KR102136697B1 - Colored resin compositions which have high mositure-proof performance - Google Patents
Colored resin compositions which have high mositure-proof performance Download PDFInfo
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Abstract
본 발명은 부분 (메타)아크릴레이트 에폭시 수지 및 광 경화성 에폭시 수지로 이루어진 광경화성 수지에 기능성 실리카 화합물과 유색 안료를 포함하는 광경화성 수지 조성물에 의해 관한 것으로, 본 발명의 광경화성 수지 조성물은 점도 조절용 희석용 단량체를 더 포함할 수 있다.
본 발명의 광경화성 수지 조성물은 수분 차단을 비약적으로 향상시켜 모듈 공정 진행시 장비에 들러붙지 않고 다음 공정을 원활하게 하고, 방투습 특성을 높여 수분침투에 의한 불량률을 줄여 공정시간 및 비용절감을 가능케 한다. The present invention relates to a photocurable resin composition comprising a functional silica compound and a colored pigment in a photocurable resin composed of a partial (meth)acrylate epoxy resin and a photocurable epoxy resin, wherein the photocurable resin composition of the present invention is for viscosity adjustment Dilution monomer may be further included.
The photo-curable resin composition of the present invention dramatically improves the moisture barrier, smoothing the next process without sticking to the equipment during the module process, and improving the moisture-permeable properties to reduce the defect rate due to moisture penetration, thereby reducing process time and cost. do.
Description
본 발명은 고해상도용 유색 수지 조성물에 관한 것으로, 특히 우수한 방투습 성능을 갖는 고해상도용 유색 수지 조성물에 관한 것이다.The present invention relates to a colored resin composition for high resolution, and particularly to a colored resin composition for high resolution having excellent moisture permeability.
기존의 디스플레이 모듈 적용 유색 수지의 경우 광,열 경화를 통해 기본적인 빛샘 방지의 목적으로만 사용하는 것이 대부분이었기 때문에 유색 수지 자체의 특성으로는 외부 환경의 수분요소에 대하여 방어적 특성을 갖게 하는데 한계가 있으며, 빛샘 방지 이외에 모듈 부착면과의 접착성을 높이거나 해상도를 위해 블랙 안료를 양을 조절하는 기술개발이 이어져 왔다. In the case of the existing display module-applied colored resin, it was mostly used only for the purpose of preventing light leakage through light and heat curing, so the characteristics of the colored resin itself have a limit to have protective properties against moisture elements in the external environment. In addition, technology development to increase the adhesiveness with the module attachment surface or to control the amount of black pigment for resolution has been continued in addition to preventing light leakage.
하지만, 디스플레이 모듈의 슬림화와 경량화, 저 소비 전략화 등의 우수한 특성이 필요하게 됨에 따라 유색 수지 또한 다양한 기능을 요구하고 있다. 디스플레이 모듈의 신규 공정들은 슬림화와 경량화에 따른 얇은 두께 제작에 맞추어 공정중에 문제가 생기지 않도록 유색 수지의 열 공정을 제거하고 광경화 공정만을 진행하고 있으며 과량의 광경화 에너지를 쏘일 경우 발생하는 수지 반응열과 수축률 때문에 모듈이 손상을 입을 수 있어 광에너지를 점점 작게 줄여가고 있다.However, as excellent characteristics such as slimming and lightening of the display module and low consumption strategy are required, colored resins also require various functions. The new processes of the display module are in accordance with the slimness and lightness of the production of thin thickness to eliminate the thermal process of the colored resin so that there is no problem during the process, and only the photo-curing process is carried out. Because of the shrinkage rate, the module may be damaged, and light energy is gradually reduced.
또, 슬림화에 따른 얇은 코팅만으로도 고해상도를 가능하게 하고, 빛샘 방지 역할뿐만 아니라 외부환경의 수분침투에 저항하기 위하여 뛰어난 방투습 특성도 요구하게 되었다. 방투습 특성에 올리기 위해 발수, 방습의 특성을 갖는 물질들을 적용하여 모듈에 코팅 후 수지를 광경화하여 코팅층을 형성하는 것이 대부분이었다.In addition, it is possible to achieve high resolution with only a thin coating according to slimming, as well as to prevent light leakage, as well as to require excellent moisture-permeability characteristics to resist moisture penetration in the external environment. In order to enhance the moisture permeability characteristics, most of the materials were coated with a water-repellent and moisture-proof characteristic to coat the module and then photo-cured the resin to form a coating layer.
