KR102721867B1 - Resin composition and display device using the same - Google Patents

Abstract

According to one embodiment of the present invention, a display device is provided, which includes a resin comprising repeating units represented by chemical formulas (1) and (10), a resin composition comprising the resin, and a pixel separation unit formed of the resin composition.
The above display device is a display device including a first electrode formed on a substrate, a pixel separator formed on the first electrode so as to partially expose the first electrode, and a second electrode installed facing the first electrode, wherein the pixel separator has an absorbance of 0.5/㎛ or more at a wavelength of 550 nm.

Description

Resin composition and display device using the same {RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME}

The present invention relates to a resin composition for a pixel separation unit and a display device capable of realizing clearer picture quality using the same.

Liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) are widely used in flat panel displays. Among these, organic light emitting display devices in particular have the advantages of low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angle.

In the case of the above organic light-emitting display device, a polarizing film is used to block light reflected from the panel when external light is incident. However, the polarizing film has a disadvantage in that it is not suitable for application to a flexible device due to its insufficient bending characteristics.

As a method for solving the above problems, methods have been proposed, such as forming an inorganic film for blocking light on the upper substrate as well as color filters and black matrices. However, the above methods have limitations in obtaining the desired level of anti-reflection effect, and do not specifically suggest a method for replacing the polarizing film.

Meanwhile, colored shading layers, particularly black shading layers, are used to prevent color interference between red, green, and blue color filters in liquid crystal display devices to improve image quality, and recently, the use of the colored shading layers is being studied to improve image visibility in organic light-emitting displays.

In the manufacture of the above-mentioned light-blocking layer, carbon black and organic pigments are used as black colorants, and since these are applied in a dispersed manner, the pigment dispersion is mixed with other compositions to form a pattern.

At this time, a binder resin together with a pigment of various types of black or a combination that can express black is used in the pixel separation portion of the organic light-emitting device. The pixel separation portion of the organic light-emitting device is formed through a photolithography process, and therefore, the binder resin must exhibit alkaline solubility and photosensitivity. In addition, the pixel separation portion must have high chemical resistance and heat resistance as the deposition process of the organic light-emitting device progresses, and therefore, research on a binder resin having high chemical resistance and heat resistance is required.

One embodiment of the present invention provides a photosensitive composition having a resolution suitable for a pixel separation material of an organic light-emitting device and a low outgassing amount, by using a binder resin having a polyimide main chain having high chemical resistance and heat resistance.

The present invention provides a photosensitive resin composition comprising: a resin comprising a repeating unit represented by the following chemical formula (1); a resin comprising a repeating unit represented by the following chemical formula (10); a reactive unsaturated compound; an initiator; a colorant, and a residual solvent.

Chemical formula (1)

Chemical formula (10)

In addition, as another preferred embodiment of the present invention, a pattern or film formed from the photosensitive resin composition according to the present invention is provided.

In addition, it is preferable that the display device according to the present invention includes a first electrode formed on a substrate, a second electrode installed opposite the first electrode, and a pattern or film formed with a photosensitive resin composition according to the present invention.

In addition, it is preferable that the electronic device according to the present invention includes a display device according to the present invention and a control unit for driving the display device.

A resin composition according to one embodiment of the present invention forms a pixel separation part of an organic light-emitting element using a resin including repeating units represented by chemical formulas (1) and (10) having high chemical resistance and heat resistance, thereby reducing the amount of outgassing and improving the resolution of a display device.

Figure 1 conceptually illustrates a display device for implementing the present invention.
Figure 2 is a representative illustration of a compound according to the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When adding reference numerals to components in each drawing, identical components may have the same numerals as much as possible even if they are shown in different drawings.

In describing the present invention, if it is judged that a specific description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted. When "includes," "has," "consists of," etc. are used in this specification, other parts may be added unless "only" is used. When a component is expressed in the singular, it may include a case where it includes a plurality unless there is a special explicit description.

In addition, when describing components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

In a description of the positional relationship of components, when it is described that two or more components are "connected", "coupled" or "connected", it should be understood that the two or more components may be directly "connected", "coupled" or "connected", but the two or more components and another component may be further "interposed" to be "connected", "coupled" or "connected". Here, the other component may be included in one or more of the two or more components that are "connected", "coupled" or "connected" to each other.

Also, when it is said that a component such as a layer, film, region, or plate is "on" or "over" another component, it should be understood that this includes not only the case where it is "directly on" the other component, but also the case where there are other components in between. Conversely, when it is said that a component is "directly on" another part, it should be understood to mean that there are no other parts in between.

In the description of the temporal flow relationship related to components, operation methods, or manufacturing methods, for example, when the temporal chronological relationship or the chronological flow relationship is described as "after", "following", "next to", or "before", it can also include cases where it is not continuous, as long as "immediately" or "directly" is not used.

Meanwhile, when numerical values or corresponding information for components are mentioned, even if there is no separate explicit description, the numerical values or corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impacts, noise, etc.).

The terms used in this specification and the appended claims have the following meanings, unless otherwise specified, without departing from the spirit of the present invention.

The term “halo” or “halogen” as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I), unless otherwise stated.

The term "alkyl" or "alkyl group" as used in this application, unless otherwise stated, means a radical of a saturated aliphatic functional group having 1 to 60 carbon atoms linked by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

The term “haloalkyl group” or “halogenalkyl group” as used in this application, unless otherwise stated, means an alkyl group substituted with a halogen.

The term "alkenyl" or "alkynyl" as used in this application, unless otherwise stated, refers to a group having a double bond or a triple bond, respectively, including a straight or branched chain group, and having from 2 to 60 carbon atoms, but is not limited thereto.

The term "cycloalkyl" as used in this application, unless otherwise stated, means, but is not limited to, alkyl forming a ring having 3 to 60 carbon atoms.

The term “alkoxy group” or “alkyloxy group” as used in this application means an alkyl group having an oxygen radical bonded thereto, and unless otherwise stated, has 1 to 60 carbon atoms, but is not limited thereto.

The terms “alkenoxyl group”, “alkenoxy group”, “alkenyloxy group”, or “alkenyloxy group” as used in this application mean an alkenyl group having an oxygen radical attached thereto, and unless otherwise stated, has from 2 to 60 carbon atoms, but is not limited thereto.

The terms "aryl group" and "arylene group" used in this application, unless otherwise stated, have 6 to 60 carbon atoms each, but are not limited thereto. The aryl group or arylene group in this application includes a single ring, a ring assembly, a fused multiple ring compound, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group may include a fluorenylene group, a substituted fluorenylene group.

The term "ring assemblies" as used herein means two or more ring systems (single rings or fused ring systems) directly connected to each other through single bonds or double bonds, and the number of such direct connections between rings is one less than the total number of ring systems in the compound. A ring assemblies may be formed by the same or different ring systems being directly connected to each other through single bonds or double bonds.

Since the aryl group in the present application includes a ring aggregate, the aryl group includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. In addition, since the aryl group also includes a compound in which an aromatic single ring and an aromatic ring system fused to each other are connected by a single bond, for example, the aryl group also includes a compound in which an aromatic single ring, a benzene ring, and an aromatic ring system fused to each other are connected by a single bond, fluorene.

The term "fused multiple ring systems" as used in the present application means a fused ring form sharing at least two atoms, and includes a form in which two or more hydrocarbon ring systems are fused, and a form in which at least one heterocyclic system including at least one heteroatom is fused, etc. Such fused multiple ring systems may be an aromatic ring, a heteroaromatic ring, an aliphatic ring, or a combination of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

The term "spiro compound" used in this application has a 'spiro union', and a spiro union means a connection formed by two rings sharing only one atom. In this case, the atom shared between the two rings is called a 'spiro atom', and depending on the number of spiro atoms contained in a compound, they are called 'monospiro-', 'dispiro-', and 'trispiro-' compounds, respectively.

As used herein, the terms "fluorenyl group", "fluorenylene group", and "fluorene triyl group", unless otherwise stated, mean a monovalent, divalent, or trivalent functional group wherein R, R', R", and R'" in the structures below are all hydrogen, respectively, and a "substituted fluorenyl group", a "substituted fluorenylene group", or a "substituted fluorene triyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, and includes a case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In the present specification, regardless of the valence such as monovalent, divalent, or trivalent, a fluorenyl group, a fluorenylene group, and a fluorene triyl group may all be referred to as a fluorene group.

In addition, the R, R', R" and R'" can each independently be an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms, for example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent or divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene and 9,9'-spirobi[9H-fluorene], respectively.

The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise stated means a ring having 2 to 60 carbon atoms each containing one or more heteroatoms, but is not limited thereto. The term "heteroatom" used in this application represents N, O, S, P or Si unless otherwise stated, and a heterocyclic group means a monocyclic ring, ring aggregate, fused multiple ring system, spiro compound, etc. containing a heteroatom.

For example, “heterocyclic group” may also include compounds that contain a heteroatom group, such as SO ₂ , P=O, etc., instead of carbon forming the ring, as in the following compounds:

The term "ring" as used in this application includes monocyclic and polycyclic rings, and includes hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

The term "polycyclic" as used in this application includes ring assemblies such as biphenyl, terphenyl, etc., fused multiple ring systems and spiro compounds, including aromatic as well as non-aromatic, and including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

The term "aliphatic ring" used in this application means a cyclic hydrocarbon other than an aromatic hydrocarbon, and includes a single ring, a ring aggregate, a fused multiple ring system, a spiro compound, etc., and unless otherwise stated, means a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, even if an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, are fused, it is considered an aliphatic ring.

Also, when prefixes are named consecutively, it means that the substituents are listed in the order they are first described. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and also in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, wherein the arylcarbonyl group is a carbonyl group substituted with an aryl group.

In addition, unless explicitly stated otherwise, the term "substituted or unsubstituted" used in the present application means "substituted" or "substituted" including deuterium, halogen, amino group, nitrile group, nitro group, C ₁ to C ₂₀ alkyl group, C ₁ to C ₂₀ alkoxy group, C ₁ to C ₂₀ alkylamine group, C ₁ to C ₂₀ alkylthiophene group, C ₆ to C ₂₀ arylthiophene group, C ₂ to C ₂₀ alkenyl group, C ₂ to C ₂₀ alkynyl group, C ₃ to C ₂₀ cycloalkyl group, C ₆ to C ₂₀ aryl group, C ₆ to C ₂₀ aryl group substituted with deuterium, C ₈ to C ₂₀ arylalkenyl group, silane group, boron group, germanium group, and O, N, S, Si and It means that it is substituted with one or more substituents selected from the group consisting of a C ₂ to C ₂₀ heterocyclic group containing at least one heteroatom selected from the group consisting of P, but is not limited to these substituents.

In this application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, may be described as the 'name of the functional group reflecting the valence', but may also be described as the 'parent compound name'. For example, in the case of 'phenanthrene', which is a type of aryl group, the name of the group may be described by distinguishing the valence, such as 'phenanthryl (group)' for the monovalent 'group' and 'phenantrylene (group)' for the divalent group, but it may also be described as the parent compound name 'phenanthrene' regardless of the valence.

Similarly, in the case of pyrimidine, regardless of the valence, it can be described as 'pyrimidine', or in the case of monovalent, it can be described as pyrimidinyl (group), in the case of divalent, it can be described as the 'group name' of the corresponding valence, such as pyrimidinylene (group). Accordingly, in the present application, when the type of substituent is described as the name of the parent compound, it can mean an n-valent 'group' formed by the abstraction of a hydrogen atom bonded to a carbon atom and/or a heteroatom of the parent compound.

