KR101784736B1 - 압전 센서 - Google Patents
압전 센서 Download PDFInfo
- Publication number
- KR101784736B1 KR101784736B1 KR1020170066198A KR20170066198A KR101784736B1 KR 101784736 B1 KR101784736 B1 KR 101784736B1 KR 1020170066198 A KR1020170066198 A KR 1020170066198A KR 20170066198 A KR20170066198 A KR 20170066198A KR 101784736 B1 KR101784736 B1 KR 101784736B1
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- film
- electrode layer
- electrode
- pvdf
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- H01L41/1132—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
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- H01L41/047—
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- H01L41/083—
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- H01L41/193—
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- H01L41/27—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
도 2는 도 1에 도시된 실시예에 따른 압전 센서를 분리하여 나타낸 사시도.
도 3은 도 1에 도시된 실시예에 채용된 PVDF 필름과 전극층의 제조 과정을 개략적으로 나타낸 사시도.
도 4는 도 1에 도시된 실시예의 단면도.
도 5는 본 발명의 다른 실시예에 따른 압전 센서의 단면도.
10 : PVDF 필름
20 : 전극층
30 : 기판 31 : 제1 전극 32 : 제2 전극 33 : 단자부
40 : 비전도층 41 : 보호필름 42 : 가장자리
50a : 제1 차폐필름
50b : 제2 차폐필름 51 : 가장자리 52 : 일단부
R : 롤 S : PVDF 필름지 P : 인쇄 장비
Claims (4)
- PVDF 필름;
상기 PVDF 필름의 상면에 형성되는 전극층;
상기 전극층과 전기적으로 연결되는 제1 전극과, 상기 제1 전극과 이격된 위치에 제2 전극을 구비하는 기판;
상기 전극층을 덮어 가리는 비전도층;
상기 비전도층에 부착되면서 상기 제2 전극과 전기적으로 연결되는 제1 차폐필름; 및
상기 PVDF 필름의 상면에 부착되고, 상기 PVDF필름 내지 상기 비전도층의 적층물을 감싸면서 상기 제1 차폐필름과 연결되는 제2 차폐필름;
을 포함하는 압전 센서. - 제1항에서,
상기 비전도층은
상기 전극층에 부착되는 비전도성 보호필름이고,
상기 보호필름의 사이즈는 상기 전극층의 사이즈보다 큰 것을 특징으로 하는
압전 센서. - 제1항에서,
말린 롤에서 풀려나오는 PVDF 필름지에 상기 전극층을 인쇄하고, 이를 재단함에 따라, 재단된 각 상기 PVDF 필름의 전면과 대응한 면적으로 전극층이 형성되어 있는 것을 특징으로 하는
압전 센서. - 제1항에서,
상기 PVDF 필름과 상기 제2 차폐필름 사이에는 전도성 접착층이 개재되는 것을 특징으로 하는
압전 센서.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170066198A KR101784736B1 (ko) | 2017-05-29 | 2017-05-29 | 압전 센서 |
| PCT/KR2018/005954 WO2018221894A1 (ko) | 2017-05-29 | 2018-05-25 | 압전 센서 |
| US16/608,297 US11346728B2 (en) | 2017-05-29 | 2018-05-25 | Piezoelectric sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170066198A KR101784736B1 (ko) | 2017-05-29 | 2017-05-29 | 압전 센서 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR101784736B1 true KR101784736B1 (ko) | 2017-10-12 |
Family
ID=60140324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170066198A Active KR101784736B1 (ko) | 2017-05-29 | 2017-05-29 | 압전 센서 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11346728B2 (ko) |
| KR (1) | KR101784736B1 (ko) |
| WO (1) | WO2018221894A1 (ko) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210067302A (ko) * | 2019-11-29 | 2021-06-08 | 명지대학교 산학협력단 | 우수한 노이즈 제거 기능을 가지는 피브디에프 센서 |
| KR20230087752A (ko) | 2021-12-10 | 2023-06-19 | 한국기술교육대학교 산학협력단 | Dba를 포함하는 압전체 및 압전체의 제조방법 |
| KR20230087753A (ko) | 2021-12-10 | 2023-06-19 | 한국기술교육대학교 산학협력단 | 이온성 액체를 포함하는 압전체 및 압전체의 제조방법 |
| KR20230163059A (ko) | 2022-05-23 | 2023-11-30 | 한국기술교육대학교 산학협력단 | 압전체의 제조방법 및 이에 의해 제조된 압전체 |
| US12303276B2 (en) | 2021-07-05 | 2025-05-20 | Atsens Co., Ltd. | Wearable device including structure for preventing noise caused by static electricity |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019132356A1 (de) * | 2019-11-28 | 2021-06-02 | Tdk Electronics Ag | Zweikanaliger Detektor |