그러나 유기재료의 특성상 발수, 방습 특성을 높이기 위해 적용하는 불소 작용기의 단량체, 실리콘 화합물, 부타디엔 계열의 고무성능을 갖는 화합물 등의 경우 디스플레이 모듈에 적용하여 코팅할 경우 황변과 같은 색 변화와 디스플레이 모듈표면의 접착성능이 낮아지는 경우가 발생하며, 적용 함량을 무작정 늘리게 되면 광경화용 수지의 경우 미경화 부분이나 표면의 끈적임(tacky)가 발생하게 된다. 이러한 유기재료의 적용 한계로 인해 기존 광경화용 수지의 경우 방투습 특성을 10^1g/m2(두께 300㎛) 이하로 특성을 구현하기에는 어려운 문제점을 갖고 있다.However, due to the nature of the organic material, in the case of coating with a display module in the case of a monomer having a fluorine functional group, a silicone compound, a compound having butadiene-based rubber performance applied to increase water and moisture resistance, color change such as yellowing and display module surface When the adhesion performance of the case is lowered, and the application content is arbitrarily increased, in the case of the resin for photocuring, an uncured portion or a tacky of the surface occurs. Due to the limitation of the application of these organic materials, in the case of the existing photocurable resin, it has a difficult problem in realizing the moisture-permeable property to 10^ 1 g/m 2 (thickness 300㎛) or less.
이에 본 발명의 목적은 기능성 실리카 화합물을 이용하여 열경화 없이 광경화만을 이용하며, 기존의 유색 수지의 문제점을 해결하는 것이다. Accordingly, an object of the present invention is to use a functional silica compound to use only photocuring without thermal curing, and to solve the problems of the conventional colored resin.
즉, 해상도를 높이기 위해 유색 안료를 첨가할수록 생기는 미경화에 의한 표면 끈적임, 해상도변화, 모듈과의 접착 효과와 수분 차단을 비약적으로 향상시켜 광경화만으로도 모듈 공정 시 장비에 들러붙지 않고 다음 공정을 원활하게 하고, 빛샘 방지 및 수분침투에 의한 불량률을 줄여 공정시간 및 비용절감을 가능케 하는 것이다. That is, as the colored pigment is added to increase the resolution, the surface stickiness, resolution change caused by uncuring, and the adhesion effect with the module and moisture blocking are dramatically improved, so that the photocuring alone does not stick to the equipment, and the next process is smooth. It is possible to reduce process time and cost by preventing light leakage and reducing the defect rate due to moisture penetration.
상기 본 발명의 목적은 광경화성 수지, 기능성 실리카 화합물, 그리고 안료 를 포함하는 유색 광경화성 수지 조성물에 의해 달성된다. The object of the present invention is achieved by a colored photocurable resin composition comprising a photocurable resin, a functional silica compound, and a pigment.
일 례로 본 발명의 유색 광경화성 수지 조성물은 광경화성 수지 100중량부, 기능성 실리카 화합물 5 내지 30중량부 및/또는 판상형 충진제 5 내지 30 중량부, 양이온 개시제 0 내지 10중량부, 및 안료 0.1 내지 10중량부를 포함한다. In one example, the colored photocurable resin composition of the present invention includes 100 parts by weight of a photocurable resin, 5 to 30 parts by weight of a functional silica compound, and/or 5 to 30 parts by weight of a plate-like filler, 0 to 10 parts by weight of a cationic initiator, and 0.1 to 10 pigments. Includes parts by weight.
본 발명의 광경화성 수지 조성물은 점도조절을 위한 희석용 단량체를 더 포함할 수 있다. The photocurable resin composition of the present invention may further include a dilution monomer for viscosity control.
본 발명의 광경화성 수지 조성물은 수분 차단을 비약적으로 향상시켜 모듈 공정 진행 시 장비에 들러붙지 않고 다음 공정을 원활하게 하고, 빛샘 방지 및 수분침투에 의한 불량률을 줄여 공정시간 및 비용을 절감하게 한다. The photo-curable resin composition of the present invention dramatically improves the moisture barrier, smoothing the next process without sticking to the equipment during the module process, reducing the defect rate due to light leakage prevention and moisture penetration to reduce process time and cost.