In addition, in this specification, numbers or alphabets indicating positions may be omitted when describing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine may be described as benzofuropyrimidine, and 9,9-dimethyl-9H-fluorene may be described as dimethylfluorene. Accordingly, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

Additionally, unless explicitly stated otherwise, the chemical formulas used in this application are applied in the same manner as the substituent definitions by the index definitions of the chemical formulas below.

Here, when a is an integer of 0, it means that the substituent R ¹ is absent, that is, when a is 0, it means that hydrogen is bonded to all the carbons forming the benzene ring, and in this case, the indication of the hydrogen bonded to the carbon can be omitted and the chemical formula or compound can be described. In addition, when a is an integer of 1, one substituent R ¹ bonds to any one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, it can bond as follows, for example, and when a is an integer of 4 to 6, it bonds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or greater, R ¹ can be the same or different.

Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused multiple rings, and the single ring and the formed fused multiple rings include not only a hydrocarbon ring but also a heterocycle containing at least one heteroatom, and may include aromatic and non-aromatic rings.

In addition, unless otherwise stated in this specification, when indicating a condensed ring, the number in 'number-condensed ring' indicates the number of rings to be condensed. For example, a form in which three rings are condensed with each other, such as anthracene, phenanthrene, and benzoquinazoline, can be expressed as a 3-condensed ring.

Meanwhile, the term "bridged bicyclic compound" used in the present application, unless otherwise specified, refers to a compound in which two rings form a ring by sharing three or more atoms. In this case, the shared atoms may include carbon or heteroatoms.

In the present application, the organic electric element may mean a component(s) between an anode and a cathode, or may mean an organic light-emitting diode including an anode, a cathode, and a component(s) positioned therebetween.

In addition, in some cases, the display device in the present application may mean an organic electric element, an organic light-emitting diode and a panel including the same, or may mean an electronic device including the panel and a circuit. Here, for example, the electronic device may include a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and may be any form of device as long as it includes the above-mentioned component(s).

Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples, and the present invention is not limited thereby, and the present invention is defined only by the scope of the claims described below.

The present invention provides a photosensitive resin composition comprising: a resin comprising a repeating unit represented by the following chemical formula (1); a resin comprising a repeating unit represented by the following chemical formula (10); a reactive unsaturated compound; an initiator; a colorant, and a residual solvent.

Each component is described in detail below.

(1) Alkali-soluble resin

A photosensitive resin composition according to one embodiment of the present invention comprises an alkali-soluble resin including a repeating unit having a structure represented by the following chemical formula (1).

Chemical formula (1)

In the above chemical formula (1),

1) X is a single bond, O, S, CR _a R _b , NR, CH ₂ , C=O, SO ₂ or C(CF ₃ ) ₂ ,

2) R _a and R _b are each independently hydrogen; deuterium; halogen; CF ₃ ; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof; or adjacent groups may form a ring; or may form a spiro ring,

3) R ² and R ³ are each independently hydrogen; deuterium; halogen; CF ₃ ; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₃ to C ₂₀ cycloalkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof; or adjacent groups may form a ring,

4) a and b are integers from 1 to 3, independently of each other.

5) n is an integer between 2 and 100,000,

6) A ¹ is the following chemical formula (A),

Chemical formula (A)

In the above chemical formula (A),

6-1) L is a C ₆ ~ C ₆₀ arylene group; a C ₁ ~ C ₂₀ alkylene group; a C ₂ ~ C ₂₀ alkenylene group; a fluorenylene group; a C ₂ ~ C ₆₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₃ ~ C ₆₀ aliphatic ring and a C ₆ ~ C ₆₀ aromatic ring; or a combination thereof,

6-2) R ¹ is a hydroxy group; an ester group; a C ₃ to C ₂₀ cycloalkyl group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof,

7) Ar ₂ is hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof,

8) Ar ₁ and Ar ₃ are each independently a C ₆ to C ₆₀ arylene group; a C ₁ to C ₂₀ alkylene group; a C ₂ to C ₂₀ alkenylene group; a fluorenylene group; a C ₂ to C ₆₀ heterocyclic group including at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₃ to C ₆₀ aliphatic ring and a C ₆ to C ₆₀ aromatic ring; chemical formula (B); chemical formula (C); or a combination thereof,

Chemical Formula (B) Chemical Formula (C)

In the above chemical formula (B) and chemical formula (C),

8-1) R ⁴ ~ R ⁶ are each independently hydrogen; deuterium; halogen; CF ₃ ; a cyano group; an ester group; an amide group; an imide group; a C ₆ ~ C ₃₀ aryl group; a C ₂ ~ C ₃₀ heterocyclic group containing at least one heteroatom selected from O, N, S, Si and P; a fused ring group of a C ₆ ~ C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~ C ₂₀ alkyl group; a C ₃ ~ C ₂₀ cycloalkyl group; a C ₂ ~ C ₂₀ alkenyl group; a C ₂ ~ C ₂₀ alkynyl group; a C ₁ ~ C ₂₀ alkoxy group; a C ₆ ~ C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ ~ C ₂₀ alkoxycarbonyl group; or a combination of these; or adjacent groups may form rings,

8-2) Y is a single bond, O, S, CO, CR'R" or SO ₂ ,

8-3) R' and R" are each independently hydrogen; deuterium; halogen; CF ₃ ; cyano group; ester group; amide group; imide group; C ₆ ~ C ₃₀ aryl group; C ₂ ~ C ₃₀ heterocyclic group including at least one heteroatom of O, N, S, Si and P; C ₆ ~ C ₃₀ fused ring group of aliphatic ring and aromatic ring; C ₁ ~ C ₂₀ alkyl group; C ₃ ~ C ₂₀ cycloalkyl group; C ₂ ~ C ₂₀ alkenyl group; C ₂ ~ C ₂₀ alkynyl group; C ₁ ~ C ₂₀ alkoxy group; C ₆ ~ C ₃₀ aryloxy group; fluorenyl group; carbonyl group; ether group; C ₁ ~ C ₂₀ alkoxycarbonyl group; or these may be a combination; or may form a ring between adjacent groups; or may form a spy ring;

8-4) c and d are independent integers from 1 to 4,

8-5) e is an integer from 1 to 6.

9) The rings formed by bonding the above R _a ~R _b , R ¹ ~R ⁶ , R'~R" , Ar ₁ ~Ar ₃ , L and adjacent groups are each independently a deuterium; a halogen; a C ₁ ~C ₃₀ alkyl group or a C ₆ ~C ₃₀ aryl group substituted or unsubstituted with a silane group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C ₁ ~C 30 alkylthio group; a C ₁ ~C ₃₀ alkoxy group; a C ₆ ~C ₃₀ arylalkoxy group; a C 1 ~C 30 alkyl group; a C 2 ~C ₃₀ alkenyl group; a C ₂ ~C ₃₀ alkynyl group; a C 6 ~C ₃₀ aryl group; a C ₆ ~C 30 group substituted with deuterium; a halogen; a C ₁ ~C ₃₀ alkyl group or a C ₆ ~C ₃₀ aryl group; a C ₆ ~C ₃₀ group substituted with deuterium. An aryl group; a fluorenyl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P; a C ₃ to C ₃₀ aliphatic ring group; a C ₇ to C ₃₀ arylalkyl group; a C ₈ to C ₃₀ arylalkenyl group; and combinations thereof, wherein the at least one substituent is further substituted with at least one substituent selected from the group consisting of; and adjacent substituents may form a ring.

When the above R _a to R _b , R ¹ to R ⁶ , R' to R" and Ar ₂ are aryl groups, they are preferably C ₆ to C ₃₀ aryl groups, more preferably C ₆ to C ₁₈ aryl groups, such as phenyl, biphenyl, naphthyl, terphenyl, and the like.

When the above R _a ~R _b , R ¹ ~R ⁶ , R'~R" , Ar ₁ ~Ar ₃ and L are heterocyclic groups, Preferably, it may be a C ₂ to C ₃₀ heterocyclic group, more preferably a C ₂ to C ₁₈ heterocyclic group, such as dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

When the above R _a to R _b , R ¹ to R ⁶ , R' to R" and Ar ₂ are fluorenyl groups, they may preferably be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl groups, 9,9'-spirobifluorene, etc.

When the above Ar ₁ , Ar ₃ and L are arylene groups, they may preferably be C ₆ to C ₃₀ arylene groups, more preferably C ₆ to C ₁₈ arylene groups, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

When the above R _a to R _b , R ¹ to R ⁶ , R' to R" and Ar ₂ are alkyl groups, they may preferably be C ₁ to C ₁₀ alkyl groups, for example, methyl, t-butyl, etc.

When the above R _a to R _b , R ¹ to R ⁶ , R' to R" and Ar ₂ are alkoxyl groups, they are preferably C ₁ to C ₂₀ alkoxyl groups, more preferably C ₁ to C ₁₀ alkoxyl groups, such as methoxy, t-butoxy, etc.

The ring formed by the adjacent groups of R _a to R _b , R ¹ to R ⁶ , R' to R " , Ar ₁ to Ar ₃ and L bonding to each other may be a C ₆ to C ₆₀ aromatic ring group; a fluorenyl group; a C ₂ to C ₆₀ heterocyclic group including at least one heteroatom of O, N, S, Si and P; or a C ₃ to C ₆₀ aliphatic ring group, and for example, when the adjacent groups bond to each other to form an aromatic ring, preferably a C ₆ to C ₂₀ aromatic ring, more preferably a C ₆ to C ₁₄ aromatic ring, such as benzene, naphthalene, phenanthrene, etc. can be formed.

In addition, the repeating unit represented by the chemical formula (1) may be represented by any one of the chemical formulas (2) to (7) below, but is not limited thereto.

Chemical formula (2) Chemical formula (3)

Chemical formula (4) Chemical formula (5)

Chemical formula (6) Chemical formula (7)

In the above chemical formulas (2) to (7), the definition of the substituents is the same as that defined in the above chemical formula (1).

The repeating unit represented by the above chemical formula (1) may be any one of the following P1-1 to P1-122, but is not limited thereto.

The weight average molecular weight of the resin of the present invention may be 5,000 to 200,000 g/mol, preferably 1,000 to 50,000 g/mol, and more preferably 1,000 to 30,000 g/mol. When the weight average molecular weight of the resin is within the above range, a pattern is formed well without residue during the manufacture of a pattern layer, there is no loss of film thickness during development, and a good pattern can be obtained.

The photosensitive resin composition of the present invention may further include a resin including a repeating unit of a structure represented by the following chemical formula (10) in addition to a resin including a repeating unit of the chemical formula (1).

Chemical formula (10)

In the above chemical formula (10),

10-1) * indicates the part where the combination is connected as a repeating unit,

10-2) R ⁴¹ and R ⁴² are each independently hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,

10-3) R ⁴¹ and R ⁴² are each capable of forming adjacent tile rings,

10-4) a' and b' are independent integers from 0 to 4,

10-5) X ⁴¹ is a single bond, O, CO, SO ₂ , CR'R", SiR'R", chemical formula (4-1) or chemical formula (4-2), preferably chemical formula (4-1),

10-6) X ⁴² is a C ₆ ~ C ₃₀ aryl group; a C ₂ ~ C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~ C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~ C ₂₀ alkyl group; a C ₂ ~ C ₂₀ alkenyl group; a C ₂ ~ C ₂₀ alkynyl group; a C ₁ ~ C ₂₀ alkoxy group; a C ₆ ~ C ₃₀ aryloxy group; or a combination thereof,

10-7) R' and R" are each independently hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,

10-8) R' and R" are each capable of forming adjacent tile rings,

10-9) A ⁴¹ and A ⁴² are independently chemical formula (4-3) or chemical formula (4-4),

10-10) The ratio of chemical formula (4-3) and chemical formula (4-4) within the polymer chain of the resin including the repeating unit represented by chemical formula (10) satisfies 1:9 to 9:1.

