KR101433636B1 - Polymer resin having electrostatic dispersion performance and polymer resin composition containing the same - Google Patents
Polymer resin having electrostatic dispersion performance and polymer resin composition containing the same Download PDFInfo
- Publication number
- KR101433636B1 KR101433636B1 KR1020060116770A KR20060116770A KR101433636B1 KR 101433636 B1 KR101433636 B1 KR 101433636B1 KR 1020060116770 A KR1020060116770 A KR 1020060116770A KR 20060116770 A KR20060116770 A KR 20060116770A KR 101433636 B1 KR101433636 B1 KR 101433636B1
- Authority
- KR
- South Korea
- Prior art keywords
- bisperfluoroalkanesulfonylimides
- weight
- group
- imidazolium
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002952 polymeric resin Substances 0.000 title claims abstract description 44
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 44
- 239000000203 mixture Substances 0.000 title claims abstract description 34
- 239000006185 dispersion Substances 0.000 title abstract description 27
- -1 aromatic diisocyanate compound Chemical class 0.000 claims abstract description 37
- 229920000570 polyether Polymers 0.000 claims abstract description 30
- 150000003839 salts Chemical class 0.000 claims abstract description 28
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004970 Chain extender Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 125000003277 amino group Chemical group 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- 150000001450 anions Chemical class 0.000 claims description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 8
- 239000007791 liquid phase Substances 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920001519 homopolymer Polymers 0.000 claims description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 claims description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims description 2
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 claims description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 claims description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 claims description 2
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 claims description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 2
- 150000005215 alkyl ethers Chemical class 0.000 claims 4
- 150000004693 imidazolium salts Chemical group 0.000 claims 3
- JIABEENURMZTTI-UHFFFAOYSA-N 1-isocyanato-2-[(2-isocyanatophenyl)methyl]benzene Chemical compound O=C=NC1=CC=CC=C1CC1=CC=CC=C1N=C=O JIABEENURMZTTI-UHFFFAOYSA-N 0.000 claims 1
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 claims 1
- 150000001924 cycloalkanes Chemical class 0.000 claims 1
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 claims 1
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 claims 1
- 229920003225 polyurethane elastomer Polymers 0.000 claims 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 abstract description 25
- 229920002635 polyurethane Polymers 0.000 abstract description 23
- 239000007788 liquid Substances 0.000 abstract description 21
- 230000000052 comparative effect Effects 0.000 description 28
- 125000003118 aryl group Chemical group 0.000 description 18
- 239000000805 composite resin Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 229920001223 polyethylene glycol Polymers 0.000 description 13
- 230000003068 static effect Effects 0.000 description 12
- 239000002202 Polyethylene glycol Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 9
- 239000004721 Polyphenylene oxide Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical class [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 7
- 229920005669 high impact polystyrene Polymers 0.000 description 7
- 239000004797 high-impact polystyrene Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
- 239000006184 cosolvent Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920002396 Polyurea Polymers 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- PZASAAIJIFDWSB-CKPDSHCKSA-N 8-[(1S)-1-[8-(trifluoromethyl)-7-[4-(trifluoromethyl)cyclohexyl]oxynaphthalen-2-yl]ethyl]-8-azabicyclo[3.2.1]octane-3-carboxylic acid Chemical compound FC(F)(F)C=1C2=CC([C@@H](N3C4CCC3CC(C4)C(O)=O)C)=CC=C2C=CC=1OC1CCC(C(F)(F)F)CC1 PZASAAIJIFDWSB-CKPDSHCKSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000005525 methide group Chemical group 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 229920003226 polyurethane urea Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- IFKPLJWIEQBPGG-QGZVFWFLSA-N (5s)-6-(dimethylamino)-5-methyl-4,4-diphenylhexan-3-one Chemical compound C=1C=CC=CC=1C([C@H](C)CN(C)C)(C(=O)CC)C1=CC=CC=C1 IFKPLJWIEQBPGG-QGZVFWFLSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- FZIIBDOXPQOKBP-UHFFFAOYSA-N 2-methyloxetane Chemical compound CC1CCO1 FZIIBDOXPQOKBP-UHFFFAOYSA-N 0.000 description 1
- CECNZZAKLLEZQO-UHFFFAOYSA-O 3-(3-methylbutyl)-1h-imidazol-3-ium Chemical compound CC(C)CC[N+]=1C=CNC=1 CECNZZAKLLEZQO-UHFFFAOYSA-O 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-O Pyrazolium Chemical compound C1=CN[NH+]=C1 WTKZEGDFNFYCGP-UHFFFAOYSA-O 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000005228 aryl sulfonate group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- INNKLBGUYQPIMP-UHFFFAOYSA-N buta-1,3-diene 5-phenylpenta-2,4-dienenitrile styrene Chemical compound C(=CC1=CC=CC=C1)C=CC#N.C=CC=C.C=CC1=CC=CC=C1 INNKLBGUYQPIMP-UHFFFAOYSA-N 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-O hydron;1,3-oxazole Chemical compound C1=COC=[NH+]1 ZCQWOFVYLHDMMC-UHFFFAOYSA-O 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-O hydron;pyrimidine Chemical compound C1=CN=C[NH+]=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-O 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BCUSQLYIPWXJKK-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC.CNCCNC BCUSQLYIPWXJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4866—Polyethers having a low unsaturation value
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
- C08G65/2645—Metals or compounds thereof, e.g. salts
- C08G65/2663—Metal cyanide catalysts, i.e. DMC's
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Abstract
유기 액상의 이온성 염을 사용하여, 정전기 분산 성능이 우수할 뿐만 아니라, 정전기 분산 성능이 반 영구적인 고분자 수지 및 이를 포함하는 고분자 수지 조성물이 개시된다. 상기 고분자 수지는, (a) 에틸렌 옥사이드를 함유하며, 이소시아네이트기와 반응하는 폴리에테르계 중합체, (b) 방향족 디이소시아네이트 화합물, 및 (c) 일차 히드록시기 또는 아민기를 함유하는 탄소수 2 내지 10의 사슬 연장제를 반응시켜 제조한 중합 생성물; 및 유기 액상의 이온성 염을 포함한다. 상기 고분자 수지 조성물은 기재 수지 100중량부; 및 상기 정전기 분산 성능을 갖는 고분자 수지 3 내지 80중량부를 포함한다.Disclosed is a polymer resin using an ionic salt of an organic liquid, which is excellent in electrostatic dispersion performance, and which is semi-permanent in terms of electrostatic dispersion performance, and a polymer resin composition containing the same. Wherein the polymer resin comprises (a) a polyether polymer containing ethylene oxide and reacting with an isocyanate group, (b) an aromatic diisocyanate compound, and (c) a chain extender having 2 to 10 carbon atoms containing a primary hydroxyl group or an amine group ≪ / RTI > And ionic salts of organic liquids. The polymeric resin composition comprises 100 parts by weight of a base resin; And 3 to 80 parts by weight of the polymer resin having the electrostatic dispersion performance.
정전기 분산, 전기 전도성, 폴리우레탄, 유기 액상 이온성 염 Electrostatic dispersion, electroconductive, polyurethane, organic liquid ionic salt
Description
본 발명은, 유기 액상의 이온성 염을 사용하여, 정전기 분산 성능이 우수할 뿐만 아니라, 정전기 분산 성능이 반 영구적인 고분자 수지 및 이를 포함하는 고분자 수지 조성물에 관한 것이다.The present invention relates to a polymer resin using an ionic salt of an organic liquid and having not only excellent electrostatic dispersion performance but also an electrostatic dispersion performance, and a polymer resin composition containing the same.
