KR102799321B1 - Fluorine-based release film, Semiconductor package manufacturing method using the same and Semiconductor package - Google Patents

Abstract

The present invention relates to a fluorine-based release film, and more specifically, to a fluorine-based release film which can prevent appearance defects caused by stains and scratches on a molding part of a semiconductor package, enable visual inspection of defective products, improve surface printability of a molding part, and at the same time exhibit excellent mechanical properties to prevent defects such as tearing even when the thickness of a molding part for molding a semiconductor element is formed thick, and a method for manufacturing a semiconductor package using the same, and a semiconductor package.

Description

Fluorine-based release film, semiconductor package manufacturing method using the same, and semiconductor package {Fluorine-based release film, semiconductor package manufacturing method using the same and semiconductor package}

The present invention relates to a fluorine-based release film, and more specifically, to a fluorine-based release film which can prevent appearance defects caused by stains and scratches on a molding part of a semiconductor package, enable visual inspection of defective products, improve surface printability of a molding part, and at the same time exhibit excellent mechanical properties to prevent defects such as tearing even when the thickness of a molding part for molding a semiconductor element is formed thick, and a method for manufacturing a semiconductor package using the same, and a semiconductor package.

The existing semiconductor package molding method forms a rough surface in the mold and performs the epoxy resin molding work, so there is resin residue in the gap of the mold, and the resin sticks to the mold, making continuous work difficult, and it places restrictions on the manufacturing method for reducing the size of semiconductor devices.

In addition, Teflon is sometimes used to coat the mold to improve release properties, but although this improves the adhesion of the resin to the mold, there are problems in that the resin accumulates in the gaps of the mold, making continuous operation difficult, and it is difficult to apply to small-sized products.

Conventional semiconductor packages, such as fine pitch ball grid array packages or chip scale packages, have physical advantages such as miniaturization and weight reduction, but they do not have reliability equivalent to that of plastic packages, and have disadvantages in that their price competitiveness is low due to high unit costs of raw materials and processes required in the production process. In addition, although micro ball grid array packages have better characteristics than fine pitch ball grid array packages or chip scale packages, they have disadvantages in that their reliability and price competitiveness are low.

Accordingly, there is an urgent need for development of a means and method for implementing a semiconductor package that can prevent appearance defects caused by stains and scratches on the molding part of a semiconductor package, enable visual inspection of defective products, improve surface printability of the molding part, and exhibit excellent mechanical properties to prevent defects such as tearing even when the thickness of the molding part for molding a semiconductor element is formed thick.

Publication date of patent publication No. 10-1993-0006104 (publication date: 1993.04.20)

The present invention has been made to solve the above-described problems, and the purpose of the present invention is to provide a fluorine-based release film which can prevent appearance defects caused by stains and scratches on the molding part of a semiconductor package, enable visual inspection of defective products, improve surface printability of the molding part, and at the same time exhibit excellent mechanical properties to prevent defects such as tearing even when the thickness of the molding part for molding a semiconductor element is formed thick, and a method for manufacturing a semiconductor package using the same, and a semiconductor package.

In order to solve the above-described problem, the present invention provides a fluorine-based release film including a plurality of unevennesses on at least a portion of a surface and satisfying the following condition (1).

(1) B/A ≤ 170

At this time, the above A represents the arithmetic average roughness (㎛) of the plurality of uneven surfaces, and the above B represents the ten-point average roughness (㎛) of the plurality of uneven surfaces.

According to one embodiment of the present invention, the following condition (1) can be satisfied.

(1) 1.6 ≤ B / A ≤ 63.

Additionally, the plurality of uneven surfaces may have an arithmetic mean roughness (R _a ) of 0.03 to 0.5 μm and a ten-point average roughness (R _z ) of 0.3 to 5.0 μm.

Additionally, the plurality of uneven surfaces may have an average uneven width (R _Sm ) of 30 to 200 μm.

Additionally, the plurality of protrusions may have a peak count (R _Pc ) of 15 to 45/1 cm.