Examples of R' and R" combining with each other to form a ring are as follows.

Specific examples of the above-mentioned chemical formulas (4-1) and (4-2) are as follows.

Chemical formula (4-1)

Chemical Formula (4-2)

In the above chemical formulas (4-1) and (4-2),

11-1) * indicates the binding position,

11-2) X ⁴³ is O, S, SO ₂ or NR',

11-3) R' is hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,

11-4) R ⁴³ ~R ⁴⁶ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,

11-5) R ⁴³ ~R ⁴⁶ can form adjacent tile rings, respectively.

11-6) c'~f' are independent integers from 0 to 4.

Specific examples of the above-mentioned chemical formulas (4-3) and (4-4) are as follows.

Chemical formula (4-3)

Chemical formula (4-4)

In the above chemical formulas (4-3) and (4-4),

12-1) * indicates the binding position,

12-2) R ⁴⁷ ~R ⁵⁰ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,

12-3) Y ⁴¹ and Y ⁴² are independently chemical formula (4-5) or chemical formula (4-6).

Specific examples of the above-mentioned chemical formulas (4-5) and (4-6) are as follows.

Chemical formula (4-5)

Chemical formula (4-6)

In the above chemical formulas (4-5) and (4-6),

13-1) * indicates the binding position,

13-2) R ⁵¹ ~R ⁵⁵ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,

13-3) L ⁴¹ ~L ⁴³ are independently a single bond, C ₁ ~C ₃₀ alkylene, C ₆ ~C ₃₀ arylene, or C ₂ ~C ₃₀ heterocycle,

13-4) g' and h' are independent integers from 0 to 3; however, g'+h'= 3.

The ratio of chemical formulas (4-5) and (4-6) in the polymer chain of the resin including the repeating unit represented by the chemical formula (10) is preferably 2:0 to 1:1, and most preferably 1.5:0.5. If the ratio of chemical formula (4-6) is higher than that of chemical formula (4-5), residue may be generated due to excessively high adhesion, and the amount of outgas may also increase significantly. When the ratio of chemical formulas (4-5) and (4-6) is 1.5:0.5, the pattern resolution is the best and the amount of outgas is also satisfactory.

The weight average molecular weight of the resin including the repeating unit represented by the chemical formula (10) may be 1,000 to 100,000 g/mol, preferably 1,000 to 50,000 g/mol, and more preferably 1,000 to 30,000 g/mol. When the weight average molecular weight of the resin is within the above range, pattern formation is performed well without residue during pattern layer production, there is no loss of film thickness during development, and a good pattern can be obtained.

The total amount of the resin including the repeating unit represented by the chemical formula (1) and the resin including the repeating unit represented by the chemical formula (10) may be included in an amount of 1 to 40 wt%, more preferably 3 to 20 wt%, based on the total amount of the photosensitive resin composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

When the photosensitive resin composition of the present invention includes a resin including a repeating unit represented by chemical formula (1) and a resin including a repeating unit represented by chemical formula (10), the ratio of the resin including the repeating unit represented by chemical formula (1) and the resin including the repeating unit represented by chemical formula (10) is preferably 1:9 to 5:5, and most preferably 3:7. When the two types of resins are included in a ratio of 3:7, the composition exhibits developability and resolution suitable for a photoresist process, and exhibits high chemical resistance even after curing, making it suitable for use as a material for a pixel separation portion of an organic light-emitting device.

The photosensitive resin composition of the present invention may further include an acrylic resin in addition to the resin. The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units. The acrylic resin may be a copolymer of ethylenically unsaturated monomers including 2 to 10 kinds of acrylates and/or methacrylates, and may have a weight average molecular weight of 5,000 to 30,000 g/mol.

(2) Reactive unsaturated compounds

A photosensitive resin composition according to one embodiment of the present invention comprises a reactive unsaturated compound having a structure represented by the following chemical formula (8).

Chemical formula (8)

In the chemical formula (2), at least two of Z ₁ to Z ₄ independently have a structure of the following chemical formula (G); the remaining Z ₁ to Z ₄ independently represent hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group including at least one heteroatom selected from O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; Or it is an alkoxycarbonyl group of C ₁ to C ₂₀ .

A specific example of the above-mentioned chemical formula (G) is as follows.

Chemical formula (G)

In the above chemical formula (G),

1) t is an integer from 1 to 20,

2) L ₄ is a single bond, C ₁ ~ C ₃₀ alkylene, C ₆ ~ C ₃₀ arylene, or C ₂ ~ C ₃₀ heterocycle,

3) Y ₃ is the following chemical formula (H) or chemical formula (I).

Specific examples of the above-mentioned chemical formula (H) or chemical formula (I) are as follows.

Chemical formula (H)

Chemical formula (I)

In the above chemical formula (H), R ₂₁ is hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group.

A multi-acrylic compound having a structure such as the above chemical formula (8) may be used alone or in combination of two or more. As an example, a multifunctional ester of (meth)acrylic acid having at least two ethylenically unsaturated double bonds may be used.

In this specification, “(meth)acrylic acid” may refer to methacrylic acid, acrylic acid, or a mixture of methacrylic acid and acrylic acid.

The above reactive unsaturated compound has the above ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure in the pattern forming process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

Specific examples of the above reactive unsaturated compounds include, but are not limited to, one or more selected from ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxyacrylate, ethylene glycol monomethyl ether acrylate, and trimethylolpropane triacrylate.

Examples of commercially available products of the above reactive unsaturated compounds are as follows.

Examples of the bifunctional esters of the above (meth)acrylic acid include Aronix M-210, M-240, M-6200 from Toagosei Chemical Industry Co., Ltd., KAYARAD HDDA, HX-220, R-604 from Nihon Kayaku Co., Ltd., and V-260, V-312, V-335 HP from Osaka Yuki Chemical Industry Co., Ltd.

Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060 from Toagosei Chemical Industry Co., Ltd., KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120 from Nihon Kayaku Co., Ltd., and V-295, V-300, V-360 from Osaka Yuki Kayaku Industry Co., Ltd.

The above products can be used alone or in combination of two or more.

The above reactive unsaturated compound can be used by treating it with an acid anhydride in order to provide better developability. The above reactive unsaturated compound can be included in an amount of 1 to 40 wt%, for example, 1 to 20 wt%, based on the total amount of the photosensitive resin composition. When the above reactive unsaturated compound is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion.

(3) Photoinitiator

In order to implement a negative pattern by photolithography, a photoradical initiator must be used. The photoinitiator has a molar absorption coefficient of 10,000 (L/㏖·cm) or more in the 320 to 380 nm region and a 5 wt% weight loss occurs at 200°C or less. Here, the molar absorption coefficient can be calculated by the beer-Lambert Law. In addition, the weight loss was measured using TGA in a nitrogen atmosphere while heating at a rate of 5°C per minute to 300°C.

A photosensitive resin composition according to one embodiment of the present invention includes an initiator having a structure represented by the following chemical formula (9).

Chemical formula (9)

In the above chemical formula (9),

1) u ₁ ~u ₃ are integers of 0 or 1, independently of each other,

2) L ₅ and L ₈ have the following chemical formula (J),

3) L ₆ , L ₇ and L ₉ are each independently a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom selected from O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₃ to C ₃₀ aliphatic ring group; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl; a C ₁ to C ₃₀ alkylene or a C ₆ to C ₃₀ arylene.

A specific example of the above-mentioned chemical formula (J) is as follows.

Chemical formula (J)

In the above chemical formula (J), R ₃₁ is hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group.

In addition, it is more preferable that L ₆ , L ₇ and L ₉ of the above chemical formula (3) are independently one of the following chemical formulas (K) to (N).

Specific examples of the above-mentioned chemical formulas (K) to (L) are as follows.

Chemical formula (K)

Chemical formula (L)

Chemical formula (M)

Chemical formula (N)

In the above chemical formula (M) and chemical formula (N),

1) A is hydrogen; O; S; a silane group; a siloxane group; a boron group; a germanium group; a cyano group; a nitro group; a nitrile group; an amino group unsubstituted or substituted with a C ₁ to C ₃₀ alkyl group, a C ₆ to C ₃₀ aryl group or a C ₂ to C ₃₀ heterocyclic group; a C ₁ to C ₃₀ alkylthio group; a C ₁ to C ₃₀ alkyl group; a C ₁ to C ₃₀ alkoxy group; a C ₆ to C ₃₀ arylalkoxy group; a C ₂ to C ₃₀ alkenyl group; a C ₂ to C ₃₀ alkynyl group; a C ₆ to C ₃₀ aryl group; a C ₆ to C ₃₀ aryl group substituted with deuterium; a fluorenyl group; A C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; a C ₃ to C ₃₀ aliphatic ring group; a C ₇ to C ₃₀ arylalkyl group; a C ₈ to C ₃₀ arylalkenyl group; and combinations thereof.

2) R ₃₂ ~R ₃₄ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,

3) T is S, O or Se.

The photosensitive resin composition according to one embodiment of the present invention may use the oxime ester compound of the chemical formula (9) alone or in combination of two or more thereof.

The initiator that can be used in combination with the above oxime ester compound is an initiator used in a photosensitive resin composition, and examples thereof include acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, and triazine compounds.

Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibuthoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloro methyl)-s-triazine, 2-biphenyl 4,6-bis(trichloro methyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

In addition to the above compound, the above initiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

The above initiator may be a radical polymerization initiator, and may be a peroxide-based compound, an azobis-based compound, etc.

Examples of the above peroxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydro peroxide, and t-butyl hydro peroxide; Dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butylperoxyvaleric acid n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyladipate; Examples include percarbonates such as di-3-methoxy butyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyaryl carbonate.

Examples of the above azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2, -azobis(methylisobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleic acid).

The above initiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, and dipentaerythritol tetrakis-3-mercapto propionate.

The above initiator may be included in an amount of 0.01 to 10 wt%, for example, 0.1 to 5 wt%, based on the total amount of the photosensitive resin composition. When the above initiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

(4) Colorant

To color the pattern, various pigments and dyes, such as pigments, can be used independently or together, and both organic and inorganic pigments can be used.

The above pigments include red pigments, green pigments, blue pigments, yellow pigments, black pigments, etc. The above pigments may be used alone or in combination of two or more, and are not limited to these examples.

Examples of the above red pigments include C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, etc.

Examples of the above green pigments include halogen-substituted copper phthalocyanine pigments such as C.I. Green Pigment 36, C.I. Green Pigment 7, etc.

Examples of the above blue pigments include copper phthalocyanine pigments such as C.I. Blue Pigment 15:6, C.I. Blue Pigment 15, C.I. Blue Pigment 15:1, C.I. Blue Pigment 15:2, C.I. Blue Pigment 15:3, C.I. Blue Pigment 15:4, C.I. Blue Pigment 15:5, C.I. Blue Pigment 16, and the like.

Examples of the above yellow pigments include isoindoline pigments such as C.I. Yellow Pigment 139, quinophthalone pigments such as C.I. Yellow Pigment 138, and nickel complex pigments such as C.I. Yellow Pigment 150.

Examples of the above black pigment include benzofuranone black, lactam black, aniline black, perylene black, titanium black, carbon black, etc. A dispersant may be used together to disperse the pigment in the photosensitive resin composition.