대부분의 플라스틱 표면에는 정전기적 전하(static charge)가 형성되고, 축적된다. 플라스틱 물질은 낮은 전도도를 가지므로, 정전기적 전하가 축적되는 경향이 매우 크며, 이러한 정전기적 전하의 축적은 플라스틱의 가공 및 사용에 있어서, 각종 문제를 야기시키는 원인이 된다. 예를 들면, 낮은 전도도를 지닌 플라스틱으로 필름을 제조할 경우, 정전기적 전하로 인하여 제조된 필름이 서로 부착되는 성질이 강하여, 다음 공정의 수행에 지장을 줄 뿐만 아니라, 먼지 등의 부착으로 상품성이 저하된다. 특히, 전기/전자 산업에서 사용되는 여러 부품들은 미세한 양의 정전기적 전하에 의해서도 심각한 손상을 입을 수 있기 때문에, 이러한 부품들의 보관, 운반 및 조립 공정에서 정전기적 전하의 발생 및 분산 조절은 무엇보다 중요한 요소이다.Most plastic surfaces form and accumulate static charges. Since plastic materials have low conductivity, the tendency of electrostatic charges to accumulate is very large, and the accumulation of such electrostatic charges causes various problems in the processing and use of plastics. For example, when a film is produced with a plastic having a low conductivity, the films produced due to the electrostatic charge are strongly adhered to each other, which may interfere with the performance of the next process, . In particular, since the various components used in the electrical / electronics industry can be seriously damaged by minute amounts of electrostatic charges, the generation and distribution control of electrostatic charges in the storage, transport and assembly processes of these components is of utmost importance Element.
정전기적 전하의 발생 및 축적을 억제하기 위하여, 다양한 정전기 분산 소재들(electrostatic dissipative materials)이 개발되고 있다. 예를 들면, 저분자량의 음이온 또는 양이온 형태의 대전 방지제를 다양한 고분자 소재에 첨가하여, 정전기 분산 성능을 얻는 방법은 오래 전부터 사용되어 왔다. 하지만 저분자량의 대전방지제는 내열성이 약하기 때문에, 고분자 수지를 가공하는 고온 조건에서 손상되어, 정전기 분산 성능이 저하되는 문제점이 있고, 또한 고분자 수지와의 상용성이 충분히 좋지 않을 경우 표면으로 용출되기 때문에, 시간이 지남에 따라 정전기 분산 성능이 저하되는 문제점이 있다. 정전기적 전하의 발생 및 축적을 억제하기 위한 다른 방법으로, 전도성 고분자 등을 플라스틱 표면에 코팅하는 방법이 있으나, 이러한 방법은 코팅된 전도성 고분자 물질이 쉽게 박리되어 전도도가 상실되고, 진공성형(vacuum thermoforming) 등의 공정 중에 코팅 면이 찢어지거나, 절단 부위에 전하가 축적되는 핫 스팟(Hot spot)이 발생되는 문제점이 있다. 또 다른 방법으로, 금속이나 카본블랙과 같은 유기 또는 무기 충전물(filler)을 고분자 수지에 혼합하여 고분자 복합수지 조성물을 제조하는 방법이 있으나, 충분한 정전기 분산 성능을 얻기 위해서는 전체 고분자 수지에 대하여 10중량% 이상의 충전물을 과량으로 사용해야 하고, 이때 충격 강도 등의 고분자 복합수지 조성물의 기계적 물성이 크게 저하되는 문제점이 있다. 특히 카본 블랙을 포함하는 고분자 복합수지 조성물을 포장용기 등으로 사용할 경우, 카본블랙이 용출되어 포장되는 제품 표면을 오염시키는 문제점이 발생한다.In order to suppress the generation and accumulation of electrostatic charges, various electrostatic dissipative materials have been developed. For example, a method of adding an antistatic agent having a low molecular weight anion or cationic form to various polymer materials and obtaining electrostatic dispersion performance has been used for a long time. However, a low-molecular-weight antistatic agent is poor in heat resistance, so that it is damaged at a high temperature condition of processing the polymer resin, and electrostatic dispersion performance is deteriorated. When the compatibility with the polymer resin is not sufficiently good, , There is a problem that the electrostatic dispersion performance deteriorates with time. Another method for suppressing the generation and accumulation of electrostatic charge is to coat a conductive polymer on a plastic surface. However, such a method has problems such that a coated conductive polymer easily peels off and the conductivity is lost, and a vacuum thermoforming ) Or the like, a hot spot may be generated in which charges are accumulated on the cut portion. In another method, there is a method of preparing a polymer composite resin composition by mixing an organic or inorganic filler such as metal or carbon black with a polymer resin. However, in order to obtain a sufficient electrostatic dispersion performance, The filler must be used in an excess amount, and the mechanical properties of the polymer composite resin composition such as impact strength are greatly deteriorated. Particularly, when a polymer composite resin composition containing carbon black is used as a packaging container or the like, there arises a problem that carbon black is eluted and the surface of the product to be packaged is contaminated.
상기 문제점들을 극복하기 위하여, 폴리에틸렌 글리콜(Polyethylene glycol)등의 에틸렌 옥사이드(ethylene oxide)를 포함한 폴리올 및 방향족 디이소시아네이트(aromatic diisocyanate)로 제조된 방향족 폴리에테르계 열가소성 폴리우레탄 수지를 정전기 분산제로 사용하는 방법이 개발되었으나, 이러한 수지 단독으로는, 정전기 분산 성능이 충분치 않아, 전기/전자제품 부품 포장재 등, 우수한 정전기 분산 성능을 요구하는 용도로 사용하기 어렵다. 따라서, 리튬 이온염을 정전기 분산 성능 향상제로 사용하는 방법이 개발되었으며, 상기 리튬 이온염을 폴리우레탄 수지 중합시 첨가하는 방법과, 압출기 등으로 혼련하여 폴리우레탄 수지에 첨가하는 방법이 사용되고 있다. 상기 리튬 이온염은 분말상이므로, 방향족 폴리에테르계 열가소성 폴리우레탄 수지 중합시 첨가할 경우, 균일하게 분산시키기 어려우므로, 이를 공용매(co-solvent)에 녹여서 사용한다. 하지만 공용매를 포함하는 고분자 복합수지를 전자제품 포장 용기 등으로 사용할 경우, 공용매와 수지의 상용성이 좋지 않으면, 공용매가 표면으로 용출되어 제품 표면을 오염시킬 수 있다. 따라서, 대전 방지 성능을 갖는 고분자 복합수지를 제조하는 데 있어, 기재 수지의 선정에 제한이 따른다. 또한, 리튬 이온염은 수분에 매우 민감해서, 대기 중에 노출되면, 대기 중의 수분을 흡수하여 용해되므로, 압출기를 사용하여 리튬 이온염을 혼련시키는 방법도 용이하지 않다.In order to overcome the above problems, there has been proposed a method of using an aromatic polyether thermoplastic polyurethane resin made of an ethylene oxide-containing polyol such as polyethylene glycol and aromatic diisocyanate as an electrostatic dispersant However, such a resin alone is not sufficient for use in applications requiring excellent electrostatic dispersion performance, such as packaging materials for electric / electronic products, because the electrostatic dispersion performance is insufficient. Therefore, a method of using a lithium ion salt as an electrostatic dispersion improving agent has been developed. A method of adding the lithium ion salt at the time of polymerization of the polyurethane resin, and a method of kneading with the extruder or the like and adding the lithium ion salt to the polyurethane resin have been used. Since the lithium ion salt is in a powder form, it is difficult to uniformly disperse when added in the polymerization of aromatic polyether thermoplastic polyurethane resin, and it is dissolved in a co-solvent and used. However, when a polymer composite resin containing a co-solvent is used as an electronic product packaging container, if the compatibility of the co-solvent and the resin is not good, the co-solvent may be eluted to the surface and contaminate the product surface. Therefore, there are restrictions on the selection of the base resin in the production of the polymer composite resin having antistatic properties. Further, the lithium ion salt is very sensitive to moisture, and when it is exposed to the air, it absorbs moisture in the air and dissolves. Therefore, it is not easy to knead the lithium ion salt using an extruder.
따라서, 본 발명의 목적은, 리튬 이온염을 포함하는 통상의 방향족 폴리에테르계 열가소성 폴리우레탄 수지와 비교하여, 동등 수준의 표면 저항률(surface resistivity) 및 체적 저항률(volume resistivity)을 가지며, 전기적 특성이 반영구적이고, 재활용이 가능하며, 우수한 정전기 분산 성능을 가지는 고분자 수지 및 이를 포함하는 고분자 수지 조성물을 제공하는 것이다.Accordingly, an object of the present invention is to provide a polyurethane resin which has an equivalent level of surface resistivity and volume resistivity as compared with a conventional aromatic polyether thermoplastic polyurethane resin containing a lithium ion salt, Which is semi-permanent, recyclable, and has excellent electrostatic dispersion performance, and a polymer resin composition containing the same.