본 발명의 유색 광경화성 수지 조성물은 광경화성 수지, 기능성 실리카 화합물, 그리고 안료를 포함한다. The colored photocurable resin composition of the present invention includes a photocurable resin, a functional silica compound, and a pigment.
기능성 실리카 화합물과 광경화성 수지, 유색안료의 함량은 공정 적용에 요구되는 두께에 따라서 구성비가 변할 수 있다.The composition ratio of the functional silica compound, the photocurable resin, and the colored pigment may vary depending on the thickness required for the process application.
일 례로, 본 발명의 광경화성 수지 조성물은 광경화성 수지 100중량부, 유리 중공구 형태의 기능성 실리카 화합물 5 내지 30중량부, 임의의 판상형 충진제 5 내지 30 중량부, 양이온 개시제 0 내지 10중량부, 및 안료 0.1 내지 10중량부를 포함한다. In one example, the photocurable resin composition of the present invention is 100 parts by weight of a photocurable resin, 5 to 30 parts by weight of a functional hollow silica compound in the form of a glass hollow sphere, 5 to 30 parts by weight of an optional plate-like filler, 0 to 10 parts by weight of a cationic initiator, And 0.1 to 10 parts by weight of pigment.
광경화성 수지로는 부분 (메타)아크릴레이트 에폭시 수지를 주제로 하고, (메타)아크릴기와 에폭시를 하나 이상 갖는 수지와, 에폭시 수지를 점도 조절하기 위해 더 포함할 수 있다. As the photo-curable resin, the subject is a partial (meth)acrylate epoxy resin, and may further include a resin having at least one (meth)acrylic group and an epoxy, and an epoxy resin to adjust viscosity.
부분 (메타)아크릴레이트 에폭시 수지는 노볼락형 에폭시 수지, 비페닐형 에폭시 수지, 나프탈렌형 에폭시 수지, 트리스 페놀 메탄형 에폭시 수지 또는 비스페놀형 에폭시 수지일 수 있다.The partial (meth)acrylate epoxy resin may be a novolac type epoxy resin, a biphenyl type epoxy resin, a naphthalene type epoxy resin, a trisphenol methane type epoxy resin or a bisphenol type epoxy resin.
상기 부분 (메타)아크릴레이트 에폭시 수지는 점도가 20000 내지 300000cps일 수 있다. The partial (meth)acrylate epoxy resin may have a viscosity of 20000 to 300000 cps.
상기 경화성 수지 중의 (메타)아크릴기를 갖는 수지의 함유량이 50 중량부 이상이고, 상기 경화성 수지 중의 (메타)아크릴기와 에폭시를 하나 이상 갖는 수지의 함유량이 20 중량부 이상이고, 경화성 에폭시 수지의 함유량이 10 중량부 이상을 포함하는 것이 바람직하다. The content of the resin having a (meth)acrylic group in the curable resin is 50 parts by weight or more, the content of a resin having at least one (meth)acrylic group and an epoxy in the curable resin is 20 parts by weight or more, and the content of the curable epoxy resin is It is preferable to contain 10 parts by weight or more.
상기 (메타)아크릴기를 갖는 수지와 각각 에폭시와 (메타)아크릴기를 하나 이상 가지고 있는 수지는 노블락형 수지, 비페닐형 수지, 나프탈렌형 수지, 트리스 페놀 메탄형 수지 및 비스페놀형 수지로 이루어진 군으로부터 선택되는 적어도 1종의 수지이다. The resin having the (meth)acrylic group and the resin having at least one epoxy and (meth)acrylic group, respectively, are selected from the group consisting of noblock resin, biphenyl resin, naphthalene resin, trisphenol methane resin and bisphenol resin. Is at least one resin.
상기 에폭시 수지는 글리시딜 에테르형 수지, 글리시딜 에스테르형 수지, 글리시딜 아민형 수지, 선형 지방족형 수지, 지환족형 수지일 수 있다.The epoxy resin may be a glycidyl ether type resin, a glycidyl ester type resin, a glycidyl amine type resin, a linear aliphatic type resin, or an alicyclic resin.