A dispersant may be used together with the photosensitive resin composition to disperse the pigment. Specifically, the pigment may be used by pre-surface-treating it with a dispersant, or the dispersant may be added together with the pigment during the production of the photosensitive resin composition. As the dispersant, a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. may be used.

Specific examples of the above dispersant include polyalkylene glycol and esters thereof, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxide adducts, alkyl amines, etc., and these may be used alone or in combination of two or more.

Examples of commercially available products of the above dispersant include BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, BASF's EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, and Zeneka's Solsperse 5000, Solsperse 12000, Solsperse These include 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, or Ajinomoto's PB711, PB821.

The above dispersant may be included in an amount of 0.1 to 15 wt% based on the total amount of the photosensitive resin composition. When the dispersant is included within the above range, the dispersibility of the photosensitive resin composition is excellent, and accordingly, the stability, developability, and patternability are excellent when producing a light-shielding layer.

The above pigment may also be used after being pretreated with a water-soluble inorganic salt and a wetting agent. When the above pigment is used after being pretreated as described above, the primary particle size of the pigment can be refined. The pretreatment may be performed through a step of kneading the pigment with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step. The kneading may be performed at a temperature of 40°C to 100°C, and the filtering and washing may be performed by washing the inorganic salt with water or the like, and then filtering.

Examples of the above water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride.

The above wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and the pigment to be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, and the like; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, and the like, and these may be used alone or in combination of two or more.

The pigment that has undergone the above-mentioned kneading step may have an average particle diameter of 20 nm to 110 nm. When the average particle diameter of the pigment is within the above range, it can effectively form a fine pattern while having excellent heat resistance and light resistance.

Meanwhile, specific examples of the dyes include C.I. solvent dyes, such as yellow dyes such as C.I. solvent yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163; red dyes such as C.I. solvent red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179; orange dyes such as C.I. solvent orange 2, 7, 11, 15, 26, 41, 45, 56, 62; C.I. Examples thereof include blue dyes such as C.I. Solvent Blue 5, 35, 36, 37, 44, 59, 67, 70; violet dyes such as C.I. Solvent Violet 8, 9, 13, 14, 36, 37, 47, 49; and green dyes such as C.I. Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35.

Among them, C.I. solvent dyes having excellent solubility in organic solvents are preferable, namely C.I. solvent yellow 14, 16, 21, 56, 151, 79, 93; C.I. solvent red 8, 49, 89, 111, 122, 132, 146, 179; C.I. solvent orange 41, 45, 62; C.I. solvent blue 35, 36, 44, 45, 70; C.I. solvent violet 13. In particular, C.I. solvent yellow 21, 79; C.I. solvent red 8, 122, 132; C.I. solvent orange 45, 62 are more preferable.

Also, C.I. As acid dyes, C.I. Acid Yellow 1, 3, 7, 9, 11, 17, 23, 25, 29, 34, 36, 38, 40, 42, 54, 65, 72, 73, 76, 79, 98, 99, 111, 112, 113, 114, 116, 119, 123, 128, 134, 135, 138, 139, 140, 144, 150, 155, 157, 160, 161, 163, 168, 169, 172, 177, 178, 179, 184, 190, 193, Yellow dyes such as 196, 197, 199, 202, 203, 204, 205, 207, 212, 214, 220, 221, 228, 230, 232, 235, 238, 240, 242, 243, 251; C.I. Acid Red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 182, 183, 198, 206, 211, 215, 216, 217, 227, 228, 249, 252, Red dyes such as 257, 258, 260, 261, 266, 268, 270, 274, 277, 280, 281, 195, 308, 312, 315, 316, 339, 341, 345, 346, 349, 382, 383, 394, 401, 412, 417, 418, 422, 426; Orange dyes such as C.I. Acid Orange 6, 7, 8, 10, 12, 26, 50, 51, 52, 56, 62, 63, 64, 74, 75, 94, 95, 107, 108, 169, 173; Blue dyes such as C.I. Acid Blue 1, 7, 9, 15, 18, 23, 25, 27, 29, 40, 42, 45, 51, 62, 70, 74, 80, 83, 86, 87, 90, 92, 96, 103, 112, 113, 120, 129, 138, 147, 150, 158, 171, 182, 192, 210, 242, 243, 256, 259, 267, 278, 280, 285, 290, 296, 315, 324:1, 335, 340; There are purple dyes such as C.I. Acid Violet 6B, 7, 9, 17, 19, 66; green dyes such as C.I. Acid Green 1, 3, 5, 9, 16, 25, 27, 50, 58, 63, 65, 80, 104, 105, 106, 109, etc.

Among the above acid dyes, C.I. Acid Yellow 42; C.I. Acid Red 92; C.I. Acid Blue 80, 90; C.I. Acid Violet 66; and C.I. Acid Green 27, which have excellent solubility in organic solvents, are preferable.

Also, as C.I. direct dyes, yellow dyes such as C.I. Direct Yellow 2, 33, 34, 35, 38, 39, 43, 47, 50, 54, 58, 68, 69, 70, 71, 86, 93, 94, 95, 98, 102, 108, 109, 129, 136, 138, 141; Red dyes such as C.I. Direct Red 79, 82, 83, 84, 91, 92, 96, 97, 98, 99, 105, 106, 107, 172, 173, 176, 177, 179, 181, 182, 184, 204, 207, 211, 213, 218, 220, 221, 222, 232, 233, 234, 241, 243, 246, 250; Orange dyes such as C.I. Direct Orange 34, 39, 41, 46, 50, 52, 56, 57, 61, 64, 65, 68, 70, 96, 97, 106, 107; C.I. Direct Blue 38, 44, 57, 70, 77, 80, 81, 84, 85, 86, 90, 93, 94, 95, 97, 98, 99, 100, 101, 106, 107, 108, 109, 113, 114, 115, 117, 119, 137, 149, 150, 153, 155, 156, 158, 159, 160, 161, 162, 163, 164, 166, 167, 170, 171, 172, 173, 188, 189, 190, Blue dyes such as 192, 193, 194, 196, 198, 199, 200, 207, 209, 210, 212, 213, 214, 222, 228, 229, 237, 238, 242, 243, 244, 245, 247, 248, 250, 251, 252, 256, 257, 259, 260, 268, 274, 275, 293; Examples thereof include purple dyes such as C.I. Direct Violet 47, 52, 54, 59, 60, 65, 66, 79, 80, 81, 82, 84, 89, 90, 93, 95, 96, 103, 104; green dyes such as C.I. Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82;

Also, yellow dyes such as C.I. Modanto dyes, such as C.I. Modanto Yellow 5, 8, 10, 16, 20, 26, 30, 31, 33, 42, 43, 45, 56, 61, 62, 65; Red dyes such as C.I. Modanto Red 1, 2, 3, 4, 9, 11, 12, 14, 17, 18, 19, 22, 23, 24, 25, 26, 30, 32, 33, 36, 37, 38, 39, 41, 43, 45, 46, 48, 53, 56, 63, 71, 74, 85, 86, 88, 90, 94, 95; Orange dyes, such as C.I. Modanto Orange 3, 4, 5, 8, 12, 13, 14, 20, 21, 23, 24, 28, 29, 32, 34, 35, 36, 37, 42, 43, 47, 48; blue dyes, such as C.I. Modanto Blue 1, 2, 3, 7, 8, 9, 12, 13, 15, 16, 19, 20, 21, 22, 23, 24, 26, 30, 31, 32, 39, 40, 41, 43, 44, 48, 49, 53, 61, 74, 77, 83, 84; Examples include purple dyes such as C.I. Modanto Violet 1, 2, 4, 5, 7, 14, 22, 24, 30, 31, 32, 37, 40, 41, 44, 45, 47, 48, 53, 58; and green dyes such as C.I. Modanto Green 1, 3, 4, 5, 10, 15, 19, 26, 29, 33, 34, 35, 41, 43, 53.

In the present invention, the dyes may be used singly or in combination of two or more.

The above pigment and dye may be included in an amount of 5 to 40 wt%, more specifically 8 to 30 wt%, based on the total amount of the photosensitive resin composition. When the pigment is included within the above range, the composition has an absorbance of 0.5/㎛ or more at a wavelength of 550 nm, and has excellent curability and adhesion of the pattern.

(5) Solvent

The solvent may be a substance that is compatible with, but does not react with, the binder resin, the reactive unsaturated compound, the pigment, and the initiator.

Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxy acetate alkyl esters such as methyl methoxy acetate, ethyl methoxy acetate, butyl methoxy acetate, methyl ethoxy acetate, and ethyl ethoxy acetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-Alkoxypropionic acid alkyl esters, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methyl propionic acid esters such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, etc.; monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl propionic acid alkyls such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; esters such as ethyl 2-hydroxypropionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxy acetate, methyl 2-hydroxy-3-methyl butanoate; ketone acid esters such as ethyl pyruvate, etc.

In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetnylacetone, isophorone, capronic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

Among the above solvents, taking into consideration compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

The solvent may be included as a remainder based on the total amount of the photosensitive resin composition, and specifically, may be included at 50 to 90 wt%. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the manufacture of a pattern layer.

Additionally, an additional embodiment of the present invention may provide a display device.

A display device according to an embodiment of the present invention is a display device including a first electrode formed on a substrate, a pixel separator formed on the first electrode so as to partially expose the first electrode, and a second electrode installed facing the first electrode, wherein the pixel separator is formed of a photosensitive resin composition having as an essential component a polymer having as a main component a structural unit represented by the chemical formula (9).

In the display device according to embodiments of the present invention, the details regarding the photosensitive resin composition are the same as those regarding the photosensitive resin composition according to embodiments of the present invention described above, and therefore, will be omitted.

The polymerization reaction product of the above photosensitive resin composition can be formed, for example, by a process of applying the photosensitive resin composition onto a TFT substrate and curing the applied photosensitive resin composition.

The above pixel separation unit can have excellent resolution and a high taper angle by including a polymerization reaction product of the photosensitive resin composition.

The above display device includes a plurality of pixels, and the pixel separation unit may be a layer that distinguishes the plurality of pixels.

For example, a light-emitting element is positioned in a pixel of the display device, and the light-emitting element may be an organic light-emitting element (see FIG. 1). The organic light-emitting element may be formed, for example, by forming a TFT layer (3) including a TFT (2) on a substrate (1), forming a flat layer (4) thereon, and then sequentially stacking a first electrode (5), a pixel separation unit (6), an organic layer (7), and a second electrode (8). In this example, the pixel separation unit (6) may be positioned on the first electrode, and the pixel separation unit may have an opening on the first electrode. The organic layer may be positioned within the opening and on the first electrode, and a second electrode may be positioned on the organic layer. Since the light-emitting area of the pixel is determined by the opening area of the pixel separation unit, the pixel separation unit described above may be a pixel definition layer.

In addition, the pixel separation portion is preferably a light-blocking layer that blocks light.

The pixel separation unit according to one embodiment of the present invention may have a high taper angle (9). For example, the pattern layer according to the embodiment of the present invention may have an inclination angle of 20 to 40 degrees. The inclination angle may be an inclination angle with respect to a direction parallel to the display surface at a point where the inclination starts.

The pixel separation part, which is the pixel definition layer described above, has an opening, and the inclined part connecting the opening part and the non-opening part has an inclined angle.