본 발명의 다른 목적은, 공용매로 인한 제품 표면의 오염 가능성이 없는 고분자 수지 및 이를 포함하는 고분자 수지 조성물을 제공하는 것이다.Another object of the present invention is to provide a polymer resin which is free from contamination of the product surface due to co-solvent and a polymer resin composition containing the same.
본 발명의 또 다른 목적은, 정전기에 민감한 전기/전자 부품 포장재 등으로 유용한 고분자 수지 및 이를 포함하는 고분자 수지 조성물을 제공하는 것이다.It is another object of the present invention to provide a polymer resin useful as a static electricity sensitive electric / electronic parts packaging material and a polymer resin composition containing the same.
상기 목적을 달성하기 위하여, 본 발명은, (a) 에틸렌 옥사이드를 함유하며, 이소시아네이트기와 반응하는 폴리에테르계 중합체, (b) 방향족 디이소시아네이트 화합물, 및 (c) 일차 히드록시기 또는 아민기를 함유하는 탄소수 2 내지 10의 사슬 연장제를 반응시켜 제조한 중합 생성물; 및 유기 액상의 이온성 염을 포함하는 정전기 분산 성능을 갖는 고분자 수지를 제공한다. 여기서, 상기 폴리에테르계 중합체는 수평균 분자량(Mn)이 500 내지 10,000 이며, 에틸렌 옥사이드기를 포함하는 주쇄와 알코올 또는 아민을 양 말단기로 가지는 것이 바람직하고, 상기 유기 액상 의 이온성 염은 질소계 양이온 및 이에 결합하는 음이온으로 구성된 것이 바람직하다. 본 발명은 또한, 기재 수지 100중량부; 및 상기 정전기 분산 성능을 갖는 고분자 수지 3 내지 80중량부를 포함하는 고분자 수지 조성물과 이로부터 제조된 성형품을 제공한다.(B) an aromatic diisocyanate compound, and (c) a compound having two or more carbon-carbon double bonds containing a primary hydroxyl group or an amine group, wherein the polyether- To 10 of a chain extender; And an ionic salt of an organic liquid. Here, it is preferable that the polyether polymer has a number average molecular weight (Mn) of 500 to 10,000, and has a main chain containing an ethylene oxide group and an alcohol or an amine at both end groups, and the ionic salt of the organic liquid is a nitrogen- A cation and an anion bonding thereto. The present invention also provides a resin composition comprising 100 parts by weight of a base resin; And 3 to 80 parts by weight of a polymer resin having the electrostatic dispersion performance, and a molded article produced from the polymer resin composition.
이하, 본 발명을 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail.
본 발명에 따른 정전기 분산 성능을 갖는 고분자 수지는, (a) 에틸렌 옥사이드를 함유하며, 이소시아네이트기와 반응하는 폴리에테르계 중합체; (b) 방향족 디이소시아네이트 화합물; 및 (c) 일차 히드록시기 또는 아민기를 함유하는 탄소수 2 내지 10의 사슬 연장제를 반응시켜 제조한 중합 생성물, 및 유기 액상의 이온성 염을 포함한다.The polymer resin having electrostatic dispersing ability according to the present invention comprises: (a) a polyether polymer containing ethylene oxide and reacting with an isocyanate group; (b) an aromatic diisocyanate compound; And (c) a polymerization product prepared by reacting a chain extender having 2 to 10 carbon atoms containing a primary hydroxyl group or an amine group, and an ionic salt in an organic liquid.
상기 폴리에테르계 중합체는, 에틸렌 옥사이드기를 포함하는 주쇄와 디이소시아네이트와 반응할 수 있는 알코올(-OH) 또는 아민(-NH2)을 양 말단기로 가진다. 상기 폴리에테르계 중합체로는, 에틸렌 옥사이드기만으로 주쇄(backbone)가 이루어진 호모폴리머(homopolymer) 형태의 선형중합체 또는 에틸렌 옥사이드와 다른 종류의 단량체들로 이루어진 코폴리머(copolymer) 형태의 선형중합체 또는 이들의 혼합물이 사용될 수 있다. 상기 에틸렌 옥사이드와 함께 코폴리머를 이루는 단량체로는 1,2-프로필렌 옥사이드(1,2-propylene oxide), 1,3-프로필렌 옥사이드(1,3- propylene oxide), 에피클로로히드린(epichlorohydrin), 1,2-부틸렌옥사이드(1,2-butylene oxide), 1,3-부틸렌옥사이드(1,3-butylene oxide), 스티렌옥사이드(styrene oxide), 알릴 글리시딜 에테르 (allyl glycidyl ether), n-부틸 글리시딜 에테르(n-butyl glycidyl ether), 글리시딜 아크릴레이트(glycidyl acrylate), 글리시딜 메타아크릴레이트(glycidyl methacrylate), 2-에틸헥실 글리시딜 에테르(2-ethylhexyl glycidyl ether), 이들의 혼합물 등이 있다. 이들 폴리에테르계 중합체는 수평균 분자량(Mn)이 약 500 내지 10,000, 바람직하게는 600 내지 4,000, 더욱 바람직하게는 1,000 내지 2,000 이다. 상기 폴리에테르계 중합체의 수평균 분자량이 500 미만일 경우, 중합된 수지의 정전기 방지 성능이 떨어지며, 수평균 분자량이 10,000을 초과하면 폴리우레탄 중합 반응이 어려운 문제를 야기할 수 있다. 또한, 상기 에틸렌 옥사이드와 다른 종류의 단량체들이 코폴리머를 형성하는 경우, 상기 에틸렌 옥사이드 단량체의 함량은 전체 단량체의 10 내지 80 중량% 인 것이 바람직하며, 만일 에틸렌 옥사이드 단량체의 함량이 너무 작으면, 고분자 수지의 전도성이 저하될 우려가 있고, 에틸렌 옥사이드 단량체의 함량이 너무 많으면, 다른 종류의 단량체 첨가로 인한 물성 향상 등의 효과를 충분히 얻지 못할 우려가 있다. 상기 폴리에테르계 중합체의 에틸렌 옥사이드 극성기는 친수성 폴리머를 형성할 수 있기 때문에 반영구적이고, 우수한 전기 전도성을 가진다.The polyether polymer has an alcohol (-OH) or an amine (-NH 2 ) which can react with a diisocyanate and a main chain containing an ethylene oxide group in both end groups. Examples of the polyether polymer include a linear polymer in the form of a homopolymer in which a backbone is formed only by ethylene oxide groups or a linear polymer in the form of a copolymer composed of ethylene oxide and other kinds of monomers, Mixtures may be used. Examples of the monomers constituting the copolymer together with the ethylene oxide include 1,2-propylene oxide, 1,3-propylene oxide, epichlorohydrin, 1,2-butylene oxide, 1,3-butylene oxide, styrene oxide, allyl glycidyl ether, allyl glycidyl ether, n-butyl glycidyl ether, glycidyl acrylate, glycidyl methacrylate, 2-ethylhexyl glycidyl ether, ), Mixtures thereof, and the like. These polyether polymers have a number average molecular weight (Mn) of about 500 to 10,000, preferably 600 to 4,000, and more preferably 1,000 to 2,000. When the number average molecular weight of the polyether polymer is less than 500, the antistatic performance of the polymerized resin is poor. When the number average molecular weight exceeds 10,000, the polyurethane polymerization reaction may be difficult. When the ethylene oxide and other monomers form a copolymer, the content of the ethylene oxide monomer is preferably 10 to 80% by weight of the entire monomer. If the content of the ethylene oxide monomer is too small, The conductivity of the resin may be deteriorated. When the content of the ethylene oxide monomer is too large, there is a possibility that the effect of improving the physical properties due to the addition of other kinds of monomers may not be sufficiently obtained. The ethylene oxide polar group of the polyether polymer is semi-permanent and has excellent electrical conductivity because it can form a hydrophilic polymer.