In addition, the fluorine-based release film may include at least one selected from the group consisting of polytetrafluoroethylene (PTFE), fluoroethylene propylene (FEP), ethylene-tetrafluoroethylene (ETFE), perfluoroalkoxy (PFA), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and polyvinyl fluoride (PVF).

Additionally, the thickness can be 20 to 250 μm.

Additionally, the elongation at a temperature of 165℃ can be greater than 200%.

In addition, the present invention provides a semiconductor package including a substrate having a semiconductor element arranged on at least a portion of a surface; and a molding part arranged on the substrate so as to mold the semiconductor element, the molding part including a plurality of protrusions on at least a portion of a substrate-side back surface; wherein the substrate-side back surface of the molding part satisfies the following condition (2).

(2) D/C ≤ 170

At this time, the above C represents the arithmetic average roughness (㎛) of a plurality of unevennesses on the substrate-side back surface of the molding part, and the above D represents the ten-point average roughness (㎛) of a plurality of unevennesses on the substrate-side back surface of the molding part.

According to one embodiment of the present invention, the plurality of unevennesses on the substrate-side rear surface of the molding part may have an arithmetic mean roughness (R _a ) of 0.03 to 0.5 ㎛ and a ten-point average roughness (R _z ) of 0.3 to 5.0 ㎛.

In addition, the plurality of unevennesses on the substrate-side back surface of the molding part may have an average width (R _Sm ) of 30 to 200 μm.

Additionally, the plurality of protrusions on the substrate-side rear surface of the molding part may have a peak count (R _Pc ) of 15 to 45/1 cm.

In addition, the present invention provides a method for manufacturing a semiconductor package, including the steps of: preparing a molding part formed with a predetermined receiving portion; arranging a fluorine-based release film according to any one of claims 1 to 8 on a surface of the molding part formed along the receiving portion; arranging a substrate having a semiconductor element arranged on at least a portion of a surface such that at least a portion of the semiconductor element is received in the receiving portion; forming a molding part by treating the receiving portion with a curable resin so that the semiconductor element is molded; and removing the molding part formed body and the fluorine-based release film.

The fluorine-based release film of the present invention, the method for manufacturing a semiconductor package using the same, and the semiconductor package can prevent appearance defects due to stains and scratches on the molding part of a semiconductor package, enable visual inspection of defective products, and improve the surface printability of the molding part. In addition, even if the thickness of the molding part for molding a semiconductor element is formed thick, it has the effect of preventing defects such as tearing due to excellent mechanical properties.

FIG. 1 is a cross-sectional schematic diagram of a method for manufacturing a semiconductor package according to one embodiment of the present invention.
FIG. 2 is a cross-sectional view of a semiconductor package according to one embodiment of the present invention.
FIG. 3 is a process flow diagram for a method of manufacturing a semiconductor package according to one embodiment of the present invention.

Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts that are not related to the description are omitted in order to clearly describe the present invention, and the same reference numerals are added to the same or similar components throughout the specification.

The fluorine-based release film according to the present invention is implemented by including a plurality of unevennesses on at least a portion of the surface.

First, before explaining each component of the fluorine-based release film of the present invention, the reason why the fluorine-based release film according to the present invention must satisfy the following condition (1) will be explained.

Even if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, if the arithmetic mean roughness is low, the molding part of the semiconductor package may suffer appearance defects due to stains and scratches, and the surface printability of the molding part may deteriorate. Even if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, if the arithmetic mean roughness is high, the mechanical properties may be poor and defects may occur. In addition, even if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, if the arithmetic mean roughness is low, the molding part of the semiconductor package may suffer appearance defects due to stains and scratches, and the surface printability of the molding part may deteriorate. Even if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, if the arithmetic mean roughness of the unevenness of the fluorine-based release film is high, the molding part of the semiconductor package may suffer appearance defects due to stains and scratches, and the surface printability of the molding part may deteriorate. And even if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, if the arithmetic mean roughness of the unevenness of the fluorine-based release film is appropriate, the molding part of the semiconductor package may suffer appearance defects due to stains and scratches, and the surface printability of the molding part may deteriorate. And the mechanical properties may be poor and defects may occur.

