KR102056658B1 - 투명 도전 기판 및 그 제조 방법 - Google Patents
투명 도전 기판 및 그 제조 방법 Download PDFInfo
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Abstract
(해결 수단) 기재와, 상기 기재의 적어도 일방의 주면 상에 형성되고, 바인더 수지 및 도전성 섬유를 포함해서 구성된 투명 도전막과, 상기 투명 도전막 상에 형성된 보호막을 갖고, 상기 바인더 수지의 열분해 개시 온도가 210℃ 이상이며, 또한 상기 보호막이 열경화성 수지의 열경화막인 것을 특징으로 하는 투명 도전 기판.
Description
도 2는 내광성 시험 후의 비교예 1의 도전 기판의 SEM 사진이다.
Claims (16)
- 기재와,
상기 기재의 적어도 일방의 주면 상에 형성되고, 바인더 수지 및 도전성 섬유를 포함해서 구성된 투명 도전막과,
상기 투명 도전막 상에 형성된 보호막을 갖고, 상기 바인더 수지는 열분해 개시 온도가 210℃ 이상이고, N-비닐아세트아미드(NVA)를 모노머 유닛으로서 70몰% 이상 포함하는 중합체를 포함하고, 또한 상기 보호막이 (A) 카르복실기를 함유하는 폴리우레탄과, (B) 에폭시 화합물과, (C) 경화 촉진제를 포함하고, 고형분 중의 방향환 함유 화합물의 함유 비율이 15질량% 이하인 열경화성 수지 조성물의 열경화막이고, 상기 도전성 섬유가 금속 나노와이어이고, 상기 바인더 수지와 금속 나노와이어의 질량비(바인더 수지/금속 나노와이어)가 0.8 이상 20 이하인 것을 특징으로 하는 투명 도전 기판. - 제 1 항에 있어서,
상기 중합체가 N-비닐아세트아미드(NVA)의 호모폴리머인 투명 도전 기판. - 제 1 항 또는 제 2 항에 있어서,
상기 금속 나노와이어가 은 나노와이어인 투명 도전 기판. - 제 1 항 또는 제 2 항에 있어서,
상기 보호막 및 바인더 수지가 모두 분자 내에 방향환을 갖지 않는 투명 도전 기판. - 제 1 항 또는 제 2 항에 있어서,
상기 기재가 수지 필름인 것을 특징으로 하는 투명 도전 기판. - 제 5 항에 있어서,
상기 수지 필름이 시클로올레핀 폴리머인 투명 도전 기판. - 기재의 적어도 일방의 주면 상에 열분해 개시 온도가 210℃ 이상이고, N-비닐아세트아미드(NVA)를 모노머 유닛으로서 70몰% 이상 포함하는 중합체를 포함하는 바인더 수지 및 도전성 섬유를 포함하는 도전성 잉크에 의해 투명 도전막을 형성하는 공정과,
상기 투명 도전막 상에 (A) 카르복실기를 함유하는 폴리우레탄과, (B) 에폭시 화합물과, (C) 경화 촉진제와, (D) 용매를 포함하고, 상기 (D) 용매의 함유율이 95.0질량% 이상 99.9질량% 이하이고, 고형분 중의 방향환 함유 화합물의 함유 비율이 15질량% 이하인 열경화성 보호막 잉크에 의해 보호막을 형성하는 공정과,
상기 보호막을 가열해서 경화시키는 공정을 포함하고,
상기 도전성 섬유가 금속 나노와이어이고, 상기 바인더 수지와 금속 나노와이어의 질량비(바인더 수지/금속 나노와이어)가 0.8 이상 20 이하인 투명 도전 기판의 제조 방법. - 제 7 항에 있어서,
상기 중합체가 N-비닐아세트아미드(NVA)의 호모폴리머인 투명 도전 기판의 제조 방법. - 제 7 항 또는 제 8 항에 있어서,
상기 금속 나노와이어가 은 나노와이어인 투명 도전 기판의 제조 방법. - 삭제
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-234242 | 2016-12-01 | ||
| JP2016234242 | 2016-12-01 | ||
| JPJP-P-2017-144454 | 2017-07-26 | ||
| JP2017144454 | 2017-07-26 | ||
| PCT/JP2017/042823 WO2018101334A1 (ja) | 2016-12-01 | 2017-11-29 | 透明導電基板及びその製造方法 |
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| KR20190068578A KR20190068578A (ko) | 2019-06-18 |
| KR102056658B1 true KR102056658B1 (ko) | 2019-12-18 |
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| JP (1) | JP6543005B2 (ko) |
| KR (1) | KR102056658B1 (ko) |
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| US10902970B2 (en) * | 2015-04-16 | 2021-01-26 | Basf Se | Patterned transparent conductive film and process for producing such a patterned transparent conductive film |
| TW202022063A (zh) * | 2018-09-13 | 2020-06-16 | 日商昭和電工股份有限公司 | 導電性墨及碳配線基板 |
| KR20210110672A (ko) | 2019-02-18 | 2021-09-08 | 쇼와 덴코 가부시키가이샤 | 투명 도전 기체 및 이것을 포함하는 터치패널 |