본 발명에 사용되는 상기 사슬 연장제는 고분자 수지의 주사슬을 연장시키기 위한 물질로서, 2 내지 10개의 탄소 원자를 가지며, 양 말단기에 일차 히드록시 기 또는 아민기를 함유하는 화합물이다. 상기 사슬연장제는 에틸렌글리콜(ethylene glycol), 디에틸렌글리콜(diethylene glycol), 프로필렌글리콜(propylene glycol), 디프로필렌글리콜(dipropylene glycol), 1,3-프로판디올(1,3-propanediol), 1,4-부탄디올(1,4-butanediol), 1,5-펜탄디올(1,5-pentanediol), 1,10-데칸디올(1,10-decanediol), 2,2-디메틸-1,3-프로판디올(2,2-dimethyl-1,3-propanediol), 1,4-시클로헥산-디메탄올(1,4-cyclohexane dimethaneol), 히드로퀴논 비스(2-히드록시에틸) 에테르(hydroquinone bis(2-hydroxyethyl) ether), 1,6-헥산 디올(1,6-hexanediol), 네오펜틸글리콜(neopentyl glycol) 등의 디올(diol) 또는 1,2-프로필렌디아민(1,2-propylenediamine), 1,3-프로필렌디아민(1,3-propylenediamine), 이소포론디아민(isophoronediamine), 에틸렌디아민(ethylenediamine), N-메틸프로필렌-1,3-디아민(N-methylpropylene-1,3-diamine), N,N'-디메틸에틸렌디아민(N,N'-dimethylethylenediamine) 등의 디아민(diamine)을 단독 또는 혼합하여 사용할 수 있으며, 1,4-부탄디올을 사용하는 것이 바람직하다. 상기 사슬 연장제의 사용량은 상기 폴리에테르계 중합체 1몰에 대하여 0.1몰 내지 30몰이고, 바람직하게는 0.1몰 내지 10몰, 더욱 바람직하게는 0.1몰 내지 5몰이다.The chain extender used in the present invention is a compound for extending the main chain of the polymer resin and has from 2 to 10 carbon atoms and contains a primary hydroxy group or an amine group at both end groups. The chain extender may be selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-propanediol, 1 1,4-butanediol, 1,5-pentanediol, 1,10-decanediol, 2,2-dimethyl-1,3- Hydroquinone bis (2-hydroxyethyl) ether, such as 2,2-dimethyl-1,3-propanediol, 1,4-cyclohexane dimethaneol, hydroxyethyl ether, 1,6-hexanediol and neopentyl glycol, or 1,2-propylenediamine, 1,3 1,3-propylenediamine, isophoronediamine, ethylenediamine, N-methylpropylene-1,3-diamine, N, N'- - diamines such as dimethylethylenediamine (N, N'-dimethylethylenediamine) It can be used poisoned or mixed, and 1,4-butanediol is preferably used. The amount of the chain extender used is from 0.1 mol to 30 mol, preferably from 0.1 mol to 10 mol, more preferably from 0.1 mol to 5 mol, based on 1 mol of the polyether polymer.
본 발명에 사용되는 상기 방향족 디이소시아네이트 화합물로는, 1,4-페닐렌디이소시아네이트(1,4-phenylene diisocyanate), 2,4-톨루엔디이소시아네이트(2,4-toluene diisocyanate), 2,6-톨루엔디이소시아네이트(2,6-toluene diisocyanate) 및 이들의 혼합물; 2,2-메틸렌디페닐렌디이소시아네이트(2,2-methylene diphenyl diisocyanate), 2,4'-메틸렌디페닐렌디이소시아네이트(2,4'-methylene diphenyl diisocyanate), 4,4'-메틸렌디페닐렌디이소시아네이트(4,4'-methylene diphenyl diisocyanate) 및 이들의 혼합물; 나프탈렌 디이소시아네이트(naphthalene diisocyanate) 등을 단독 또는 혼합하여 사용할 수 있으며, 이 중 4,4'-메틸렌디페닐렌디이소시아네이트(4,4'-methylene diphenyl diisocyanate)를 사용하는 것이 바람직하다. 상기 디이소시아네이트 화합물의 사용량은 사슬연장제와 폴리에테르계 중합체 전체 (즉, 사슬연장제 + 폴리에테르계 중합체) 1.0몰에 대하여 0.90몰 내지 1.10몰, 바람직하게는 0.92몰 내지 1.05몰, 가장 바람직하게는 0.93몰 내지 1.03몰이다.Examples of the aromatic diisocyanate compound used in the present invention include 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,6-toluene diisocyanate and mixtures thereof; But are not limited to, 2,2-methylene diphenyl diisocyanate, 2,4'-methylene diphenyl diisocyanate, 4,4'-methylenediphenylenediisocyanate (4,4'-methylene diphenyl diisocyanate) and mixtures thereof; Naphthalene diisocyanate and the like may be used alone or in combination. Among them, 4,4'-methylene diphenyl diisocyanate is preferably used. The amount of the diisocyanate compound to be used is in the range of 0.90 to 1.10 mol, preferably 0.92 to 1.05 mol, most preferably 0.02 to 1.0 mol, per mol of 1.0 mol of the chain extender and the entire polyether polymer (i.e., chain extender + polyether polymer) Is 0.93 mol to 1.03 mol.
본 발명에 따른 고분자 수지를 구성하는 중합 생성물은 통상적인 폴리우레탄(polyurethane) 또는 폴리우레아(polyurea) 중합방법으로 제조될 수 있다. 예를 들면, 상기 에틸렌 옥사이드를 함유한 폴리에테르계 중합체; 방향족 디이소시아네이트 화합물; 및 사슬 연장제를 원-샷(one-shot)중합방법으로 동시에 반응시키거나, 상기 폴리에테르계 중합체와 사슬 연장제를 먼저 블렌딩(blending)한 후, 방향족 디이소시아네이트 화합물과 반응시켜 제조 할 수 있다. 또한 필요에 따라, 상기 폴리에테르계 중합체와 상기 방향족 디이소시아네이트를 먼저 반응시켜 프리폴리머(prepolymer)를 제조한 후, 상기 사슬 연장제와 반응시켜, 정전기 분산 성능을 갖는 폴리우레탄 또는 폴리우레아를 제조할 수 있다.The polymerization product constituting the polymer resin according to the present invention can be produced by a conventional polyurethane or polyurea polymerization method. For example, the above-mentioned ethylene oxide-containing polyether-based polymer; Aromatic diisocyanate compounds; And a chain extender may be simultaneously reacted in a one-shot polymerization process, or the polyether polymer and the chain extender may be blended first and then reacted with an aromatic diisocyanate compound . If necessary, the polyether polymer and the aromatic diisocyanate may be first reacted to prepare a prepolymer and then reacted with the chain extender to prepare a polyurethane or polyurea having electrostatic dispersibility have.
