KR101836566B1 - 도전성 접착제 및 이를 이용한 복합소재의 접합방법 - Google Patents
도전성 접착제 및 이를 이용한 복합소재의 접합방법 Download PDFInfo
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- KR101836566B1 KR101836566B1 KR1020150067966A KR20150067966A KR101836566B1 KR 101836566 B1 KR101836566 B1 KR 101836566B1 KR 1020150067966 A KR1020150067966 A KR 1020150067966A KR 20150067966 A KR20150067966 A KR 20150067966A KR 101836566 B1 KR101836566 B1 KR 101836566B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
Abstract
Description
도 2는 본 발명에 따른 접착강도 평가를 위한 인장 겹침 전단 강도 시편의 평면도 및 단면도이다.
| 구분 | 실시예 1 | 실시예 2 | 실시예 3 |
| 전도성 섬유길이 (㎜) | 3 | 6 | 1 |
| 전도성 섬유함량 (중량%) |
12 | 15 | 18 |
| 접착강도*1) (㎫) | 26.8 | 27.2 | 28.3 |
| 저항 *2) (Ω·m) | 1.2X10-7 | 1.3X10-7 | 9.7X10-8 |
| 선팽창계수 (10-6 m/m·K) |
14.2 | 13.7 | 12.6 |
| *1) ISO 4587 인장 겹침 전단 강도 측정 (Single Lap Shear Joint Test), 접착 전 표면처리는 ISO 17212를 따름 *2) 접착층의 저항 ※ 스틸의 선팽창계수: 13×10-6 m/m·K, 복합소재(탄소섬유 복합재 루프)의 선팽창계수: 2~14×10-6 m/m·K |
|||
| 구분 | 비교예 1 | 비교예 2 | 비교예 3 | 비교예 4 | 비교예 5 |
| 전도성 섬유길이 (㎜) | - | 3 | 3 | 0.5 | 10 |
| 전도성 섬유함량 (중량%) |
None | 5 | 35 | 12 | 12 |
| 접착강도*1) (㎫) | 22.8 | 23.9 | 16.2 | 25.7 | 17.6 |
| 저항 *2) (Ω·m) | 4.83X1011 | 1.3X10-7 | 9.2X10-8 | 6.3X10-5 | 1.1X10-8 |
| 선팽창계수 (10-6 m/m·K) |
49.1 | 28.8 | 11.9 | 13.4 | 16.9 |
| *1) ISO 4587 인장 겹침 전단 강도 측정 (Single Lap Shear Joint Test), 접착 전 표면처리는 ISO 17212를 따름 *2) 접착층의 저항 ※ 스틸의 선팽창계수: 13×10-6 m/m·K, 복합소재(탄소섬유 복합재 루프)의 선팽창계수: 2 ~ 14×10-6 m/m·K |
|||||
Claims (15)
상기 전도성 섬유는 평균 섬유길이가 1~6 mm이고, 평균 섬유직경이 2~12 ㎛이며, 전도성 금속이 0.1~0.5 ㎛의 평균 두께로 도금된 탄소섬유이고,
상기 도전성 접착제는 선팽창계수가 12.6 x 10-6 내지 14.2 x 10-6 m/m·K인 것을 특징으로 하는 도전성 접착제.
상기 1 액형 또는 2 액형 접착제는 에폭시계, 우레탄계 및 아크릴레이트계로 이루어진 군에서 선택된 1종 이상인 것을 특징으로 하는 도전성 접착제.
상기 전도성 금속은 구리(Cu), 아연(Zn), 은(Ag), 금(Au), 백금(Pt), 안티몬(Sb), 망간(Mn), 니켈(Ni), 주석(Sn), 바나듐(V), 인듐(In), 및 주석(Sn)으로 이루어진 군에서 선택되는 1종 이상인 것을 특징으로 하는 도전성 접착제.
상기 전도성 금속이 도금된 탄소섬유에서 상기 전도성 금속의 도금량은 탄소섬유 대비 8 ~ 150 중량%인 것을 특징으로 하는 도전성 접착제.
