KR102681687B1 - Special Lower Particle Tray for semiconductor package and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a tray for suppressing semiconductor package particles and a manufacturing method thereof. According to the present invention, the tray produced by using a polyphenylene ether-based composite resin composition for a semiconductor chip tray, which is characterized by including polyphenylene ether, polystyrene, glass fiber, carbon fiber, and mineral is surface-treated and heat-dried to lead to protection of the surface, thereby achieving the effect of suppressing particles. Furthermore, the tray not only has excellent shrinkage rate, dimensional stability, coefficient of thermal expansion, and heat resistance, but also exhibits superior basic physical properties such as mechanical strength and impact resistance. Additionally, the improved injection moldability and smooth surface make it possible to create a product suitable for semiconductor chip trays that undergo ion beam, plasma, or conductive liquid impregnation treatments.

Description

Tray for suppressing semiconductor package particles and manufacturing method thereof {Special Lower Particle Tray for semiconductor package and manufacturing method thereof}

The present invention relates to a tray for suppressing semiconductor package particles and a method of manufacturing the same. More specifically, the present invention relates to a semiconductor package particle suppressing tray using a composition for a semiconductor tray comprising polyphenylene ether, polystyrene, glass fiber, carbon fiber, and minerals. It relates to a method of manufacturing a tray for suppressing particles and a tray for suppressing particles in a semiconductor package manufactured thereby.

In the manufacturing of semiconductor products, various entities cooperate, and it is necessary to transfer the products produced by one entity to other products. The delivered product may be a processed or processed wafer, a semiconductor chip made by dicing it, or even a semiconductor package encapsulated with molding resin.

Trays are used to store and transport these semiconductor devices, such as semiconductor chips or semiconductor packages. In some cases, even trays can be stored in test equipment or heat treatment equipment to perform testing or other processing on the semiconductor chips or semiconductor packages. You can. In the case of testing or processing where high temperatures are applied, the tray must have heat resistance, and in addition, thermal and chemical stability that does not affect the appearance of the product is required.

In the assembly and electrical inspection process of semiconductor packages, a tray is a tool that facilitates handling and transport of the semiconductor package. In addition, the tray also serves to protect the semiconductor package contained inside from external shock during handling, transport, and packaging of the semiconductor package.

To manufacture a semiconductor chip tray (IC TRAY), conventionally, acrylobutadiene-styrene-copolymer (ABS), polyphenylene oxide or polyphenylene ether (PPO or PPE), polysulfone (POLYSULFONE) or polyether were used. For injection molding of semiconductor chip trays by mixing sulfone (PES) resin with carbon fiber (CARBON FIBER) or conductive carbon black (CARBON BLACK) and other inorganic fillers (glass fiber, talc, mica, kaolin, wollastonite, etc.) when necessary. Raw materials were prepared.

The technical problem to be solved by the present invention is to provide a composition for trays that can suppress particles in a semiconductor package.

Another technical problem to be solved by the present invention is to provide a method of manufacturing a tray capable of suppressing particles in a semiconductor package tray using the tray composition.

In addition, another technical problem to be solved by the present invention is to provide a tray capable of suppressing particles in the semiconductor package tray manufactured according to the above method.

In order to solve the above technical problems, the present invention provides a composition for a semiconductor tray made of polyphenylene ether, polystyrene, glass fiber, carbon fiber, and mineral.

Preferably, the composition for the semiconductor tray is comprised of 50 to 60 parts by weight of polyphenylene ether, 10 to 20 parts by weight of polystyrene, 5 to 15 parts by weight of glass fiber, 10 to 15 parts by weight of carbon fiber, and 10 to 20 parts by weight of mineral. It is characterized by

The present invention is characterized by surface treatment of a semiconductor package tray manufactured using the composition for a semiconductor tray.

Preferably, the method is characterized in that the tray surface is protected by hot air drying after the surface treatment.

In addition, another technical problem to be solved by the present invention is to provide a tray capable of suppressing particles in the semiconductor package tray manufactured according to the above method.