본 발명의 고분자 수지에 사용되는 유기 액상의 이온성 염으로는 질소계 양이온 및 이에 결합하는 음이온으로 구성된 이온성 염을 사용할 수 있다. 상기 질소계 양이온으로는 피리디늄(Pyridinium), 피리다지늄(Pyridazinium), 피리미디늄(Pyrimidinium), 피라지늄(Pyrazinium), 이미다졸륨(Imidazolium), 피라졸륨(Pyrazolium), 티아졸륨(Thiazolium), 옥사졸륨(Oxazolium), 트리아졸륨(Triazolium) 등을 단독 또는 혼합하여 사용할 수 있고, 이미다졸륨을 사용하는 것이 바람직하다. 상기 질소계 양이온에 결합하는, 바람직하게는 약하게 배위결합하는 음이온으로는 Cl-, Br-, F-, HSO4 -, H2PO4 -, NO3 -, ClO4 -, BF4 -, PF6 -, SbF6 -, AsF6 -, 알칸(alkan)설포네이트, 아릴(aryl)설포네이트, 알카릴설포네이트(alkaryl sulfonate) 등의 유기 음이온 또는 퍼플루오로알칸설포네이트(perfluoroalkanesulfonates), 시아노퍼플루오로알칸설포닐아미드(cyanoperfluoroalkanesulfonylamides), 비스시아노플루오로알칸설포닐메티드(bis(cyano)fluoroalkanesulfonylmethides), 비스퍼플루오로알칸설포닐이미드(bis(perfluoroalkanesulfonyl)imides), 비스퍼플루오로알칸설포닐메티드(bis(perfluoroalkanesulfonyl)methides), 트리스퍼플루오로알칸설포닐메티드(tris(perfluoroalkanesulfonyl)methides) 등의 불화 유기 음이온(fluoro-organic anions)을 단독 또는 혼합하여 사용할 수 있고, 불화 유기 음이온을 사용하는 것이 바람직하다.As the ionic salt of the organic liquid used for the polymer resin of the present invention, an ionic salt composed of a nitrogen-based cation and an anion binding thereto can be used. Examples of the nitrogen-based cations include pyridinium, pyridazinium, pyrimidinium, pyrazinium, imidazolium, pyrazolium, thiazolium, ), Oxazolium, triazolium, etc. may be used alone or in combination, and it is preferable to use imidazolium. Examples of the anion which binds to, preferably weakly coordinate to, the nitrogen-based cation include Cl - , Br - , F - , HSO 4 - , H 2 PO 4 - , NO 3 - , ClO 4 - , BF 4 - Organic perions or perfluoroalkanesulfonates such as 6 - , SbF 6 - , AsF 6 - , alkane sulfonates, aryl sulfonates and alkaryl sulfonates, Cyanoperfluoroalkanesulfonylamides, bis (cyano) fluoroalkanesulfonylmethides, bis (perfluoroalkanesulfonyl) imides, bisperfluoroalkanesulfonylimides, bisperfluoroalkanesulfonylimides, Fluoro-organic anions such as bis (perfluoroalkanesulfonyl) methides and tris (perfluoroalkanesulfonyl) methides can be used singly or in combination, and fluorinated organic anions can be used To use Is recommended.
상기 유기 액상의 이온성 염을, 정전기 분산 성능 향상제로서, 상기 폴리에테르계 중합체, 방향족 디이소시아네이트 화합물 및 사슬 연장제의 총 사용량 100중량부에 대하여 0.1 내지 20중량부, 바람직하게는 0.5 내지 10중량부를 주쇄에 분산시킴으로써, 전도성이 더욱 향상된 고분자 수지를 제조할 수 있다. 여기서, 상기 유기 액상의 이온성 염의 사용량이 0.1중량부 미만이면 정전기 분산 및 전도성 향상 효과가 미미하며, 20중량부를 초과하면, 더 이상의 정전기 분산 및 전도성 향상 효과가 미미할 뿐만 아니라, 고가의 정전기 분산 성능 향상제를 과량 사용함에 따른 제품가격이 상승하는 문제점이 있다. 또한, 상기 이온성 염이 과량 사용될 경우 수지의 기계적 물성이 저하될 수 있다. 상기 유기 액상의 이온성 염은 고분자 수지에 분산시키는 방법은, 압출기(screw extruder) 등 다양한 종류의 혼련기(mixer)에 유기 액상 공급장치(liquid feeder)를 사용하여 물리적으로 혼련(mixing)하거나, 수지 중합 시 첨가함으로써 분산시킬 수 있다. The ionic salt of the organic liquid is used as an electrostatic dispersion improving agent in an amount of 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the total amount of the polyether polymer, the aromatic diisocyanate compound and the chain extender By dispersing the polymer in the main chain, a polymer resin having improved conductivity can be produced. If the amount of the ionic salt used in the organic liquid is less than 0.1 part by weight, the effect of improving electrostatic dispersion and conductivity is insignificant. If the amount is more than 20 parts by weight, further electrostatic dispersion and improvement of conductivity are insufficient, There is a problem that the product price increases due to excessive use of the enhancer. In addition, when the ionic salt is used in excess, the mechanical properties of the resin may be deteriorated. The method of dispersing the ionic salt of the organic liquid in the polymer resin may be a method of physically mixing the polymeric resin with an organic liquid feeder using various types of mixers such as a screw extruder, It can be dispersed by adding it during resin polymerization.
본 발명은 또한, 기재 수지(base polymer) 100중량부에 대하여, 본 발명에 따른 정전기 분산 성능을 갖는 고분자 수지 3 내지 80중량부, 바람직하게는 25 내지 50중량부를 포함하는 고분자 수지 조성물을 제공한다. 상기 수지 조성물은, 상기 정전기 분산 성능을 갖는 고분자 수지 및 기재 수지를 압출기(screw extruder) 등의 통상적인 혼련기(mixer)로 혼합하여 제조할 수 있다. 상기 복합 수지 조성물에 있어서, 상기 정전기 분산 성능을 갖는 고분자 수지의 함량이 3중량부 미만인 경우 효과적인 정전기 방지 성능을 기대할 수 없고, 80중량부를 초과할 경우 제조 된 복합수지 조성물의 정전기 방지 성능의 추가적인 개선 효과가 미미하다. 상기 기재 수지는 폴리옥시메틸렌(Polyoxymethylene: POM), 폴리아크릴 (Polyacryl), 폴리메틸메타크릴레이트(Polymethylmethacrylate: PMMA), 폴리스티렌(Polystyrene: PS) 호모폴리머(homopolymer) 또는 폴리스티렌 공중합체, 스티렌-아크릴로니트릴(styrene-acrylonitrile: SAN), 아크릴로니트릴-부타디엔-스티렌(acrylonitrile-butadiene-styrene: ABS), 고충격 폴리스티렌(high impact polystyrene: HIPS), 폴리카보네이트(Polycarbonate: PC), 폴리에틸렌(Polyethylene: PE), 폴리프로필렌(Polypropylene: PP) 호모폴리머 또는 폴리프로필렌 공중합체, 폴리에틸렌 테레프탈레이트(Polyethylene terephthalate: PET), 글리콜 변성 폴리에틸렌 테레프탈레이트(glycol modified polyethylene terephthalate: PETG), 폴리부틸렌 테레프탈레이트(Polybutylene terephthalate: PBT), 폴리에테르-에스테르 코폴리머(Polyether-ester copolymers), 폴리에테르-아미드 코폴리머 (Polyether-amide copolymers), 나일론 6(Nylon 6), 나일론 6,6(Nylon 6,6), 나일론 6,10(Nylon 6,10), 나일론 6,12(Nylon 6,12), 나일론 11(Nylon 11), 나일론 12(Nylon 12), 폴리아미드이미드(Polyamideimides), 폴리아릴레이트(Polyarylates), 폴리우레탄(Polyurethanes), 에틸렌 프로필렌 고무(ethylene propylene rubber: EPR),에틸렌 프로필렌 디엔 모노머(ethylene propylene diene monomer: EPDM), 폴리아릴설폰(polyarylsulfone), 폴리에테르설폰(Polyethersulfone), 폴리페닐렌설피드(polyphenylene sulfide), 폴리페닐렌옥사이드(polyphenylene oxide), 염화비닐클로라이드(polyvinyl chloride: PVC), 폴리설폰(Polysulfone), 폴리에테르이미 드(Polyetherimide), 폴리테트라플로로에틸렌(Polytetrafluoroethylene: PTFE), 불화프로필렌에틸렌(fluorinated propylene ethylene), 폴리플루오로알콕시(Polyfluoroalkoxy), 폴리클로로트리플루오로에틸렌(Polychlorotrifluoroethylene), 폴리비닐리덴플루오리드(Polyvinylidene fluoride), 폴리비닐 플루오리드(Polyvinyl fluoride), 폴리에테르케톤(Polyetherketone: PEK), 폴리에테르 에테르케톤(Polyether etherketone: PEEK), 폴리에테르 케톤 케톤(Polyether ketone ketone) 등을 단독 또는 혼합하여 사용할 수 있다.The present invention also provides a polymer resin composition comprising 3 to 80 parts by weight, preferably 25 to 50 parts by weight, of a polymer resin having electrostatic dispersibility according to the present invention, based on 100 parts by weight of a base polymer . The resin composition can be produced by mixing the polymer resin having the electrostatic dispersion property and the base resin with a conventional mixer such as a screw extruder. When the content of the polymer resin having the electrostatic dispersing ability is less than 3 parts by weight, an effective antistatic property can not be expected. When the amount exceeds 80 parts by weight, further improvement of the antistatic performance of the prepared composite resin composition The effect is minimal. The base resin may be at least one selected from the group consisting of polyoxymethylene (POM), polyacryl, polymethylmethacrylate (PMMA), polystyrene (PS) homopolymer or polystyrene copolymer, styrene- Acrylonitrile-butadiene-styrene (ABS), high impact polystyrene (HIPS), polycarbonate (PC), and polyethylene (PE) ), Polypropylene (PP) homopolymer or polypropylene copolymer, polyethylene terephthalate (PET), glycol modified polyethylene terephthalate (PETG), polybutylene terephthalate PBT), polyether-ester copolymers, polyether-amide copolymers (Po nylon 6, nylon 6,6, nylon 6,10, nylon 6,12, nylon 6,12, nylon 6, nylon 6, 11, nylon 12, polyamideimides, polyarylates, polyurethanes, ethylene propylene rubber (EPR), ethylene propylene diene monomer (EPDM), polyarylsulfone, polyethersulfone, polyphenylene sulfide, polyphenylene oxide, polyvinyl chloride (PVC), polysulfone ), Polyetherimide, polytetrafluoroethylene (PTFE), fluorinated propylene ethylene, polyfluoroalkoxy, polychlorotrifluoroethylene, polyvinylsulfone Liden Polyetheretherketone (PEEK), polyetherketone ketone (Polyether ketone ketone), and the like may be used singly or in combination with one or more of the following materials: polyvinylidene fluoride, polyvinyl fluoride, polyetherketone (PEK), polyether etherketone Can be used.