1 액형 접착제 또는 2 액형 접착제 82~88 중량%에 상기 전도성 섬유 12~18 중량%를 혼합하여 도전성 접착제를 제조하는 단계;
피접착물 상에 상기 도전성 접착제를 도포하는 단계; 및
상기 도전성 접착제가 도포된 피접착물 상에 복합소재를 접착시키는 단계;
를 포함하고,
상기 전도성 섬유를 준비하는 단계에서 상기 전도성 섬유는 평균 섬유길이가 1~6 mm이고, 평균 섬유직경이 2~12 ㎛가 되도록 절단하는 공정을 수행하고,
상기 전도성 섬유는 전도성 금속이 0.1~0.5 ㎛의 평균 두께로 도금된 탄소섬유이고,
상기 도전성 접착제는 선팽창계수가 12.6 x 10-6 내지 14.2 x 10-6 m/m·K인 것을 특징으로 하는 자동차용 복합소재의 접합방법.
상기 전도성 금속은 구리(Cu), 아연(Zn), 은(Ag), 금(Au), 백금(Pt), 안티몬(Sb), 망간(Mn), 니켈(Ni), 주석(Sn), 바나듐(V), 인듐(In), 및 주석(Sn)으로 이루어진 군에서 선택되는 1종 이상인 것을 특징으로 하는 자동차용 복합소재의 접합방법.
상기 전도성 금속이 도금된 탄소섬유에서 상기 전도성 금속의 도금량은 탄소섬유 대비 8 ~ 150 중량%인 것을 특징으로 하는 자동차용 복합소재의 접합방법.
상기 도전성 접착제의 도포량은 상기 피접착물의 접착단위면적(㎡) 당 1.42 ~ 5.20 ㎏인 것을 특징으로 하는 자동차용 복합소재의 접합방법.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150067966A KR101836566B1 (ko) | 2015-05-15 | 2015-05-15 | 도전성 접착제 및 이를 이용한 복합소재의 접합방법 |
| US14/954,880 US10351735B2 (en) | 2015-05-15 | 2015-11-30 | Conductive adhesive and bonding method of composite material using the conductive adhesive |
| DE102015225077.6A DE102015225077B4 (de) | 2015-05-15 | 2015-12-14 | Leitfähiger Klebstoff und Klebeverfahren für ein Verbundmaterial unter Verwendung des leitfähigen Klebstoffs |
| CN201510947273.1A CN106147645B (zh) | 2015-05-15 | 2015-12-17 | 导电粘合剂和使用导电粘合剂的复合材料粘合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150067966A KR101836566B1 (ko) | 2015-05-15 | 2015-05-15 | 도전성 접착제 및 이를 이용한 복합소재의 접합방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160134241A KR20160134241A (ko) | 2016-11-23 |
| KR101836566B1 true KR101836566B1 (ko) | 2018-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150067966A Expired - Fee Related KR101836566B1 (ko) | 2015-05-15 | 2015-05-15 | 도전성 접착제 및 이를 이용한 복합소재의 접합방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10351735B2 (ko) |
| KR (1) | KR101836566B1 (ko) |
| CN (1) | CN106147645B (ko) |
| DE (1) | DE102015225077B4 (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107189721B (zh) * | 2017-05-26 | 2019-02-26 | 江苏斯瑞达新材料科技有限公司 | 一种导电压敏胶组合物及其在生产厚胶层导电胶带中的应用 |
| WO2018221898A1 (ko) * | 2017-06-02 | 2018-12-06 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
| KR102136705B1 (ko) | 2017-06-02 | 2020-07-22 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
| CN107163886A (zh) * | 2017-06-29 | 2017-09-15 | 铜陵市永创变压器电子有限公司 | 一种石英晶振用镀镍碳纤维/石墨烯填充的导电胶粘剂及其制备方法 |
| KR101984966B1 (ko) * | 2018-10-02 | 2019-05-31 | 주식회사 한엘 | 마이크로 와이어와 비드를 포함하는 아크릴 점착제 코팅액 조성물 및 이를 이용한 보안필름 제조방법 |
| DE102022103873A1 (de) | 2022-02-18 | 2023-08-24 | DIAMANT Polymer GmbH | Mehrkomponentensystem und Verfahren zum Ausgleichen von Unebenheiten und/oder Spalten zwischen zumindest zwei Bauteilen sowie Verwendung des Mehrkomponentensystems |