기능성 실리카 화합물은 예를 들어, 표면에 히드록실, 메틸, 비닐, 글리시딜기를 갖는 것으로 하기의 구조를 갖는 화합물들로 유리 중공구 형태이다. 유리중공구 타입의 기능성 실리카 화합물을 이용하여 광경화시 빛의 산란을 높여 유색수지의 경화율을 높인다. 또한, 표면의 치환기들로 인해 수지와의 결합력이 높아져서 방투습효과가 향상된다. The functional silica compound is, for example, a hydroxyl, methyl, vinyl, glycidyl group on the surface, and is a compound in the form of a glass hollow sphere having the following structure. The glass hollow sphere type functional silica compound is used to increase light scattering during photocuring to increase the curing rate of the colored resin. In addition, due to the substituents on the surface, the bonding strength with the resin is increased, thereby improving the moisture permeability.
기능성 실리카 화합물의 함량은 공정 적용에 요구되는 두께에 따라서 구성비가 변할 수 있다. 기능성 실리카 화합물은 전체 유색 광경화성 수지 조성물 내에서 5 내지 30중량부의 함량으로 사용될 수 있다.The content of the functional silica compound may vary in composition ratio depending on the thickness required for process application. The functional silica compound may be used in an amount of 5 to 30 parts by weight in the total colored photocurable resin composition.
상기 판상형 충진재는 실리카, 탈크, 석면, 규조토, 벤토나이트, 알루미나, 산화아연, 산화철, 셀리사이트 활성 백토, 질화알루미늄, 유리비즈, 산화 알루미늄, 클레이일 수 있다.The plate-like filler may be silica, talc, asbestos, diatomaceous earth, bentonite, alumina, zinc oxide, iron oxide, celisite activated clay, aluminum nitride, glass beads, aluminum oxide, clay.
판상형 충진재도 투습성을 더욱 향상시키기 위해 포함되며, 경화성 수지 100중량부에 판상형 충진제를 5 내지 30중량부의 양으로 포함한다. A plate-shaped filler is also included to further improve moisture permeability, and includes a plate-shaped filler in an amount of 5 to 30 parts by weight, 100 parts by weight of the curable resin.
양이온 중합 개시제는 광조사에 의해 프로톤 또는 루이스산을 발생하는 것이면, 특히 한정되지 않으며 시판되는 양이온 중합 개시제를 사용할 수 있다. 예를 들어, 양이온 중합 개시제로, 붕소계 양이온 개시제, 포스페이계 양이온 개시제, 기타 양이온 개시제 등을 사용할 수 있다. 안티몬 타입과 비안티몬 타입을 다 포함하며 비안티몬 타입의 오니윰 염, 이오도니윰 염, 설포니윰 염, 알콕시 피리디니윰 염, 아조니윰 염 등으로 이루어진 군으로부터 적어도 1종을 사용할 수 있다. 양이온 중합 개시제는 경화성 수지 100중량부에 0 내지 10중량부의 양으로 사용된다. The cationic polymerization initiator is not particularly limited as long as it generates protons or Lewis acids by light irradiation, and commercially available cationic polymerization initiators can be used. For example, as a cationic polymerization initiator, a boron-based cationic initiator, a phosphate-based cationic initiator, other cationic initiators, and the like can be used. It includes both an antimony type and a nonantimony type, and at least one type can be used from the group consisting of nonantimony type onipon salts, iodonim salts, sulfonymium salts, alkoxy pyridininium salts, and azonidium salts. . The cationic polymerization initiator is used in an amount of 0 to 10 parts by weight of 100 parts by weight of the curable resin.
예를 들어, SI-B2A(산에이드), SI-B3A(산에이드), 4-메틸티오페닐 술포늄 트리플레이트(시그마-알드리치), 트리페닐 술포늄 트리플레이트(시그마-알드리치), 4-페닐티오페닐 디페닐 술포늄 트리플레이트(시그마-알드리치), 4-이오도페닐 술포늄 트리플레이트(시그마-알드리치) 등이 있다. For example, SI-B2A (acid aid), SI-B3A (acid aid), 4-methylthiophenyl sulfonium triflate (Sigma-Aldrich), triphenyl sulfonium triflate (Sigma-Aldrich), 4-phenyl Thiophenyl diphenyl sulfonium triflate (Sigma-Aldrich), 4-iodophenyl sulfonium triflate (Sigma-Aldrich), and the like.
열경화제 또는 중합 개시제 중 적어도 1종의 첨가제를 더 포함할 수도 있다.It may further include at least one additive of a thermosetting agent or a polymerization initiator.