본 발명은 또한, 기재 수지(polymer) 100중량부에 대하여, 본 발명에 따른 정전기 분산 성능을 갖는 고분자 수지 3 내지 80중량부, 바람직하게는 25 내지 50중량부를 포함하는 복합 수지 조성물로 제조된 성형품을 제공한다. The present invention also provides a molded article made from a composite resin composition comprising 3 to 80 parts by weight, preferably 25 to 50 parts by weight, of a polymer resin having an electrostatic dispersing ability according to the present invention, based on 100 parts by weight of a base resin .
이하, 구체적인 실시예 및 비교예를 통하여 본 발명을 더욱 상세히 설명한다. 하기 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것으로써, 본 발명의 범위가 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail by way of specific examples and comparative examples. The following examples are intended to further illustrate the present invention, and the scope of the present invention is not limited by the following examples.
[비교예 1][Comparative Example 1]
수평균 분자량이 1500인 폴리에틸렌 글리콜(Polyethylene glycol) 64.3중량%를 120℃로 승온한 후, 4,4-메틸렌비스페닐이소시아네이트(4,4- methylenebis(phenyl isocyanate): MDI) 29.4중량% 및 1,4-부탄디올(1,4-butanediol) 6.3중량%를 첨가하고 120℃에서 5 분간 가열하여, 원샷(one-shot) 중합법으로 반응시킨 후, 80℃ 열풍 오븐에서 15시간 동안 숙성하여 방향족(aromatic) 폴리우레탄을 제조하였다. 제조된 방향족 폴리우레탄을 180℃의 핫 프레스(hot press)에서 용융시켜, 시트(sheet) 시편을 제조한 후, 표면 저항률을, ASTM D-257 규정에 따라, 온도 23±1℃, 상대습도 50±15%의 조건에서 24시간 방치한 후, 저항기(Resistivity meter)를 사용하여 측정하였으며, 그 결과를 하기 표 1에 표기 하였다.64.3% by weight of polyethylene glycol having a number average molecular weight of 1,500 was heated to 120 DEG C, 29.4% by weight of 4,4-methylenebis (phenyl isocyanate): MDI, One-shot polymerization was carried out by heating at 120 ° C for 5 minutes and then aging was carried out in a hot air oven at 80 ° C for 15 hours to prepare an aromatic (aromatic ) Polyurethane. The prepared aromatic polyurethane was melted in a hot press at 180 占 폚 to prepare a sheet specimen and the surface resistivity was measured according to ASTM D-257 at a temperature of 23 占 占 폚 and a relative humidity of 50 ± 15% for 24 hours, and then measured using a resistivity meter. The results are shown in Table 1 below.
[비교예 2][Comparative Example 2]
수평균 분자량이 2400이고, 분자 내 에틸렌옥사이드를 18% 함유한 프로필렌 글리콜(Ethylene oxide-propylene glycol: EO-PPG) 61.4중량%, 4,4-메틸렌비스페닐이소시아네이트(MDI) 30.1중량% 및 1,4-부탄디올 8.5중량%를 사용한 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면 저항률을 측정하여 하기 표 1에 나타내었다.61.4% by weight of propylene glycol (EO-PPG) having a number average molecular weight of 2,400, 18% of ethylene oxide in the molecule, 30.1% by weight of 4,4-methylenebisphenyl isocyanate (MDI) An aromatic polyurethane sheet specimen was prepared in the same manner as in Comparative Example 1, except that 8.5 wt% 4-butanediol was used, and the surface resistivity was measured and shown in Table 1 below.
[비교예 3][Comparative Example 3]
수평균 분자량이 2000인 폴리옥시에틸렌아민(Polyoxyethylene amine) 62.8중량%, 4,4-메틸렌비스페닐이소시아네이트(MDI) 29.4 중량% 및 1,4-부탄디올 7.8중량%를 사용한 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레 아 시트 시편을 제조한 후, 표면 저항률을 측정하여 하기 표 1에 나타내었다.Except that 62.8 wt% of polyoxyethylene amine having a number average molecular weight of 2000, 29.4 wt% of 4,4-methylenebisphenyl isocyanate (MDI) and 7.8 wt% of 1,4-butanediol were used. The aromatic polyurea sheet specimens were prepared in the same manner as in Example 1, and the surface resistivity was measured and shown in Table 1 below.
[실시예 1][Example 1]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜(Polyethylene glycol) 64.3중량%, (B) 4,4-메틸렌비스페닐이소시아네이트 (MDI) 29.4중량%, (C) 1,4-부탄디올(1,4-butanediol) 6.3중량% 및 상기 전체 화합물(A+B+C) 100 중량부에 대하여 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 (1,3-methylbutyl imidazolium bistrimethylflourosulfonylimide) 2.5 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 1에 나타내었다.(A) 64.3% by weight of polyethylene glycol having a number average molecular weight of 1500, (B) 29.4% by weight of 4,4-methylenebisphenyl isocyanate (MDI), (C) 1,4- and 2.5 parts by weight of 1,3-methylbutyl imidazolium bistrimethylflourosulfonylimide was added to 100 parts by weight of the total compound (A + B + C) The results are shown in Table 1. The results are shown in Table 1. The results are shown in Table 1. [Table 1] < tb > < TABLE >
[실시예 2][Example 2]
수평균 분자량이 2400이고, (A) 분자 내 에틸렌옥사이드를 18% 함유한 프로필렌 글리콜(Ethylene oxide-propylene glycol: EO-PPG) 61.4중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 30.1중량%, (C) 1,4-부탄디올 8.5중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 1, 3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 2.5 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 1에 나타내었다. (A) 61.4% by weight of propylene glycol (EO-PPG) containing 18% of ethylene oxide in the molecule, (B) 4,4-methylenebisphenyl isocyanate (MDI) 2.5 parts by weight of 1, 3-methylbutylimidazolium bistrimethylfluorosulfonylimide per 100 parts by weight of (C) 1,4-butanediol 8.5% by weight and the total compound (A + B + C) The results are shown in Table 1 below, except that the aromatic polyurethane sheet specimens were prepared in the same manner as in Comparative Example 1,
[실시예 3][Example 3]
수평균 분자량이 2000인 (A) 폴리옥시에틸렌아민 (Polyoxyethylene amine) 62.8중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 29.4 중량%, (C) 1,4-부탄디올 7.8중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 2.5 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레아 시트 시편을 제조한 후, 표면 저항률을 측정하여 하기 표 1에 나타내었다. 62.8 wt% of (A) polyoxyethylene amine having a number average molecular weight of 2000, (B) 29.4 wt% of 4,4-methylenebisphenyl isocyanate (MDI), (C) 7.8 wt% And 2.5 parts by weight of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide was added to 100 parts by weight of the total compound (A + B + C). The aromatic polyurea sheet specimens were prepared in the same manner, and the surface resistivity was measured and shown in Table 1 below.
