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KR101881066B1 - 반도체 발광 소자 - Google Patents

반도체 발광 소자 Download PDF

Info

Publication number
KR101881066B1
KR101881066B1 KR1020160015233A KR20160015233A KR101881066B1 KR 101881066 B1 KR101881066 B1 KR 101881066B1 KR 1020160015233 A KR1020160015233 A KR 1020160015233A KR 20160015233 A KR20160015233 A KR 20160015233A KR 101881066 B1 KR101881066 B1 KR 101881066B1
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020160015233A
Other languages
English (en)
Other versions
KR20160141362A (ko
Inventor
차남구
임완태
김용일
노혜석
신은주
심성현
유하늘
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to US15/163,204 priority Critical patent/US10217914B2/en
Priority to DE102016109616.4A priority patent/DE102016109616B4/de
Priority to CN201610357748.6A priority patent/CN106206862B/zh
Publication of KR20160141362A publication Critical patent/KR20160141362A/ko
Priority to US15/973,977 priority patent/US20180261738A1/en
Application granted granted Critical
Publication of KR101881066B1 publication Critical patent/KR101881066B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L33/24—
    • H01L33/005—
    • H01L33/22—
    • H01L33/36—
    • H01L33/502—
    • H01L33/62—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
KR1020160015233A 2015-05-27 2016-02-05 반도체 발광 소자 Expired - Fee Related KR101881066B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/163,204 US10217914B2 (en) 2015-05-27 2016-05-24 Semiconductor light emitting device
DE102016109616.4A DE102016109616B4 (de) 2015-05-27 2016-05-25 Licht emittierende Halbleitervorrichtung
CN201610357748.6A CN106206862B (zh) 2015-05-27 2016-05-26 半导体发光器件
US15/973,977 US20180261738A1 (en) 2015-05-27 2018-05-08 Semiconductor light emitting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020150073930 2015-05-27
KR20150073930 2015-05-27
KR1020150138683 2015-10-01
KR20150138683 2015-10-01

Publications (2)

Publication Number Publication Date
KR20160141362A KR20160141362A (ko) 2016-12-08
KR101881066B1 true KR101881066B1 (ko) 2018-07-25

Family

ID=57577064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160015233A Expired - Fee Related KR101881066B1 (ko) 2015-05-27 2016-02-05 반도체 발광 소자

Country Status (1)

Country Link
KR (1) KR101881066B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11005076B2 (en) 2018-11-05 2021-05-11 Samsung Display Co., Ltd. Flexible display device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102430500B1 (ko) * 2017-05-30 2022-08-08 삼성전자주식회사 반도체 발광소자 및 이를 이용한 led 모듈
KR102346393B1 (ko) * 2017-06-19 2022-01-03 동우 화인켐 주식회사 터치센서를 포함하는 플렉시블 표시장치의 제조방법
KR102666539B1 (ko) 2017-12-13 2024-05-17 삼성전자주식회사 자외선 반도체 발광소자
KR102582424B1 (ko) * 2017-12-14 2023-09-25 삼성전자주식회사 발광소자 패키지 및 이를 이용한 디스플레이 장치
US11843077B2 (en) * 2020-02-11 2023-12-12 Seoul Viosys Co., Ltd. Unit pixel having light emitting device and displaying apparatus
EP4141972A4 (en) * 2020-06-08 2024-05-01 Seoul Viosys Co., Ltd UNIT PIXEL WITH LIGHT-EMITTING DEVICES AND DISPLAY DEVICE
US12364073B2 (en) 2020-06-08 2025-07-15 Seoul Viosys Co., Ltd. Unit pixel having light emitting device and displaying apparatus
US12272765B2 (en) 2020-09-24 2025-04-08 Seoul Viosys Co., Ltd. High efficiency light emitting device, unit pixel having the same, and displaying apparatus having the same
US20250275335A1 (en) * 2021-08-18 2025-08-28 Lg Electronics Inc. Display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205468A (ja) * 2007-02-20 2008-09-04 Cree Inc 低屈折率キャリア基板上のｉｉｉ族窒化物ダイオード
JP2011060966A (ja) * 2009-09-09 2011-03-24 Panasonic Electric Works Co Ltd 発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205468A (ja) * 2007-02-20 2008-09-04 Cree Inc 低屈折率キャリア基板上のｉｉｉ族窒化物ダイオード
JP2011060966A (ja) * 2009-09-09 2011-03-24 Panasonic Electric Works Co Ltd 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11005076B2 (en) 2018-11-05 2021-05-11 Samsung Display Co., Ltd. Flexible display device

Also Published As

Publication number Publication date
KR20160141362A (ko) 2016-12-08

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