Accordingly, the fluorine-based release film must have a specific ratio of the arithmetic mean roughness and the ten-point average roughness of the plurality of irregularities, and thus the fluorine-based release film according to the present invention is designed to satisfy the following condition (1).

As condition (1), B / A ≤ 170, and preferably 1.6 ≤ B / A ≤ 63.

At this time, the above A represents the arithmetic average roughness (㎛) of the plurality of uneven surfaces, and the above B represents the ten-point average roughness (㎛) of the plurality of uneven surfaces.

If B/A exceeds 170 in the above condition (1), appearance defects due to stains and scratches may occur in the molding part of the semiconductor package, surface printability of the molding part may deteriorate, and mechanical properties may be poor, resulting in defects.

Meanwhile, the arithmetic mean roughness refers to the centerline average roughness, and specifically, according to the Korean Industrial Standards (KS), it refers to the value obtained by the following mathematical formula 1 when the direction of the average line is extracted from the roughness curve by a standard length in the direction of the average line, the direction of the average line of the sample portion is set as the X-axis and the vertical magnification direction is set as the Y-axis, and the roughness curve is expressed as y = f(x).

[Mathematical Formula 1]

Here, l is the reference length.

In addition, the 10-point average roughness refers to the difference in ㎛ between the average elevation of the fifth highest peak and the average elevation of the fifth deepest valley, measured in the longitudinal magnification direction on a straight line that is parallel to the mean line and does not cross the cross-sectional curve, at a section extracted from the cross-sectional curve by the standard length as shown in JIS B0601, and the average value of the measurement values at 10 points is called the 10-point average surface roughness.

Hereinafter, each component of the fluorine-based release film of the present invention will be described.

The above fluorine-based release film is capable of achieving the effect aimed at by the present invention, and the fluorine-based release film can be used without limitation as long as it is a fluorine-based resin that can be commonly used in the art, and preferably, it may include at least one selected from the group consisting of polytetrafluoroethylene (PTFE), fluoroethylenepropylene (FEP), ethylene-tetrafluoroethylene (ETFE), perfluoroalkoxy (PFA), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and polyvinyl fluoride (PVF), and more preferably, it may include at least one selected from the group consisting of polytetrafluoroethylene (PTFE), fluoroethylenepropylene (FEP), ethylene-tetrafluoroethylene (ETFE), and perfluoroalkoxy (PFA), and even more preferably, it may be more advantageous in achieving the purpose of the present invention to include ethylene-tetrafluoroethylene (ETFE).

In addition, the fluorine-based release film includes a plurality of unevennesses on at least a portion of the surface as described above, and the plurality of unevennesses may have an arithmetic mean roughness (Ra) of 0.03 to 0.5 ㎛ and a ten-point average roughness (Rz) of 0.3 to 5.0 ㎛ in order to satisfy the condition (1), and preferably, an arithmetic mean roughness (Ra) of 0.05 to 0.3 ㎛ and a ten-point average roughness (Rz) of 0.5 to 3.0 ㎛.

If the arithmetic mean roughness of the plurality of unevennesses of the fluorine-based release film is less than 0.03 ㎛, appearance defects due to stains and scratches may occur in the molding part of the semiconductor package, and surface printability of the molding part may deteriorate. If the arithmetic mean roughness of the plurality of unevennesses of the fluorine-based release film exceeds 0.5 ㎛, mechanical properties may be poor, and thus defects may occur. In addition, if the ten-point average roughness of the plurality of unevennesses of the fluorine-based release film is less than 0.3 ㎛, appearance defects due to stains and scratches may occur in the molding part of the semiconductor package, and surface printability of the molding part may deteriorate. If the ten-point average roughness of the plurality of unevennesses of the fluorine-based release film exceeds 5.0 ㎛, appearance defects due to stains and scratches may occur in the molding part of the semiconductor package, and surface printability of the molding part may deteriorate. And mechanical properties may be poor, and thus defects may occur.

