동하는 로봇팔 구동부와; 줌렌즈를 장착한 CCD 카메라 및 두께감지센서를 구비하여 웨이퍼의 외관검사와 두께측정을 하는 센싱박스와; 상기 센싱박스의 출력신호를 중앙처리부의 처리를 통해 화상으로 표시하는 모니터로 구성되어, 웨이퍼 전체를 빠르고 정확하게 검사할 수 있으며, 육안으로는 검사할 수 없는 폴리이미드 막 경화를 미실시한 웨이퍼를 검출할 수 있는 효과와, 웨이퍼의 두께를 측정하여 규격에 맞지 않는 웨이퍼를 선별할 수 있는 효과가 있다.The present invention relates to a wafer inspection apparatus for automatically inspecting the appearance of a wafer, and in the related art, by inspecting the appearance of a wafer through the naked eye or through a microscope, there has been a problem in that productivity is reduced due to a decrease in precision and inspection speed. The present invention in view of the above problems, the robot arm drive unit for driving the robot arm for the movement of the wafer under the control of the central processing unit; A sensing box including a CCD camera equipped with a zoom lens and a thickness sensor to inspect the wafer and measure the thickness of the wafer; The monitor is configured to display the output signal of the sensing box as an image through the processing of the central processing unit, so that the entire wafer can be inspected quickly and accurately, and the wafer that has not undergone polyimide film curing that cannot be inspected by the naked eye can be detected. There is an effect that can be, and by measuring the thickness of the wafer has the effect of selecting a wafer that does not meet the standard.
Description
본 고안은 웨이퍼 검사장치에 관한 것으로, 특히 웨이퍼의 외관을 자동으로 검사하는 웨이퍼 검사장치에 관한 것이다.The present invention relates to a wafer inspection apparatus, and more particularly to a wafer inspection apparatus for automatically inspecting the appearance of the wafer.
종래에는 웨이퍼 상부 또는 내부에 반도체 소자 및 시스템을 제조한 후, 웨이퍼의 두께를 제조규격에 맞도록 그 뒷면을 그라인딩(grinding)하며, 상기 그라인딩 후에 작업자는 웨이퍼의 깨짐, 금감, 이물질, 패드의 변색, 폴리이미드막 코팅(PIQ coating) 등의 제조 규격상의 이상 유무를 판단하기 위하여, 육안이나 현미경을 사용하여 웨이퍼의 외관을 관찰하였다. 또한, 패키지 공정의 첫 단계인 웨이퍼 프레임에 포일테이프를 사용하여 웨이퍼를 고정시키는 포일 마운트(FOIL MOUNT)공정시에, 웨이퍼 뒷면과 포일테이프의 접착계면에 이물질 또는 기포가 있는지 작업자가 육안으로 직접 확인하였다.Conventionally, after fabricating a semiconductor device and a system on or inside the wafer, grinding the back of the wafer to match the thickness of the wafer to meet the manufacturing specifications, the operator after the grinding cracks, gold, foreign matter, discoloration of the pad In order to judge the presence or absence of abnormalities in manufacturing standards such as polyimide film coating (PIQ coating), the appearance of the wafer was observed using the naked eye or a microscope. In addition, during the FOIL MOUNT process, which uses foil tape to fix the wafer to the wafer frame, which is the first step of the packaging process, the operator visually checks whether there is any foreign matter or bubbles on the adhesive interface between the back of the wafer and the foil tape. It was.
상기한 바와 같이 종래에는 작업자가 육안을 통하여 웨이퍼의 외관을 검사함으로써, 웨이퍼 전체를 정확하게 볼 수 없었고, 그 정밀도가 낮으며, 검사시간이 지연되어 생산성이 감소하는 문제점과, 웨이퍼의 두께를 측정하는 것이 불가능한 문제점이 있었다.As described above, when the operator inspects the appearance of the wafer through the naked eye, the entire wafer cannot be seen accurately, the accuracy is low, the inspection time is delayed, and the productivity is reduced, and the thickness of the wafer is measured. There was a problem that it was impossible.
상기의 문제점을 감안한 본 고안은, 정확하고 빠르게 웨이퍼의 외관검사 및 그 웨이퍼의 두께 측정이 가능한 웨이퍼 검사장치의 제공을 목적으로 한다.The present invention in view of the above problems is an object of the present invention to provide a wafer inspection apparatus capable of accurately and quickly inspecting the appearance of a wafer and measuring the thickness of the wafer.