A pixel separation unit according to one embodiment of the present invention includes a polymerization reaction product of the photosensitive resin composition described above, wherein the photosensitive resin composition described above can form a pattern layer without residue, and can form a taper angle of 20 to 30 degrees by melting flow during a pattern formation process, and when the taper angle is formed to be 20 to 30 degrees, deposition defects that may occur in a deposition process of an organic light-emitting device can be reduced.

Accordingly, the pixel separation portion having a high inclination angle can reduce the length of the inclination portion, thereby reducing the distance between the apertures, allowing pixels to be arranged densely, and enabling the display device to have a high resolution.

In addition, it is preferable that the pixel separation portion according to the present invention is formed to cover the edge portion of the first electrode, and the thickness of the pixel separation portion is preferably 0.5 to 10 ㎛.

Another embodiment can form a pixel separation portion by patterning the photosensitive resin composition described above on an organic light-emitting element electrode.

Hereinafter, synthetic examples and examples according to the present invention are specifically described, but the synthetic examples and examples of the present invention are not limited thereto.

Synthetic example

First, the abbreviations for the compounds used in the synthetic examples and examples described below are as follows.

BPDA: 3,3',4,4'-Biphenyltetracarboxylic dianhydride

6FDA: 4,4'-(hexafluoroisopropylidene)diphthalic anhydride

ODPA: 4,4'-Oxydiphthalic anhydride

HEA: 2-hydroxyethyl acrylate

HEMA: 2-hydroxyethyl methacrylate

GLM: Glycidyl methacrylate

NMP: N-methyl-2-pyrrolidone

GBL: γ-butyloractone

DCC: N,N'-Dicyclohexylcarbodiimide

A resin comprising a repeating unit represented by chemical formula (1) according to the present invention is synthesized by the following <Reaction Scheme 1>, but is not limited thereto.

<Reaction Formula 1>

The above Ar ₁ to Ar ₃ , R ₁ , n, L and X are the same as defined in the above chemical formula 1.

Examples of the synthesis of specific compounds are as follows.

1. P1-1 Synthesis Example

<Reaction Formula 2>

In a nitrogen atmosphere, add 22.21 g (0.05 mol) of 6FDA, 14.31 g (0.11 mol) of HEMA, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone together with 30 g of NMP to a 250 ml three-necked flask, heat to 70°C, and stir for 10 hours. The completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, and 28.38 g (0.05 mol) of 4',4'"-(6-([1,1'-biphenyl]-4-yl)-1,3,5-triazine-2,4-diyl)bis(([1,1'-biphenyl]-4-amine)) was dissolved in 25 g of NMP and slowly added dropwise, reacted for 1 hour at 0°C, and reacted for 8 hours at room temperature. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 61.6 g of a powder (weight average molecular weight: 8,674 g/mol).

2. P1-6 Synthesis Example

<Reaction Formula 3>

In a nitrogen atmosphere, add 22.21 g (0.05 mol) of 6FDA, 15.64 g (0.11 mol) of GLM, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone together with 30 g of NMP to a 250 ml three-necked flask, heat to 70°C, and stir for 10 hours. After the completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, 24.47 g (0.05 mol) of 4,4'-(6-(naphthalen-1-yl)-1,3,5-triazine-2,4-diyl)bis(naphthalen-1-amine) dissolved in 25 g of NMP was slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 59.2 g of a powder (weight average molecular weight: 8,547 g/mol).

3. P1-29 Synthetic Example

<Reaction Formula 4>

In a nitrogen atmosphere, 16.81 g (0.05 mol) of 4,4'-Isopropylidenediphthalic anhydride, 12.77 g (0.11 mol) of HEA, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone were added together with 30 g of NMP in a 250 ml three-necked flask, and the mixture was heated to 70°C and stirred for 10 hours. After the completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, and 29.48 g (0.05 mol) of 3-(4-(4-(4-(4-aminophenoxy)phenyl)-6-(4-phenoxyphenyl)-1,3,5-triazin-2-yl)phenoxy)aniline was dissolved in 25 g of NMP and slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 56.1 g of a powder (weight average molecular weight: 8,562 g/mol).

4. P1-38 Synthesis Example

<Reaction Formula 5>

In a nitrogen atmosphere, 16.81 g (0.05 mol) of 4,4'-Isopropylidenediphthalic anhydride, 14.31 g (0.11 mol) of HEMA, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone were added together with 30 g of NMP in a 250-ml three-necked flask, and the mixture was heated to 70°C and stirred for 10 hours. The completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, 4',4'"-(6-(2,2'-bis(trifluoromethyl)-[1,1'-biphenyl]-4-yl)-1,3,5-triazine-2,4-diyl)bis(2,2'-bis(trifluoromethyl)-[1,1'-biphenyl]-4-amine) 48.78 g (0.05 mol) dissolved in 25 g of NMP was slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 75.9 g of powder. (Weight average molecular weight: 8,559 g/mol) was obtained.

5. P1-54 Synthetic Example

<Reaction Formula 6>

In a nitrogen atmosphere, 16.31 g (0.05 mol) of 5,5'-thiobis(isobenzofuran-1,3-dione), 14.31 g (0.11 mol) of HEMA, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone were added together with 30 g of NMP in a 250 ml three-necked flask, and the mixture was heated to 70°C and stirred for 10 hours. After the completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, and 33.19 g (0.05 mol) of 4,4'-(((6-(4-(phenylthio)phenyl)-1,3,5-triazine-2,4-diyl)bis(4,1-phenylene))bis(sulfanediyl))dianiline was dissolved in 25 g of NMP and slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 60.6 g of a powder (weight average molecular weight: 8,621 g/mol).

6. P1-80 Synthesis Example

<Reaction Formula 7>

In a nitrogen atmosphere, 15.51 g (0.05 mol) of ODPA, 15.64 g (0.11 mol) of GLM, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone were added together with 30 g of NMP in a 250 ml three-necked flask, heated to 70°C, and stirred for 10 hours. After the completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, and 30.48 g (0.05 mol) of 3,3'-(((6-(4-benzylphenyl)-1,3,5-triazine-2,4-diyl)bis(4,1-phenylene))bis(methylene))dianiline was dissolved in 25 g of NMP and slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 58.5 g of a powder (weight average molecular weight: 8,618 g/mol).

7. P1-90 Synthetic Example

<Reaction Formula 8>

In a nitrogen atmosphere, 14.71 g (0.05 mol) of BPDA, 14.31 g (0.11 mol) of HEMA, 17.40 g (0.22 mol) of pyridine, and 0.2 g (0.002 mol) of hydroquinone were added together with 30 g of NMP in a 250 ml three-necked flask, the temperature was raised to 70°C, and the mixture was stirred for 10 hours. After the completely dissolved solution was cooled to room temperature, 25 g of NMP was added, cooled with ice water, 20.633 g (0.1 mol) of DCC was added at 0°C, stirred for 2 hours, and 28.38 g (0.05 mol) of 3',3'"-(6-([1,1'-biphenyl]-3-yl)-1,3,5-triazine-2,4-diyl)bis(([1,1'-biphenyl]-4-amine)) was dissolved in 25 g of NMP and slowly added dropwise, and further reacted at 0°C for 1 hour, and then reacted at room temperature for 8 hours. After stirring, the obtained solution was slowly added dropwise to a 1:1 mixture of ethanol: water, solidified, and dried in a vacuum drying oven at 50°C for one day to obtain 54.5 g of a powder (weight average molecular weight: 8,534 g/mol).

A resin comprising a repeating unit represented by chemical formula (10) according to the present invention can be synthesized by the following method, but is not limited thereto.

Synthesis Example 1

(Preparation of compound 1-1)

9,9'-Bisphenol fluorene 20g (Sigma Aldrich), Glycidyl chloride (Sigma Aldrich) 8.67 g, 30 g of anhydrous potassium carbonate and 100 ml of dimethylformamide were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column, heated to 80°C and reacted for 4 hours, then the temperature was lowered to 25°C and the reaction solution was filtered. The filtrate was added dropwise to 1000 ml of water with stirring, the precipitated powder was filtered, washed with water and dried under reduced pressure at 40°C to obtain compound 1-1 (25 g). The obtained powder showed a purity of 98% as a result of purity analysis by HPLC.

<Compound 1-1>

Synthesis Example 2

(Preparation of compounds 2-1 to 2-3)

25 g (54 mmol) of compound 1-1 obtained in Synthetic Example 1, 8 g of acrylic acid (Daejung Chemicals & Metals Co., Ltd.), 0.2 g of benzyltriethylammonium chloride (Daejung Chemicals & Metals Co., Ltd.), 0.2 g of hydroquinone (Daejung Chemicals & Metals Co., Ltd.), and 52 g of toluene (Sigma Aldrich Co., Ltd.) were placed in a 300 ml 3-necked round-bottom flask equipped with a distillation column and stirred at 110°C for 6 hours. After completion of the reaction, toluene was removed by distillation under reduced pressure to obtain the product. After 500 g of silica gel 60 (230-400 mesh, Merck Co., Ltd.) was charged into a glass column having a diameter of 220 mm, 20 g of the product was charged, and separation was performed using 10 L of a solvent containing a mixture of hexane and ethyl acetate in a volume ratio of 4:1 to isolate compounds 2-1 to 2-3.

<Compound 2-1>

<Compound 2-2>

<Compound 2-3>

Synthetic examples 3 to 9

(Manufacture of Polymer 1-1 to Polymer 1-7)

Compounds 2-1, 2-2, and 2-3 obtained in Synthetic Example 2 were placed in a 50 ml 3-necked round-bottom flask equipped with a distillation column, as shown in Table 1 below, and 0.1 g of tetraethylammonium bromide (Daejung Chemicals & Metals Co., Ltd.), 0.03 g of hydroquinone (Daejung Chemicals & Metals Co., Ltd.), and 8.05 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) were added to the 50 ml 3-necked round-bottom flask equipped with a distillation column, and 1.22 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 0.38 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were additionally added, and then stirred at 110°C for 6 hours. After completion of the reaction, the reaction solution was recovered, and polymers 1-1 to 1-7 having repeating units such as compounds 2-1, 2-2, and 2-3 were obtained in the form of solutions containing 45% solid content. The weight-average molecular weight (Mw) of the synthesized polymers was analyzed using gel permeation chromatography (Agilent).

Synthesis Example 3
(Polymer 1-1) Synthesis Example 4
(Polymer 1-2) Synthesis Example 5
(Polymer 1-3) Synthesis Example 6
(Polymer 1-4) Synthesis Example 7
(Polymer 1-5) Synthesis Example 8
(Polymer 1-6) Synthesis Example 9
(Polymer 1-7) Compound 2-1 3 g 1 g 1 g 4.25 g 0.25 g 5 g 0 g Compound 2-2 1 g 3 g 1 g 0.25 g 4.25 g 0 g 5 g Compound 2-3 1 g 1 g 3 g 0.5 g 0.5 g 0 g 0 g Weight average
Molecular weight 4,800 g/mol 4,200 g/mol 4,600 g/mol 4,400 g/mol 4,100 g/mol 5,200 g/mol 3,300 g/mol

Synthesis Example 10

(Preparation of compound 3-1)

In a 3-neck round-bottom flask equipped with a distillation column connected to cooling water, 20 g (0.147 mol) of trichloro silane (Gelest) and 17.51 g (0.147 mol) of 6-chloro-1-hexene (Aldrich) were dissolved in 200 ml of ethyl acetate, 0.02 g of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex solution (2 wt% in xylene / Aldrich) was added, nitrogen was added, the temperature was increased to 75°C, and the reaction was performed for 5 hours. The solution was then filtered through a 0.1 μm Teflon membrane to remove the platinum catalyst. After that, 15.6 g (0.487 mol) of methanol was added dropwise at room temperature for 30 minutes, then the temperature was raised to 50℃ and reacted for 2 more hours. The reaction solution was distilled under reduced pressure to remove the solvent. 24 g (0.1 mol) of 6-Chlorohexyltrimethoxysilane thus obtained, 8 g (0.15 mol) of sodium methoxide (Aldrich), 187 ml (0.15 mol) of hydrogen sulfide THF solution (0.8 M concentration), and 100 ml of methanol were placed in an autoclave and the reaction was performed at 100℃ for 2 hours. After cooling the reaction solution, 100 ml of hydrogen chloride in methanol (1.25 M concentration) was added dropwise at room temperature for 30 minutes, the generated salt was filtered off, and distilled under reduced pressure to obtain compound 3-1 (23 g).