Meanwhile, the plurality of uneven portions may have an average width (R _Sm ) of 30 to 200 μm, and preferably, the average width of the uneven portions may be 50 to 150 μm. If the average width of the plurality of uneven portions of the fluorine-based release film is less than 30 μm, the mechanical properties may not be good, resulting in defects, and if it exceeds 200 μm, the appearance may be deteriorated due to stains and scratches on the molding portion of the semiconductor package, and the surface printability of the molding portion may be deteriorated.

At this time, the average width of the irregularities (R _Sm ) represents the average distance value between the irregularities passing through the center line measuring the arithmetic average roughness.

In addition, the plurality of unevennesses may have a peak count (RPc) of 15 to 45/1cm, and preferably, the peak count may be 20 to 40/1cm. If the peak count of the plurality of unevennesses of the fluorine-based release film is less than 15/1cm, appearance defects due to stains and scratches may occur in the molding portion of the semiconductor package, and surface printability of the molding portion may deteriorate, and if the peak count of the plurality of unevennesses of the fluorine-based release film exceeds 45/1cm, mechanical properties may be poor, resulting in defects.

At this time, the peak count indicates the number of peaks measured on an upper reference line that passes 0.5 μm above the center line and is parallel to the center line when measuring the arithmetic mean roughness.

Meanwhile, the fluorine-based release film according to the present invention may have a thickness of 20 to 250 μm, preferably, the fluorine-based release film may have a thickness of 25 to 230 μm, and more preferably, the fluorine-based release film may have a thickness of 20 to 200 μm. When the thickness of the fluorine-based release film satisfies the above range, appearance defects due to stains and scratches on the molding part of the semiconductor package can be prevented, the surface printability of the molding part can be improved, and even if the molding part is formed thickly, defects such as tearing can be prevented due to excellent mechanical properties.

In addition, the fluorine-based release film according to the present invention may have an elongation of 200% or more at a temperature of 165°C, and preferably an elongation of 300% or more at a temperature of 165°C. By satisfying the elongation range of the fluorine-based release film at a temperature of 165°C, it is possible to prevent the occurrence of defects by exhibiting excellent mechanical properties regardless of the thickness of the molding portion.

Meanwhile, the present invention provides a semiconductor package (1000) including a substrate (300) having a semiconductor element (310) arranged on at least a portion of a surface thereof, as illustrated in FIG. 2, and a molding part (400) disposed on the substrate (300) so that the semiconductor element (310) is molded, and including a plurality of protrusions on at least a portion of a back surface of the substrate (300).

At this time, the back surface of the substrate (300) side of the molding part (400) satisfies the following condition (2).

As condition (2), D / C ≤ 170, and preferably 1.6 ≤ D / C ≤ 63.

At this time, the above C represents the arithmetic average roughness (㎛) of a plurality of unevennesses on the back surface of the substrate (300) side of the molding part (400), and the above D represents the ten-point average roughness (㎛) of a plurality of unevennesses on the back surface of the substrate (300) side of the molding part (400).

If D/C exceeds 170 in the above condition (2), appearance defects due to stains and scratches may occur in the molding part of the semiconductor package, surface printability of the molding part may deteriorate, and mechanical properties may be poor, resulting in defects.

Meanwhile, the molding part (400) may be formed of a curable resin, and the curable resin may be any curable resin commonly used in the art without limitation, and preferably may include at least one of an epoxy resin, an acrylic resin, an isocyanate resin, and a urethane resin, and more preferably, including an epoxy resin may be more advantageous in achieving the purpose of the present invention.

Meanwhile, since any known epoxy resin can be used without limitation as to the specific type of the epoxy resin, the present invention does not specifically limit it.

In addition, the plurality of unevennesses on the back surface of the substrate (300) of the molding portion (400) may have an arithmetic mean roughness (Ra) of 0.03 to 0.5 ㎛ and a ten-point average roughness (Rz) of 0.3 to 5.0 ㎛ in order to satisfy the condition (2), and preferably, an arithmetic mean roughness (Ra) of 0.05 to 0.3 ㎛ and a ten-point average roughness (Rz) of 0.5 to 3.0 ㎛.