[표 1][Table 1]
(PEG, Mn=1500)Polyethylene glycol
(PEG, Mn = 1500)
(Mn= 2000)Polyoxyethylene amine
(Mn = 2000)
이소시아네이트4,4-methylenebisphenyl
Isocyanate
플루오르설포닐이미드1,3-Methylbutylimidazolium bistrimethyl
Fluorosulfonylimide
상기 표 1은 다양한 방향족 폴리에테르 우레탄 또는 우레아에 이미다졸륨계 액상 이온염인 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드를 첨가할 경우, 전기 전도성이 향상됨을 보여주고 있다. 구체적으로, 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드를 2.5 중량부(phr) 첨가하였을 경우, 표면저항률이 약 4 order가량 낮아짐으로써 정전기 분산 성능이 향상됨을 확인할 수 있다.Table 1 above shows that when 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide, which is an imidazolium-based liquid ionic salt, is added to various aromatic polyether urethanes or ureas, electrical conductivity is improved. Specifically, when 2.5 parts by weight (phr) of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide is added, the surface resistivity is lowered by about 4 orders, which indicates that the electrostatic dispersion performance is improved.
[비교예 4][Comparative Example 4]
수평균 분자량이 1500인 폴리에틸렌 글리콜(Polyethylene glycol) 71.8중량%, 4,4-메틸렌비스페닐이소시아네이트(4,4-methylenebis(phenyl isocyanate): MDI) 25.0중량% 및 에틸렌글리콜(ethylene glycol) 3.2중량%을 사용한 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 2에 나타내었다., 71.0% by weight of polyethylene glycol having a number average molecular weight of 1500, 25.0% by weight of 4,4-methylenebis (phenyl isocyanate): MDI and 3.2% by weight of ethylene glycol, , An aromatic polyurethane sheet specimen was prepared in the same manner as in Comparative Example 1, and the surface resistivity was measured and shown in Table 2 below.
[실시예 4][Example 4]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜 71.8 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 25.0 중량%, (C) 에틸렌글리콜 3.2중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 1 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 2에 나타내었다.(A) + (B + B) + (B) + (B) + (B) Except that 1 part by weight of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide was added and reacted with 100 parts by weight of the aromatic polyurethane sheet sample (C) in the same manner as in Comparative Example 1 After the preparation, the surface resistivity was measured and shown in Table 2 below.
[실시예 5][Example 5]
수평균 분자량이 1500인 (A)폴리에틸렌 글리콜 71.8 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 25.0 중량%, (C)에틸렌글리콜 3.2중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 3 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 2에 나타내었다.(A) + (B + B) + (B) + (B) + (B) Except that 3 parts by weight of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide was added to 100 parts by weight of the aromatic polyurethane sheet (C) After the preparation, the surface resistivity was measured and shown in Table 2 below.
[실시예 6][Example 6]
수평균 분자량이 1500인 (A)폴리에틸렌 글리콜 71.8 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 25.0 중량%, (C)에틸렌글리콜 3.2중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드 5 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 2에 나타내었다.(A) + (B + B) + (B) + (B) + (B) Except that 5 parts by weight of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide was added to 100 parts by weight of the aromatic polyurethane sheet After the preparation, the surface resistivity was measured and shown in Table 2 below.
[표 2] [Table 2]
상기 표 2는 이디다졸륨계 액상 이온염인 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드의 첨가에 따른, 정전기 분산 성능 향상 효과를 나타낸 것이다. 방향족 폴리에테르계 우레탄에 1,3-메틸부틸이미다졸륨 비스트리메틸플루오로설포닐이미드를 1 중량부만 넣어주어도, 표면 저항률이 2.5 order 이상 낮아져 정전기 분산 성능이 향상됨을 확인할 수 있다.Table 2 shows the effect of improving the electrostatic dispersion performance by adding 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide, which is an imidazolium-based liquid ionic salt. It can be confirmed that even when only 1 part by weight of 1,3-methylbutylimidazolium bistrimethylfluorosulfonylimide is added to the aromatic polyether-based urethane, the surface resistivity is lowered by 2.5 orders or more and the electrostatic dispersion performance is improved.
[실시예 7][Example 7]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜 64.3 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 29.4 중량%, (C) 1,4-부탄디올 6.3중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 코에이 케미칼 (KOEI chemical)의 피리디늄계 액상 이온 염 (상품명: IL-P1) 1 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 3에 나타내었다.(A) 64.3% by weight of polyethylene glycol having a number average molecular weight of 1500, (B) 29.4% by weight of 4,4-methylenebisphenyl isocyanate (MDI), (C) 6.3% by weight of 1,4- Except that 1 part by weight of a pyridinium type liquid ionic salt (trade name: IL-P1) of KOEI chemical was added to 100 parts by weight of a polyimide precursor And the surface resistivity was measured. The results are shown in Table 3 below. ≪ tb > < TABLE >
[실시예 8][Example 8]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜 64.3 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 29.4 중량%, (C) 1,4-부탄디올 6.3중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 코에이 케미칼 (KOEI chemical)의 피리디늄계 액상 이온 염 (상품명: IL-P1) 3 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 3에 나타내었다.(A) 64.3% by weight of polyethylene glycol having a number average molecular weight of 1500, (B) 29.4% by weight of 4,4-methylenebisphenyl isocyanate (MDI), (C) 6.3% by weight of 1,4- Except that 3 parts by weight of a pyridinium based liquid phase ionic salt (trade name: IL-P1) of KOEI chemical was added to 100 parts by weight of a surfactant And the surface resistivity was measured. The results are shown in Table 3 below. ≪ tb > < TABLE >
[실시예 9][Example 9]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜 64.3 중량%, (B) 4,4-메틸 렌비스페닐이소시아네이트(MDI) 29.4 중량%, (C) 1,4-부탄디올 6.3중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 코에이 케미칼 (KOEI chemical)의 이미다졸륨계 액상 이온 염 (상품명: IL-IM1) 1 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 3에 나타내었다.(A) 64.3% by weight of polyethylene glycol having a number average molecular weight of 1500, (B) 29.4% by weight of 4,4-methylenebisphenyl isocyanate (MDI), (C) 6.3% by weight of 1,4- Except that 1 part by weight of an imidazolium-based liquid ionic salt (trade name: IL-IM1) of KOEI chemical was added to 100 parts by weight of an inorganic filler (A + B + C) The aromatic polyurethane sheet specimens were prepared, and the surface resistivity was measured and shown in Table 3 below.
[실시예 10][Example 10]
수평균 분자량이 1500인 (A) 폴리에틸렌 글리콜 64.3 중량%, (B) 4,4-메틸렌비스페닐이소시아네이트(MDI) 29.4 중량%, (C) 1,4-부탄디올 6.3중량% 및 상기 전체 화합물(A+B+C) 100중량부에 대하여 코에이 케미칼 (KOEI chemical)의 이미다졸륨계 액상 이온 염 (상품명: IL-IM1) 3 중량부를 첨가하여 반응시킨 것을 제외하고는, 상기 비교예 1과 동일한 방법으로 방향족 폴리우레탄 시트 시편을 제조한 후, 표면저항률을 측정하여 하기 표 3에 나타내었다.(A) 64.3% by weight of polyethylene glycol having a number average molecular weight of 1500, (B) 29.4% by weight of 4,4-methylenebisphenyl isocyanate (MDI), (C) 6.3% by weight of 1,4- Except that 3 parts by weight of an imidazolium-based liquid ionic salt (trade name: IL-IM1) of KOEI chemical was added to 100 parts by weight of polyvinyl alcohol And the surface resistivity was measured. The results are shown in Table 3 below. ≪ tb > < TABLE >
[표 3] [Table 3]
표 3으로부터, 다양한 액상 이온염 첨가에 따라, 방향족 열가소성 폴리에테르계 폴리우레탄의 전기 전도성, 즉 정전기 분산 성능이 향상됨을 확인할 수 있다.From Table 3, it can be seen that the electrical conductivity of the aromatic thermoplastic polyether polyurethane, i.e. the electrostatic dispersion performance, is improved by the addition of various liquid ionic salts.