<Compound 3-1>

Synthesis Example 11

(Preparation of compound 3-2)

Compound 3-2 (24 g) was obtained by synthesizing in the same manner as in Synthesis Example 10, except that 9-Chloro-1-nonene (AK Scientific) 23.7 (0.147 mol) was used instead of 6-chloro-1-hexene in Synthesis Example 10.

<Compound 3-2>

Synthesis Example 12

(Preparation of compound 3-3)

Compound 3-3 (26 g) was obtained by synthesizing in the same manner as in Synthesis Example 10, except that 30 g (0.147 mol) of 12-Chloro-1-dodecene (Atomax Chemicals) was used instead of 6-chloro-1-hexene in Synthesis Example 10.

<Compound 3-3>

Synthesis Example 13

(Preparation of compounds 3-4)

Compound 3-4 (24 g) was obtained by synthesizing in the same manner as in Synthesis Example 10, except that 22.4 g (0.487 mol) of ethanol (Aldrich) was used instead of the methanol introduced after removing platinum in Synthesis Example 10.

<Compound 3-4>

Synthesis Example 14

(Preparation of compounds 3-5)

Compound 3-5 (27 g) was obtained by synthesizing in the same manner as in Synthesis Example 10, except that 36 g (0.487 mol) of 1-butanol (Aldrich) was used instead of the methanol introduced after removing platinum in Synthesis Example 10.

<Compound 3-5>

Synthesis Example 15

(Preparation of compounds 3-6)

Compound 3-6 (22 g) was obtained by synthesizing in the same manner as in Synthesis Example 10, except that 18 g (0.147 mol) of dichloromethylsilane was used instead of trichlorosilane in Synthesis Example 10.

<Compound 3-6>

Synthesis Example 16

(Manufacture of Polymer 2-1)

In 360 g of the solution of Polymer 1-1 manufactured in Synthesis Example 3, 6.36 g (34 mmol) of KBM 803 [3-(Trimethoxysilyl)-1-propanethiol] (Shinetsu Corporation), which is the same as Compound 3-7 below, was added, the temperature was increased to 60°C, and stirred for 4 hours to obtain Polymer 2-1, a cardo-based binder resin substituted with a silane group, which is the same as Compound 3-7 below.

<Compound 3-7>

Synthesis examples 17 to 22

(Manufacture of Polymer 2-2 to Polymer 2-7)

Except that Polymer 1-2 to Polymer 1-7 described in Table 2 below were used instead of the solution of Polymer 1-1 in Synthesis Example 16, silane group-substituted cardo-based binder resins Polymer 2-2 to Polymer 2-7 were prepared in the same manner as Synthesis Example 16.

The weight average molecular weights of Polymer 2-1 to Polymer 2-7 synthesized in Synthesis Examples 16 to 22 are as shown in Table 2 below.

Synthesis Example 16
(Polymer 2-1) Synthesis Example 17
(Polymer 2-2) Synthesis Example 18
(Polymer 2-3) Synthesis Example 19
(Polymer 2-4) Synthetic example
20
(Polymer 2-5) Synthetic example
21
(Polymer 2-6) Synthesis Example 22
(Polymer 2-7) Polymer backbone Polymer 1-1 Polymer 1-2 Polymer 1-3 Polymer 1-4 Polymer 1-5 Polymer 1-6 Polymer 1-7 Silane group Compound 3-7 Compound 3-7 Compound 3-7 Compound 3-7 Compound 3-7 Compound 3-7 Compound 3-7 Weight average
Molecular weight 4,880 g/mol 4,250 g/mol 4,680 g/mol 4,430 g/mol 4,140 g/mol 5,270 g/mol 3,320 g/mol

(Manufacture of Polymer 3-1)

8.1 g (34 mmol) of 6-(Trimethoxysilyl)-1-hexanethiol (compound 3-1) was added to 360 g of the solution of Polymer 1-1 manufactured in the above Synthesis Example 3, the temperature was raised to 60°C, and stirred for 4 hours to obtain a cardo-based binder resin Polymer 3-1 having a silane group substituted like compound 3-1.

Synthesis examples 24 to 29

(Manufacture of Polymer 3-2 to Polymer 3-7)

Except that Polymer 1-2 to Polymer 1-7 described in Table 3 below were used instead of the solution of Polymer 1-1 in Synthesis Example 23, silane group-substituted cardo-based binder resins Polymer 3-2 to Polymer 3-7 were prepared in the same manner as in Synthesis Example 23.

The weight average molecular weights of Polymer 3-1 to Polymer 3-7 synthesized in Synthesis Examples 23 to 29 are as shown in Table 3 below.

Synthesis Example 23
(Polymer 3-1) Synthesis Example 24
(Polymer 3-2) Synthesis Example 25
(Polymer 3-3) Synthesis Example 26
(Polymer 3-4) Synthetic example
27
(Polymer 3-5) Synthetic example
28
(Polymer 3-6) Synthesis Example 29
(Polymer 3-7) Polymer backbone Polymer 1-1 Polymer 1-2 Polymer 1-3 Polymer 1-4 Polymer 1-5 Polymer 1-6 Polymer 1-7 Silane group Compound 3-1 Compound 3-1 Compound 3-1 Compound 3-1 Compound 3-1 Compound 3-1 Compound 3-1 Weight average
Molecular weight 4,900 g/mol 4,280 g/mol 4,690 g/mol 4,470 g/mol 4,160 g/mol 5,290 g/mol 3,360 g/mol

Synthesis Example 30

(Manufacture of Polymer 4-1)

9.53 g (34 mmol) of 6-(Triethoxysilyl)-1-hexanethiol (compound 3-4) was added to 360 g of the solution of Polymer 1-1 manufactured in the above Synthesis Example 3, the temperature was raised to 60°C, and stirred for 4 hours to obtain Polymer 4-1, a cardo-based binder resin substituted with a silane group like compound 3-4.

Synthesis examples 31 to 36

(Manufacture of Polymer 4-2 to Polymer 4-7)

Except that Polymer 1-2 to Polymer 1-7 described in Table 4 below were used instead of the solution of Polymer 1-1 in Synthesis Example 30, silane group-substituted cardo-based binder resins Polymer 4-2 to Polymer 4-7 were prepared in the same manner as in Synthesis Example 30.

The weight average molecular weights of Polymer 4-1 to Polymer 4-7 synthesized in Synthesis Examples 30 to 36 are as shown in Table 3 below.

Synthesis Example 30
(Polymer 4-1) Synthesis Example 31
(Polymer 4-2) Synthesis Example 32
(Polymer 4-3) Synthesis Example 33
(Polymer 4-4) Synthetic example
34
(Polymer 4-5) Synthetic example
35
(Polymer 4-6) Synthesis Example 36
(Polymer 4-7) Polymer backbone Polymer 1-1 Polymer 1-2 Polymer 1-3 Polymer 1-4 Polymer 1-5 Polymer 1-6 Polymer 1-7 Silane group Compound 3-4 Compound 3-4 Compound 3-4 Compound 3-4 Compound 3-4 Compound 3-4 Compound 3-4 Weight average
Molecular weight 4,900 g/mol 4,290 g/mol 4,690 g/mol 4,480 g/mol 4,180 g/mol 5,290 g/mol 3,380 g/mol

Synthesis Example 37

(Preparation of compound 5-1)

20 g of pentaerythritol (Sigma Aldrich) and 42.77 g of acrylic acid (Sigma Aldrich) were placed together with 100 g of toluene in a 300 ml 3-necked round-bottom flask equipped with a distillation column and a Dean-Stark column, 1 g of sulfuric acid was added, the temperature was increased to 110°C, and reacted for 8 hours. Then, the temperature was lowered to 25°C, and the reaction solution was washed three times with 200 ml of a 10 wt% aqueous solution of Na ₂ CO ₃ and once with 200 ml of water. The upper organic solution was dried under reduced pressure at 40°C to obtain 50 g of compound 5-1.

Compound 5-1

Synthesis Example 38

(Preparation of compound 6-1)

In a 300 mL 3-necked round-bottom flask in N ₂ atmosphere, 10 g of 1-methoxynaphthalene (TCI) and 12.7 g of 3-oxo-3-phenylpropanoyl chloride were added to 120 mL of dichloroethane, stirred to dissolve, and cooled to 5°C. 9.27 g of aluminum chloride (Aldrich) was added little by little over 30 minutes, stirred for 1 hour, warmed to room temperature, and stirred for 2 hours. 100 mL of 1 N HCl aqueous solution was added to the reaction solution, stirred, and the organic layer was collected, washed 3 times with 100 mL of distilled water, distilled under reduced pressure, and separated using a silica gel column to obtain 13.4 g of compound 6-1.

Compound 6-1

Synthesis Example 39

(Preparation of compound 6-2)

10 g of compound 5-1 obtained in Synthetic Example 16 and 27.8 g of N,N-Dimethylformamide (Aldrich) were placed in a 100 mL 3-necked round-bottom flask under a N2 atmosphere and dissolved, cooled to 5°C, 5.5 g of a 35 wt% HCl aqueous solution and 8 g of isobutyl acetate (Aldrich) were added dropwise to the reactor over 30 minutes, and reacted for 10 hours. After the reaction, washing was performed five times with 100 mL of distilled water, followed by distillation under reduced pressure and separation using a silica gel column to obtain 5.48 g of compound 6-2.

Compound 6-2

Synthesis Example 40

(Preparation of compound 6-3)

In a 100 mL 3-necked round-bottom flask in N ₂ atmosphere, 5 g of compound 5-2 obtained in Synthesis Example 39 and 1.4 g of acetyl chloride were added and dissolved in 50 mL of dichloro ethane, cooled to 5°C, 1.8 g of triethyl amine was added dropwise over 30 minutes, then raised to room temperature and stirred for 2 hours. After washing three times with 100 mL of distilled water, distillation under reduced pressure and separation using a silica gel column were performed, to obtain 4.5 g of compound 6-3.

Compound 6-3

Manufacturing example 1

(Preparation of black pigment dispersion)

A dispersion was obtained by dispersing 15 g of black pigment (Irgaphor® Black S 0100CF, BASF), 8.5 g of Disperbyk 163 (BYK), 5.5 g of V259ME (Nippon Steel Chemical), 71 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) for 10 hours using a paint shaker (Asada).