If the arithmetic mean roughness of the plurality of unevennesses on the substrate-side back surface of the molding portion is less than 0.03 ㎛, the molding portion may suffer from appearance defects due to stains and scratches, and the surface printability of the molding portion may deteriorate. If the arithmetic mean roughness of the plurality of unevennesses on the substrate-side back surface of the molding portion exceeds 0.5 ㎛, the mechanical properties of the release film for forming the corresponding roughness may not be good, and thus a defect may occur. In addition, if the ten-point average roughness of the plurality of unevennesses on the substrate-side back surface of the molding portion is less than 0.3 ㎛, the molding portion may suffer from appearance defects due to stains and scratches, and the surface printability of the molding portion may deteriorate. If the ten-point average roughness of the plurality of unevennesses on the substrate-side back surface of the molding portion exceeds 5.0 ㎛, the molding portion may suffer from appearance defects due to stains and scratches, and the surface printability of the molding portion may deteriorate. If the mechanical properties of the release film for forming the corresponding roughness may not be good, and thus a defect may occur.

Meanwhile, the average width (R _Sm ) of the plurality of unevennesses on the substrate (300)-side back surface of the molding portion (400) may be 30 to 200 μm, and preferably, the average width of the unevennesses may be 50 to 150 μm. If the average width of the plurality of unevennesses on the substrate-side back surface of the molding portion is less than 30 μm, the mechanical properties of the release film for forming the corresponding width may not be good, resulting in defects, and if it exceeds 200 μm, the molding portion may suffer from appearance defects due to stains and scratches, and the surface printability of the molding portion may deteriorate.

In addition, the peak count (RPc) of the plurality of unevennesses on the substrate (300)-side back surface of the molding part (400) may be 15 to 45/cm, and preferably, the peak count may be 20 to 40/cm. If the peak count of the plurality of unevennesses on the substrate-side back surface of the molding part is less than 15/1cm, the molding part may have poor appearance due to stains and scratches, and the surface printability of the molding part may deteriorate. In addition, if the peak count of the plurality of unevennesses on the substrate-side back surface of the molding part exceeds 45/1cm, the mechanical properties of the release film for forming the corresponding peak count may not be good, and thus a defect may occur.

The semiconductor element (310) may be mounted on the substrate (300), the semiconductor element (310) may have a surface electrode, the substrate (300) may have a substrate electrode corresponding to the surface electrode of the semiconductor element (310), and the surface electrode and the substrate electrode may be electrically connected.

Meanwhile, since the specific shapes of the substrate (300), the semiconductor element (310), and the semiconductor package (1000) can be applied to known shapes of the substrate, semiconductor element, and semiconductor package, the present invention does not specifically limit them.

The present invention provides a method for manufacturing a semiconductor package, including the steps of: (S1) preparing a molding part forming body (100) having a predetermined receiving portion (101) formed, as illustrated in FIGS. 1 and 3; (S2) arranging the above-described fluorine-based release film (200) on a portion of the surface of the molding part forming body (100) along the receiving portion (101); (S3) arranging a substrate (300) having a semiconductor element (310) arranged on at least a portion of the surface such that at least a portion of the semiconductor element (310) is received in the receiving portion (101); (S4) forming a molding part (400) by treating the receiving portion (101) with a curable resin so that the semiconductor element (310) is molded; and (S5) removing the molding part forming body (100) and the fluorine-based release film (200).

The step (S1) of preparing the molding part forming body (100) is a step of preparing a molding part forming body (100) including a receiving portion (101) so that the fluorine-based release film (200) is placed and the molding part (400) can be formed through the curable resin treatment. Since any material and specification of a molding part forming body that can be commonly used in the art can be used without limitation, the present invention does not specifically limit this.

In addition, the step (S2) of arranging the fluorine-based release film (200) is a step of arranging the fluorine-based release film (200) along the surface of the receiving portion (101) of the molding part forming body (100), and is a step of forming an area where the curable resin described below is actually processed. Since a known method can be used as the method of arranging the fluorine-based release film (200), the present invention does not specifically limit it.