The effect of suppressing particles can be obtained by surface treating a tray manufactured using the polyphenylene ether-based composite resin composition for a semiconductor chip tray of the present invention and drying it with hot air to protect the surface. In addition, it has excellent shrinkage, dimensional stability, linear thermal expansion coefficient, and heat resistance, as well as excellent basic physical properties such as mechanical rigidity and impact resistance. In addition, it has improved injection moldability and a smooth surface, making it a semiconductor chip that can be treated with ion beam, plasma, or conductive liquid impregnation. We can make products suitable for trays.

The following drawings attached to this specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention along with the contents of the above-described invention. Therefore, the present invention is limited to the matters described in such drawings. It should not be interpreted in a limited way.
Figure 1 shows MPPO vs. This is the result of comparing particle data from the SLP tray (Special Lower Particle Tray).
Figure 2 shows MPPO vs. This shows the QUV test results of the TRAY of the SLP tray.
Figure 3 shows MPPO vs. This photo shows the SLP tray surface resistance analysis test method.
Figure 4 shows MPPO vs. This shows the results of the appearance analysis of the SLP tray.
Figure 5 shows MPPO vs. This shows the results of analysis of hazardous substances in the SLP tray.

Hereinafter, the present invention will be described in more detail.

The present invention provides a composition for a semiconductor tray made of polyphenylene ether, polystyrene, glass fiber, carbon fiber, and mineral.

According to one embodiment of the present invention, the composition for a semiconductor tray includes 50 to 60 parts by weight of polyphenylene ether, 10 to 20 parts by weight of polystyrene, 5 to 15 parts by weight of glass fiber, 10 to 15 parts by weight of carbon fiber, and minerals. It is characterized in that it consists of 10 to 20 parts by weight.

(1) Polyphenylene ether

In general, polyphenylene ether was developed for the first time in the world by G-Plastic in the United States. In the present invention, the two types of polyphenylene ethers developed by GE Plastics in the United States can be used individually or in combination. The polyphenylene ether contains a copper content of 10 ppm or less and a toluene content of 2000 ppm or less.

The polyphenylene ether used in the composite resin composition for manufacturing semiconductor chip trays according to the present invention is preferably two or more types of resins with intrinsic viscosities of 0.1-0.4 and 0.41-1.0, respectively, used individually or in combination. At this time, polyphenylene ether with high intrinsic viscosity is used to prevent glass fiber, mica, and other fillers from protruding to the surface, and polyphenylene ether with low intrinsic viscosity has abundant fluidity during injection and covers the surface of the product. It prevents excessive glass fiber, mica, and other fillers from coming out to the surface of the product and interfering with surface treatment by ion beam, plasma, or conductive solution impregnation.

In particular, when the content of glass fiber, mica and other fillers is low or absent, it is not necessary to use two types of polyphenylene ether in combination, but when the content is high, each or two types of polyphenylene ether are used depending on the content to improve the surface of the product. It is desirable to prevent glass fiber, mica and other fillers from appearing on the product surface.

(2) polystyrene

The reason for using polystyrene in the composite resin composition for manufacturing semiconductor chip trays of the present invention is that when polyphenylene ether is used alone, there may be difficulties in mass production due to excessive injection pressure. In order to solve this injection problem, polystyrene can be used in an amount of 10 to 20 parts by weight. In addition, polystyrene has much better injection fluidity than polyphenylene ether, which has the effect of improving the product surface and increasing injection mass production, and similar results were obtained with polycarbonate.

The polystyrene used in the present invention achieved the above effects by using polystyrene with a flow index of 20 or less and polystyrene resin with a flow index of 10 or less separately or in combination. When polycarbonate was used, the effect of low-viscosity polycarbonate was especially excellent.

(3) Glass fiber

The glass fibers used in the present invention may be acicular, flat, or spherical glass fibers with a diameter of 20 μm or less and a length of 1 inch or less, respectively or in combination. It is more preferable to use glass fibers with a diameter of 3㎛ to 10㎛, which play an excellent role in increasing the heat resistance temperature of the semiconductor tray and providing dimensional stability. In addition, in order to eliminate the orientation of the surface and glass fiber, 0% to 30% of milled glass fiber, chopped glass fiber, or glass flake can be used, and milled glass fiber or chopped glass fiber can be used at 0% to 30%. It is very easy to achieve an excellent surface, maintain three-dimensional shrinkage, and make the surface beautiful.