Examples 1 to 9

A photosensitive composition was prepared with the composition shown in Table 5 below.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Black pigment dispersion of manufacturing example 1 32 32 32 32 32 32 32 32 32 Compound 5-1 6 6 6 6 6 6 6 6 6 Compound 6-3 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 P1-1 2 2 2 2 2 2 - - - P1-6 - - - - - - 2 3 1 Polymer 1-1 4 - - - - - 4 - - Polymer 1-2 - 4 - - - - - - - Polymer 1-3 - - 4 - - - - - - Polymer 2-1 - - - 4 - - - 3 5 Polymer 2-2 - - - - 4 - - - - Polymer 2-3 - - - - - 4 - - - Propylene glycol methyl ether acetate (Daicel) 55.5 55.5 55.5 55.5 55.5 55.5 55.5 55.5 55.5

Comparative examples 1 to 4

A photosensitive composition was prepared with the composition shown in Table 6 below.

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Black pigment dispersion of manufacturing example 1 32 32 32 32 Compound 5-1 6 6 6 6 Compound 6-3 0.5 0.5 0.5 0.5 P1-1 2 2 - - Comparative compound A - - 2 - Comparative compound B - - - 2 Polymer 2-1 - - 4 4 Polymer 1-6 4 - - - Polymer 2-7 - 4 - - Propylene glycol methyl ether acetate (Daicel) 55.5 55.5 55.5 55.5

The repeating unit structure and weight average molecular weight of the above comparative compounds A and B are as follows.

Comparative compound A

Weight average molecular weight: 8,460 g/mol

Comparative compound B

Weight average molecular weight: 8,680 g/mol

The method for manufacturing a light-shielding layer using the composition according to Table 5 and Table 6 above is as follows (photolithography step).

(1) Application and film formation stage

The above-described black photosensitive resin composition was applied to a washed 10 cm x 10 cm ITO/Ag substrate using a spin coater to a thickness of 1.5 ㎛, and then heated at 100° C. for 1 minute to remove the solvent, thereby forming a coating film.

(2) Exposure stage

In order to form a necessary pattern on the obtained film, a mask of a predetermined shape was interposed, and then an active line of 190 nm to 500 nm was irradiated. MA-6 was used as the exposure device, and the exposure dose was 100 mJ/cm ² .

(3) Phenomenon stage

Following the above exposure step, the film was developed by dipping in AZEM Corporation's AX 300 MIF developer at 25°C for 1 minute, and then washed with water to dissolve and remove the unexposed portion, leaving only the exposed portion to form an image pattern.

(4) Post-processing step

In order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc., the image pattern obtained by the above phenomenon was post-baked in an oven at 230°C for 30 minutes.

(5) Measurement of minimum pattern size above the description

The minimum pattern size of the patterns of the photosensitive compositions of Examples 1 to 9 and Comparative Examples 1 to 4 obtained through the above post-processing step was measured on a substrate using an optical microscope (Nikon).

(6) Outgas measurement

The photosensitive compositions of Examples 1 to 9 and Comparative Examples 1 to 4 were cut into a size of 1 cm x 3 cm after forming a film on a glass substrate through steps (1) to (4) above to prepare six specimens each. The outgas was captured for 30 minutes at 250°C using JTD-505² from JAI. After measuring toluene black samples (100, 500, 1,000 ppm) using QP2020 GC/MS from Shimadzu, a calibration curve was created, and the amount of outgas generated from the captured samples was measured.

The outgassing amount of the patterns obtained through the above photolithography step and the maximum resolution of the pattern formed on the substrate (the minimum size pattern on the substrate) were measured and shown in Tables 7 and 8.

Photosensitive composition Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Minimum pattern size (㎛) above the substrate 3.5 3.4 3.5 2.3 2.2 2.4 3.6 3.9 2.1 Outgassing (ppm) 2.4 2.5 2.6 3.5 3.6 3.1 2.3 2.1 3.8

Photosensitive composition Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Minimum pattern size (㎛) above description 7.5 6.8 6.0 5.4 Outgassing (ppm) 3.9 4.7 4.3 4.5

As can be seen from the results in Tables 7 and 8 above, when a photolithography process was performed using a binder resin containing a repeating unit represented by the chemical formula (1) and a resin containing a repeating unit represented by the chemical formula (10) (Examples 1 to 9), the minimum pattern size on the substrate was smaller than in Comparative Examples 1 to 4 using Comparative Compound A or Comparative Compound B and Polymer 1-6 or Polymer 2-7, so not only was the resolution excellent, but the amount of outgas generated was also significantly reduced.

More specifically, the resin comprising a repeating unit represented by the chemical formula (1) and Comparative Compound A and Comparative Compound B are similar in that they are formed of repeating units in which a triazine moiety and an acrylic moiety are bonded to a polyimide or polyamic acid moiety, but the resin comprising a repeating unit represented by the chemical formula (1) is a linear polyimide, not a heterocyclic polyimide like Comparative Compound B, and differs in that two acrylic groups are substituted per repeating unit.

Here, when examining the minimum pattern size and outgassing amount measurement values of Example 4 in Table 7 and Comparative Examples 3 and 4 in Table 8, where all the remaining components of the photosensitive composition except for the polyimide-based resin are the same, it can be confirmed that the properties of the resin significantly differ depending on the linear polyimide structure and the number and position of substitutions of acrylic groups, even though Comparative Compound A and Comparative Compound B and the resin including the repeating unit represented by Chemical Formula (1) are composed of similar components, and it can be seen that the resin including the repeating unit represented by Chemical Formula (1) has two or more acrylic groups substituted in the main chain consisting of linear polyimide and triazine, so that the resolution and outgassing characteristics become suitable for the photolithography process, and exhibit characteristics suitable as a material for the pixel separation portion of an organic light-emitting device.

That is, in order to examine the effect of a resin including a repeating unit represented by chemical formula (1), compounds having relatively high structural similarity were set as a comparison group, but in conclusion, since comparative compounds A and comparative compounds B are structurally different from the resin including a repeating unit represented by chemical formula (1), the chemical and physical properties of the resin are significantly different, and therefore, when photolithography evaluation was performed using the resin including a repeating unit represented by chemical formula (1), significantly superior evaluation results that were completely unexpected by those skilled in the art were derived.

In addition, when comparing Examples 1 to 6 in Table 7 and Comparative Examples 1 and 2 in Table 8, in which all remaining components of the photosensitive composition are the same except for the cardo resin, it can be confirmed that the minimum size pattern on the substrate and the outgas characteristics greatly differ depending on the main chain structure of the cardo resin, and it can be confirmed that the minimum size pattern on the substrate and the outgas characteristics are greatly improved when the cardo resin included in the structure of chemical formula (10) of the present invention is used.

In summary, it can be seen that the resolution and outgas generation characteristics of Examples 1 to 9, which used the polyimide-based resin included in the structure of chemical formula (1) of the present invention and the cardo-based resin included in the structure of chemical formula (10) of the present invention together, are much better than those of Comparative Examples 1 to 2, which used the polyimide-based resin included in the structure of chemical formula (1) of the present invention and the cardo-based resin having a structure not included in the structure of chemical formula (1) of the present invention, and Comparative Examples 3 to 4, which used the polyimide-based resin not included in the structure of chemical formula (1) of the present invention and the cardo-based resin having a structure included in chemical formula (10) of the present invention, and thus exhibited properties suitable as a material for the pixel separation portion of an organic light-emitting device. That is, it can be seen through the above results that when a photolithographic evaluation of a photosensitive composition including a resin including a repeating unit represented by chemical formula (1) and a resin including a repeating unit represented by chemical formula (10) was performed, remarkably excellent evaluation results that were completely unexpected by those skilled in the art were derived.

The above description is merely an example of the present invention, and those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in this specification are not intended to limit the present invention but to explain it, and the spirit and scope of the present invention are not limited by these embodiments. The protection scope of the present invention should be interpreted by the claims, and all techniques within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

1: Substrate 2: TFT
3: TFT layer 4: Flat layer
5: First electrode 6: Pixel separation unit
7: Organic layer 8: Second electrode
9: Taper angle

Claims (16)

A photosensitive resin composition comprising a resin comprising a repeating unit represented by the following chemical formula (1); a resin comprising a repeating unit represented by the following chemical formula (10); a reactive unsaturated compound; an initiator; a colorant and a residual solvent:
Chemical formula (1)

In the above chemical formula (1),
1) X is a single bond, O, S, CR _a R _b , NR, CH ₂ , C=O, SO ₂ or C(CF ₃ ) ₂ ,
2) R _a and R _b are each independently hydrogen; deuterium; halogen; CF ₃ ; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof; or adjacent groups may form a ring; or may form a spiro ring,
3) R ² and R ³ are each independently hydrogen; deuterium; halogen; CF ₃ ; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₃ to C ₂₀ cycloalkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof; or adjacent groups may form a ring,
4) a and b are integers from 1 to 3, independently of each other.
5) n is an integer between 2 and 100,000,
6) A ¹ is the following chemical formula (A),
Chemical formula (A)

In the above chemical formula (A),
6-1) L is a C ₆ ~ C ₆₀ arylene group; a C ₁ ~ C ₂₀ alkylene group; a C ₂ ~ C ₂₀ alkenylene group; a fluorenylene group; a C ₂ ~ C ₆₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₃ ~ C ₆₀ aliphatic ring and a C ₆ ~ C ₆₀ aromatic ring; or a combination thereof,
6-2) R ¹ is a hydroxy group; an ester group; a C ₃ to C ₂₀ cycloalkyl group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof,
7) Ar ₂ is hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl group; or a combination thereof,
8) Ar ₁ and Ar ₃ are each independently a C ₆ to C ₆₀ arylene group; a C ₁ to C ₂₀ alkylene group; a C ₂ to C ₂₀ alkenylene group; a fluorenylene group; a C ₂ to C ₆₀ heterocyclic group including at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₃ to C ₆₀ aliphatic ring and a C ₆ to C ₆₀ aromatic ring; chemical formula (B); chemical formula (C); or a combination thereof,
Chemical Formula (B) Chemical Formula (C)

In the above chemical formula (B) and chemical formula (C),
8-1) R ⁴ ~ R ⁶ are each independently hydrogen; deuterium; halogen; CF ₃ ; a cyano group; an ester group; an amide group; an imide group; a C ₆ ~ C ₃₀ aryl group; a C ₂ ~ C ₃₀ heterocyclic group containing at least one heteroatom selected from O, N, S, Si and P; a fused ring group of a C ₆ ~ C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~ C ₂₀ alkyl group; a C ₃ ~ C ₂₀ cycloalkyl group; a C ₂ ~ C ₂₀ alkenyl group; a C ₂ ~ C ₂₀ alkynyl group; a C ₁ ~ C ₂₀ alkoxy group; a C ₆ ~ C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ ~ C ₂₀ alkoxycarbonyl group; or a combination of these; or adjacent groups may form rings,
8-2) Y is a single bond, O, S, CO, CR'R" or SO ₂ ,
8-3) R' and R" are each independently hydrogen; deuterium; halogen; CF ₃ ; cyano group; ester group; amide group; imide group; C ₆ ~ C ₃₀ aryl group; C ₂ ~ C ₃₀ heterocyclic group including at least one heteroatom of O, N, S, Si and P; C ₆ ~ C ₃₀ fused ring group of aliphatic ring and aromatic ring; C ₁ ~ C ₂₀ alkyl group; C ₃ ~ C ₂₀ cycloalkyl group; C ₂ ~ C ₂₀ alkenyl group; C ₂ ~ C ₂₀ alkynyl group; C ₁ ~ C ₂₀ alkoxy group; C ₆ ~ C ₃₀ aryloxy group; fluorenyl group; carbonyl group; ether group; C ₁ ~ C ₂₀ alkoxycarbonyl group; or these may be a combination; or may form a ring between adjacent groups; or may form a spy ring;
8-4) c and d are independent integers from 1 to 4,
8-5) e is an integer from 1 to 6.
9) The rings formed by bonding the above R _a ~R _b , R ¹ ~R ⁶ , R'~R" , Ar ₁ ~Ar ₃ , L and adjacent groups are each independently a deuterium; a halogen; a C ₁ ~C ₃₀ alkyl group or a C ₆ ~C ₃₀ aryl group substituted or unsubstituted with a silane group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C ₁ ~C 30 alkylthio group; a C ₁ ~C ₃₀ alkoxy group; a C ₆ ~C ₃₀ arylalkoxy group; a C 1 ~C 30 alkyl group; a C 2 ~C ₃₀ alkenyl group; a C ₂ ~C ₃₀ alkynyl group; a C 6 ~C ₃₀ aryl group; a C ₆ ~C 30 group substituted with deuterium; a halogen; a C ₁ ~C ₃₀ alkyl group or a C ₆ ~C ₃₀ aryl group; a C ₆ ~C ₃₀ group substituted with deuterium. An aryl group; a fluorenyl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; a C ₃ to C ₃₀ aliphatic ring group; a C ₇ to C ₃₀ arylalkyl group; a C ₈ to C _{30 arylalkenyl group; and combinations thereof, wherein the C 3 to C 30} aliphatic ring group is further substituted with one or more substituents selected from the group consisting of; and adjacent substituents may form a ring,