[비교예 5][Comparative Example 5]
글리콜 변성 폴레에틸렌 테레프탈레이트(glycol modified polyethylene terephthalate: PETG) 75중량%와 상기 비교예 1의 폴리우레탄 25중량%를 압출기로 용융 혼련하여, 펠렛(pellet) 형태의 복합수지 조성물을 제조하였다. 제조된 복합수지 조성물을 압출기를 사용하여 시트(sheet)형태의 제품으로 만든 후, 표면 저항률 및 "static decay time"을 측정하여, 하기 표 4에 나타내었다. 표면 저항률은 ASTM D-257 규정에 따라, 온도 23±1℃, 상대습도 50±15%의 조건에서 24시간 방치한 후, 저항기(Resistivity meter)를 사용하여 측정하였고, static decay time(정전기 방전시간)은 FTMC-101C 규정에 따라 시험 시편이 1000V에서 10V로 방전되는데 걸리는 시간을 측정하였다.75% by weight of glycol-modified polyethylene terephthalate (PETG) and 25% by weight of the polyurethane of Comparative Example 1 were melted and kneaded by an extruder to prepare a pellet-type composite resin composition. The prepared composite resin composition was made into a sheet-like product by using an extruder, and the surface resistivity and "static decay time" were measured and shown in Table 4 below. The surface resistivity was measured using a resistivity meter after standing for 24 hours at a temperature of 23 ± 1 ° C. and a relative humidity of 50 ± 15% according to ASTM D-257, and the static decay time ) Measured the time taken for the test specimen to discharge from 1000V to 10V according to the FTMC-101C specification.
[실시예 11][Example 11]
글리콜 변성 폴레에틸렌 테레프탈레이트(PETG) 75중량%와 상기 실시예 9의 폴리우레탄 25중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여, 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5 except that 75% by weight of glycol-modified polyethylene terephthalate (PETG) and 25% by weight of the polyurethane of Example 9 were used, quot; static decay time "were measured and shown in Table 4 below.
[실시예 12][Example 12]
글리콜 변성 폴레에틸렌 테레프탈레이트(PETG) 75중량%와 상기 실시예 10의 폴리우레탄 25중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여, 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5, except that 75% by weight of glycol-modified polyethylene terephthalate (PETG) and 25% by weight of the polyurethane of Example 10 were used, quot; static decay time "were measured and shown in Table 4 below.
[실시예 12a][Example 12a]
글리콜 변성 폴레에틸렌 테레프탈레이트(PETG) 70중량%에 상기 실시예 10의 폴리우레탄 30중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5, except that 30 wt% of the polyurethane of Example 10 was used in 70 wt% of glycol-modified polyethylene terephthalate (PETG) static decay time "was measured and shown in Table 4 below.
[비교예 6][Comparative Example 6]
고충격 폴리스티렌(High Impact Polystyrene: HIPS) 75중량%와 상기 비교예 1의 폴리우레탄 25중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5 except that 75% by weight of High Impact Polystyrene (HIPS) and 25% by weight of the polyurethane of Comparative Example 1 were used, "static decay time" was measured and shown in Table 4 below.
[실시예 13][Example 13]
고충격 폴리스티렌 75중량%와 상기 실시예 9의 폴리우레탄 25중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5 except that 75% by weight of high-impact polystyrene and 25% by weight of the polyurethane of Example 9 were used, and the surface resistivity and the "static decay time" Are shown in Table 4 below.
[실시예 14][Example 14]
고충격 폴리스티렌 75중량%와 상기 비교예 10의 폴리우레탄 25중량%을 사용한 것을 제외하고는, 상기 비교예 5와 동일한 방법으로 복합수지 조성물 시편을 제조하여, 표면 저항률 및 "static decay time"을 측정하여 하기 표 4에 나타내었다.A composite resin composition specimen was prepared in the same manner as in Comparative Example 5 except that 75% by weight of high-impact polystyrene and 25% by weight of the polyurethane of Comparative Example 10 were used, and the surface resistivity and the "static decay time" Are shown in Table 4 below.
[표 4][Table 4]
13Example
13
상기 표 4에서는, 액상 이온성 염을 포함한 고분자 수지를 다양한 기재수지에 첨가할 경우, 정전기 분산 성능이 향상됨을 보여주고 있다. 이미다졸륨계 액상 이온염 1중량부를 포함한 고분자 수지 25중량%를 기재수지에 사용한 복합수지 조성물들(실시예 11 및 13)은 액상 이온염을 포함하지 않는 고분자 수지 25중량%를 사용한 경우(비교예 5 및 6) 보다, 표면 저항률이 약 2 오더(order)이상 개선되며 "static decay time"도 60초에서 0.3초 이하로 줄어듦으로써 정전기 분산 성능이 획기적으로 개선됨을 알 수 있다.Table 4 shows that the electrostatic dispersion performance is improved when a polymer resin containing a liquid ionic salt is added to various base resin. (Examples 11 and 13) in which 25 wt% of a polymer resin containing an imidazolium-based liquid ionic salt salt was used as a base resin was used in the case of using 25 wt% of a polymer resin not containing a liquid ionic salt (Comparative Example 5 and 6), the surface resistivity is improved by about two orders or more, and the "static decay time" is also reduced to less than 0.3 seconds from 60 seconds, thereby remarkably improving the electrostatic dispersion performance.
이상 상술한 바와 같이, 본 발명에 따른 고분자 수지 및 이를 포함하는 고분자 수지 혼합물은 표면 저항률(surface resistivity)이 낮고, 전기적 특성이 반 영구적이고, 재활용이 가능하며, 우수한 정전기 분산 성능을 가질 뿐만 아니라, 다른 고분자 수지와의 상용성이 우수하다. 따라서, 본 발명에 따른 고분자 수지 및 이를 포함하는 고분자 수지 혼합물은 정전기에 민감한 전기/전자 부품 포장재 등에 널리 이용될 수 있다.As described above, the polymer resin and the polymer resin mixture containing the same according to the present invention have low surface resistivity, are semi-permanent electrical characteristics, can be recycled, have excellent electrostatic dispersion performance, It is excellent in compatibility with other polymer resins. Therefore, the polymer resin and the polymer resin mixture containing the polymer resin according to the present invention can be widely used for electrostatic sensitive electric / electronic parts packaging materials.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0423847B1 (en) | 1984-08-20 | 1995-03-15 | Dai Nippon Insatsu Kabushiki Kaisha | Heat transfer sheet |
| US5454980A (en) * | 1993-12-13 | 1995-10-03 | Xerox Corporation | Method of making bubble and foreign particle free electrically conductive polyurethanes |
| KR950011921B1 (en) * | 1990-04-16 | 1995-10-12 | 다이이찌 고교 세이야꾸 가부시끼가이샤 | Antistatic resin composition |
| US20060100323A1 (en) * | 2002-07-05 | 2006-05-11 | Creavis Gesellschaft Fuer Technologie Und Inno. | Polymer compositions containing polymers and ionic liquids |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0423847B1 (en) | 1984-08-20 | 1995-03-15 | Dai Nippon Insatsu Kabushiki Kaisha | Heat transfer sheet |
| KR950011921B1 (en) * | 1990-04-16 | 1995-10-12 | 다이이찌 고교 세이야꾸 가부시끼가이샤 | Antistatic resin composition |
| US5454980A (en) * | 1993-12-13 | 1995-10-03 | Xerox Corporation | Method of making bubble and foreign particle free electrically conductive polyurethanes |
| US20060100323A1 (en) * | 2002-07-05 | 2006-05-11 | Creavis Gesellschaft Fuer Technologie Und Inno. | Polymer compositions containing polymers and ionic liquids |
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