(4) Mica

Mica in the present invention can be used to stabilize the shrinkage rate and linear thermal expansion coefficient in the three-dimensional direction. Similar to glass fiber, it plays an excellent role in enhancing the heat resistance temperature, linear thermal expansion coefficient, and shrinkage rate of the semiconductor chip tray. In order to prevent warpage of the semiconductor tray, the size is preferably 30 ㎛, and 3 to 30 ㎛ is more preferable.

(5) Carbon fiber

In the case of carbon fiber, it serves as a filler rather than just providing conductivity, so it is possible to use low-grade, recycled or pulverized carbon fiber.

(6) Inorganic reinforcement

The inorganic reinforcing material of the present invention may be used alone or in combination to reinforce the heat resistance, dimensional stability, linear thermal expansion coefficient, bending resistance, three-way shrinkage rate, and other physical rigidities (flexural modulus, tensile strength, etc.) of the semiconductor tray.

When wollastonite as a calcium-meta-silicate-based compound is used, wollastonite is preferably needle-shaped with an aspect composition ratio of 10 to 19 and an average particle diameter of 3 to 25 ㎛, and 0 to 30 with respect to the total amount of the composition. Weight percent can be used.

As inorganic reinforcing materials that can be used in the present invention, talc, calcium-carbonate, asbestos, kaolin, carbon fiber, etc. can be used. When talc is used, the average particle size is 2 to 2. It is preferable to use fragments of 4㎛.

In some cases, it is advantageous to use a product whose surface has been chemically treated to increase the interfacial adhesion with the polymer, and the amount of the inorganic reinforcing material used is preferably 1 to 40% by weight based on the total amount of the composition.

(7) Additives

The polyphenylene ether-based composite resin composition for semiconductor chip trays of the present invention may contain suitable additives depending on the intended use. The additives of the present invention include a coupling agent, primary or secondary antioxidant (anti-oxidation agent), Oxidants, UV stabilizers, heat stabilizers, process lubricants, and antistatic agents may be included in the composite resin composition, and if necessary, carbon black, pigments, nucleating agents, etc. may be included.

The coupling agent is used to increase the adhesive strength between the polyphenylene ether and polystyrene used in the present invention and the inorganic reinforcing material. As the coupling agent, aminosilane-based, aminotitanium-based, etc. may be used. The amount of the coupling agent used is preferably 0.05 to 3% by weight based on the total amount of the composition.

The primary or secondary antioxidant and heat stabilizer are used to prevent thermal decomposition that may occur during processing of the polyphenylene ether or polyphenylene oxide-based composite resin of the present invention. The primary antioxidant is a conventional antioxidant. Phenol-based compounds, etc. may be used, and the amount of the primary antioxidant used is preferably 0.01 to 1% by weight.

As the secondary antioxidant, common amine compounds may be used, and the amount of the secondary antioxidant used is preferably 0.01 to 1% by weight.

The heat-resistant stabilizer includes common phenolic compounds such as 2,6-di-t-butyl-4-methylphenol, and diphenyl-p-phenylenediamine. Common amine compounds such as (diphenyl-p-phenylenediamine) can be used, and the amount used is preferably 0.01 to 1.0% by weight based on the total weight of the composition.

The ultraviolet stabilizer is sometimes added to the composite resin composition to strengthen the weather resistance of the composite resin and prevent decomposition due to ultraviolet rays when the composite resin is exposed outdoors. The ultraviolet stabilizer includes HALS-based compounds, benzophenol-based compounds, and benzoate. Triazole-based compounds, etc. may be used, and the amount used is preferably 0.02 to 1% by weight based on the total weight of the composition.

The processing lubricant is used to improve the processability of the composite resin composition and to facilitate the flow of the resin during composite resin manufacturing or semiconductor chip tray injection, thereby minimizing residual stress within the resin. Types include 0.05 to 15% by weight of calcium-stearate, zinc-stearate, zinc oxide, and alicyclic saturated hydrocarbon resin. It can be used, and it is more preferable to use 0.1 to 15% by weight of alicyclic saturated hydrocarbon resin.

The antistatic agent prevents dust or foreign substances from attaching to the semiconductor chip tray when manufacturing or transporting it by suppressing static electricity of the composite resin. Typically, alkylamine-based compounds, stearic acid-based compounds, etc. may be used, and alkylamine-based compounds can be used. It is preferable to use 0.01 to 1% by weight of the antistatic agent based on the total amount of the composition.