상기 중합 개시제는 0 내지 10 중량부가 포함되고, 광과 열에서 경화가 일어나는 개시제이며, 벤조인계 화합물, 아세토페논류, 벤조페논류, 티옥산톤류, 안트라퀴논류, α-아실옥심에스테르류, 페닐글리옥시레이트류, 벤질류, 아조계 화합물, 티페닐술피드계 화합물, 아실포스핀옥시계 화합물, 유기 색소계 화합물 또는 철-프탈로시아닌계 화합물, 이온계 화합물일 수 있다. 이온계 화합물로는 안티몬 타입과 비안티몬 타입을 다 포함하며 비안티몬 타입의 오니윰 염, 이오도니윰 염, 설포니윰 염, 알콕시 피리디니윰 염, 아조니윰 염 등으로 이루어진 군으로부터 적어도 1종을 사용할 수 있다. 상기 중합 개시제는 0 내지 10 중량부가 포함되고, 단독으로 사용해도 좋고 2종 이상을 조합시켜서 사용해도 좋다.The polymerization initiator contains 0 to 10 parts by weight, and is an initiator in which curing occurs in light and heat, benzoin compounds, acetophenones, benzophenones, thioxanthones, anthraquinones, α-acyloxime esters, phenyl Glyoxylates, benzyls, azo compounds, thiphenylsulfide compounds, acylphosphineoxy compounds, organic pigment compounds or iron-phthalocyanine compounds, ionic compounds. The ionic compound includes both an antimony type and a nonantimony type, and is at least 1 from the group consisting of a nonantimony type of onipon salt, iodonim salt, sulfonym salt, alkoxy pyridinium salt, azonimon salt, and the like. Species can be used. The polymerization initiator contains 0 to 10 parts by weight, and may be used alone or in combination of two or more.
안료는 다양한 유색안료(블랙, 노랑, 블루 등)를 사용하여 해상도 및 컬러표시를 향상시킨다. 바람직하게는 흑색 안료일 수 있고, 상기 흑색 안료로는 카본 블랙, 산화철, 탄소나노튜브 또는 흑연 등을 사용할 수 있다. 안료의 평균 입경은 13 내지 70nm 일 수 있다. 유색안료는 0.1 내지 10 중량부를 사용한다. Pigments use various colored pigments (black, yellow, blue, etc.) to improve resolution and color display. Preferably, it may be a black pigment, and the black pigment may be carbon black, iron oxide, carbon nanotube or graphite. The average particle diameter of the pigment may be 13 to 70 nm. The colored pigment is used in an amount of 0.1 to 10 parts by weight.
본 발명의 광경화성 수지 조성물은 다음과 같은 단량체를 점도조절을 위한 희석용으로 더 포함할 수 있다: The photocurable resin composition of the present invention may further include the following monomers for dilution for viscosity control:
3-에틸-3-[(2-에틸헥실옥시)메틸]옥세탄, 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane,
비스[1-에틸(3-옥세타닐)]메틸에테르, Bis[1-ethyl(3-oxetanyl)]methyl ether,
이하에서는 구체적인 실시 예들은 들어 본 발명을 더욱 상세하게 설명한다. 그러나 하기 실시 예들에 의하여 본 발명의 기술 사상이 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to specific embodiments. However, the technical spirit of the present invention is not limited by the following examples.
[비교 예 1~71, 실시 예 1~56][Comparative Examples 1 to 71, Examples 1 to 56]
모두 중량부로 표시된, 표 1~17에 기재된 배합비에 따라, 각 재료를 교반기를 사용하여 혼합하고 저점도일 경우는 가압필터(대화테크)를 이용하여 필터하며, 고점도일 경우는 3-롤 밀(이노우에 제조)을 사용하여 혼합 분산시킨 후, 감압필터 장비(대화테크)로 제조한 조성물들을 필터 후 각각 진공 탈포기(대화테크)를 이용하여 기포를 제거하여 비교 예(표 1~표 9) 및 실시 예(표10~표 17)의 디스플레이용 접착제 조성물을 조제하였다. In accordance with the mixing ratios shown in Tables 1 to 17, all expressed in parts by weight, each material is mixed using a stirrer and filtered using a pressure filter (Daehwa Tech) in case of low viscosity, and 3-roll mill (in case of high viscosity) After mixing and dispersing using Inoue), after filtering the compositions prepared with a pressure-reducing filter equipment (Daehwa Tech), air bubbles are removed using a vacuum degassing machine (Daehwa Tech) to compare them (Tables 1 to 9) and The adhesive composition for a display of Examples (Tables 10 to 17) was prepared.