| US20230160762A1 (en) * | 2021-11-25 | 2023-05-25 | National Taiwan University Of Science And Technology | Pressure Sensing Element with Porous Structure Based Flexible Base |
| JP7632760B2 (ja) * | 2022-07-06 | 2025-02-19 | 株式会社村田製作所 | センサ及び把持負荷検出デバイス |
| FR3147863B1 (fr) | 2023-04-12 | 2025-11-07 | Wormsensing | Dispositif piezoelectrique flexible de mesure de deformation, unidirectionnel, bidirectionel ou omnidirectionnel |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101322838B1 (ko) | 2012-10-15 | 2013-10-28 | 경희대학교 산학협력단 | 카본블랙이 함유된 압전센서 제조방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036797A (ko) * | 2002-10-24 | 2004-05-03 | 전국진 | 맥진 검출 센서 및 그 제조방법 그리고 이를 이용한 맥진검출장치 |
| US20120127136A1 (en) * | 2010-08-18 | 2012-05-24 | Kent Displays Incorporated | Display device including piezoelectric and liquid crystal layers |
| KR20130021499A (ko) * | 2011-08-23 | 2013-03-06 | 서울시립대학교 산학협력단 | 압전센서 및 그 제조방법 |
| KR101340143B1 (ko) * | 2011-12-14 | 2013-12-10 | 광운대학교 산학협력단 | 압전-자성 마이크로 소자, 이를 포함하는 자기 센서 및 압전-자성 마이크로 소자의 제조 방법 |
| TW201621585A (zh) * | 2014-10-14 | 2016-06-16 | 康寧公司 | 壓電膜結構與感測器以及使用該壓電膜結構與感測器的顯 示組件 |
| US10008659B2 (en) * | 2014-12-09 | 2018-06-26 | Lg Innotek Co., Ltd. | Fingerprint sensor |
| KR101730396B1 (ko) * | 2015-07-15 | 2017-05-11 | 경희대학교 산학협력단 | 전기방사하여 얻은 나노섬유 웹 형태의 pla 압전소재를 이용한 압력측정 센서 |
| KR101862467B1 (ko) * | 2016-09-07 | 2018-07-05 | 연세대학교 산학협력단 | 압전 소자 및 이의 제조 방법 |
| CN106525296A (zh) * | 2016-10-09 | 2017-03-22 | 深圳瑞湖科技有限公司 | 一种用于触摸检测的电子皮肤 |
| US11126814B2 (en) * | 2018-10-17 | 2021-09-21 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with flexible substrate |
| CN109253828A (zh) * | 2018-10-25 | 2019-01-22 | 业成科技(成都)有限公司 | 触觉传感器及其制备方法 |
| US10929636B2 (en) * | 2019-01-18 | 2021-02-23 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer |
| US20210041287A1 (en) * | 2019-08-09 | 2021-02-11 | Apple Inc. | On-Bed Differential Piezoelectric Sensor |
-
2017
- 2017-05-29 KR KR1020170066198A patent/KR101784736B1/ko active Active
-
2018
- 2018-05-25 WO PCT/KR2018/005954 patent/WO2018221894A1/ko not_active Ceased
- 2018-05-25 US US16/608,297 patent/US11346728B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101322838B1 (ko) | 2012-10-15 | 2013-10-28 | 경희대학교 산학협력단 | 카본블랙이 함유된 압전센서 제조방법 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210067302A (ko) * | 2019-11-29 | 2021-06-08 | 명지대학교 산학협력단 | 우수한 노이즈 제거 기능을 가지는 피브디에프 센서 |
| KR102309737B1 (ko) * | 2019-11-29 | 2021-10-06 | 명지대학교 산학협력단 | 우수한 노이즈 제거 기능을 가지는 피브디에프 센서 |
| US12303276B2 (en) | 2021-07-05 | 2025-05-20 | Atsens Co., Ltd. | Wearable device including structure for preventing noise caused by static electricity |
| KR20230087752A (ko) | 2021-12-10 | 2023-06-19 | 한국기술교육대학교 산학협력단 | Dba를 포함하는 압전체 및 압전체의 제조방법 |
| KR20230087753A (ko) | 2021-12-10 | 2023-06-19 | 한국기술교육대학교 산학협력단 | 이온성 액체를 포함하는 압전체 및 압전체의 제조방법 |
| KR20230163059A (ko) | 2022-05-23 | 2023-11-30 | 한국기술교육대학교 산학협력단 | 압전체의 제조방법 및 이에 의해 제조된 압전체 |
| KR20250090256A (ko) | 2022-05-23 | 2025-06-19 | 한국기술교육대학교 산학협력단 | 압전체의 제조방법 및 이에 의해 제조된 압전체 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018221894A1 (ko) | 2018-12-06 |
| US11346728B2 (en) | 2022-05-31 |
| US20210102850A1 (en) | 2021-04-08 |
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