도 1은 본 고안에 의한 웨이퍼 검사장치의 구성도.1 is a block diagram of a wafer inspection apparatus according to the present invention.
도 2는 도 1에 있어서, 웨이퍼를 검사하는 센싱박스를 도시한 도.FIG. 2 illustrates a sensing box for inspecting a wafer in FIG. 1.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1:중앙처리부.2:로봇팔구동부.1: central processing unit 2: robot arm driving unit.
3:로봇팔.3a:웨이퍼 유무 검출센서.3: Robot arm. 3a: Wafer presence sensor.
3b:집게.4a,4b:센싱박스.3b: tongs. 4a, 4b: sensing box.
5:모니터.6:웨이퍼 카세트.5: Monitor. 6: Wafer cassette.
7:웨이퍼.7: Wafer.
상기와 같은 목적은 웨이퍼를 자동으로 운반하는 운반수단과, 웨이퍼의 외관을 검사할 검사수단과, 상기 운반수단 및 검사수단을 제어하는 제어수단으로 구성함으로써 달성되는 것으로, 본 고안에 의한 웨이퍼 검사장치를 첨부한 도면을 참조하여 상세히 설명하면 다음과 같다.The above object is achieved by configuring a conveying means for automatically conveying a wafer, an inspecting means for inspecting the appearance of the wafer, and a control means for controlling the conveying means and the inspecting means. When described in detail with reference to the accompanying drawings as follows.
도 1은 본 고안에 의한 웨이퍼 검사장치의 구성도로서 이에 도시된 바와 같이 본 고안은, 중앙처리부(1)의 제어에 따라 웨이퍼(7)의 감지와 위치이동을 위한 로봇팔(3)을 구동시키는 로봇팔 구동부(2)와; 줌렌즈(zoom lenz)를 장착한 전하 결합 소자(이하, CCD) 카메라 및 두께감지센서를 구비하여 웨이퍼의 외관검사와 두께측정을 하는 센싱박스(4a),(4b)와; 상기 센싱박스(4a),(4b)의 출력신호를 중앙처리부(1)의 처리를 통해 화상으로 표시하는 모니터(5)로 구성된다. 이와 같이 구성된 웨이퍼 검사장치의 동작을 설명하면 다음과 같다.1 is a configuration diagram of a wafer inspection apparatus according to the present invention, as shown in the present invention, the robot arm 3 for detecting and shifting the position of the wafer 7 under the control of the central processing unit 1 is driven. Robot arm drive unit 2 and; Sensing boxes (4a) and (4b) having a charge coupled device (hereinafter referred to as CCD) camera and a thickness detecting sensor equipped with a zoom lens to inspect the wafer and measure the thickness of the wafer; And a monitor 5 for displaying the output signals of the sensing boxes 4a and 4b as images through the processing of the central processing unit 1. The operation of the wafer inspection apparatus configured as described above is as follows.
먼저, 중앙처리부(1)의 제어에 따라 로봇팔 구동부(2)는 로봇팔(3)을 구동시켜 웨이퍼 카세트(6)로 이동시킨다. 이때 로봇팔(3)에 구비된 웨이퍼 유무 검출 센서(3a)는 웨이퍼 카세트(6)에 장착된 웨이퍼(7)의 유무를 판단하여 그 판단신호를 중앙처리부(1)로 전달한다. 상기 판단신호를 입력받은 중앙처리부(1)는 그 판단신호에 따라 로봇팔 구동부(2)에 동작제어신호를 출력하고, 상기 동작제어신호를 입력받은 로봇팔 구동부(2)는 동작제어신호에 따라 로봇팔(3)에 구비된 집게(3b)를 사용하여 웨이퍼(7)를 집어 도 2에 도시한 바와 같이 센싱박스(4a),(4b)의 사이로 이동시킨다.First, under the control of the central processing unit 1, the robot arm driver 2 drives the robot arm 3 to move the wafer cassette 6. At this time, the wafer presence sensor 3a of the robot arm 3 determines the presence or absence of the wafer 7 mounted on the wafer cassette 6 and transmits the determination signal to the central processing unit 1. The central processing unit 1 receiving the determination signal outputs an operation control signal to the robot arm driver 2 according to the determination signal, and the robot arm driver 2 receiving the operation control signal according to the operation control signal. Using the tongs 3b provided in the robot arm 3, the wafer 7 is picked up and moved between the sensing boxes 4a and 4b as shown in FIG.