In addition, to the polyphenylene ether-based composite resin composition for semiconductor chip trays of the present invention, additives such as carbon black, pigments, and nucleating agents can be added depending on the purpose for color development and weather resistance reinforcement, and the amount of the additives used. It is preferably 0.05 to 10% by weight based on the total amount of silver composition.

In order to manufacture the polyphenylene ether-based composite resin composition for a semiconductor chip tray of the present invention, the raw materials are mixed using a Henssel Blender, Ribbon Blender, or V-Blender, or Each raw material can be directly supplied to a processing device at a set ratio using different raw material supply devices. The processing devices include a single-screw extruder, a twin-screw extruder, and a kneader mixer depending on the characteristics of the raw materials and the final composition. , Banbery Mixer, etc. can be used. The components of the composite resin composition of the present invention are melted and mixed using the processing device, and then shaped into pellets. At this time, since the physical properties and performance of the resin composition may change depending on the processing conditions, a twin-screw extruder that can use a part of the extruder as a feed port in addition to one supply port is mainly used to change the screw rotation speed, extrusion amount, and processing temperature. It is desirable to select optimal processing conditions and prepare the composite resin composition.

In the present invention, a tray capable of suppressing particles in a semiconductor package can be manufactured using the semiconductor tray composition shown in Table 1 below.

In the present invention, the polyphenylene ether-based composite resin composition for semiconductor trays satisfied the JEDEC standard for dimensional stability when subjected to ion beam treatment, plasma treatment, or conductive liquid impregnation treatment even immediately after injection and after baking.

In addition, the standards used for impact testing of semiconductor chip trays (if necessary, 20 of the 10 semiconductor chip trays are dropped from a height of 30 to 50 cm to check for damage) were satisfied both after injection and baking.

In addition, the present invention provides a method of manufacturing a tray for particle suppression, characterized in that surface treatment is performed on a semiconductor package tray manufactured using the semiconductor tray composition. At this time, auto & manual dipping, rack, spray, and other treatment methods can all be applied as surface treatment methods for the semiconductor package tray.

According to one embodiment of the present invention, the method is characterized in that the tray surface is protected by hot air drying after the surface treatment. At this time, the hot air drying method can also be applied using conveyor method, heater, dryer, convection oven, and other methods.

In addition, another technical problem to be solved by the present invention is to provide a tray capable of suppressing particles in a semiconductor package manufactured according to the above method.

The effect of suppressing particles can be obtained by surface treating a tray manufactured using the polyphenylene ether-based composite resin composition for a semiconductor chip tray of the present invention and drying it with hot air to protect the surface. In addition, it has excellent shrinkage, dimensional stability, linear thermal expansion coefficient, and heat resistance, as well as excellent basic physical properties such as mechanical rigidity and impact resistance. In addition, it has improved injection moldability and a smooth surface, making it a semiconductor chip that can be treated with ion beam, plasma, or conductive liquid impregnation. We can make products suitable for trays. In addition, in the present invention, it is possible to manufacture semiconductor trays suitable for existing semiconductor chip tray molds by using various resins and additives individually or in combination, and also to manufacture semiconductor trays with low density when manufacturing new molds. It can replace expensive raw materials for semiconductor chip trays containing carbon fiber or conductive carbon black, maximizing economic benefits.

Hereinafter, the present invention will be described in more detail through examples. Since these examples are merely for illustrating the present invention, the scope of the present invention is not to be construed as being limited by these examples.

< Test example 1> MPPO vs. SLP tray particle drop test analysis

1) Test method

-Banding the 11 trays Ø

-Drop the banding from 75cm

- Drop 1 time on each of the six faces

- Tray particle on sticky mat inspection

2) Test results

Here, the SLP tray is a tray according to the present invention, and the MPPO tray is a tray manufactured according to an existing method.

As shown in Table 2 above, MPPO vs. As a result of comparing the particle data of the SLP tray, it was confirmed that the particles of the SLP tray were greatly reduced.