In addition, the step (S3) of arranging the semiconductor element (310) so that at least a part of it is accommodated in the receiving portion (101) is a step of arranging the substrate (300) on which the semiconductor element (310) is arranged on at least a part of the surface so that the semiconductor element (310) faces the receiving portion (101) so that at least a part of the semiconductor element (310) is accommodated in the receiving portion (101). Since a known method can be used as the method of arranging the substrate (300), the present invention does not specifically limit it.

In addition, the step (S4) of forming the molding part can be performed by treating the receiving part (101) with a curable resin so that the semiconductor element (310), at least part of which is received in the receiving part (101), is molded.

At this time, the above treatment may include a step of placing a curable resin in a receiving portion (101) and a step of curing the curable resin placed in the receiving portion. Since the method of placing the curable resin in the receiving portion (101) and the method of curing the curable resin may use known methods, the present invention does not specifically limit them.

And, the step (S5) of removing the molding part forming body (100) and the fluorine-based release film (200) can be performed by separating the semiconductor package (1000) including the substrate (300) on which the semiconductor element (310) is arranged on at least a portion of the surface, and the molding part (400) which is arranged on the substrate (300) so that the semiconductor element (310) is molded and includes a plurality of unevennesses on at least a portion of the back surface of the substrate (300), from the molding part forming body (11) and the fluorine-based release film (200) arranged on a portion of the surface of the molding part forming body (100). Since the separation method can use a known method, the present invention does not specifically limit it.

The fluorine-based release film of the present invention, the method for manufacturing a semiconductor package using the same, and the semiconductor package can prevent appearance defects due to stains and scratches on the molding part of a semiconductor package, enable visual inspection of defective products, and improve the surface printability of the molding part. In addition, even if the thickness of the molding part for molding a semiconductor element is formed thick, it has the effect of preventing defects such as tearing due to excellent mechanical properties.

The present invention will be described more specifically through the following examples, but the following examples do not limit the scope of the present invention, and should be interpreted as helping to understand the present invention.

<Example 1>

First, ethylene-tetrafluoroethylene copolymer (ETFE) was extruded as a fluorinated resin, and the molten resin was formed into a film through a T-die, and then passed between two metal substrate rolls each having a plurality of unevennesses that satisfy an arithmetic mean roughness (R _a ) of 0.17 μm, a ten-point average roughness (R _z ) of 1.7 μm, an average width of unevenness (R _Sm ) of 115 μm, and a peak count (R _Pc ) of 30/1 cm, thereby manufacturing a fluorinated release film having a thickness of 130 μm by pressing and heating under the conditions of a temperature of 320°C, a pressure of 100 kg/cm2, and a speed of 4 m/min. At this time, the fluorine-based release film included a plurality of unevennesses, and the plurality of unevennesses satisfied an arithmetic mean roughness (R _a ) of 0.17 μm, a ten-point average roughness (R _z ) of 1.7 μm, an average width of unevennesses (R _Sm ) of 115 μm, and a peak count (R _Pc ) of 30/1 cm.

<Examples 2 to 11 and Comparative Examples 1 to 3>

Fluorine-based release films were manufactured in the same manner as in Example 1, except that the arithmetic mean roughness (R _a ), ten-point mean roughness (R _z ), average width of irregularities (R _Sm ), peak count (R _Pc ), whether multiple irregularities were formed, and the forming material of the release film were changed to manufacture fluorine-based release films as shown in Tables 1 to 3 below.

<Experimental example>

For each of the heteromorphic films manufactured according to the examples and comparative examples, a semiconductor package as shown in Fig. 2 was manufactured by performing the process as shown in Figs. 1 and 3.

Specifically, a release film manufactured according to Examples and Comparative Examples was placed along a receiving portion of a molding portion-formed body in which a receiving portion was formed, and a semiconductor element of a substrate having a semiconductor element mounted thereon was placed so as to be received in the receiving portion, and then a cresol novolac epoxy resin, which is an epoxy resin that is a curable resin, was treated and cured in the receiving portion to form a molding portion having an average thickness of 0.2 T (2 mm) so that the semiconductor element was molded, and then the molding portion-formed body and the release film manufactured according to Examples and Comparative Examples were removed to manufacture each semiconductor package.