수지Curability
Suzy
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
methylphenyl
sulfoniumtriflate/(시그마-알드리치)(4-methylthiophenyl)
methylphenyl
sulfoniumtriflate/(Sigma-Aldrich)
<평가><Evaluation>
접착제 효과Adhesive effect
경화 전 유색 광경화 수지 조성물은 세정한 ITO 유리기판(삼성 코닝사)을 이용하여 동일한 ITO 유리기판이 중첩되는 중앙부에 취하고 중첩시킨 후 두께를 균일하게 하고, 메탈 할라이드 램프로 2,000mJ/㎠의 자외선 조사하고 조성물을 광경화시켜 접착 강도 측정용 시편을 제작하였다. 제작된 시편을 인장강도계(Tinius Olsen)을 사용하여 접착 강도를 측정하였다. 얻어진 측정치(N)를 시일 도포 단면적(mm2)으로 나눈 값이 1.5 이상인 경우를 『◎』, 1.0 이상인 경우를 『○』, 0.5 이상인 경우를 The colored photocurable resin composition before curing is taken by using the cleaned ITO glass substrate (Samsung Corning) in the central portion where the same ITO glass substrate overlaps, superimposed and uniformly thickened, and irradiated with 2,000 mJ/cm 2 of ultraviolet light with a metal halide lamp. And the composition was photocured to prepare a specimen for measuring adhesive strength. Adhesive strength of the prepared specimen was measured using a tensile strength meter (Tinius Olsen). When the obtained measurement value (N) is divided by the seal application cross-sectional area (mm 2 ) is 1.5 or more, ``◎'', 1.0 or more, ``○'', 0.5 or more
『△』, 0.5 이하인 경우를 『X』로 하여 평가하였다. 평가 결과를 표 18~26에 표시하였다.When "△" and 0.5 or less were evaluated as "X". The evaluation results are shown in Tables 18-26.
투습 방지효과Prevention of moisture permeation
- 고습조건에서 수분 투과도 측정-Moisture permeability measurement under high humidity conditions
비교 예의 경우 사각틀을 이용하여 4cm*4cm 사이즈 시편을 제작 후 메탈 할라이드 램프로 2,000mJ/㎠의 자외선 조사하고 조성물을 광경화시켜 고습조건 수분 투과도 측정용 시편을 제작하였다. 제작된 시편을 MOCON 수분투과도 측정 장비에 장착하여, 온도 38±2℃ 습도 100%RH 조건에서 24hr 동안 투습도를 측정하였다. 얻어진 투습도의 값이 25g/m2·24hr 이하인 경우를 『◎』, 50.0g/m2·24hr 이하인 경우를 『○』, 100.0g/m2·24hr 이하인 경우를 『△』, 100.0보다 큰 경우를 『X』로 하여 평가하였다. 평가 결과를 표 18~21에 표시하였다.In the case of the comparative example, after preparing a 4 cm * 4 cm size specimen using a square frame, a metal halide lamp was irradiated with 2,000 mJ/cm 2 of ultraviolet rays and photocured to prepare a specimen for moisture permeability measurement under high humidity conditions. The prepared specimen was mounted on a MOCON moisture permeability measuring instrument, and the moisture permeability was measured for 24 hr at a temperature of 38±2°C and a humidity of 100%RH. When the obtained moisture permeability value is 25 g/m 2· 24 hr or less, “◎”, 50.0 g/m 2· 24 hr or less, “○”, 100.0 g/m 2· 24 hr or less, “△”, when it is greater than 100.0 Was evaluated as "X". The evaluation results are shown in Tables 18-21.