< Test example 2> MPPO vs. SLP Tray OPT Tape Test Analysis

1) Test method: OPT tape was attached to the side surface of the TRAY and then separated to compare particle characteristics.

2) Test results

Figure 1 shows MPPO vs. This is the result of comparing particle data from SLP TRAY. As you can see here, you can see that the particles in the SLP tray have been reduced by 99.2%.

< Test example 3> MPPO vs. SLP tray QUV test analysis

1) Test organization: Korea Automotive Research Institute

2) Test method: Check the change in quality characteristics of the product after 300 hours of continuous QUV.

3) Test conditions: UV 0.45W/m2, temperature 63℃, humidity 50%

4) Test results

Figure 2 shows MPPO vs. This shows the QUV test results of the TRAY of the SLP tray. As seen here, the QUV test results of the SLP TRAY showed no change in appearance and tray characteristics, and a 99.5% reduction in particles.

< Test example 4> MPPO vs. SLP TRAY surface resistance analysis

Test method: As shown in Figure 3, measurements were basically made at three locations on the surface. Figure 3 shows MPPO vs. This photo shows the SLP TRAY surface resistance analysis test method.

As shown in Table 3 above, MPPO vs. As a result of comparing the surface resistance data of the SLP trays, it was found that there was no significant difference in the surface resistance of the SLP trays.

< Test example 5> MPPO vs. SLP Tray bending strength test analysis

Test method: Place the TRAY on the JIG of the strength measuring device, adjust it to be located in the center of the horizontal side, and then measure it.

As shown in Table 4 above, MPPO vs. As a result of comparing the bending strength data of SLP TRAY, there was no significant difference between the two products.

< Test example 6> MPPO vs. SLP Tray Warpage Analysis

1) Bake Test Method - 24 Hour Bake Test & 5 Times/6hr Bake Test

2) Test results (SPEC: Max 0.76㎜)

As shown in Table 5 above, MPPO vs. As a result of comparing the warpage of SLP TRAY, there was no significant difference.

< Test example 7> MPPO vs. SLP Tray moisture test analysis

The quality characteristics of the SLP TRAY were measured after being stored in water for 24 hours.

As shown in Table 6 above, when comparing the data before and after the moisture test of the SLP tray, no significant difference was found.

< Test example 8> MPPO vs. SLP Tray Dimension Comparison

Tray dimensions were compared using FBGA 10X11.

As shown in Table 7 above, MPPO vs. As a result of comparing the dimensions and shrinkage rate of the SLP TRAY, there was no significant difference.

< Test example 9> MPPO vs. SLP TRAY appearance (surface) analysis

Material surface analysis (MPPO vs. SLP TRAY) was performed.

Figure 4 shows MPPO vs. This shows the results of the appearance analysis of the SLP tray. As seen here, MPPO vs. As a result of SLP TRAY's appearance analysis, there was no difference in appearance (surface) between the two products.

< Test example 10> MPPO vs. SLP TRAY hazardous substance analysis

Test organization: SGS KOREA-Test items: Cd, Pb, Hg, Cr6+, PBBs / PBDEs, Br, Cl, Sb, Phthalates 5 types

Figure 5 shows MPPO vs. This shows the results of analysis of hazardous substances in the SLP tray. As you can see here, no hazardous substances were detected in either product.

Claims (5)

A composition for a semiconductor tray containing polyphenylene ether, polystyrene, glass fiber, carbon fiber, mineral, mica and inorganic reinforcement,
The composition for the semiconductor tray includes 50 to 60 parts by weight of polyphenylene ether, 10 to 20 parts by weight of polystyrene, 5 to 15 parts by weight of glass fiber, 10 to 15 parts by weight of carbon fiber, and 10 to 20 parts by weight of mineral,
The mica has a size of 3 to 30㎛,
The inorganic reinforcing material includes at least one of Talc, Calcium-carbonate, Asbestos, and Kaolin, and is a semiconductor characterized in that it contains 1 to 40% by weight based on the total amount of the composition. Composition for trays.
delete Surface treatment is performed on the semiconductor package tray manufactured using the composition for semiconductor tray of claim 1,
A method of manufacturing a tray, characterized in that the tray surface is protected by hot air drying after the surface treatment.
delete A tray capable of suppressing particles in a semiconductor package tray manufactured according to the method according to claim 3.