| JP7272069B2 (ja) * | 2019-04-04 | 2023-05-12 | 東洋インキScホールディングス株式会社 | 有機溶剤系印刷インキ、印刷物および積層体 |
| US12424348B2 (en) * | 2019-04-26 | 2025-09-23 | Konica Minolta, Inc. | Transparent electrode and electronic device equipped with same |
| US11535047B2 (en) | 2019-05-31 | 2022-12-27 | Showa Denko K.K. | Method for producing transparent conducting film |
| WO2021060149A1 (ja) * | 2019-09-26 | 2021-04-01 | 昭和電工株式会社 | 透明ポリウレタン及びその製造方法並びに透明ポリウレタンを含む熱硬化性組成物及び透明導電フィルム |
| JP7061734B2 (ja) * | 2019-10-18 | 2022-04-28 | 昭和電工株式会社 | 透明導電フィルム積層体及びその加工方法 |
| CN110798968B (zh) * | 2019-12-06 | 2021-10-15 | 北京万物皆媒科技有限公司 | 一种透明电路板及制作方法 |
| CN111171630A (zh) * | 2020-01-19 | 2020-05-19 | 惠州达祺光电科技有限公司 | 一种喷墨打印图案化透明导电膜的制备方法 |
| WO2021150200A1 (en) * | 2020-01-20 | 2021-07-29 | Hewlett-Packard Development Company, L.P. | Fixer composition |
| TWI767296B (zh) * | 2020-08-13 | 2022-06-11 | 大陸商天材創新材料科技(廈門)有限公司 | 透明導電薄膜及其製備方法 |
| JP6999071B1 (ja) * | 2020-08-26 | 2022-02-14 | 昭和電工株式会社 | 透明導電基体 |
| WO2022065195A1 (ja) * | 2020-09-25 | 2022-03-31 | 昭和電工株式会社 | 透明基板及びその製造方法 |
| KR102519130B1 (ko) | 2020-12-16 | 2023-04-10 | 한국전자기술연구원 | 금속 기반의 유무기 화합물을 이용한 은기반 복합구조 나노선 네트워크 제조 방법 및 제조된 은나노선 네트워크 |
| KR20230074535A (ko) | 2020-12-24 | 2023-05-30 | 가부시끼가이샤 레조낙 | 투명 도전 필름 적층체 |
| US20240203618A1 (en) | 2021-03-29 | 2024-06-20 | Resonac Corporation | Transparent conductive film and method for forming transparent conduction pattern |
| JPWO2022210586A1 (ko) | 2021-03-29 | 2022-10-06 | ||
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| JP5600457B2 (ja) | 2010-03-26 | 2014-10-01 | パナソニック株式会社 | 透明導電膜付き基材 |
| JP2012230881A (ja) | 2010-06-24 | 2012-11-22 | Fujifilm Corp | 導電膜、タッチパネル及び太陽電池 |
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| JP2013170210A (ja) | 2012-02-21 | 2013-09-02 | Jnc Corp | 透明導電膜の保護膜用熱硬化性組成物 |
| TWI499647B (zh) * | 2012-04-26 | 2015-09-11 | Univ Osaka | 透明導電性油墨及透明導電圖型之形成方法 |
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| JP6669443B2 (ja) * | 2015-06-02 | 2020-03-18 | 昭和電工株式会社 | 金属ナノワイヤを用いた導電パターンの保護膜用樹脂組成物及び透明導電基板 |
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| WO2009035059A1 (ja) | 2007-09-12 | 2009-03-19 | Kuraray Co., Ltd. | 導電膜、導電部材および導電膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190388933A1 (en) | 2019-12-26 |
| US11154902B2 (en) | 2021-10-26 |
| CN109923622B (zh) | 2020-06-19 |
| TW201832933A (zh) | 2018-09-16 |
| JP6543005B2 (ja) | 2019-07-10 |
| TWI677434B (zh) | 2019-11-21 |
| WO2018101334A1 (ja) | 2018-06-07 |
| KR20190068578A (ko) | 2019-06-18 |
| CN109923622A (zh) | 2019-06-21 |
| JPWO2018101334A1 (ja) | 2019-04-04 |
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