Chemical formula (10)

In the above chemical formula (10),
10-1) * indicates the part where the combination is connected as a repeating unit,
10-2) R ⁴¹ and R ⁴² are each independently hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,
10-3) R ⁴¹ and R ⁴² are each capable of forming adjacent tile rings,
10-4) a' and b' are independent integers from 0 to 4,
10-5) X ⁴¹ is a single bond, O, CO, SO ₂ , CR'R", SiR'R", chemical formula (4-1) or chemical formula (4-2),
10-6) X ⁴² is a C ₆ ~ C ₃₀ aryl group; a C ₂ ~ C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~ C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~ C ₂₀ alkyl group; a C ₂ ~ C ₂₀ alkenyl group; a C ₂ ~ C ₂₀ alkynyl group; a C ₁ ~ C ₂₀ alkoxy group; a C ₆ ~ C ₃₀ aryloxy group; or a combination thereof,
10-7) R' and R" are each independently hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,
10-8) R' and R" are each capable of forming adjacent tile rings,
10-9) A ⁴¹ and A ⁴² are independently chemical formula (4-3) or chemical formula (4-4),
10-10) The ratio of chemical formula (4-3) and chemical formula (4-4) in the polymer chain of the resin including the repeating unit represented by chemical formula (10) satisfies 1:9 to 9:1,
Chemical formula (4-1)

Chemical Formula (4-2)

In the above chemical formulas (4-1) and (4-2),
11-1) * indicates the binding position,
11-2) X ⁴³ is O, S, SO ₂ or NR',
11-3) R' is hydrogen; deuterium; halogen; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group,
11-4) R ⁴³ ~R ⁴⁶ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,
11-5) R ⁴³ ~R ⁴⁶ can form adjacent tile rings, respectively.
11-6) c'~f' are independent integers from 0 to 4,
Chemical formula (4-3)

Chemical formula (4-4)

In the above chemical formulas (4-3) and (4-4),
12-1) * indicates the binding position,
12-2) R ⁴⁷ ~R ⁵⁰ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,
12-3) Y ⁴¹ and Y ⁴² are independently chemical formula (4-5) or chemical formula (4-6),
Chemical formula (4-5)

Chemical formula (4-6)

In the above chemical formulas (4-4) and (4-6),
13-1) * indicates the binding position,
13-2) R ⁵¹ ~R ⁵⁵ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,
13-3) L ⁴¹ ~L ⁴³ are independently a single bond, C ₁ ~C ₃₀ alkylene, C ₆ ~C ₃₀ arylene, or C ₂ ~C ₃₀ heterocycle,
13-4) g' and h' are independent integers from 0 to 3; however, g'+h'= 3,
14) The rings formed by bonding the above R ⁴¹ to R ⁵⁵ , R', R", X ⁴¹ to X ⁴² and L ⁴¹ to L ⁴³ and the adjacent groups are each independently a deuterium; a halogen; a silane group substituted or unsubstituted with a C ₁ to C ₃₀ alkyl group or a C ₆ to C ₃₀ aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C ₁ to C ₃₀ alkylthio group; a C ₁ to C ₃₀ alkoxy group; a C ₆ to C 30 arylalkoxy group; a C ₁ to C ₃₀ alkyl group; a C 2 to C ₃₀ alkenyl group; a C ₂ to C ₃₀ alkynyl group; a C 6 to C 30 aryl group; a C ₆ to C _{30 group substituted with deuterium; a halogen; a C 1 to C 30} alkyl group or a C ₆ to C ₃₀ aryl group; a C ₆ to C A C 2 to C ₃₀ heterocyclic group containing at least one heteroatom selected from the group consisting of a C ₃ to C 30 aryl group; a fluorenyl group; a C 2 to C ₃₀ heterocyclic group; a C ₃ to C ₃₀ aliphatic ring group; a C ₇ to C ₃₀ arylalkyl group; a C 8 to C 30 arylalkenyl group; and combinations thereof may be further substituted with one or more substituents selected from the group consisting of a C 3 to C 30 aryl group; a C 3 to C 30 arylalkyl group; a C ₈ to C ₃₀ arylalkenyl group; and combinations thereof, and adjacent substituents may form a ring. A photosensitive resin composition, characterized in that in claim 1, the repeating unit represented by the chemical formula (1) is represented by any one of the following chemical formulas (2) to (7).
Chemical formula (2) Chemical formula (3)

Chemical formula (4) Chemical formula (5)

Chemical formula (6) Chemical formula (7)

In the above chemical formulas (2) to (7), the definition of the substituent is the same as that defined in chemical formula (1) of the first paragraph. A photosensitive resin composition characterized in that in claim 1, the weight average molecular weight of the resin represented by the repeating unit represented by the chemical formula (1) is 5,000 to 200,000. In claim 1, a resin characterized in that the repeating unit represented by the chemical formula (1) is any one of the following P1-1 to P1-122:




























































A photosensitive resin composition, characterized in that in claim 1, the total amount of the resin including the repeating unit represented by the chemical formula (1) and the resin including the repeating unit represented by the chemical formula (10) is 1 to 40 wt% based on the total amount of the photosensitive resin composition. A photosensitive resin composition, characterized in that in claim 1, the reactive unsaturated compound is contained in an amount of 1 to 40 wt% based on the total amount of the photosensitive resin composition. A photosensitive resin composition according to claim 1, characterized in that the reactive unsaturated compound comprises a compound represented by the following chemical formula (8):
Chemical formula (8)

In the chemical formula (8), at least two of Z ₁ to Z ₄ independently have a structure of the following chemical formula (G); the remaining Z ₁ to Z ₄ independently represent hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group including at least one heteroatom selected from O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; Or an alkoxycarbonyl group of C ₁ to C ₂₀ ,
Chemical formula (G)

In the above chemical formula (G),
1) t is an integer from 1 to 20,
2) L ₄ is a single bond, C ₁ ~ C ₃₀ alkylene, C ₆ ~ C ₃₀ arylene, or C ₂ ~ C ₃₀ heterocycle,
3) Y ₃ is the following chemical formula (H) or chemical formula (I),
Chemical formula (H)

Chemical formula (I)

In the above chemical formula (H), R ₂₁ is hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group. A photosensitive resin composition, characterized in that in claim 1, the photoinitiator is contained in an amount of 0.01 to 10 wt% based on the total amount of the photosensitive resin composition. A photosensitive resin composition, characterized in that in claim 1, the photoinitiator comprises a compound represented by the following chemical formula (9):
Chemical formula (9)

In the above chemical formula (9),
1) u ₁ ~u ₃ are integers of 0 or 1, independently of each other,
2) L ₅ and L ₈ have the following chemical formula (J),
3) L ₆ , L ₇ and L ₉ are each independently a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group including at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₃ to C ₃₀ aliphatic ring group; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; a C ₁ to C ₂₀ alkoxycarbonyl; a C ₁ to C ₃₀ alkylene or a C ₆ to C ₃₀ arylene,
Chemical formula (J)

In the above chemical formula (J), R ₃₁ is hydrogen, deuterium, halogen, a methyl group, an ethyl group; a methylhydroxy group; a C ₆ to C ₃₀ aryl group; a C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom among O, N, S, Si and P; a fused ring group of a C ₆ to C ₃₀ aliphatic ring and an aromatic ring; a C ₁ to C ₂₀ alkyl group; a C ₂ to C ₂₀ alkenyl group; a C ₂ to C ₂₀ alkynyl group; a C ₁ to C ₂₀ alkoxy group; a C ₆ to C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ to C ₂₀ alkoxycarbonyl group. A photosensitive resin composition, characterized in that in claim 9, L6, L7 and L9 of the chemical formula (9) are independently any one of the following chemical formulas (K) to (N):
Chemical formula (K)

Chemical formula (L)

Chemical formula (M)

Chemical formula (N)

In the above chemical formula (M) and chemical formula (N),
1) A is hydrogen; O; S; a silane group; a siloxane group; a boron group; a germanium group; a cyano group; a nitro group; a nitrile group; an amino group unsubstituted or substituted with a C ₁ to C ₃₀ alkyl group, a C ₆ to C ₃₀ aryl group or a C ₂ to C ₃₀ heterocyclic group; a C ₁ to C ₃₀ alkylthio group; a C ₁ to C ₃₀ alkyl group; a C ₁ to C ₃₀ alkoxy group; a C ₆ to C ₃₀ arylalkoxy group; a C ₂ to C ₃₀ alkenyl group; a C ₂ to C ₃₀ alkynyl group; a C ₆ to C ₃₀ aryl group; a C ₆ to C ₃₀ aryl group substituted with deuterium; a fluorenyl group; A C ₂ to C ₃₀ heterocyclic group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; a C ₃ to C ₃₀ aliphatic ring group; a C ₇ to C ₃₀ arylalkyl group; a C ₈ to C ₃₀ arylalkenyl group; and combinations thereof.
2) R ₃₂ ~R ₃₄ are each independently hydrogen; deuterium; halogen; a C ₆ ~C ₃₀ aryl group; a C ₂ ~C ₃₀ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a fused ring group of a C ₆ ~C ₃₀ aliphatic ring and an aromatic ring; a C ₁ ~C ₂₀ alkyl group; a C ₂ ~C ₂₀ alkenyl group; a C ₂ ~C ₂₀ alkynyl group; a C ₁ ~C ₂₀ alkoxy group; a C ₆ ~C ₃₀ aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C ₁ ~C ₂₀ alkoxycarbonyl group,
3) T is S, O or Se. A photosensitive resin composition, characterized in that in claim 1, the colorant is contained in an amount of 5 to 40 wt% based on the total amount of the photosensitive resin composition. A photosensitive resin composition according to claim 1, characterized in that the colorant comprises at least one of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment. A photosensitive resin composition, characterized in that in claim 1, the ratio of the resin including the repeating unit represented by the chemical formula (1) and the resin including the repeating unit represented by the chemical formula (10) is 1:9 to 5:5. A pattern or film formed from a photosensitive resin composition according to claim 1. A display device characterized by including a first electrode formed on a substrate, a second electrode installed opposite the first electrode, and a pattern or film formed with a photosensitive resin composition according to claim 1. An electronic device comprising a display device according to claim 15 and a control unit for driving the display device.