실시 예의 경우 비교 예에서 선택된 비교 예 62의 조성을 가지고 동일한 측정 조건으로 2 ,000mJ/㎠의 자외선 조사하고 조성물을 광경화시켜 고습조건 수분 투과도 측정용 시편을 제작하였다 제작된 시편을 MOCON 수분투과도 측정 장비에 장착하여, 온도 38±2℃ 습도 100%RH 조건에서 24hr동안 투습도를 측정하였다. 얻어진 투습도의 결과는 g/m224hr 단위를 갖는 수치로 기입하여 평가 결과를 표 22~26에 표시하였다. In the case of Examples, the composition of Comparative Example 62 selected from Comparative Example was irradiated with UV of 2,000 mJ/cm 2 under the same measurement conditions, and the composition was photocured to prepare a specimen for moisture permeability measurement under high humidity conditions. Attached to, the moisture permeability was measured for 24 hr at a temperature of 38±2° C. and a humidity of 100% RH. The results of the obtained moisture permeability were written in numerical values having g/m 2 24hr units, and the evaluation results are shown in Tables 22-26.
경화율Curing rate
조성물을 기판에 도포 후 메탈 할라이드 램프로 2,000mJ/㎠의 자외선 조사하였다. 유색재료의 특성상 적외선 IR 분광기(perkin elmer)를 사용하여 스펙트럼을 측정하고, 각각의 스펙트럼으로부터 조성물의 (메타)아크릴 관능기의 경화율을 구할수 없다. 그래서 기존 모듈공정에서 사용하는 방법을 적용하여 경화율이 높아 경화된 재료가 Tack free인 경우를 『◎』, 표면은 약간의 Takcy를 가지고 있으나 테스트용 쇠자로 눌렀다 떼었을 때 쇠자에 붙지 않는 경우를 『○』, Tacky로 인해 경화된 재료가 테스트용 쇠자로 눌렀을 때 붙을 경우 를『△』, 미경화로 인해 묻어나는 경우를 『X』로 하여 평가하였다. 평가 결과를 표 18~26에 표시하였다.After the composition was applied to the substrate, 2,000 mJ/cm 2 of ultraviolet light was irradiated with a metal halide lamp. Due to the nature of the colored material, the spectrum is measured using an infrared IR spectroscopy (perkin elmer), and the curing rate of the (meth)acrylic functional group of the composition cannot be obtained from each spectrum. So, when the method used in the existing module process is applied, the cured material is high and the cured material is tack free 『◎』, while the surface has some taccy, but it does not stick to the metal when pressed and released as a test iron. 『○』, when the material cured by Tacky was pressed when pressed with a test iron, was evaluated as “△” and when it was buried due to uncured as “X”. The evaluation results are shown in Tables 18-26.
안정성stability
비교 예 및 실시 예에서 얻어진 조성물을 25℃에서 30일간 보관했을 때의 점도와 제조 직후의 초기 점도를 측정하여 (25℃에서 10일간 보관 후의 점도)/(초기점도)의 값으로 평가하였다. 또한, 조성물의 점도는 Cone plate type 점도계(Toki Sangyo)를 사용하여, 5rpm의 조건으로 측정하였다. 점도 변화율이 1.0% 이하인 경우를 『◎』, 2.5% 이하인 경우를 『○』, 5.0% 이하인 경우를 『△』, 5.0%보다 큰 경우를 『X』로 하여 평가하였다. 평가 결과를 표 18~26에 표시하였다.The compositions obtained in Comparative Examples and Examples were measured for viscosity when stored at 25°C for 30 days and initial viscosity immediately after preparation, and evaluated as a value of (viscosity after storage at 25°C for 10 days)/(initial viscosity). In addition, the viscosity of the composition was measured using a Cone plate type viscometer (Toki Sangyo) under conditions of 5 rpm. The case where the viscosity change rate was 1.0% or less was evaluated as "◎", when it was 2.5% or less, "○", when it was 5.0% or less, as "△", and when it was greater than 5.0% as "X". The evaluation results are shown in Tables 18-26.