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| JPH0742449B2 (ja) | 1988-11-30 | 1995-05-10 | サンスター技研株式会社 | 自動車構造用接着剤 |
| KR100197169B1 (ko) | 1997-05-31 | 1999-06-15 | 이연복 | 자동차 철구조물의 연속적 면접합이 가능한 고강도 접착제 조성 물 |
| JP2000191987A (ja) * | 1998-12-28 | 2000-07-11 | Polymatech Co Ltd | 熱伝導性接着フィルムおよび半導体装置 |
| DE19964364B4 (de) | 1999-01-30 | 2008-03-27 | Asahi Kasei Kabushiki Kaisha | Thermoplastischer Formkörper, der Kohlefasern enthält und dessen Verwendung |
| US6384128B1 (en) * | 2000-07-19 | 2002-05-07 | Toray Industries, Inc. | Thermoplastic resin composition, molding material, and molded article thereof |
| JP2004027134A (ja) | 2002-06-28 | 2004-01-29 | Kinseki Ltd | 導電性接着剤 |
| JP4817772B2 (ja) * | 2004-09-14 | 2011-11-16 | 昭和電工株式会社 | 導電性樹脂組成物、その製造方法及び用途 |
| WO2006088127A1 (ja) * | 2005-02-18 | 2006-08-24 | Toyo Ink Manufacturing Co., Ltd. | 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法 |
| CN101268163B (zh) * | 2005-09-16 | 2012-11-14 | 东洋油墨制造株式会社 | 粘结剂组合物、使用它的粘结剂片及其应用 |
| KR20070102333A (ko) | 2006-04-15 | 2007-10-18 | (주)한국특수합판 | 콘크리트 거푸집 패널의 접착제 조성물 |
| KR100888324B1 (ko) | 2007-05-04 | 2009-03-12 | 앰코 테크놀로지 코리아 주식회사 | 도전성 접착제의 제조방법 |
| JP2008297514A (ja) * | 2007-06-04 | 2008-12-11 | Teijin Ltd | 熱伝導性接着剤 |
| US7628879B2 (en) | 2007-08-23 | 2009-12-08 | The Boeing Company | Conductive scrim embedded structural adhesive films |
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| CN101903485B (zh) * | 2007-12-18 | 2012-12-05 | 3M创新有限公司 | 导电粘合剂前体及其使用方法和制品 |
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| US20110132537A1 (en) | 2009-12-03 | 2011-06-09 | 3M Innovative Properties Company | Composition, tape, and use thereof |
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| CN104039852B (zh) | 2011-05-16 | 2017-02-15 | 亚什兰许可和知识产权有限公司 | 具有高温储能模量的双组分聚脲‑聚氨酯粘合剂 |
| DE102012207462A1 (de) | 2012-05-04 | 2013-11-07 | Tesa Se | Dreidimensional elektrisch leitfähige Klebstofffolie |
-
2015
- 2015-05-15 KR KR1020150067966A patent/KR101836566B1/ko not_active Expired - Fee Related
- 2015-11-30 US US14/954,880 patent/US10351735B2/en active Active
- 2015-12-14 DE DE102015225077.6A patent/DE102015225077B4/de not_active Expired - Fee Related
- 2015-12-17 CN CN201510947273.1A patent/CN106147645B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE102015225077B4 (de) | 2022-12-08 |
| US20160333231A1 (en) | 2016-11-17 |
| DE102015225077A1 (de) | 2016-11-17 |
| CN106147645B (zh) | 2020-12-04 |
| US10351735B2 (en) | 2019-07-16 |
| KR20160134241A (ko) | 2016-11-23 |
| CN106147645A (zh) | 2016-11-23 |
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