Afterwards, the following properties were evaluated and the results are shown in Tables 1 to 3.

1. Evaluation of the appearance of the molding part

For each molding part of each of the above semiconductor packages, the presence or absence of defects in the appearance of the molding part was evaluated through visual evaluation (if there were defects in the appearance due to stains or scratches, etc. - ○, if there were no defects in the appearance - ×). In addition, the degree of gloss for each molding part was evaluated (○ - glossy, △ - medium, × - matte).

2. Evaluation of molding part printability

For each molding part of each of the above semiconductor packages, the printability of the molding part was evaluated by the laser marking method using a diode laser. At this time, the printability was evaluated as ○ if the printability was good (excellent clarity and no blurring), and × if the printability was poor (poor clarity and blurring).

3. Evaluation of defect occurrence according to mechanical properties

The thickness of each of the above molding parts was formed to 0.5T instead of 0.3T, and the occurrence of defects due to tearing of the release film, etc. was evaluated. A total of 100 products were manufactured and the number of defects occurring was measured.

division Example
1 Example
2 Example
3 Example
4 Example
5 Fluorine-based release film Formative material ETFE ETFE ETFE ETFE ETFE Arithmetic mean roughness (R _a , ㎛), "A" 0.17 0.3 0.05 0.02 0.7 Ten-point average roughness (R _z , ㎛), "B" 1.7 0.5 3 0.9 2.2 Condition (1), B/A 10 1.67 63 45 3.14 Average width of irregularities (R _Sm , ㎛) 115 50 150 137 72 Peak count (R _Pc , pcs/1cm) 30 40 20 24 37 Molding part Arithmetic mean roughness (R _a , ㎛), "C" 0.19 0.35 0.055 0.022 0.5 Ten-point average roughness (R _z , ㎛), "D" 1.9 0.58 3.3 1 2.5 Condition (2), D/C 10 1.66 60 45.5 5 Molding part
Appearance Evaluation Defective or not × × × ○ × Light degree × × × △ × Molding part printability evaluation ○ ○ ○ △ △ Defect evaluation (times) based on mechanical properties 0 0 0 0 12

division Example
6 Example
7 Example
8 Example
9 Example
10 Fluorine-based release film Formative material ETFE ETFE ETFE ETFE ETFE Arithmetic mean roughness (R _a , ㎛), "A" 0.05 0.45 0.41 0.054 0.056 Ten-point average roughness (R _z , ㎛), "B" 0.2 5.5 1.9 0.62 0.7 Condition (1), B/A 4 12.2 4.63 11.48 12.5 Average width of irregularities (R _Sm , ㎛) 83 109 24 212 188 Peak count (R _Pc , pcs/1cm) 33 28 44 17 12 Molding part Arithmetic mean roughness (R _a , ㎛), "C" 0.06 0.5 0.46 0.06 0.063 Ten-point average roughness (R _z , ㎛), "D" 0.23 6.1 2.1 0.69 0.82 Condition (2), D/C 3.83 12.2 4.57 11.5 13.02 Molding part
Appearance Evaluation Defective or not ○ ○ × ○ ○ Light degree △ △ × △ △ Molding part printability evaluation × △ △ × × Defect evaluation (times) based on mechanical properties 0 6 11 0 0

division Example
11 Comparative example
1 Comparative example
2 ¹⁾ Comparative example
3 ²⁾ Fluorine-based release film Formative material ETFE ETFE ETFE PS Arithmetic mean roughness (R _a , ㎛), "A" 0.44 0.028 - 0.17 Ten-point average roughness (R _z , ㎛), "B" 2.3 5.4 - 1.7 Condition (1), B/A 5.23 192.86 - 10 Average width of irregularities (R _Sm , ㎛) 38 21 - 115 Peak count (R _Pc , pcs/1cm) 49 46 - 30 Molding part Arithmetic mean roughness (R _a , ㎛), "C" 0.49 0.031 - 0.19 Ten-point average roughness (R _z , ㎛), "D" 2.6 6 - 1.9 Condition (2), D/C 5.31 193.55 - 10 Molding part
Appearance Evaluation Defective or not × ○ ○ × Light degree × ○ ○ × Molding part printability evaluation △ × × △ Defect evaluation (times) based on mechanical properties 12 16 43 4 1) The above comparative example 2 shows that no unevenness is formed on the heteromorphic film.
2) The above comparative example 3 shows that ETFE was changed to polystyrene (PS).