그 다음, 센싱박스(4a),(4b)는 상기 운반된 웨이퍼(7)를 줌렌즈를 장착한 CCD 카메라 및 두께감지센서를 사용하여 웨이퍼(7)의 표면과 두께를 감지한다. 이때, 운반된 웨이퍼 또는 센싱박스(4a),(4b)를 이동시키거나, 혹은 웨이퍼와 센싱박스(4a),(4b)를 이동시켜 검사되는 웨이퍼의 전체를 빠짐없이 검사한다. 검사후 이상이 없으면, 다음 웨이퍼를 검사하고 이상이 있으면 이를 표시한다. 또한, 센싱박스(4a),(4b)에 구비된 줌렌즈가 부착된 CCD 카메라 및 두께감지센서의 수를 늘려, 웨이퍼의 검사속도를 증가시킬 수 있다.Then, the sensing boxes 4a and 4b detect the surface and thickness of the wafer 7 by using a CCD camera and a thickness sensor equipped with a zoom lens. At this time, the conveyed wafer or the sensing boxes 4a and 4b are moved, or the wafer and the sensing boxes 4a and 4b are moved to inspect the entire wafer to be inspected. If there is no abnormality after the inspection, the next wafer is inspected and if there is an abnormality, it is indicated. In addition, by increasing the number of the CCD camera and the thickness sensor with the zoom lens provided in the sensing box (4a, 4b), it is possible to increase the inspection speed of the wafer.
그 다음, 상기의 동작으로 센싱박스(4a),(4b)에서 얻어진 정보는 중앙처리부(1)에서 처리되어 모니터(5)로 전달되고, 모니터(5)는 그 정보를 작업자가 알 수 있도록 표시하게 된다.Then, the information obtained from the sensing boxes 4a and 4b by the above operation is processed by the central processing unit 1 and transferred to the monitor 5, and the monitor 5 displays the information so that the operator can know it. Done.
상기한 바와 같이 본 고안은 웨이퍼 전체를 빠르고 정확하게 검사할 수 있으며, 육안으로는 검사할 수 없는 폴리이미드막 경화를 미실시한 웨이퍼를 검출할 수 있는 효과와, 웨이퍼의 두께를 측정하여 규격에 맞지 않는 웨이퍼를 선별할 수 있는 효과가 있다.As described above, the present invention can quickly and accurately inspect the entire wafer, and the effect of detecting a wafer without polyimide film curing which cannot be inspected by the naked eye, and measuring the thickness of the wafer does not meet the specification. There is an effect that can select the wafer.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960036009U KR19980022647U (en) | 1996-10-29 | 1996-10-29 | Wafer Inspection Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960036009U KR19980022647U (en) | 1996-10-29 | 1996-10-29 | Wafer Inspection Device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980022647U true KR19980022647U (en) | 1998-07-25 |
Family
ID=53980572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960036009U Ceased KR19980022647U (en) | 1996-10-29 | 1996-10-29 | Wafer Inspection Device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19980022647U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100714751B1 (en) * | 2005-08-24 | 2007-05-07 | 주식회사 디이엔티 | Automatic wafer inspection system |
| CN115383619A (en) * | 2021-05-06 | 2022-11-25 | 海太半导体（无锡）有限公司 | Automatic detection system of semiconductor wafer grinding equipment |
| US20240178022A1 (en) * | 2022-11-29 | 2024-05-30 | Applied Materials Israel Ltd. | Calculate wafers thickness out of wafer mapping process |
-
1996
- 1996-10-29 KR KR2019960036009U patent/KR19980022647U/en not_active Ceased
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100714751B1 (en) * | 2005-08-24 | 2007-05-07 | 주식회사 디이엔티 | Automatic wafer inspection system |
| CN115383619A (en) * | 2021-05-06 | 2022-11-25 | 海太半导体（无锡）有限公司 | Automatic detection system of semiconductor wafer grinding equipment |
| US20240178022A1 (en) * | 2022-11-29 | 2024-05-30 | Applied Materials Israel Ltd. | Calculate wafers thickness out of wafer mapping process |
| WO2024118833A1 (en) * | 2022-11-29 | 2024-06-06 | Applied Materials Israel Ltd. | Calculate wafers thickness out of wafer mapping process |
| US12400887B2 (en) * | 2022-11-29 | 2025-08-26 | Applied Materials Israel Ltd. | Method and system of operating substrate processing by calculating wafer thickness out of wafer mapping process |
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