접착성 평가After photocuring
Adhesion evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
점도안정성
평가25℃ 10 days after leaving
Viscosity stability
evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
점도안정성
평가25℃ 10 days after leaving
Viscosity stability
evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
점도안정성
평가25℃ 10 days after leaving
Viscosity stability
evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
점도안정성
평가25℃ 10 days after leaving
Viscosity stability
evaluation
접착성 평가After photocuring
Adhesion evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
10일방치후의
점도안정성
평가25℃
After 10 days
Viscosity stability
evaluation
측정Light curing rate
Measure
접착성 평가After photocuring
Adhesion evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
10일방치후의
점도안정성
평가25℃
After 10 days
Viscosity stability
evaluation
측정Light curing rate
Measure
접착성 평가After photocuring
Adhesion evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
10일방치후의
점도안정성
평가25℃
After 10 days
Viscosity stability
evaluation
측정Light curing rate
Measure
접착성 평가After photocuring
Adhesion evaluation
측정
g/m2 dayMoisture permeability under high humidity conditions
Measure
g/m 2 day
10일방치후의
점도안정성
평가25℃
After 10 days
Viscosity stability
evaluation
측정Light curing rate
Measure
접착성 평가After photocuring
Adhesion evaluation
수분투과도
측정
g/m2 dayUnder high humidity
Moisture permeability
Measure
g/m 2 day
발생crack
Occur
10일방치후의
점도안정성
평가25℃
After 10 days
Viscosity stability
evaluation
기존 디스플레이용 유색 수지조성물은 아크릴과 에폭시 수지를 포함하여 접착성능이 우수하나 열경화제의 영향으로 상온 안정성이 떨어지는 단점과 열경화제를 배제하고 조제할 경우 광경화만으로는 디스플레이 재료들의 패널 적용에서 요구하는 접착 성능 ?? 방투습 특성을 구현이 어려웠다. 그 이유는 유색 재료의 빛 흡수 및 차단등의 효과로 인해 광경화에서는 경화가 잘 진행되지 않기 때문이다. 본 발명의 디스플레이용 유색 광경화성 수지조성물은 광중합용 양이온 개시제, 균일한 미세사이즈로 인해 빛에 투과가 용이한 비전도성 유색 재료, 수지와 가교도를 높일 수 있는 기능성 실리카를 이용하여 디스플레이 재료들의 패널 적용에 요구되는 접착 성능 및 방투습 특성을 획기적으로 상승시킬 수 있으며, 더불어 열 경화제 없는 양이온 개시제 사용으로 안정성을 아주 크게 향상시킬 수 있다. 검은색이나 노란색등의 유색 안료들이 첨가되어 광경화가 잘 안되어 경화율이 낮은 재료, 즉 가교밀도가 좋지 않은 것을 기능성 실리카를 이용하여 광개시제에 의한 연속반응으로 자체 광경화율 및 가교밀도를 높여 표면의 끈적임없는 10-2g/m224hr 단위를 갖는 우수한 방투습 특성을 나타내는 유색광경화 수지 조성물을 개발한 것이다. Existing colored resin compositions for displays have excellent adhesive performance, including acrylic and epoxy resins, but the disadvantages of poor stability at room temperature due to the influence of thermosetting agents and the exclusion of thermosetting agents are the adhesion required by panel application of display materials by light curing alone. Performance ?? It was difficult to implement moisture-permeable properties. The reason is that hardening does not proceed well in light curing due to the effect of light absorption and blocking of colored materials. The colored photocurable resin composition for display of the present invention uses a cationic initiator for photopolymerization, a non-conductive colored material that is easily permeable to light due to a uniform fine size, and a panel of display materials using functional silica that can increase the degree of crosslinking with resin. It is possible to dramatically increase the adhesion performance and moisture-permeable properties required for, and also, the use of a cationic initiator without a thermal curing agent can greatly improve stability. Colored pigments, such as black or yellow, are added, and the photocuring is poor, resulting in a material with low curing rate, that is, a poor crosslinking density, that is, a functional silica using functional silica to increase its own photocuring rate and crosslinking density, resulting in stickiness on the surface. It was developed a colored photocurable resin composition exhibiting excellent moisture-permeable properties having no 10 -2 g/m 2 24hr unit.
Claims (6)
A colored photocurable resin composition comprising 100 parts by weight of a photocurable resin, 5 to 30 parts by weight of at least one functional silica compound selected from the following structure in the form of a glass hollow sphere, 0 to 10 parts by weight of a cationic initiator, and 0.1 to 10 parts by weight of a pigment:
The method of claim 5, wherein the plate-like filler is at least one selected from the group consisting of silica, talc, asbestos, diatomaceous earth, bentonite, alumina, zinc oxide, iron oxide, celisite activated clay, aluminum nitride, glass beads, aluminum oxide, and clay. Photocurable resin composition, characterized in that.
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| US7232850B2 (en) * | 2003-10-03 | 2007-06-19 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
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