As can be seen from the above Tables 1 to 3, it can be confirmed that Examples 1 to 3, which satisfy all of the arithmetic mean roughness (R _a ), ten-point average roughness (R _z ), average width of irregularities (R _Sm ), peak count (R _Pc ), whether multiple irregularities are formed, and forming material of the release film according to the present invention, can simultaneously achieve the effects of having no defects in the appearance of the molding portion, exhibiting matte characteristics, having significantly superior printability, and having no defects due to mechanical properties, compared to Examples 4 to 11 and Comparative Examples 1 to 3, which do not satisfy even one of these.

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily suggest other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

100: Molding part forming body
101: Reception area
200: Fluorine-based release film
300: Substrate
310: Semiconductor devices
400: Molding part
1000: Semiconductor Package

Claims (13)

At least a portion of the surface comprises a plurality of irregularities having a peak count (R _Pc ) of 15 to 45/1 cm,
A fluorine-based release film satisfying the following condition (1), wherein the plurality of unevennesses have an arithmetic mean roughness (R _a ) of 0.03 to 0.5 μm and a ten-point average roughness (R _z ) of 0.3 to 5.0 μm:
(1) B/A ≤ 170
At this time, the above A represents the arithmetic average roughness (㎛) of multiple unevennesses, and the above B represents the ten-point average roughness (㎛) of multiple unevennesses. In the first paragraph,
Fluorine-based release film satisfying the following condition (1):
(1) 1.6 ≤ B / A ≤ 63. delete In the first paragraph,
The above-mentioned plurality of unevennesses are a fluorine-based release film having an average unevenness width (R _Sm ) of 30 to 200 ㎛. delete In the first paragraph, the fluorine-based release film,
A fluorine-based release film comprising at least one selected from the group consisting of polytetrafluoroethylene (PTFE), fluoroethylene propylene (FEP), ethylene-tetrafluoroethylene (ETFE), perfluoroalkoxy (PFA), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and polyvinyl fluoride (PVF). In the first paragraph,
Fluorine-based release film with a thickness of 20 to 250 μm. In the first paragraph,
Fluorine-based release film having an elongation of 200% or more at a temperature of 165℃. A substrate having semiconductor elements arranged on at least a portion of a surface; and
A molding part is disposed on the substrate so that the semiconductor element is molded, and includes a plurality of protrusions having a peak count (R _Pc ) of 15 to 45/1 cm on at least a portion of the substrate-side back surface;
The substrate-side back surface of the above molding part satisfies the following condition (2), and the plurality of uneven portions have an arithmetic mean roughness (R _a ) of 0.03 to 0.5 μm and a ten-point average roughness (R _z ) of 0.3 to 5.0 μm: A semiconductor package:
(2) D/C ≤ 170
At this time, the above C represents the arithmetic average roughness (㎛) of a plurality of unevennesses on the substrate-side back surface of the molding part, and the above D represents the ten-point average roughness (㎛) of a plurality of unevennesses on the substrate-side back surface of the molding part. delete In Article 9,
A semiconductor package in which a plurality of protrusions on the substrate-side rear surface of the molding part have an average width (R _Sm ) of 30 to 200 μm. delete A step for preparing a molding part forming body in which a predetermined receiving portion is formed;
A step of disposing a fluorine-based release film according to any one of claims 1, 2, 4, 6 to 8 on a portion of the surface of the molding part forming body along the receiving portion;
A step of arranging a substrate having semiconductor elements arranged on at least a portion of a surface thereof such that at least a portion of the semiconductor elements are accommodated in the receiving portion;
A step of forming a molding part by treating the above-mentioned receiving part with a curable resin so that the semiconductor element is molded; and
A method for manufacturing a semiconductor package, comprising: a step of removing the molding part forming body and the fluorine-based release film.

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